JP2009049104A5 - - Google Patents

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Publication number
JP2009049104A5
JP2009049104A5 JP2007212307A JP2007212307A JP2009049104A5 JP 2009049104 A5 JP2009049104 A5 JP 2009049104A5 JP 2007212307 A JP2007212307 A JP 2007212307A JP 2007212307 A JP2007212307 A JP 2007212307A JP 2009049104 A5 JP2009049104 A5 JP 2009049104A5
Authority
JP
Japan
Prior art keywords
electrode plate
soldered
main surface
power semiconductor
bus bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007212307A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009049104A (ja
JP4881256B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007212307A priority Critical patent/JP4881256B2/ja
Priority claimed from JP2007212307A external-priority patent/JP4881256B2/ja
Priority to US12/190,941 priority patent/US7982299B2/en
Priority to CN200810173727.4A priority patent/CN101373762B/zh
Publication of JP2009049104A publication Critical patent/JP2009049104A/ja
Publication of JP2009049104A5 publication Critical patent/JP2009049104A5/ja
Application granted granted Critical
Publication of JP4881256B2 publication Critical patent/JP4881256B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007212307A 2007-08-16 2007-08-16 パワー半導体モジュール Expired - Fee Related JP4881256B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007212307A JP4881256B2 (ja) 2007-08-16 2007-08-16 パワー半導体モジュール
US12/190,941 US7982299B2 (en) 2007-08-16 2008-08-13 Power semiconductor module
CN200810173727.4A CN101373762B (zh) 2007-08-16 2008-08-15 功率半导体模块

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007212307A JP4881256B2 (ja) 2007-08-16 2007-08-16 パワー半導体モジュール

Publications (3)

Publication Number Publication Date
JP2009049104A JP2009049104A (ja) 2009-03-05
JP2009049104A5 true JP2009049104A5 (enExample) 2009-11-12
JP4881256B2 JP4881256B2 (ja) 2012-02-22

Family

ID=40362300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007212307A Expired - Fee Related JP4881256B2 (ja) 2007-08-16 2007-08-16 パワー半導体モジュール

Country Status (3)

Country Link
US (1) US7982299B2 (enExample)
JP (1) JP4881256B2 (enExample)
CN (1) CN101373762B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8493762B2 (en) * 2009-12-28 2013-07-23 Kabushiki Kaisha Toshiba Power semiconductor module and semiconductor power converter provided with the same
JP6165525B2 (ja) 2012-10-31 2017-07-19 株式会社東芝 半導体電力変換装置およびその製造方法
JP6155676B2 (ja) * 2013-02-11 2017-07-05 株式会社デンソー 半導体装置及びその製造方法
JP2019149479A (ja) * 2018-02-27 2019-09-05 トヨタ自動車株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002164485A (ja) 2000-11-28 2002-06-07 Toyota Industries Corp 半導体モジュール
JP4434520B2 (ja) 2001-06-29 2010-03-17 日本製紙クレシア株式会社 柔軟性と表面滑性に優れた圧縮ティッシュペーパー及びこれの製造方法
US20060164813A1 (en) * 2004-11-30 2006-07-27 Kabushiki Kaisha Toshiba Semiconductor package and semiconductor module
CN100418216C (zh) 2004-11-30 2008-09-10 株式会社东芝 半导体封装及半导体模块

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