JP2009049052A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP2009049052A JP2009049052A JP2007211221A JP2007211221A JP2009049052A JP 2009049052 A JP2009049052 A JP 2009049052A JP 2007211221 A JP2007211221 A JP 2007211221A JP 2007211221 A JP2007211221 A JP 2007211221A JP 2009049052 A JP2009049052 A JP 2009049052A
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- interlayer insulating
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000011229 interlayer Substances 0.000 claims abstract description 45
- 238000004380 ashing Methods 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 230000008569 process Effects 0.000 claims abstract description 26
- 150000002500 ions Chemical class 0.000 claims abstract description 24
- 239000011368 organic material Substances 0.000 claims abstract description 22
- 238000009832 plasma treatment Methods 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 65
- 239000007789 gas Substances 0.000 claims description 19
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims description 9
- 229910010272 inorganic material Inorganic materials 0.000 claims description 2
- 239000011147 inorganic material Substances 0.000 claims description 2
- 230000002542 deteriorative effect Effects 0.000 abstract description 2
- 239000010949 copper Substances 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 16
- 230000001681 protective effect Effects 0.000 description 11
- 230000004888 barrier function Effects 0.000 description 10
- 238000005530 etching Methods 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000005596 ionic collisions Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
- H01L21/76808—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures involving intermediate temporary filling with material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
- H01L21/76831—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches, e.g. non-conductive sidewall liners
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76814—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
Abstract
【解決手段】基板101上に層間絶縁膜103を介して形成された有機材料膜105をプラズマ処理によってアッシング除去する工程を行う半導体装置の製造方法において、プラズマ処理は、プラズマ中のイオンを基板101へ引き込むために基板1に印加するRFバイアスをTMバイアスとしてパルス状にオン/オフ印加する。
【選択図】図1
Description
図1は、本発明の第1実施形態を説明するための断面工程図であり、この図に基づいて第1実施形態を説明する。
Gap間隔 :40mm
ソースパワー :1000W
RFバイアス ;800kHz
RFバイアスパワー:100W(TMバイアスDuty比;20m秒:20m秒)
プロセスガス :H2/N2=100/100sccm
圧力 :30mTorr
基板温度 :20℃
処理時間 :60秒
Gap間隔 :40mm
ソースパワー :1000W
RFバイアス ;800kHz
RFバイアスパワー:100W(TMバイアスDuty比;10m秒:30m秒)
プロセスガス :O2=300sccm
圧力 :20mTorr
基板温度 :0℃
処理時間 :70秒
Claims (4)
- 基板上に層間絶縁膜を介して形成された有機材料膜をプラズマ処理によってアッシング除去する工程を行う半導体装置の製造方法において、
前記プラズマ処理は、プラズマ中のイオンを前記基板へ引き込むための電力印加を周期的にオン/オフさせながら行う
ことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記プラズマ処理は、プロセスガスとして窒素を含むガスを用いる
ことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記層間絶縁膜が、酸化シリコンよりも誘電率の低い無機系の材料膜からなる
ことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記プラズマ処理は、露出側壁に改質層を形成しながら行われる
ことを特徴とする半導体装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007211221A JP5251033B2 (ja) | 2007-08-14 | 2007-08-14 | 半導体装置の製造方法 |
US12/190,351 US20090047793A1 (en) | 2007-08-14 | 2008-08-12 | Method of manufacturing semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007211221A JP5251033B2 (ja) | 2007-08-14 | 2007-08-14 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009049052A true JP2009049052A (ja) | 2009-03-05 |
JP5251033B2 JP5251033B2 (ja) | 2013-07-31 |
Family
ID=40363308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007211221A Expired - Fee Related JP5251033B2 (ja) | 2007-08-14 | 2007-08-14 | 半導体装置の製造方法 |
Country Status (2)
Country | Link |
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US (1) | US20090047793A1 (ja) |
JP (1) | JP5251033B2 (ja) |
Cited By (2)
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JP2019526169A (ja) * | 2016-06-29 | 2019-09-12 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 材料改質とrfパルスを用いた選択的エッチング |
WO2022230414A1 (ja) * | 2021-04-28 | 2022-11-03 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置及びエッチング方法 |
Families Citing this family (29)
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JP5654794B2 (ja) * | 2010-07-15 | 2015-01-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US9132436B2 (en) | 2012-09-21 | 2015-09-15 | Applied Materials, Inc. | Chemical control features in wafer process equipment |
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US10504700B2 (en) | 2015-08-27 | 2019-12-10 | Applied Materials, Inc. | Plasma etching systems and methods with secondary plasma injection |
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US11417534B2 (en) | 2018-09-21 | 2022-08-16 | Applied Materials, Inc. | Selective material removal |
US11682560B2 (en) | 2018-10-11 | 2023-06-20 | Applied Materials, Inc. | Systems and methods for hafnium-containing film removal |
US11121002B2 (en) | 2018-10-24 | 2021-09-14 | Applied Materials, Inc. | Systems and methods for etching metals and metal derivatives |
US11437242B2 (en) | 2018-11-27 | 2022-09-06 | Applied Materials, Inc. | Selective removal of silicon-containing materials |
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JP2006156486A (ja) * | 2004-11-25 | 2006-06-15 | Tokyo Electron Ltd | 基板処理方法および半導体装置の製造方法 |
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JP2004103971A (ja) * | 2002-09-12 | 2004-04-02 | Hitachi High-Technologies Corp | ダマシン処理方法、ダマシン処理装置および、ダマシン構造 |
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2007
- 2007-08-14 JP JP2007211221A patent/JP5251033B2/ja not_active Expired - Fee Related
-
2008
- 2008-08-12 US US12/190,351 patent/US20090047793A1/en not_active Abandoned
Patent Citations (2)
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WO2003083935A1 (fr) * | 2002-04-03 | 2003-10-09 | Nec Corporation | Dispositif a semiconducteur et son procede de production |
JP2006156486A (ja) * | 2004-11-25 | 2006-06-15 | Tokyo Electron Ltd | 基板処理方法および半導体装置の製造方法 |
Cited By (3)
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JP2019526169A (ja) * | 2016-06-29 | 2019-09-12 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 材料改質とrfパルスを用いた選択的エッチング |
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Also Published As
Publication number | Publication date |
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US20090047793A1 (en) | 2009-02-19 |
JP5251033B2 (ja) | 2013-07-31 |
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