JP2009038279A5 - - Google Patents

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Publication number
JP2009038279A5
JP2009038279A5 JP2007202751A JP2007202751A JP2009038279A5 JP 2009038279 A5 JP2009038279 A5 JP 2009038279A5 JP 2007202751 A JP2007202751 A JP 2007202751A JP 2007202751 A JP2007202751 A JP 2007202751A JP 2009038279 A5 JP2009038279 A5 JP 2009038279A5
Authority
JP
Japan
Prior art keywords
electrode
semiconductor device
resin protrusion
semiconductor
polygon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007202751A
Other languages
English (en)
Japanese (ja)
Other versions
JP4924831B2 (ja
JP2009038279A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007202751A priority Critical patent/JP4924831B2/ja
Priority claimed from JP2007202751A external-priority patent/JP4924831B2/ja
Publication of JP2009038279A publication Critical patent/JP2009038279A/ja
Publication of JP2009038279A5 publication Critical patent/JP2009038279A5/ja
Application granted granted Critical
Publication of JP4924831B2 publication Critical patent/JP4924831B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007202751A 2007-08-03 2007-08-03 半導体装置及び電子デバイス Expired - Fee Related JP4924831B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007202751A JP4924831B2 (ja) 2007-08-03 2007-08-03 半導体装置及び電子デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007202751A JP4924831B2 (ja) 2007-08-03 2007-08-03 半導体装置及び電子デバイス

Publications (3)

Publication Number Publication Date
JP2009038279A JP2009038279A (ja) 2009-02-19
JP2009038279A5 true JP2009038279A5 (enExample) 2010-09-09
JP4924831B2 JP4924831B2 (ja) 2012-04-25

Family

ID=40439911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007202751A Expired - Fee Related JP4924831B2 (ja) 2007-08-03 2007-08-03 半導体装置及び電子デバイス

Country Status (1)

Country Link
JP (1) JP4924831B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5954519B2 (ja) * 2011-03-15 2016-07-20 セイコーエプソン株式会社 電子部品及び電子部品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237459A (ja) * 2005-02-28 2006-09-07 Matsushita Electric Ind Co Ltd 配線基板およびそれを用いた半導体装置
JP4224717B2 (ja) * 2005-07-11 2009-02-18 セイコーエプソン株式会社 半導体装置
JP2007165744A (ja) * 2005-12-16 2007-06-28 Epson Imaging Devices Corp 半導体装置、実装構造体、電気光学装置、半導体装置の製造方法、実装構造体の製造方法、電気光学装置の製造方法、及び、電子機器

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