JP2009010063A5 - - Google Patents
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- Publication number
- JP2009010063A5 JP2009010063A5 JP2007168379A JP2007168379A JP2009010063A5 JP 2009010063 A5 JP2009010063 A5 JP 2009010063A5 JP 2007168379 A JP2007168379 A JP 2007168379A JP 2007168379 A JP2007168379 A JP 2007168379A JP 2009010063 A5 JP2009010063 A5 JP 2009010063A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- forming body
- circuit forming
- circuit
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 claims 13
- 239000004840 adhesive resin Substances 0.000 claims 12
- 229920006223 adhesive resin Polymers 0.000 claims 12
- 238000013459 approach Methods 0.000 claims 6
- 230000001681 protective effect Effects 0.000 claims 6
- 238000002788 crimping Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 229920001187 thermosetting polymer Polymers 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007168379A JP5005443B2 (ja) | 2007-06-27 | 2007-06-27 | 電極接合ユニット及び電極接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007168379A JP5005443B2 (ja) | 2007-06-27 | 2007-06-27 | 電極接合ユニット及び電極接合方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009010063A JP2009010063A (ja) | 2009-01-15 |
| JP2009010063A5 true JP2009010063A5 (enrdf_load_stackoverflow) | 2010-04-30 |
| JP5005443B2 JP5005443B2 (ja) | 2012-08-22 |
Family
ID=40324890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007168379A Expired - Fee Related JP5005443B2 (ja) | 2007-06-27 | 2007-06-27 | 電極接合ユニット及び電極接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5005443B2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024204086A1 (ja) * | 2023-03-28 | 2024-10-03 | 古河電気工業株式会社 | ケーブル組立体、回転コネクタ装置、及びケーブル組立体の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232318A (ja) * | 1993-02-05 | 1994-08-19 | Sharp Corp | 半田付け用リード端子 |
| JPH0878477A (ja) * | 1994-08-31 | 1996-03-22 | Toshiba Corp | ボンディングツ−ル |
| JPH08146450A (ja) * | 1994-11-24 | 1996-06-07 | Sanyo Electric Co Ltd | 液晶表示装置 |
| JP3603890B2 (ja) * | 2002-03-06 | 2004-12-22 | セイコーエプソン株式会社 | 電子デバイス及びその製造方法並びに電子機器 |
| JP2004212493A (ja) * | 2002-12-27 | 2004-07-29 | Optrex Corp | 配線接続構造、配線接続構造の製造方法および有機エレクトロルミネッセンス表示装置 |
| JP2005241837A (ja) * | 2004-02-25 | 2005-09-08 | Advanced Display Inc | 表示装置および表示装置の製造方法 |
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2007
- 2007-06-27 JP JP2007168379A patent/JP5005443B2/ja not_active Expired - Fee Related