JP5005443B2 - 電極接合ユニット及び電極接合方法 - Google Patents
電極接合ユニット及び電極接合方法 Download PDFInfo
- Publication number
- JP5005443B2 JP5005443B2 JP2007168379A JP2007168379A JP5005443B2 JP 5005443 B2 JP5005443 B2 JP 5005443B2 JP 2007168379 A JP2007168379 A JP 2007168379A JP 2007168379 A JP2007168379 A JP 2007168379A JP 5005443 B2 JP5005443 B2 JP 5005443B2
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- Prior art keywords
- electrode
- bonding
- adhesive resin
- forming body
- circuit forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Wire Bonding (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2007168379A JP5005443B2 (ja) | 2007-06-27 | 2007-06-27 | 電極接合ユニット及び電極接合方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007168379A JP5005443B2 (ja) | 2007-06-27 | 2007-06-27 | 電極接合ユニット及び電極接合方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009010063A JP2009010063A (ja) | 2009-01-15 |
JP2009010063A5 JP2009010063A5 (enrdf_load_stackoverflow) | 2010-04-30 |
JP5005443B2 true JP5005443B2 (ja) | 2012-08-22 |
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ID=40324890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007168379A Expired - Fee Related JP5005443B2 (ja) | 2007-06-27 | 2007-06-27 | 電極接合ユニット及び電極接合方法 |
Country Status (1)
Country | Link |
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JP (1) | JP5005443B2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024204086A1 (ja) * | 2023-03-28 | 2024-10-03 | 古河電気工業株式会社 | ケーブル組立体、回転コネクタ装置、及びケーブル組立体の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06232318A (ja) * | 1993-02-05 | 1994-08-19 | Sharp Corp | 半田付け用リード端子 |
JPH0878477A (ja) * | 1994-08-31 | 1996-03-22 | Toshiba Corp | ボンディングツ−ル |
JPH08146450A (ja) * | 1994-11-24 | 1996-06-07 | Sanyo Electric Co Ltd | 液晶表示装置 |
JP3603890B2 (ja) * | 2002-03-06 | 2004-12-22 | セイコーエプソン株式会社 | 電子デバイス及びその製造方法並びに電子機器 |
JP2004212493A (ja) * | 2002-12-27 | 2004-07-29 | Optrex Corp | 配線接続構造、配線接続構造の製造方法および有機エレクトロルミネッセンス表示装置 |
JP2005241837A (ja) * | 2004-02-25 | 2005-09-08 | Advanced Display Inc | 表示装置および表示装置の製造方法 |
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2007
- 2007-06-27 JP JP2007168379A patent/JP5005443B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2009010063A (ja) | 2009-01-15 |
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