JP2008546182A5 - - Google Patents

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Publication number
JP2008546182A5
JP2008546182A5 JP2008512507A JP2008512507A JP2008546182A5 JP 2008546182 A5 JP2008546182 A5 JP 2008546182A5 JP 2008512507 A JP2008512507 A JP 2008512507A JP 2008512507 A JP2008512507 A JP 2008512507A JP 2008546182 A5 JP2008546182 A5 JP 2008546182A5
Authority
JP
Japan
Prior art keywords
substrate
mask
charged particles
conductive layer
masked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008512507A
Other languages
English (en)
Japanese (ja)
Other versions
JP5301269B2 (ja
JP2008546182A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2006/019250 external-priority patent/WO2006125089A2/en
Publication of JP2008546182A publication Critical patent/JP2008546182A/ja
Publication of JP2008546182A5 publication Critical patent/JP2008546182A5/ja
Application granted granted Critical
Publication of JP5301269B2 publication Critical patent/JP5301269B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008512507A 2005-05-18 2006-05-18 基板上の動電学的な析出およびパターニング工程のためのマスクおよび方法 Expired - Fee Related JP5301269B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US68213005P 2005-05-18 2005-05-18
US60/682,130 2005-05-18
PCT/US2006/019250 WO2006125089A2 (en) 2005-05-18 2006-05-18 Mask and method for electrokinetic deposition and patterning process on substrates

Publications (3)

Publication Number Publication Date
JP2008546182A JP2008546182A (ja) 2008-12-18
JP2008546182A5 true JP2008546182A5 (enExample) 2009-07-16
JP5301269B2 JP5301269B2 (ja) 2013-09-25

Family

ID=37432143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008512507A Expired - Fee Related JP5301269B2 (ja) 2005-05-18 2006-05-18 基板上の動電学的な析出およびパターニング工程のためのマスクおよび方法

Country Status (6)

Country Link
US (1) US7678255B2 (enExample)
EP (1) EP1882056A2 (enExample)
JP (1) JP5301269B2 (enExample)
KR (1) KR20080022111A (enExample)
TW (1) TWI388697B (enExample)
WO (1) WO2006125089A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7538429B2 (en) * 2006-08-21 2009-05-26 Intel Corporation Method of enabling solder deposition on a substrate and electronic package formed thereby
US8216441B2 (en) * 2007-12-10 2012-07-10 Applied Materials, Inc. Electrophoretic solar cell metallization process and apparatus
US8323998B2 (en) * 2009-05-15 2012-12-04 Achrolux Inc. Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure
KR101104681B1 (ko) * 2010-01-08 2012-01-16 서울대학교산학협력단 비전도성 기판 상에 하전 입자를 부착하는 방법
CN103030097B (zh) * 2012-12-12 2015-06-17 中北大学 基于静电场自聚焦的圆片级低维纳米结构的制备方法
US20170301434A1 (en) * 2016-04-18 2017-10-19 Littelfuse, Inc. Methods for manufacturing an insulated busbar
US10685766B2 (en) 2016-04-18 2020-06-16 Littelfuse, Inc. Methods for manufacturing an insulated busbar
CN107723753B (zh) * 2017-09-27 2021-04-27 上海瑞尔实业有限公司 高强度高韧性镍金属遮蔽工装制备方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431887A (en) 1963-11-13 1969-03-11 Polymer Corp Apparatus for coating articles in a fluidized bed
JPH04211193A (ja) * 1990-03-22 1992-08-03 Canon Inc 導電回路部材、導電回路部材の製造方法、導電性ペースト及び電子機器
US5981043A (en) 1996-04-25 1999-11-09 Tatsuta Electric Wire And Cable Co., Ltd Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield
US5817374A (en) * 1996-05-31 1998-10-06 Electrox Corporation Process for patterning powders into thick layers
WO1998045504A1 (en) 1997-04-04 1998-10-15 University Of Southern California Article, method, and apparatus for electrochemical fabrication
TWI231293B (en) 1997-11-12 2005-04-21 Jsr Corp Transfer film
US6153348A (en) 1998-08-07 2000-11-28 Parelec Llc Electrostatic printing of conductors on photoresists and liquid metallic toners therefor
US6781612B1 (en) 1998-10-13 2004-08-24 Electrox Corporation Electrostatic printing of functional toner materials for electronic manufacturing applications
US6579652B1 (en) 1999-11-23 2003-06-17 Electrox Corporation Durable electrostatic printing plate and method of making the same
US6524758B2 (en) 1999-12-20 2003-02-25 Electrox Corporation Method of manufacture of printed wiring boards and flexible circuitry
TW495809B (en) * 2000-02-28 2002-07-21 Semiconductor Energy Lab Thin film forming device, thin film forming method, and self-light emitting device
US20060071084A1 (en) 2000-12-15 2006-04-06 Electrox Corporation Process for manufacture of novel, inexpensive radio frequency identification devices
JP2002223059A (ja) * 2001-01-24 2002-08-09 Sharp Corp 微細パターン形成方法
US6815130B2 (en) 2001-02-08 2004-11-09 Electrox Corporation Electrostatic printing plate possessing a tiered surface
WO2002071465A1 (en) 2001-03-02 2002-09-12 Electrox Corp. Process for the manufacture of large area arrays of discrete components
US6803092B2 (en) * 2001-06-26 2004-10-12 3M Innovative Properties Company Selective deposition of circuit-protective polymers
US6790483B2 (en) 2002-12-06 2004-09-14 Eastman Kodak Company Method for producing patterned deposition from compressed fluid
US6780249B2 (en) 2002-12-06 2004-08-24 Eastman Kodak Company System for producing patterned deposition from compressed fluid in a partially opened deposition chamber
WO2005033352A2 (en) 2003-07-09 2005-04-14 Fry's Metals, Inc. Deposition and patterning process
CN100542692C (zh) 2003-07-09 2009-09-23 福莱金属公司 包覆金属颗粒
JP2007277619A (ja) * 2006-04-05 2007-10-25 Electroplating Eng Of Japan Co 電気泳動による粒子堆積方法

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