JP5301269B2 - 基板上の動電学的な析出およびパターニング工程のためのマスクおよび方法 - Google Patents

基板上の動電学的な析出およびパターニング工程のためのマスクおよび方法 Download PDF

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JP5301269B2
JP5301269B2 JP2008512507A JP2008512507A JP5301269B2 JP 5301269 B2 JP5301269 B2 JP 5301269B2 JP 2008512507 A JP2008512507 A JP 2008512507A JP 2008512507 A JP2008512507 A JP 2008512507A JP 5301269 B2 JP5301269 B2 JP 5301269B2
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substrate
mask
particles
charged particles
conductive layer
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JP2008546182A5 (enExample
JP2008546182A (ja
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ハセレブ，オスカー
ルイス，ブライアン，ジー．
マーチ，マイケル
シン，バワ
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Alpha Assembly Solutions Inc
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Frys Metals Inc
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    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2008512507A 2005-05-18 2006-05-18 基板上の動電学的な析出およびパターニング工程のためのマスクおよび方法 Expired - Fee Related JP5301269B2 (ja)

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US68213005P 2005-05-18 2005-05-18
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PCT/US2006/019250 WO2006125089A2 (en) 2005-05-18 2006-05-18 Mask and method for electrokinetic deposition and patterning process on substrates

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US8216441B2 (en) * 2007-12-10 2012-07-10 Applied Materials, Inc. Electrophoretic solar cell metallization process and apparatus
US8323998B2 (en) * 2009-05-15 2012-12-04 Achrolux Inc. Methods and apparatus for forming uniform layers of phosphor material on an LED encapsulation structure
KR101104681B1 (ko) * 2010-01-08 2012-01-16 서울대학교산학협력단 비전도성 기판 상에 하전 입자를 부착하는 방법
CN103030097B (zh) * 2012-12-12 2015-06-17 中北大学 基于静电场自聚焦的圆片级低维纳米结构的制备方法
US20170301434A1 (en) * 2016-04-18 2017-10-19 Littelfuse, Inc. Methods for manufacturing an insulated busbar
US10685766B2 (en) 2016-04-18 2020-06-16 Littelfuse, Inc. Methods for manufacturing an insulated busbar
CN107723753B (zh) * 2017-09-27 2021-04-27 上海瑞尔实业有限公司 高强度高韧性镍金属遮蔽工装制备方法

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TWI388697B (zh) 2013-03-11
WO2006125089A2 (en) 2006-11-23
JP2008546182A (ja) 2008-12-18
US20060260943A1 (en) 2006-11-23
TW200706704A (en) 2007-02-16
EP1882056A2 (en) 2008-01-30
WO2006125089A3 (en) 2007-11-22
KR20080022111A (ko) 2008-03-10

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