JP2012513672A5 - - Google Patents

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Publication number
JP2012513672A5
JP2012513672A5 JP2011542124A JP2011542124A JP2012513672A5 JP 2012513672 A5 JP2012513672 A5 JP 2012513672A5 JP 2011542124 A JP2011542124 A JP 2011542124A JP 2011542124 A JP2011542124 A JP 2011542124A JP 2012513672 A5 JP2012513672 A5 JP 2012513672A5
Authority
JP
Japan
Prior art keywords
thermoplastic particles
substrate
image
conductive powder
thermoplastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011542124A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012513672A (ja
Filing date
Publication date
Priority claimed from US12/341,099 external-priority patent/US8512933B2/en
Application filed filed Critical
Publication of JP2012513672A publication Critical patent/JP2012513672A/ja
Publication of JP2012513672A5 publication Critical patent/JP2012513672A5/ja
Withdrawn legal-status Critical Current

Links

JP2011542124A 2008-12-22 2009-12-14 電子写真を用いる電子回路基板の製造方法 Withdrawn JP2012513672A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/341,099 2008-12-22
US12/341,099 US8512933B2 (en) 2008-12-22 2008-12-22 Method of producing electronic circuit boards using electrophotography
PCT/US2009/006541 WO2010090631A1 (en) 2008-12-22 2009-12-14 Method of producing electronic circuit boards using electrophotography

Publications (2)

Publication Number Publication Date
JP2012513672A JP2012513672A (ja) 2012-06-14
JP2012513672A5 true JP2012513672A5 (enExample) 2013-01-10

Family

ID=42154701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011542124A Withdrawn JP2012513672A (ja) 2008-12-22 2009-12-14 電子写真を用いる電子回路基板の製造方法

Country Status (5)

Country Link
US (2) US8512933B2 (enExample)
EP (1) EP2368412A1 (enExample)
JP (1) JP2012513672A (enExample)
CN (1) CN102265713A (enExample)
WO (1) WO2010090631A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
MY168368A (en) * 2010-10-14 2018-10-31 Stora Enso Oyj Method and arrangement for attaching a chip to a printed conductive surface
CN104244609B (zh) * 2013-06-19 2018-04-06 南昌欧菲光科技有限公司 基材双面塞孔装置
US9465346B2 (en) 2014-06-24 2016-10-11 Kabushiki Kaisha Toshiba Metallic color image forming apparatus and metallic color image forming method
SE539800C2 (en) 2015-05-26 2017-12-05 Stora Enso Oyj Method and arrangement for producing electrically conductive patterns on substrates
US20170044416A1 (en) 2015-08-10 2017-02-16 Delavan Inc Particulates for additive manufacturing techniques
US10437169B2 (en) 2016-03-31 2019-10-08 Hp Indigo B.V. Photoconductor charging uniformity correction
US10682703B2 (en) * 2017-11-07 2020-06-16 Aaron Roni Shafir Systems and methods for delivering materials for printing three dimensional (3D) objects
AU2018432186B2 (en) * 2018-10-05 2021-02-18 Mayekawa Mfg. Co., Ltd. Clamping device for bone-in limb meat, loading device for bone-in limb meat, and clamping method for bone-in limb meat

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095117A (en) * 1963-12-26 1967-12-13 Matsushita Electric Industrial Co Ltd Method of making printed circuit board
US3997344A (en) * 1974-07-05 1976-12-14 American Can Company Dry positive photopolymer imaging process involving heating and application of toner
JP4680362B2 (ja) * 2000-09-22 2011-05-11 株式会社石井工作研究所 電子部品の製造方法及び製造装置
US20060071084A1 (en) 2000-12-15 2006-04-06 Electrox Corporation Process for manufacture of novel, inexpensive radio frequency identification devices
JP2004048030A (ja) 2002-07-15 2004-02-12 Toshiba Corp 電子回路の製造方法および電子回路の製造装置
US7051429B2 (en) 2003-04-11 2006-05-30 Eastman Kodak Company Method for forming a medium having data storage and communication capabilities
US7163734B2 (en) 2003-08-26 2007-01-16 Eastman Kodak Company Patterning of electrically conductive layers by ink printing methods
US7033713B2 (en) 2003-08-26 2006-04-25 Eastman Kodak Electrographic patterning of conductive electrode layers containing electrically-conductive polymeric materials
US6872500B2 (en) 2003-08-26 2005-03-29 Eastman Kodak Company Method of patterning an electroconductive layer on a support
US6893790B2 (en) 2003-08-26 2005-05-17 Eastman Kodak Company Photopatterning of conductive electrode layers containing electrically-conductive polymer particles
JP2005203396A (ja) * 2004-01-13 2005-07-28 Toshiba Corp 電子部品の製造装置、電子部品の製造方法および電子部品
JP3947776B2 (ja) 2004-05-13 2007-07-25 ニスカ株式会社 導電性材料及びその製造方法
US7593656B2 (en) 2004-10-20 2009-09-22 Eastman Kodak Company Method and device for controlling registration
US20070218258A1 (en) * 2006-03-20 2007-09-20 3M Innovative Properties Company Articles and methods including patterned substrates formed from densified, adhered metal powders
US20090145548A1 (en) * 2007-12-08 2009-06-11 Chien-Han Ho Method Of Forming Printed Circuit By Printing Method

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