CN102265713A - 使用电子照相术制造电路板的方法 - Google Patents

使用电子照相术制造电路板的方法 Download PDF

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Publication number
CN102265713A
CN102265713A CN2009801521821A CN200980152182A CN102265713A CN 102265713 A CN102265713 A CN 102265713A CN 2009801521821 A CN2009801521821 A CN 2009801521821A CN 200980152182 A CN200980152182 A CN 200980152182A CN 102265713 A CN102265713 A CN 102265713A
Authority
CN
China
Prior art keywords
conductive powder
substrate
thermoplastic
image
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801521821A
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English (en)
Chinese (zh)
Inventor
T·N·汤姆斯
D·S·瑞麦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eastman Kodak Co
Original Assignee
Eastman Kodak Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co
Publication of CN102265713A publication Critical patent/CN102265713A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H85/00—Recirculating articles, i.e. feeding each article to, and delivering it from, the same machine work-station more than once
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/14—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base
    • G03G15/16—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer
    • G03G15/1625—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer on a base other than paper
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
    • G03G15/221—Machines other than electrographic copiers, e.g. electrophotographic cameras, electrostatic typewriters
    • G03G15/224—Machines for forming tactile or three dimensional images by electrographic means, e.g. braille, 3d printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
    • G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • G03G15/65—Apparatus which relate to the handling of copy material
    • G03G15/6588—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material
    • G03G15/6591—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material characterised by the recording material, e.g. plastic material, OHP, ceramics, tiles, textiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/30—Orientation, displacement, position of the handled material
    • B65H2301/33—Modifying, selecting, changing orientation
    • B65H2301/333—Inverting
    • B65H2301/3331—Involving forward reverse transporting means
    • B65H2301/33312—Involving forward reverse transporting means forward reverse rollers pairs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G2215/00—Apparatus for electrophotographic processes
    • G03G2215/00362—Apparatus for electrophotographic processes relating to the copy medium handling
    • G03G2215/00443—Copy medium
    • G03G2215/00523—Other special types, e.g. tabbed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0517—Electrographic patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0522—Using an adhesive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Textile Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combination Of More Than One Step In Electrophotography (AREA)
CN2009801521821A 2008-12-22 2009-12-14 使用电子照相术制造电路板的方法 Pending CN102265713A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/341,099 2008-12-22
US12/341,099 US8512933B2 (en) 2008-12-22 2008-12-22 Method of producing electronic circuit boards using electrophotography
PCT/US2009/006541 WO2010090631A1 (en) 2008-12-22 2009-12-14 Method of producing electronic circuit boards using electrophotography

Publications (1)

Publication Number Publication Date
CN102265713A true CN102265713A (zh) 2011-11-30

Family

ID=42154701

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801521821A Pending CN102265713A (zh) 2008-12-22 2009-12-14 使用电子照相术制造电路板的方法

Country Status (5)

Country Link
US (2) US8512933B2 (enExample)
EP (1) EP2368412A1 (enExample)
JP (1) JP2012513672A (enExample)
CN (1) CN102265713A (enExample)
WO (1) WO2010090631A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014201740A1 (zh) * 2013-06-19 2014-12-24 南昌欧菲光科技有限公司 基材双面塞孔装置
CN111405952A (zh) * 2017-11-07 2020-07-10 亚伦·罗尼·沙菲尔 用于输送用于打印三维(3d)对象的材料的系统和方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
MY168368A (en) * 2010-10-14 2018-10-31 Stora Enso Oyj Method and arrangement for attaching a chip to a printed conductive surface
US9465346B2 (en) 2014-06-24 2016-10-11 Kabushiki Kaisha Toshiba Metallic color image forming apparatus and metallic color image forming method
SE539800C2 (en) 2015-05-26 2017-12-05 Stora Enso Oyj Method and arrangement for producing electrically conductive patterns on substrates
US20170044416A1 (en) 2015-08-10 2017-02-16 Delavan Inc Particulates for additive manufacturing techniques
US10437169B2 (en) 2016-03-31 2019-10-08 Hp Indigo B.V. Photoconductor charging uniformity correction
AU2018432186B2 (en) * 2018-10-05 2021-02-18 Mayekawa Mfg. Co., Ltd. Clamping device for bone-in limb meat, loading device for bone-in limb meat, and clamping method for bone-in limb meat

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4091194A (en) * 1974-07-05 1978-05-23 American Can Company Dry photopolymer imaging process
US20040197487A1 (en) * 2002-07-15 2004-10-07 Hideo Aoki Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit
TW200525651A (en) * 2004-01-13 2005-08-01 Toshiba Kk Electronic component manufacturing apparatus, electronic component manufacturing method, and electronic component

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GB1095117A (en) * 1963-12-26 1967-12-13 Matsushita Electric Industrial Co Ltd Method of making printed circuit board
JP4680362B2 (ja) * 2000-09-22 2011-05-11 株式会社石井工作研究所 電子部品の製造方法及び製造装置
US20060071084A1 (en) 2000-12-15 2006-04-06 Electrox Corporation Process for manufacture of novel, inexpensive radio frequency identification devices
US7051429B2 (en) 2003-04-11 2006-05-30 Eastman Kodak Company Method for forming a medium having data storage and communication capabilities
US7163734B2 (en) 2003-08-26 2007-01-16 Eastman Kodak Company Patterning of electrically conductive layers by ink printing methods
US7033713B2 (en) 2003-08-26 2006-04-25 Eastman Kodak Electrographic patterning of conductive electrode layers containing electrically-conductive polymeric materials
US6872500B2 (en) 2003-08-26 2005-03-29 Eastman Kodak Company Method of patterning an electroconductive layer on a support
US6893790B2 (en) 2003-08-26 2005-05-17 Eastman Kodak Company Photopatterning of conductive electrode layers containing electrically-conductive polymer particles
JP3947776B2 (ja) 2004-05-13 2007-07-25 ニスカ株式会社 導電性材料及びその製造方法
US7593656B2 (en) 2004-10-20 2009-09-22 Eastman Kodak Company Method and device for controlling registration
US20070218258A1 (en) * 2006-03-20 2007-09-20 3M Innovative Properties Company Articles and methods including patterned substrates formed from densified, adhered metal powders
US20090145548A1 (en) * 2007-12-08 2009-06-11 Chien-Han Ho Method Of Forming Printed Circuit By Printing Method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4091194A (en) * 1974-07-05 1978-05-23 American Can Company Dry photopolymer imaging process
US20040197487A1 (en) * 2002-07-15 2004-10-07 Hideo Aoki Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit
TW200525651A (en) * 2004-01-13 2005-08-01 Toshiba Kk Electronic component manufacturing apparatus, electronic component manufacturing method, and electronic component

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014201740A1 (zh) * 2013-06-19 2014-12-24 南昌欧菲光科技有限公司 基材双面塞孔装置
CN104244609A (zh) * 2013-06-19 2014-12-24 南昌欧菲光科技有限公司 基材双面塞孔装置
US9751104B2 (en) 2013-06-19 2017-09-05 Nanchang O-Film Tech Co., Ltd. Apparatus for substrate double-surface hole-filling
CN104244609B (zh) * 2013-06-19 2018-04-06 南昌欧菲光科技有限公司 基材双面塞孔装置
CN111405952A (zh) * 2017-11-07 2020-07-10 亚伦·罗尼·沙菲尔 用于输送用于打印三维(3d)对象的材料的系统和方法

Also Published As

Publication number Publication date
US20100159373A1 (en) 2010-06-24
JP2012513672A (ja) 2012-06-14
US20130004892A1 (en) 2013-01-03
EP2368412A1 (en) 2011-09-28
US8512933B2 (en) 2013-08-20
US8497057B2 (en) 2013-07-30
WO2010090631A1 (en) 2010-08-12

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Application publication date: 20111130