JP2008546170A - フレキシブルなプリント配線板を備えた制御ユニット - Google Patents
フレキシブルなプリント配線板を備えた制御ユニット Download PDFInfo
- Publication number
- JP2008546170A JP2008546170A JP2008511659A JP2008511659A JP2008546170A JP 2008546170 A JP2008546170 A JP 2008546170A JP 2008511659 A JP2008511659 A JP 2008511659A JP 2008511659 A JP2008511659 A JP 2008511659A JP 2008546170 A JP2008546170 A JP 2008546170A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- flexible printed
- control unit
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 25
- 239000003990 capacitor Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
Abstract
Description
フレキシブルなプリント配線板が設けられており、
リジットなプリント配線板が設けられており、該リジットなプリント配線板に電子構成部分が装着されており、
フレキシブルなプリント配線板がリジットなプリント配線板に電気的に接続されており、
リジットなプリント配線板と、フレキシブルなプリント配線板の一部とが、1つのハウジング内に配置されており、
該ハウジングを通ってフレキシブルなプリント配線板が貫通案内されている
形式の制御ユニットに関する。
全ての電子構成部分が一様に、フレキシブルなプリント配線板への転出のために適しているわけではない。転出に適しているのは基本的に、リジットなプリント配線板とフレキシブルなプリント配線板との間にできるだけ僅かな付加的なボンディング結合しか形成しない機能ブロックである。また、リジットなプリント配線板の導体路を、フレキシブルなプリント配線板の導体路よりも小さな寸法で形成することができる。したがって、傾向的には、著しく密集しておらずかつかつそれほど多くはない接続部しか有しない電子構成部分の方が簡単に、フレキシブルなプリント配線板へ転出され得る。なぜならば、フレキシブルなプリント配線板では導体路は任意に密接して位置することができないからである。
図2は、慣用のトランスミッション制御部の構造を示す概略図であり、
図3は、慣用のトランスミッション制御部と、本発明の第1実施例とを対比して示す側面図であり、
図4は、本発明の別の実施例における制御ユニットの概略図である。
Claims (10)
- 車両コンポーネントに用いられる制御ユニットであって、
フレキシブルなプリント配線板(3)が設けられており、
リジットなプリント配線板(5)が設けられており、該リジットなプリント配線板(5)に電子構成部分(7)が装着されており、
フレキシブルなプリント配線板(3)がリジットなプリント配線板(5)に電気的に接続されており、
リジットなプリント配線板(5)と、フレキシブルなプリント配線板(3)の一部とが、1つのハウジング内に配置されており、
該ハウジングを通ってフレキシブルなプリント配線板(3)が貫通案内されている
形式のものにおいて、
フレキシブルなプリント配線板(3)にハウジングの内部で電子構成部分(7´)が装着されている
ことを特徴とする制御ユニット。 - フレキシブルなプリント配線板(3)にハウジングの外部で電子構成部分(7´´)が装着されている、請求項1記載の制御ユニット。
- フレキシブルなプリント配線板(3)に、1つまたは複数のコンデンサおよび/または1つまたは複数のトランジスタおよび/または1つまたは複数の抵抗および/または1つまたは複数の電圧調整器および/または1つまたは複数のセンサ、特にホールセンサが装着されている、請求項1または2記載の制御ユニット。
- ハウジングがオイル密であり、フレキシブルなプリント配線板(3)が該ハウジングを通ってオイル密に貫通案内されている、請求項1から3までのいずれか1項記載の制御ユニット。
- フレキシブルなプリント配線板(3)が、絶縁性のベース層と、絶縁性のカバー層とを有しており、該カバー層が切欠きを有しており、該切欠きに電子構成部分(7´,7´´)が配置されている、請求項1から4までのいずれか1項記載の制御ユニット。
- フレキシブルなプリント配線板(3)が、導体路(34)を備えた正確に1つの層を有している、請求項1から5までのいずれか1項記載の制御ユニット。
- フレキシブルなプリント配線板(3)が、導体路(34)を備えた複数の層を有している、請求項1から6までのいずれか1項記載の制御ユニット。
- フレキシブルなプリント配線板(3)に設けられた導体路(34)のうちの少なくとも1つが、ボンディング結合部(9)によって橋絡されている、請求項6または7記載の制御ユニット。
- フレキシブルなプリント配線板(3)が複数の部分から成っている、請求項1から8までのいずれか1項記載の制御ユニット。
- 当該制御ユニットが、車両トランスミッションに用いられる制御ユニットである、請求項1から9までのいずれか1項記載の制御ユニット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005022536A DE102005022536A1 (de) | 2005-05-17 | 2005-05-17 | Steuereinheit mit einer flexiblen Leiterplatte |
DE102005022536.5 | 2005-05-17 | ||
PCT/EP2006/050505 WO2006122837A1 (de) | 2005-05-17 | 2006-01-30 | Steuereinheit mit einer flexiblen leiterplatte |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008546170A true JP2008546170A (ja) | 2008-12-18 |
JP5124449B2 JP5124449B2 (ja) | 2013-01-23 |
Family
ID=36218147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008511659A Active JP5124449B2 (ja) | 2005-05-17 | 2006-01-30 | フレキシブルなプリント配線板を備えた制御ユニット |
Country Status (7)
Country | Link |
---|---|
US (1) | US8004849B2 (ja) |
EP (1) | EP1882401B1 (ja) |
JP (1) | JP5124449B2 (ja) |
KR (1) | KR20080015012A (ja) |
CN (1) | CN101176392B (ja) |
DE (1) | DE102005022536A1 (ja) |
WO (1) | WO2006122837A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101008436B1 (ko) * | 2009-08-21 | 2011-01-14 | 삼성전기주식회사 | 인쇄회로기판 및 이를 이용한 카메라 모듈 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006033269B4 (de) * | 2006-07-18 | 2010-10-28 | Continental Automotive Gmbh | Verfahren zum Herstellen einer Anordnung mit einem flexiblen Leiterträger, einer Basisplatte und einem Dichtkörper |
DE102007013619B4 (de) * | 2007-03-21 | 2019-07-11 | Continental Automotive Gmbh | Elektronikbauteil mit neuer flexibler Leiterplattentechnologie, Verfahren zu seiner Herstellung sowie Verwendung eines solchem. |
DE102007017529B4 (de) * | 2007-04-13 | 2012-04-26 | Continental Automotive Gmbh | Modul für eine elektronische Steuervorrichtung mit vereinfachtem Aufbau, Verfahren zur Herstellung sowie Verwendung eines solchen Moduls |
DE102007028512A1 (de) * | 2007-06-21 | 2008-12-24 | Robert Bosch Gmbh | Elektrisches Bauteil |
DE102007029913A1 (de) | 2007-06-28 | 2009-01-02 | Robert Bosch Gmbh | Elektrisches Steuergerät |
DE102007032593B3 (de) * | 2007-07-12 | 2008-11-13 | Continental Automotive Gmbh | Steuervorrichtung |
DE102007032535B4 (de) | 2007-07-12 | 2009-09-24 | Continental Automotive Gmbh | Elektronisches Modul für eine integrierte mechatronische Getriebesteuerung |
DE102013218787A1 (de) * | 2013-09-19 | 2015-03-19 | Robert Bosch Gmbh | Hydraulikaggregat aufweisend einen Motor und eine Pumpen-Ventil-Einheit |
FR3015664B1 (fr) * | 2013-12-19 | 2017-03-10 | Airbus Operations Sas | Dispositif de mesure a circuit de commande unique |
DE102014210914A1 (de) * | 2014-06-06 | 2015-12-17 | Conti Temic Microelectronic Gmbh | Flexible Leiterplattenstruktur und die Verwendung der flexiblen Leiterplattenstruktur in einem Steuergerät für ein Kraftfahrzeug |
CN105889183A (zh) * | 2014-09-26 | 2016-08-24 | 罗伯特·博世有限公司 | 具有马达和泵-阀-单元的液压设备 |
DE102014118188A1 (de) | 2014-12-09 | 2016-06-09 | Elringklinger Ag | Zellkontaktierungssystem für eine elektrochemische Vorrichtung |
KR101963069B1 (ko) * | 2015-02-09 | 2019-03-27 | 제이에프이 스틸 가부시키가이샤 | 연자성 분말용 원료 분말 및 압분 자심용 연자성 분말 |
DE102016209485A1 (de) | 2016-05-31 | 2017-11-30 | Robert Bosch Gmbh | Elektronikmodul für ein Getriebesteuergerät mit auf FR4-Leiterplattenfolie verklebtem Deckel |
CN113759238B (zh) * | 2021-10-12 | 2024-01-30 | 云南保利天同水下装备科技有限公司 | 一种用于高低温湿热试验的电路板防护装置及其加工方法 |
KR102620857B1 (ko) * | 2022-06-14 | 2024-01-02 | 주식회사 현대케피코 | 변속기에 내장되는 홀 소자의 자기장 차폐 구조 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10051945C1 (de) * | 2000-10-19 | 2001-11-29 | Siemens Ag | Dichte Aufnahmekammer für Kfz-Elektronikbauteil und Verfahren zur Herstellung derselben |
JP2001356399A (ja) * | 2000-06-16 | 2001-12-26 | Olympus Optical Co Ltd | カメラの電気基板装置 |
JP2002537664A (ja) * | 1999-02-24 | 2002-11-05 | シーメンス アクチエンゲゼルシヤフト | 車両用の制御装置 |
JP2004535532A (ja) * | 2001-03-07 | 2004-11-25 | シーメンス アクチエンゲゼルシヤフト | メカトロニックトランスミッション制御装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4510551A (en) * | 1984-05-21 | 1985-04-09 | Endeco Canada Limited | Portable memory module |
US5280413A (en) * | 1992-09-17 | 1994-01-18 | Ceridian Corporation | Hermetically sealed circuit modules having conductive cap anchors |
DE19542883C2 (de) | 1995-02-02 | 2002-01-17 | Fraunhofer Ges Forschung | Chip-Gehäusung sowie Verfahren zur Herstellung einer Chip-Gehäusung |
JPH09129686A (ja) * | 1995-11-06 | 1997-05-16 | Toshiba Microelectron Corp | テープキャリヤ及びその実装構造 |
DE59806054D1 (de) | 1997-04-02 | 2002-11-28 | Siemens Ag | Elektrische verbindung eines schaltungsträgers mit einem leiterbahnträger |
JP3175673B2 (ja) * | 1997-11-27 | 2001-06-11 | 日本電気株式会社 | 半導体素子を実装したフレキシブル回路基板ユニットの製造方法 |
DE19856839C2 (de) | 1998-12-09 | 2001-07-12 | Siemens Ag | Anordnung aus Motor-oder Getriebesteuergerät und flexibler Leiterplattenstrukt r |
DE19929754C2 (de) | 1999-06-29 | 2001-08-16 | Siemens Ag | Verguß einer bestückten Baugruppe mit vibrationsdämpfender Gießmasse |
DE19955603C1 (de) * | 1999-11-18 | 2001-02-15 | Siemens Ag | Steuergerät für ein Kraftfahrzeug und Herstellungsverfahren |
JP2001308566A (ja) * | 2000-04-26 | 2001-11-02 | Auto Network Gijutsu Kenkyusho:Kk | 車両用制御ユニットの冷却構造 |
DE10032849C2 (de) | 2000-07-06 | 2002-06-20 | Freudenberg Carl Kg | Elektrisches Gerät mit einem Gehäuse aus verfestigtem polymeren Werkstoff |
JP2002141463A (ja) * | 2000-10-31 | 2002-05-17 | Mitsubishi Electric Corp | 半導体モジュール |
DE10110257A1 (de) * | 2001-03-02 | 2002-09-19 | Siemens Ag | Mechatronische Getriebeanordnung für Kraftfahrzeuge |
DE10110620A1 (de) | 2001-03-06 | 2002-09-26 | Conti Temic Microelectronic | Elekronische Baugruppe |
JP4222885B2 (ja) * | 2003-06-04 | 2009-02-12 | 日東電工株式会社 | 配線回路基板 |
US7420817B2 (en) * | 2006-01-09 | 2008-09-02 | Honeywell International Inc. | MEMS device seal using liquid crystal polymer |
-
2005
- 2005-05-17 DE DE102005022536A patent/DE102005022536A1/de not_active Withdrawn
-
2006
- 2006-01-30 WO PCT/EP2006/050505 patent/WO2006122837A1/de not_active Application Discontinuation
- 2006-01-30 KR KR1020077029473A patent/KR20080015012A/ko not_active Application Discontinuation
- 2006-01-30 US US11/911,970 patent/US8004849B2/en not_active Expired - Fee Related
- 2006-01-30 CN CN2006800169742A patent/CN101176392B/zh active Active
- 2006-01-30 JP JP2008511659A patent/JP5124449B2/ja active Active
- 2006-01-30 EP EP06707884A patent/EP1882401B1/de active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002537664A (ja) * | 1999-02-24 | 2002-11-05 | シーメンス アクチエンゲゼルシヤフト | 車両用の制御装置 |
JP2001356399A (ja) * | 2000-06-16 | 2001-12-26 | Olympus Optical Co Ltd | カメラの電気基板装置 |
DE10051945C1 (de) * | 2000-10-19 | 2001-11-29 | Siemens Ag | Dichte Aufnahmekammer für Kfz-Elektronikbauteil und Verfahren zur Herstellung derselben |
JP2004535532A (ja) * | 2001-03-07 | 2004-11-25 | シーメンス アクチエンゲゼルシヤフト | メカトロニックトランスミッション制御装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101008436B1 (ko) * | 2009-08-21 | 2011-01-14 | 삼성전기주식회사 | 인쇄회로기판 및 이를 이용한 카메라 모듈 |
Also Published As
Publication number | Publication date |
---|---|
KR20080015012A (ko) | 2008-02-15 |
EP1882401A1 (de) | 2008-01-30 |
WO2006122837A1 (de) | 2006-11-23 |
US20080156511A1 (en) | 2008-07-03 |
EP1882401B1 (de) | 2012-06-13 |
JP5124449B2 (ja) | 2013-01-23 |
US8004849B2 (en) | 2011-08-23 |
CN101176392A (zh) | 2008-05-07 |
CN101176392B (zh) | 2011-01-12 |
DE102005022536A1 (de) | 2006-11-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5124449B2 (ja) | フレキシブルなプリント配線板を備えた制御ユニット | |
JP5167358B2 (ja) | 簡略化された構造を有する集積電子制御回路のためのモジュール | |
US8895871B2 (en) | Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller | |
KR101203078B1 (ko) | 제어 장치의 시스템 부품 | |
US6483037B1 (en) | Multilayer flexible FR4 circuit | |
JP4991874B2 (ja) | モジュラ式のコンタクトパートナーを備える標準化された電子的ケーシング | |
KR19990063681A (ko) | 다중칩 모듈 | |
US20150029669A1 (en) | Control device and method for producing a control device for a motor vehicle | |
TW526635B (en) | Piezo-bent-converter and its application | |
JP5485173B2 (ja) | 回路離間システム、本質安全電気機器、本質安全フィールド機器及び本質的に安全離間を保つ方法 | |
WO2015076050A1 (ja) | 電子制御装置の実装構造 | |
US7080575B2 (en) | Mechatronic transmission control | |
JP5645693B2 (ja) | 空気流量測定装置 | |
US20080108232A1 (en) | Device for controlling a vehicle | |
CN105555015A (zh) | 用于在污染的介质中使用的电仪器以及用于制造这样的电仪器的方法 | |
US8031473B2 (en) | Control device and method for producing a control device | |
JP2018512724A (ja) | 電子コンポーネントおよびその製造方法 | |
JP5625731B2 (ja) | Icパッケージ、配線基板にicパッケージが実装された回路基板、及び回路基板を備えた電子装置 | |
DE102015219072A1 (de) | Elektronikmodul für ein Getriebesteuergerät | |
JP2010219093A (ja) | 電子回路装置 | |
US20230114396A1 (en) | Power module | |
JP2007166899A (ja) | 自動車制御装置 | |
JP2007180459A (ja) | 配線基板および車載用ecu | |
JP2010219091A (ja) | 電子回路装置 | |
JP2004514278A (ja) | 回路支持体および導体基板または導体基板構成体からなる構成体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100428 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20100728 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20100804 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100830 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20100924 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101228 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110124 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20110204 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20110408 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20111020 |
|
RD01 | Notification of change of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7426 Effective date: 20111023 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20120326 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120614 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120619 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120717 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120720 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120814 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120817 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120904 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121029 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151102 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5124449 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |