JP4991874B2 - モジュラ式のコンタクトパートナーを備える標準化された電子的ケーシング - Google Patents
モジュラ式のコンタクトパートナーを備える標準化された電子的ケーシング Download PDFInfo
- Publication number
- JP4991874B2 JP4991874B2 JP2009536689A JP2009536689A JP4991874B2 JP 4991874 B2 JP4991874 B2 JP 4991874B2 JP 2009536689 A JP2009536689 A JP 2009536689A JP 2009536689 A JP2009536689 A JP 2009536689A JP 4991874 B2 JP4991874 B2 JP 4991874B2
- Authority
- JP
- Japan
- Prior art keywords
- casing
- electronic
- connection
- printed circuit
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000005755 formation reaction Methods 0.000 claims 1
- 239000003923 scrap metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000005219 brazing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Description
それ故に本発明の課題は、機能的な周辺要素、例えばセンサ系やサテライト系、外部コネクタ系の簡単かつ確実で融通性に富んだ接続を可能にさせる、標準化された電子制御系ケーシングを提供することである。従ってここではこのような電子制御系ケーシングへの周辺要素の標準化された特にモジュラ形式のコンタクト形成のための構想が練られるべきである。
さらなる有利な構成例及び改善例は、個別に若しくは相互に組み合わせて用いることが可能であり、それらは従属請求項の対象である。
Claims (10)
- 少なくとも2つのケーシング部分を有し、
前記ケーシング部分は、
少なくとも1つのケーシング底部(2)と、
少なくとも1つのケーシングカバー(3)と、
ケーシング内部空間に配設された電子的基板(5)とケーシング外部に存在する構成要素との間の、プリント基板の形態の、少なくとも1つの電子的接続部(4)とを有しており、
前記電子的接続部(4)はケーシング底部(2)に固定されている、電子的ケーシング(1)において、
前記電子的接続部(4)は、ケーシングカバー(3)の外部に開放導体路領域(8)を有しており、前記開放導体路領域(8)は、少なくとも部分的に1つ以上のコンタクトパートナー(6)によって金属屑から密閉されるように覆われており、
前記コンタクトパートナー(6)は、1つ以上の開放導体路領域(8)のための電気的なコンタクト形成部を有しており、
前記コンタクトパートナー(6)は、1つ以上の周辺要素のための1つ以上の統合化された電気的係止接続部(6a;6b;6c)を有している、ことを特徴とする電子的ケーシング。 - 前記コンタクトパートナー(6)は同時に、1つ以上の周辺要素のための支持体である、請求項1記載の電子的ケーシング。
- 前記電子的接続部(4)は、フレキシブルなプリント基板、特に多層のフレキシブルプリント基板である、請求項1又は2記載の電子的ケーシング。
- 前記電子的接続部(4)は、少なくとも2つ以上のフレキシブルな部分プリント基板から形成されている、請求項1から3いずれか1項記載の電子的ケーシング。
- 前記ケーシング底部(2)は、ケーシングカバー(3)よりも広い底面積を有している、請求項1から4いずれか1項記載の電子的ケーシング。
- 前記コンタクトパートナー(6)は、ケーシングカバー(3)の縁部に重なっている、請求項1から5いずれか1項記載の電子的ケーシング。
- 前記コンタクトパートナー(6)は、ケーシングカバー(3)の縁部と同一平面で終端している、請求項1から6いずれか1項記載の電子的ケーシング。
- 請求項1から7いずれか1項記載の電子的ケーシングの製造方法において、
少なくとも1つの電子的接続部(4)をケーシング底部(2)に被着させ、
ケーシングの内部にて電子的基板(5)と接続させ、
ケーシングカバー(3)を固定し、
ケーシング外部に存在する構成要素を少なくとも部分的にコンタクトパートナー(6)によって係止接続させるようにしたことを特徴とする方法。 - 前記電子的基板(5)と電子的接続部(4)の接続を太線ワイヤボンディングを用いて実施し、前記コンタクトパートナー(6)と電子的接続(4)の接続を蝋付け、溶接又はクリップを用いて実施する、請求項8記載の方法。
- 1つ以上のコンタクトパートナー(6)を有していることを特徴とする請求項1から7いずれか1項記載の電子的ケーシング(1)の自動車の変速機制御用の電子制御装置に対する適用方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006053407.7 | 2006-11-13 | ||
DE102006053407A DE102006053407A1 (de) | 2006-11-13 | 2006-11-13 | Standardisiertes Elektronikgehäuse mit modularen Kontaktpartnern |
PCT/EP2007/061252 WO2008058828A1 (de) | 2006-11-13 | 2007-10-22 | Standardisiertes elektronikgehäuse mit modularen kontaktpartnern |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010509742A JP2010509742A (ja) | 2010-03-25 |
JP4991874B2 true JP4991874B2 (ja) | 2012-08-01 |
Family
ID=39047626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009536689A Expired - Fee Related JP4991874B2 (ja) | 2006-11-13 | 2007-10-22 | モジュラ式のコンタクトパートナーを備える標準化された電子的ケーシング |
Country Status (6)
Country | Link |
---|---|
US (1) | US8089773B2 (ja) |
EP (1) | EP2055154B1 (ja) |
JP (1) | JP4991874B2 (ja) |
CN (1) | CN101584257B (ja) |
DE (2) | DE102006053407A1 (ja) |
WO (1) | WO2008058828A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007112485A1 (en) | 2006-03-31 | 2007-10-11 | Aortech Biomaterials Pty Ltd | Biostable polyurethanes |
DE102008009947A1 (de) * | 2008-02-20 | 2009-08-27 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Vorrichtung zur Aufnahme eines elektrischen/elektronischen Bauteils und entsprechendes Montageverfahren sowie Abdeckung für eine solche Vorrichtung |
DE102011004154A1 (de) * | 2011-02-15 | 2012-08-16 | Robert Bosch Gmbh | Direktsteckverbindung für eine elektronische Komponente |
DE102011076661B4 (de) * | 2011-05-30 | 2024-03-14 | Zf Friedrichshafen Ag | Steuervorrichtung für ein Getriebe eines Fahrzeugs und Verfahren zum Montieren einer Steuervorrichtung für ein Getriebe eines Fahrzeugs |
DE102013201931B4 (de) * | 2013-02-06 | 2022-03-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Laserbauelement und Verfahren zu seiner Herstellung |
DE102014201945A1 (de) | 2014-02-04 | 2015-08-20 | Zf Friedrichshafen Ag | Elektronische Einheit mit Kurzschlussschutz, Steuergerät und Verfahren dazu |
DE102014223356A1 (de) * | 2014-11-17 | 2016-05-19 | Robert Bosch Gmbh | Anordnung mit einem Sensor und mit einem elektrischen Kabel |
CN107106853B (zh) * | 2014-12-01 | 2022-01-07 | 心脏起搏器股份公司 | 具有堆叠的电路组件的植入式医疗设备 |
JP6490460B2 (ja) * | 2015-03-18 | 2019-03-27 | 矢崎総業株式会社 | ワイヤハーネス、接続構造、及び、コネクタ |
DE102015219569B4 (de) * | 2015-10-09 | 2024-05-16 | Vitesco Technologies Germany Gmbh | Elektronische Anordnung, Kombination und Verfahren zur Montage einer elektronischen Anordnung |
DE102018102552A1 (de) * | 2018-02-06 | 2019-08-08 | Connaught Electronics Ltd. | Leiterplattenanordnung für zumindest einen integrierten Schaltkreis, wobei Kontaktblöcke als separate Komponenten ausgebildet sind, sowie Verfahren |
US11807160B2 (en) | 2021-12-02 | 2023-11-07 | Honda Motor Co., Ltd. | Push-in nut lighting assembly |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3149896A (en) * | 1960-11-04 | 1964-09-22 | Bendix Corp | Electrical connector |
US5418685A (en) * | 1992-02-21 | 1995-05-23 | Robert Bosch Gmbh | Housing for a control device having a printed circuit board with an electrically and thermally conducting lining |
EP0972318B1 (de) | 1997-04-02 | 2002-10-23 | Siemens Aktiengesellschaft | Elektrische verbindung eines schaltungsträgers mit einem leiterbahnträger |
US6392148B1 (en) * | 1999-05-10 | 2002-05-21 | Furukawa Electric Co., Ltd. | Wire harness joint |
DE50003179D1 (de) * | 1999-02-18 | 2003-09-11 | Siemens Ag | Elektrisches verbindungsverfahren und verbindungsstelle |
US7021971B2 (en) * | 2003-09-11 | 2006-04-04 | Super Talent Electronics, Inc. | Dual-personality extended-USB plug and receptacle with PCI-Express or Serial-At-Attachment extensions |
US7259967B2 (en) * | 2005-09-02 | 2007-08-21 | Super Talent Electronics, Inc. | USB device with plastic housing having integrated plastic plug shell |
US7440287B1 (en) * | 2000-01-06 | 2008-10-21 | Super Talent Electronics, Inc. | Extended USB PCBA and device with dual personality |
DE10036900C2 (de) * | 2000-07-28 | 2002-07-11 | Siemens Ag | Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner |
JP4789125B2 (ja) * | 2000-12-07 | 2011-10-12 | 株式会社アドバンテスト | 電子部品試験用ソケットおよびこれを用いた電子部品試験装置 |
AT410728B (de) * | 2001-02-09 | 2003-07-25 | Pollmann Austria Ohg | Verfahren zum einbetten zumindest einer flexiblen leiterbahnfolie in kunststoff, leiterbahneneinheitsowie einbettungseinheit hiefür |
US20040080917A1 (en) * | 2002-10-23 | 2004-04-29 | Steddom Clark Morrison | Integrated microwave package and the process for making the same |
DE10250933B3 (de) * | 2002-10-31 | 2004-08-12 | Fci | Verbinderanordnung zwischen einem Flex-Flachbandkabel und einer elektrischen Leiterplatte |
TW565026U (en) * | 2003-01-24 | 2003-12-01 | C One Technology Corp | Small connector device |
US6854984B1 (en) * | 2003-09-11 | 2005-02-15 | Super Talent Electronics, Inc. | Slim USB connector with spring-engaging depressions, stabilizing dividers and wider end rails for flash-memory drive |
DE102004036683A1 (de) * | 2004-07-28 | 2006-03-30 | Siemens Ag | Steuervorrichtung, insbesondere mechatronisches Getriebe- oder Motorsteuergerät |
DE102004050687B4 (de) * | 2004-10-18 | 2019-01-31 | Continental Automotive Gmbh | Kontaktierungsanordnung für eine flexible Leiterplatte und deren Verwendung |
DE102005005705A1 (de) * | 2005-02-03 | 2006-08-17 | Visteon Global Technologies, Inc., Dearborn | Kontaktierungsmittel für flexible elektrische Flachbandkabel |
DE102005009443A1 (de) * | 2005-03-02 | 2006-09-07 | Hirschmann Electronics Gmbh | Folienantenne für ein Fahrzeug |
US7359208B2 (en) * | 2005-08-26 | 2008-04-15 | Super Talent Electronics, Inc. | USB device with metal plug shell attached to plastic housing |
US20090166065A1 (en) * | 2008-01-02 | 2009-07-02 | Clayton James E | Thin multi-chip flex module |
-
2006
- 2006-11-13 DE DE102006053407A patent/DE102006053407A1/de not_active Ceased
-
2007
- 2007-10-22 DE DE502007006688T patent/DE502007006688D1/de active Active
- 2007-10-22 JP JP2009536689A patent/JP4991874B2/ja not_active Expired - Fee Related
- 2007-10-22 WO PCT/EP2007/061252 patent/WO2008058828A1/de active Application Filing
- 2007-10-22 CN CN2007800422571A patent/CN101584257B/zh not_active Expired - Fee Related
- 2007-10-22 EP EP07821616A patent/EP2055154B1/de not_active Ceased
- 2007-10-22 US US12/514,083 patent/US8089773B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP2055154B1 (de) | 2011-03-09 |
WO2008058828A1 (de) | 2008-05-22 |
JP2010509742A (ja) | 2010-03-25 |
US20100002403A1 (en) | 2010-01-07 |
CN101584257A (zh) | 2009-11-18 |
EP2055154A1 (de) | 2009-05-06 |
CN101584257B (zh) | 2011-08-24 |
DE102006053407A1 (de) | 2008-05-15 |
DE502007006688D1 (de) | 2011-04-21 |
US8089773B2 (en) | 2012-01-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4991874B2 (ja) | モジュラ式のコンタクトパートナーを備える標準化された電子的ケーシング | |
US8488324B2 (en) | Electric control unit having a housing part and a cooling part | |
US7749134B2 (en) | Control module | |
US8004849B2 (en) | Control unit with flexible circuit board | |
JP4470980B2 (ja) | 電子装置 | |
US5311398A (en) | Housing for motor vehicle electronic system | |
US9258918B2 (en) | Module for integrated control electronics having simplified design | |
US8111527B2 (en) | Standardized support element with integrated interface | |
JP5167354B2 (ja) | 簡単化された構造を有する集積型メカトロニック変速機制御装置のための電子モジュールの使用方法 | |
JP2007305494A (ja) | コネクタの実装構造 | |
US7983054B2 (en) | Compact control device for a motor vehicle | |
JP5294175B2 (ja) | 自動車用制御装置 | |
JP3722702B2 (ja) | 車載電子機器 | |
JP4851154B2 (ja) | 回路基板内蔵筐体 | |
JP5436214B2 (ja) | 標準インターフェースを備えた電子装置ケーシング | |
KR20170086042A (ko) | 오염 매체 내에 사용하기 위한 변속기 제어 모듈, 이러한 변속기 제어 모듈에 사용하기 위한 tcu 어셈블리, 및 이러한 변속기 제어 모듈의 제조 방법 | |
JP2009253040A (ja) | Led照明ユニット | |
JP5542815B2 (ja) | 回路基板収容体 | |
JP4770514B2 (ja) | 電子装置 | |
JP2007180459A (ja) | 配線基板および車載用ecu | |
JP6698563B2 (ja) | 電子制御装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20101228 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110727 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20111027 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20111104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111121 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120405 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120507 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4991874 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150511 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |