JP5167358B2 - 簡略化された構造を有する集積電子制御回路のためのモジュール - Google Patents
簡略化された構造を有する集積電子制御回路のためのモジュール Download PDFInfo
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- JP5167358B2 JP5167358B2 JP2010523460A JP2010523460A JP5167358B2 JP 5167358 B2 JP5167358 B2 JP 5167358B2 JP 2010523460 A JP2010523460 A JP 2010523460A JP 2010523460 A JP2010523460 A JP 2010523460A JP 5167358 B2 JP5167358 B2 JP 5167358B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
- Casings For Electric Apparatus (AREA)
Description
自動車技術においては、例えばトランスミッション、エンジン又はブレーキシステム等の構成要素は、ますます電子制御されるようになっている。この場合、集積されたメカトロニクス制御のための開発、つまり、電子制御回路及び所属の電子構成要素(例えばセンサ又は弁)を、トランスミッション、エンジン又はブレーキシステムに統合するための開発が行われている。制御装置は一般的に、制御装置の外部のその他の構成要素に接続された複数の電子構成要素を有している。このような"Vorort-Elektroniken"(その位置における電子制御回路)においては、このような制御装置は、もはや別個に保護されたエレクトロニクススペース内に収容することができないので、相応の環境の影響及び、機械的、熱的並びに化学的な負荷に耐えなければならない。
そこで本発明の課題は、ハウジングと、該ハウジング内に収容された、種々異なる電子素子を有する中央の制御ユニットと、ハウジング内室とハウジング該室との間の電気的な接続部とを備えた集積電子制御回路を改良して、ハウジングの外に位置する構成要素に簡単かつフレキシブルに接続することができ、この場合、電気的な接続部と中央の制御ユニットが、簡略化され、かつ安価なコストを有し、それと同時に確実に短絡及び/又は導電性の不純物に対して保護されるようなものを提供することである。
Claims (9)
- 集積電子制御回路のためのハウジング構造(1)であって、ハウジング底部(2)と、中央の電子制御回路の電子素子(12)が装着された回路キャリア(4)と、前記中央の電子制御回路と周辺構成要素との電気的な接続部としての信号及び電流分配構成要素(5)とを備えている形式のものにおいて、
前記ハウジング底部(2)がバスタブ状に構成されており、該ハウジング底部(2)内に、前記中央の電子制御回路の電子素子(12)のための回路キャリア(4)が配置されていて、該回路キャリア(4)は、上方に向かって湾曲された少なくとも1つの縁部領域(7)に設けられた接点箇所(9)によって、この接点箇所(9)上に配置された前記信号及び電流分配構成要素(5)と電気的に接続されるようになっており、前記ハウジング底部(2)が縁部領域(7)において環状に、固定手段を用いて前記信号及び電流分配構成要素(5)と機械的に接続されている、ことを特徴とする、集積電子制御回路のためのハウジング構造(1)。 - 前記信号及び電流分配構成要素(5)が2層又は多層に構成されている、請求項1記載のハウジング構造(1)。
- 多層の信号及び電流分配構成要素(5)が、周辺構成要素を電気的に接続するための種々異なる接点箇所を有している、請求項2記載のハウジング構造(1)。
- 前記回路キャリア(4)が一体的に構成されているか又は複数部分より構成されている、請求項2又は3記載のハウジング構造(1)。
- 前記中央の電子制御回路の電子素子(12)が、はんだ付け、接着又はボンディングによって前記回路キャリア(4)に固定され、かつ/または接触されている、請求項1から4までのいずれか1項記載のハウジング構造(1)。
- 前記中央の電子制御回路の電子素子(12)が、前記回路キャリア(4)内に組み込まれ、かつ/または注型材料によってシールされている、請求項1から5までのいずれか1項記載のハウジング構造(1)。
- 請求項1から6までのいずれか1項記載の特徴を有するハウジング構造(1)を製造するための方法において、
回路キャリア(4)に、前記中央の電子制御回路の前記電子素子(12)を装着し、該回路キャリア(4)をバスタブ状のハウジング底部(2)内に設置し、前記回路キャリア(4)の上に配置された信号及び電流分配構成要素(5)を1回の作業段階で前記回路キャリア(4)と電気的に接続し、かつ前記バスタブ状のハウジング底部(2)と機械的に接続することを特徴とする、ハウジング構造(1)を製造するための方法。 - ハウジング底部(2)内に回路キャリア(4)を設置した後に、注型材料を充填し、回路キャリア(4)をシールする、請求項7に記載の方法。
- 請求項1から6までのいずれか1項記載のハウジング構造(1)の使用法において、自動車のトランスミッション制御集積回路に使用することを特徴とする、ハウジング構造(1)の使用法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007042593.9A DE102007042593B4 (de) | 2007-09-07 | 2007-09-07 | Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau |
DE102007042593.9 | 2007-09-07 | ||
PCT/EP2008/060227 WO2009033890A1 (de) | 2007-09-07 | 2008-08-04 | Modul für eine integrierte steuerelektronik mit vereinfachtem aufbau |
Publications (2)
Publication Number | Publication Date |
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JP2010538484A JP2010538484A (ja) | 2010-12-09 |
JP5167358B2 true JP5167358B2 (ja) | 2013-03-21 |
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JP2010523460A Expired - Fee Related JP5167358B2 (ja) | 2007-09-07 | 2008-08-04 | 簡略化された構造を有する集積電子制御回路のためのモジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US9258918B2 (ja) |
EP (1) | EP2201830B1 (ja) |
JP (1) | JP5167358B2 (ja) |
DE (1) | DE102007042593B4 (ja) |
WO (1) | WO2009033890A1 (ja) |
Cited By (1)
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JP5188483B2 (ja) | 2009-09-30 | 2013-04-24 | 日立オートモティブシステムズ株式会社 | 変速制御装置及び機電一体型電子制御装置 |
DE102012213952A1 (de) * | 2012-08-07 | 2014-02-13 | Robert Bosch Gmbh | Getriebesteuermodul eines Kraftfahrzeuggetriebes in Sandwichbauweise mit abgedichtet angeordneten Bauelementen |
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DE102014205385A1 (de) * | 2014-03-24 | 2015-09-24 | Robert Bosch Gmbh | Elektronikmodul, insbesondere für Getriebesteuergerät, mit zwei übereinander gestapelten Leiterplattenelementen |
JP5995113B2 (ja) * | 2014-07-02 | 2016-09-21 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
DE102014010177A1 (de) * | 2014-07-09 | 2016-01-14 | Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt | Sensormodul zur berührungslosen Betätigung eines verstellbaren Fahrzeugteils |
DE102014221973A1 (de) * | 2014-10-28 | 2016-04-28 | Robert Bosch Gmbh | Elektrisches Gerät für den Einsatz in einem kontaminierenden Medium und Verfahren zur Herstellung eines solchen |
DE102015212092A1 (de) * | 2015-06-29 | 2016-12-29 | Conti Temic Microelectronic Gmbh | Elektronische Komponente und Verfahren zu deren Herstellung |
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JP6834513B2 (ja) * | 2017-01-19 | 2021-02-24 | アイシン精機株式会社 | プリント基板の収容ケース |
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DE102017207491A1 (de) * | 2017-05-04 | 2018-11-08 | Bayerische Motoren Werke Aktiengesellschaft | Elektronikmodul |
DE102020211081A1 (de) | 2020-09-02 | 2022-03-03 | Robert Bosch Gesellschaft mit beschränkter Haftung | Steuervorrichtung, insbesondere Lenkungssteuervorrichtung |
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US6881077B2 (en) * | 2002-07-22 | 2005-04-19 | Siemens Vdo Automotive Corporation | Automotive control module housing |
EP1575344B1 (de) | 2004-03-11 | 2007-05-30 | Siemens Aktiengesellschaft | Steuergerät |
DE102004036683A1 (de) | 2004-07-28 | 2006-03-30 | Siemens Ag | Steuervorrichtung, insbesondere mechatronisches Getriebe- oder Motorsteuergerät |
DE102005002813B4 (de) | 2005-01-20 | 2006-10-19 | Robert Bosch Gmbh | Steuermodul |
DE102005046826A1 (de) | 2005-09-29 | 2007-04-05 | Robert Bosch Gmbh | Steuergerät, insbesondere für ein Kraftfahrzeuggetriebe |
-
2007
- 2007-09-07 DE DE102007042593.9A patent/DE102007042593B4/de not_active Expired - Fee Related
-
2008
- 2008-08-04 EP EP08786840.2A patent/EP2201830B1/de not_active Not-in-force
- 2008-08-04 WO PCT/EP2008/060227 patent/WO2009033890A1/de active Application Filing
- 2008-08-04 US US12/676,935 patent/US9258918B2/en not_active Expired - Fee Related
- 2008-08-04 JP JP2010523460A patent/JP5167358B2/ja not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022078860A1 (en) * | 2020-10-13 | 2022-04-21 | Signify Holding B.V. | Deep-drawn mcpcb |
US12007080B2 (en) | 2020-10-13 | 2024-06-11 | Signify Holding B.V. | Deep-drawn MCPCB |
Also Published As
Publication number | Publication date |
---|---|
DE102007042593A1 (de) | 2009-03-26 |
JP2010538484A (ja) | 2010-12-09 |
DE102007042593B4 (de) | 2018-10-31 |
EP2201830B1 (de) | 2017-06-28 |
US20100271791A1 (en) | 2010-10-28 |
WO2009033890A1 (de) | 2009-03-19 |
EP2201830A1 (de) | 2010-06-30 |
US9258918B2 (en) | 2016-02-09 |
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