JP2008527422A - カプセル化ツールおよび方法 - Google Patents
カプセル化ツールおよび方法 Download PDFInfo
- Publication number
- JP2008527422A JP2008527422A JP2007549639A JP2007549639A JP2008527422A JP 2008527422 A JP2008527422 A JP 2008527422A JP 2007549639 A JP2007549639 A JP 2007549639A JP 2007549639 A JP2007549639 A JP 2007549639A JP 2008527422 A JP2008527422 A JP 2008527422A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- organic electronic
- lid
- housing
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K99/00—Subject matter not provided for in other groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/02—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Abstract
Description
本願は、2004年12月30日出願の米国特許公報(特許文献1)に利益を要求する。この特許の開示は、本明細書において全体として援用される。
図1を参照すると、例示的な有機電子デバイス100が示される。デバイス100は基材105を含む。基材105は、剛性であっても、屈曲性でもよく、例えば、ガラス、セラミック、金属、プラスチックであってよい。電圧が印加される時、放射された光は基材105を通して可視である。
「1つ(aまたはan)」の使用は、本発明の要素および部品を記載するために利用される。これは単に便宜上のため、そして本発明の一般的な意味を与えるためである。この記載は1つまたは少なくとも1つを含むように読解されなければならない。そして他に意味があることが明白でない限り、単数には複数も含まれる。
Claims (9)
- ハウジングと、
係合時に蓋およびハウジングがその間に密封空間を画定するように、ハウジングを係合する蓋と、
密封空間における条件を変更するための制御装置と、
を含んでなることを特徴とするデバイス。 - 密封空間が有機電子デバイスを受け取るために適応されることを特徴とする請求項1に記載のデバイス。
- 制御装置が密封空間における圧力を制御することを特徴とする請求項1に記載のデバイス。
- 制御装置が密封空間における温度を制御することを特徴とする請求項1に記載のデバイス。
- 制御装置が密封空間におけるガス同一性を制御することを特徴とする請求項1に記載のデバイス。
- 少なくとも1つのアラインメントカメラをさらに含んでなることを特徴とする請求項1に記載のデバイス。
- 少なくとも1つのUV光源をさらに含んでなることを特徴とする請求項1に記載のデバイス。
- 請求項6に記載のデバイスにおいて有機電子デバイスを配置する工程を含んでなることを特徴とする有機電子デバイスのカプセル化蓋の位置合わせ方法。
- ハウジングと、ハウジングに適合する蓋とを含んでなり、ハウジングまたは蓋の少なくとも一方が、製造のため、有機電子デバイスの一部を受け取るように適応されることを特徴とする装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64078104P | 2004-12-30 | 2004-12-30 | |
PCT/US2005/047412 WO2006074062A2 (en) | 2004-12-30 | 2005-12-29 | Encapsulation tool and methods |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008527422A true JP2008527422A (ja) | 2008-07-24 |
Family
ID=36648062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007549639A Pending JP2008527422A (ja) | 2004-12-30 | 2005-12-29 | カプセル化ツールおよび方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8002939B2 (ja) |
JP (1) | JP2008527422A (ja) |
KR (1) | KR20070095371A (ja) |
CN (1) | CN101198470B (ja) |
TW (1) | TW200635425A (ja) |
WO (1) | WO2006074062A2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103171156B (zh) * | 2011-12-26 | 2017-04-12 | 深圳光启高等理工研究院 | 超材料封装工具及超材料封装方法 |
JP5837972B1 (ja) * | 2014-10-03 | 2015-12-24 | 富士インパルス株式会社 | 電熱装置 |
CN104678615B (zh) * | 2015-03-12 | 2017-09-15 | 京东方科技集团股份有限公司 | 一种组装对位装置 |
US10461139B2 (en) | 2016-11-10 | 2019-10-29 | Int Tech Co., Ltd. | Light emitting device manufacturing method and apparatus thereof |
US10811636B2 (en) | 2016-11-10 | 2020-10-20 | Int Tech Co., Ltd. | Light emitting device manufacturing method and apparatus thereof |
CN107276534B (zh) * | 2017-07-25 | 2019-03-26 | 南昌航空大学 | 一种染料敏化太阳开放电池组装测试夹 |
TWI678829B (zh) * | 2017-09-05 | 2019-12-01 | 創王光電股份有限公司 | 發光元件及其製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4573627A (en) * | 1984-12-20 | 1986-03-04 | The United States Of America As Represented By The Secretary Of The Army | Indium bump hybrid bonding method and system |
JPH01501032A (ja) * | 1986-09-26 | 1989-04-06 | ゼネラル・エレクトリック・カンパニイ | 少なくとも1つの半導体チップ装置の表面に重合体フィルムを結合する方法 |
US4899921A (en) * | 1988-10-28 | 1990-02-13 | The American Optical Corporation | Aligner bonder |
US5191218A (en) * | 1990-06-29 | 1993-03-02 | Canon Kabushiki Kaisha | Vacuum chuck |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3489608A (en) * | 1965-10-26 | 1970-01-13 | Kulicke & Soffa Ind Inc | Method and apparatus for treating semiconductor wafers |
US4421589A (en) * | 1982-07-13 | 1983-12-20 | Spire Corporation | Laminator for encapsulating multilayer laminate assembly |
US5094709A (en) * | 1986-09-26 | 1992-03-10 | General Electric Company | Apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
US4718974A (en) * | 1987-01-09 | 1988-01-12 | Ultraphase Equipment, Inc. | Photoresist stripping apparatus using microwave pumped ultraviolet lamp |
US5352327A (en) * | 1992-07-10 | 1994-10-04 | Harris Corporation | Reduced temperature suppression of volatilization of photoexcited halogen reaction products from surface of silicon wafer |
US6209480B1 (en) * | 1996-07-10 | 2001-04-03 | Mehrdad M. Moslehi | Hermetically-sealed inductively-coupled plasma source structure and method of use |
US6303238B1 (en) | 1997-12-01 | 2001-10-16 | The Trustees Of Princeton University | OLEDs doped with phosphorescent compounds |
JP3828670B2 (ja) * | 1998-11-16 | 2006-10-04 | 松下電器産業株式会社 | 液晶表示素子の製造方法 |
KR100913568B1 (ko) | 1999-05-13 | 2009-08-26 | 더 트러스티즈 오브 프린스턴 유니버시티 | 전계인광에 기초한 고 효율의 유기 발광장치 |
US6495233B1 (en) * | 1999-07-09 | 2002-12-17 | Applied Materials, Inc. | Apparatus for distributing gases in a chemical vapor deposition system |
IT1313118B1 (it) * | 1999-08-25 | 2002-06-17 | Morton Int Inc | Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello |
EP3379591A1 (en) | 1999-12-01 | 2018-09-26 | The Trustees of Princeton University | Complexes of form l2mx |
US6821645B2 (en) | 1999-12-27 | 2004-11-23 | Fuji Photo Film Co., Ltd. | Light-emitting material comprising orthometalated iridium complex, light-emitting device, high efficiency red light-emitting device, and novel iridium complex |
US20020121638A1 (en) | 2000-06-30 | 2002-09-05 | Vladimir Grushin | Electroluminescent iridium compounds with fluorinated phenylpyridines, phenylpyrimidines, and phenylquinolines and devices made with such compounds |
CN100505375C (zh) | 2000-08-11 | 2009-06-24 | 普林斯顿大学理事会 | 有机金属化合物和发射转换有机电致磷光 |
JP4154139B2 (ja) | 2000-09-26 | 2008-09-24 | キヤノン株式会社 | 発光素子 |
JP4154140B2 (ja) | 2000-09-26 | 2008-09-24 | キヤノン株式会社 | 金属配位化合物 |
KR100469354B1 (ko) * | 2002-02-06 | 2005-02-02 | 엘지.필립스 엘시디 주식회사 | 액정 표시 장치의 제조 방법 |
JP2005048259A (ja) * | 2003-07-31 | 2005-02-24 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
-
2005
- 2005-12-29 JP JP2007549639A patent/JP2008527422A/ja active Pending
- 2005-12-29 TW TW094147277A patent/TW200635425A/zh unknown
- 2005-12-29 WO PCT/US2005/047412 patent/WO2006074062A2/en active Application Filing
- 2005-12-29 KR KR1020077017363A patent/KR20070095371A/ko not_active Application Discontinuation
- 2005-12-29 CN CN200580045408XA patent/CN101198470B/zh not_active Expired - Fee Related
- 2005-12-29 US US11/721,732 patent/US8002939B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4573627A (en) * | 1984-12-20 | 1986-03-04 | The United States Of America As Represented By The Secretary Of The Army | Indium bump hybrid bonding method and system |
JPH01501032A (ja) * | 1986-09-26 | 1989-04-06 | ゼネラル・エレクトリック・カンパニイ | 少なくとも1つの半導体チップ装置の表面に重合体フィルムを結合する方法 |
US4899921A (en) * | 1988-10-28 | 1990-02-13 | The American Optical Corporation | Aligner bonder |
US5191218A (en) * | 1990-06-29 | 1993-03-02 | Canon Kabushiki Kaisha | Vacuum chuck |
Also Published As
Publication number | Publication date |
---|---|
CN101198470B (zh) | 2011-08-31 |
US8002939B2 (en) | 2011-08-23 |
WO2006074062A2 (en) | 2006-07-13 |
TW200635425A (en) | 2006-10-01 |
US20080257473A1 (en) | 2008-10-23 |
KR20070095371A (ko) | 2007-09-28 |
WO2006074062A3 (en) | 2008-01-03 |
CN101198470A (zh) | 2008-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8002939B2 (en) | Encapsulation tool and methods | |
JP2012519950A (ja) | 電気活性層の形成方法 | |
JP2015062900A (ja) | 電気活性層の形成方法 | |
KR101491877B1 (ko) | 전기활성 층을 형성하기 위한 방법 | |
JP5701782B2 (ja) | 電気活性層の形成方法 | |
US7749037B2 (en) | Process for fabricating an organic electronic device using liquid deposition and devices made by the process | |
JP2008097828A (ja) | 有機el素子の製造方法およびこれにより得られた有機el素子 | |
US20080309221A1 (en) | Containment Structure For an Electronic Device | |
JP4941297B2 (ja) | 有機エレクトロルミネッセンス素子の製造方法 | |
US8350238B2 (en) | Device patterning using irradiation | |
US20080157659A1 (en) | Electronic device including an organic device layer | |
US8017223B2 (en) | Containment structure and method | |
US8148885B2 (en) | Methods of conditioning getter materials | |
JP5258302B2 (ja) | 有機電子デバイスおよび方法 | |
US7732062B1 (en) | Charge transport layers and organic electron devices comprising same | |
US7811624B1 (en) | Self-assembled layers for electronic devices | |
US7781550B1 (en) | Charge transport compositions and their use in electronic devices | |
US8950328B1 (en) | Methods of fabricating organic electronic devices | |
US7736540B1 (en) | Organic compositions for depositing onto fluorinated surfaces | |
US7723546B1 (en) | Arylamine compounds and their use in electronic devices | |
JP6825287B2 (ja) | 有機el素子及びその製造方法 | |
Zhang et al. | Efficiency Roll‐Off in Light‐Emitting Electrochemical Cells |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20081031 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110819 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20111121 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120417 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120713 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130301 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130920 |