JP2008523616A5 - - Google Patents

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Publication number
JP2008523616A5
JP2008523616A5 JP2007545456A JP2007545456A JP2008523616A5 JP 2008523616 A5 JP2008523616 A5 JP 2008523616A5 JP 2007545456 A JP2007545456 A JP 2007545456A JP 2007545456 A JP2007545456 A JP 2007545456A JP 2008523616 A5 JP2008523616 A5 JP 2008523616A5
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JP
Japan
Prior art keywords
acid
polishing solution
organic acid
monofunctional
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007545456A
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English (en)
Japanese (ja)
Other versions
JP2008523616A (ja
JP5198870B2 (ja
Filing date
Publication date
Priority claimed from US11/009,608 external-priority patent/US20060124026A1/en
Application filed filed Critical
Publication of JP2008523616A publication Critical patent/JP2008523616A/ja
Publication of JP2008523616A5 publication Critical patent/JP2008523616A5/ja
Application granted granted Critical
Publication of JP5198870B2 publication Critical patent/JP5198870B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2007545456A 2004-12-10 2005-10-25 研磨溶液 Expired - Fee Related JP5198870B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/009,608 US20060124026A1 (en) 2004-12-10 2004-12-10 Polishing solutions
US11/009,608 2004-12-10
PCT/US2005/038372 WO2006065347A2 (en) 2004-12-10 2005-10-25 Polishing solutions

Publications (3)

Publication Number Publication Date
JP2008523616A JP2008523616A (ja) 2008-07-03
JP2008523616A5 true JP2008523616A5 (cg-RX-API-DMAC7.html) 2008-12-11
JP5198870B2 JP5198870B2 (ja) 2013-05-15

Family

ID=36582316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007545456A Expired - Fee Related JP5198870B2 (ja) 2004-12-10 2005-10-25 研磨溶液

Country Status (9)

Country Link
US (1) US20060124026A1 (cg-RX-API-DMAC7.html)
EP (1) EP1833937B1 (cg-RX-API-DMAC7.html)
JP (1) JP5198870B2 (cg-RX-API-DMAC7.html)
KR (1) KR20070087647A (cg-RX-API-DMAC7.html)
CN (1) CN101076575B (cg-RX-API-DMAC7.html)
AT (1) ATE469952T1 (cg-RX-API-DMAC7.html)
DE (1) DE602005021699D1 (cg-RX-API-DMAC7.html)
TW (1) TWI473866B (cg-RX-API-DMAC7.html)
WO (1) WO2006065347A2 (cg-RX-API-DMAC7.html)

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US7591956B2 (en) * 2006-05-03 2009-09-22 OMG Electronic Chemicals, Inc. Method and composition for selectively stripping nickel from a substrate
US20080220610A1 (en) * 2006-06-29 2008-09-11 Cabot Microelectronics Corporation Silicon oxide polishing method utilizing colloidal silica
US20090031636A1 (en) * 2007-08-03 2009-02-05 Qianqiu Ye Polymeric barrier removal polishing slurry
JP5135002B2 (ja) 2008-02-28 2013-01-30 ルネサスエレクトロニクス株式会社 半導体装置
US8431490B2 (en) * 2010-03-31 2013-04-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal
WO2012008237A1 (ja) 2010-07-14 2012-01-19 日立化成工業株式会社 銅研磨用研磨液及びそれを用いた研磨方法
US9388330B2 (en) * 2012-12-17 2016-07-12 Fuji Engineering Co., Ltd. Bag containing blasting material
CN104745084B (zh) * 2013-12-25 2018-09-14 安集微电子（上海）有限公司 一种用于铝的化学机械抛光液及使用方法
US10253216B2 (en) * 2016-07-01 2019-04-09 Versum Materials Us, Llc Additives for barrier chemical mechanical planarization
JP6720791B2 (ja) * 2016-09-13 2020-07-08 Ａｇｃ株式会社 研磨剤と研磨方法、および研磨用添加液
US10676647B1 (en) * 2018-12-31 2020-06-09 Cabot Microelectronics Corporation Composition for tungsten CMP
KR102714939B1 (ko) * 2019-06-06 2024-10-07 가부시끼가이샤 레조낙 연마액 및 연마 방법
US20260201570A1 (en) * 2022-12-29 2026-07-16 Basf Se Composition for selectively removing oxide compounds and etching residues of one or both of co and cu

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