JP2008519458A - 銅相互接続配線およびこれを形成する方法 - Google Patents
銅相互接続配線およびこれを形成する方法 Download PDFInfo
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- JP2008519458A JP2008519458A JP2007540161A JP2007540161A JP2008519458A JP 2008519458 A JP2008519458 A JP 2008519458A JP 2007540161 A JP2007540161 A JP 2007540161A JP 2007540161 A JP2007540161 A JP 2007540161A JP 2008519458 A JP2008519458 A JP 2008519458A
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- gcib
- capping
- accelerated
- dielectric
- forming
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 223
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 169
- 239000010949 copper Substances 0.000 title claims abstract description 169
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 13
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
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- 229910052782 aluminium Inorganic materials 0.000 description 2
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- 239000010937 tungsten Substances 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
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- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
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- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JPNWDVUTVSTKMV-UHFFFAOYSA-N cobalt tungsten Chemical compound [Co].[W] JPNWDVUTVSTKMV-UHFFFAOYSA-N 0.000 description 1
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- 229940116318 copper carbonate Drugs 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
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- WABPQHHGFIMREM-RKEGKUSMSA-N lead-214 Chemical compound [214Pb] WABPQHHGFIMREM-RKEGKUSMSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- UYDPQDSKEDUNKV-UHFFFAOYSA-N phosphanylidynetungsten Chemical compound [W]#P UYDPQDSKEDUNKV-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76867—Barrier, adhesion or liner layers characterized by methods of formation other than PVD, CVD or deposition from a liquids
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C—CHEMISTRY; METALLURGY
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- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02304—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment formation of intermediate layers, e.g. buffer layers, layers to improve adhesion, lattice match or diffusion barriers
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Abstract
【選択図】図5A
Description
図3は、背景技術で知られた形式のGCIB処理装置100のための典型的な構成の基本的要素の概略図を示しており、これは次のように説明され得る:真空容器102は、3つの連通チャンバに、すなわちビーム源チャンバ104とイオン化/加速チャンバ106と処理チャンバ108とに分割されている。これら3つのチャンバは、それぞれ真空ポンプシステム146a、146bおよび146cによって適当な動作圧力に排気される。第1のガス保存シリンダ111に保存された第1の濃縮可能ソースガス112(例えばアルゴンまたは窒素または事前混合されたガス混合物)は、ガス遮断バルブ115と第1のガス測定バルブ113とガス供給チューブ114とを介して滞留チャンバ116内に圧力下で入れられる。任意選択の第2のガス保存シリンダ230に保存された任意選択の第2の濃縮可能ソースガス232(例えば二酸化炭素、酸素または事前混合されたガス混合物)は、第2のガス遮断バルブ236と第2の第1のガス測定バルブ234とを介して任意選択的に圧力下で入れられる。両ソースガスが使用されるとき、これらのガスはガス供給チューブ114と滞留チャンバ116の中で混じり合う。滞留チャンバ116内のガスまたはガス混合物は、適正に形作られたノズル110を介して実質的に低い圧力の真空内に放出される。その結果、超音速ガスジェット118が発生する。ジェットにおける膨張の結果から生じる冷却は、ガスジェット118の一部分を各々が数個から数千個の弱結合原子または分子からなるガスクラスタに濃縮する。ガススキマー開口部120は、このような高い圧力が有害であるような下流領域(例えばイオナイザ122、高電圧電極126および処理チャンバ108)における圧力を最小にするように、ガスクラスタジェットに濃縮されなかったガス分子をこのガスクラスタジェットから部分的に分離する。適当な濃縮可能ソースガス112は、アルゴン、窒素、二酸化炭素、酸素および他のガスおよび/またはガス混合物を含むが、必ずしもこれらに限定されない。
Claims (59)
- 一つ以上の銅相互接続表面と一つ以上の誘電体表面とを含む構造体について、
減圧されたチャンバ内に前記構造体を配置するステップと、
前記減圧されたチャンバ内で加速されたキャッピング(以下、「保護」あるいは「被覆」を意味するものとする。)GCIB(以下、「ガスクラスターイオンビーム」を意味するものとする。)を形成するステップと、
前記加速されたキャッピングGCIBが方向付けられる前記一つ以上の表面上に少なくとも一つのキャッピング構造体を形成するように、前記一つ以上の銅相互接続表面と前記一つ以上の誘電体表面のうちの少なくとも一つに前記加速されたキャッピングGCIBを方向付けるステップと、を備える、キャッピング構造体を形成する方法。 - 前記キャッピングGCIB形成および方向付けステップに先立って、前記減圧されたチャンバ内で加速された洗浄GCIBを形成するステップと、
前記加速された洗浄GCIBが方向付けられる前記一つ以上の表面を洗浄するように前記加速された洗浄GCIBを前記一つ以上の銅相互接続表面と前記一つ以上の誘電体表面とに方向付けるステップとを更に備える、請求項1に記載の方法。 - 加速された洗浄GCIBを形成するステップはAr、N2、NH3およびH2からなるグループから選択される少なくとも一つのガスの分子からガスクラスタイオンを生成するステップを更に備える、請求項2に記載の方法。
- 前記加速された洗浄GCIBを形成するステップは約3kVから約50kVの範囲内の加速電位によって洗浄GCIBガスクラスタイオンを加速するステップを更に備える、請求項2に記載の方法。
- 前記加速された洗浄GCIBを方向付けるステップは前記一つ以上の銅相互接続表面と前記一つ以上の誘電体表面とのうちの少なくとも一つに送達される約5×1013から約5×1016ガスクラスタイオン(ions)/cm2の範囲内の照射量という結果をもたらす、請求項2に記載の方法。
- 前記一つ以上の誘電体表面はレベル間誘電体層の一部分を含む、請求項1に記載の方法。
- 前記一つ以上の誘電体表面は多孔性誘電体層の少なくとも一部分の上に重なるハードマスク層の一部分を含む、請求項1に記載の方法。
- 前記加速されたキャッピングGCIBを形成するステップは銅表面に注入されるときに電気絶縁性材料を形成するように反応し、誘電体表面に注入されるときに電気絶縁性材料を形成するように反応する元素からガスクラスタイオンを生成するステップを更に備えており、
形成された前記少なくとも一つのキャッピング構造体は電気絶縁性キャッピング構造体である、請求項1に記載の方法。 - 前記元素は、C、N、O、Si、BおよびGeからなるグループから選択される少なくとも一つの元素からなる、請求項8に記載の方法。
- 前記加速されたキャッピングGCIBを形成するステップは不活性ガスの分子からガスクラスタイオンを生成するステップを備える、請求項8に記載の方法。
- 前記加速されたキャッピングGCIBを形成するステップは約3kVから約50kVの範囲内の加速電位によって、生成されたガスクラスタイオンを加速するステップを更に備える、請求項8に記載の方法。
- 前記加速されたキャッピングGCIBを方向付ける(指向させる)ステップは前記一つ以上の銅相互接続表面と前記一つ以上の誘電体表面とのうちの少なくとも一つに送達される約1×1014から約1×1017ガスクラスタイオン(ions)/cm2の範囲内の照射量という結果をもたらす、請求項8に記載の方法。
- 形成された前記少なくとも一つのキャッピング構造体の上に重なる少なくとも一つの絶縁層を形成するステップを更に含む、請求項8に記載の方法。
- 少なくとも一つの絶縁層を形成するステップはPECVD(プラズマ加速化学気相成長法)堆積プロセスを利用する、請求項13に記載の方法。
- 形成された前記少なくとも一つの絶縁層は炭化ケイ素、窒化ケイ素およびケイ素炭素窒化物からなるグループから選択される一つの材料からなる、請求項13に記載の方法。
- 前記加速されたキャッピングGCIBを形成するステップは銅表面に注入されるときに導電性材料を形成するように反応し、誘電体表面に注入されるときに電気絶縁性材料を形成するように反応する元素からガスクラスタイオンを生成するステップを更に備えており、
形成された前記少なくとも一つのキャッピング構造体は前記銅相互接続部の被照射領域上の導電性キャッピング構造体と誘電体部の被照射領域上の電気絶縁性キャッピング構造体とのうちの少なくとも一つを備える、請求項1に記載の方法。 - 前記元素はBとTiからなるグループからの少なくとも一つの元素からなる、請求項16に記載の方法。
- 前記ガスクラスタイオンは不活性ガスの分子を更に含む、請求項17に記載の方法。
- 形成された前記少なくとも一つのキャッピング構造体の上に重なる少なくとも一つの誘電体拡散障壁フィルムを形成するステップを更に備える、請求項16に記載の方法。
- 少なくとも一つの誘電体拡散障壁フィルムを形成するステップはPECVD堆積プロセスを利用する、請求項19に記載の方法。
- 少なくとも一つの誘電体拡散障壁フィルムを形成するステップはGCIB堆積プロセスを利用する、請求項19に記載の方法。
- 形成された前記少なくとも一つの誘電体拡散障壁フィルムは炭化ケイ素、窒化ケイ素、およびケイ素炭素窒化物からなるグループから選択される材料からなる、請求項19に記載の方法。
- 前記加速されたキャッピングGCIBを形成するステップは約3kVから約50kVの範囲内の加速電位によって、生成されたガスクラスタイオンを加速するステップを更に備える、請求項16に記載の方法。
- 前記加速されたキャッピングGCIBを方向付けるステップは前記一つ以上の銅相互接続表面と前記一つ以上の誘電体表面とのうちの少なくとも一つに送達される約1×1014から約1×1017ガスクラスタイオン(ions)/cm2の範囲内の照射量という結果をもたらす、請求項16に記載の方法。
- 一つ以上の銅相互接続表面と誘電体材料をカバーする一つ以上の障壁層表面とを含む構造体において、
減圧されたチャンバ内に前記構造体を配置するステップと、
前記減圧されたチャンバ内で加速されたエッチング・キャッピングGCIBを形成するステップと、
前記エッチング・キャッピングGCIBが方向付けられる前記一つ以上の銅相互接続表面上にキャッピング構造体を形成するように、前記一つ以上の銅相互接続表面と前記一つ以上の障壁層表面とのうちの少なくとも一つに前記加速されたエッチング・キャッピングGCIBを方向付けて、下の前記誘電体材料を露出するために前記エッチング・キャッピングGCIBが方向付けられる前記少なくとも一つの障壁層表面をエッチング除去するステップと、を備える、キャッピング構造体を形成する方法。 - 各々が基板表面上の位置の関数として一つ以上の障壁層表面の一つに対応する前記一つ以上の障壁層の厚さを測定するステップと、
前記基板表面上の前記一つ以上の障壁層厚さのマップを生成するステップと、を更に備えており、
前記方向付けるステップは前記露出された誘電体材料の最小量を除去するように前記一つ以上の測定された障壁層厚さを補正するステップを更に備える、請求項25に記載の方法。 - 前記加速されたエッチング・キャッピングGCIBを形成するステップはFとSからなるグループから選択される少なくとも一つの元素を含むガスからガスクラスタイオンを生成するステップを更に備える、請求項25に記載の方法。
- 前記加速されたエッチング・キャッピングGCIBを形成するステップはF、S、Ar、XeおよびNからなるグループから選択される少なくとも一つの元素を含むガスからガスクラスタイオンを生成するステップを更に備える、請求項25に記載の方法。
- 前記加速されたエッチング・キャッピングGCIBを形成するステップは約200sccmから約3000sccmのノズルガス流量で流れるソースガスからガスクラスタイオンを生成するステップと、
約10kVから約50kVの範囲内の加速電位によってガスクラスタイオンを加速するステップと、を備える、請求項25に記載の方法。 - 前記エッチング・キャッピングGCIBを形成および方向付けするステップに先立って、前記減圧されたチャンバ内で加速された洗浄GCIBを形成するステップと、
前記加速された洗浄GCIBが方向付けられる前記一つ以上の表面を洗浄するように前記加速された洗浄GCIBを前記一つ以上の銅相互接続表面と前記一つ以上の障壁層表面とのうちの少なくとも一つに方向付けるステップとを更に備える、請求項25に記載の方法。 - 前記加速された洗浄GCIBを形成するステップはAr、N2、NH3およびH2からなるグループから選択される少なくとも一つのガスを含む一つ以上のガスからガスクラスタイオンを生成するステップを備える、請求項30に記載の方法。
- 前記加速された洗浄GCIBを形成するステップは約3kVから約50kVの範囲内の加速電位によって、前記生成されタガスクラスタイオンを加速するステップを更に備える、請求項31に記載の方法。
- 前記加速された洗浄GCIBを方向付けるステップは前記一つ以上の銅相互接続表面と前記一つ以上の障壁層表面とのうちの少なくとも一つに送達される約5×1013から約5×1016ガスクラスタイオン(ions)/cm2の範囲内の照射量という結果をもたらす、請求項30に記載の方法。
- 一つ以上の銅相互接続表面と誘電体材料をカバーする一つ以上の障壁層表面とを有する構造体について、
減圧されたチャンバ内に前記構造体を配置するステップと、
前記減圧されたチャンバ内で加速されたエッチングGCIBを形成するステップと、
下の前記誘電体材料を露出するために前記エッチングGCIBが方向付けられる前記一つ以上の障壁層表面をエッチング除去するように前記加速されたエッチングGCIBを前記一つ以上の障壁層表面に方向付けるステップと、
前記減圧されたチャンバ内に加速されたキャッピングGCIBを形成するステップと、
その上に一つ以上のキャッピング構造体を形成するように前記加速されたキャッピングGCIBを前記一つ以上の銅相互接続表面に方向付けるステップと、を備える、キャッピング構造体を形成する方法。 - 各々が基板表面上の位置の関数として一つ以上の障壁層表面の一つに関連する前記一つ以上の障壁層の厚さを測定するステップと、
前記基板表面上の障壁層厚さのマップを生成するステップと、を更に備え、
前記加速されたエッチングGCIBを方向付けるステップは前記露出された誘電体材料の最小量を除去するように前記一つ以上の測定された障壁層厚さを補正するステップを更に含む、請求項34に記載の方法。 - 前記加速されたキャッピングGCIBはC、N、O、Si、B、Ge、Ti、SおよびFからなるグループから選択される少なくとも一つの元素からなる、請求項34に記載の方法。
- 前記加速されたキャッピングGCIBはC、N、O、Si、B、GeおよびTiを含むグループから選択される少なくとも一つの元素からなる、請求項34に記載の方法。
- 前記加速されたキャッピングGCIBガスクラスタイオンはArおよびXeからなるグループから選択される少なくとも一つの元素を更に含む、請求項36に記載の方法。
- 前記加速されたキャッピングGCIBガスクラスタイオンはArおよびXeからなるグループから選択される少なくとも一つの元素を更に含む、請求項37に記載の方法。
- 前記加速されたキャッピングGCIBを形成するステップは約3kVから約50kVの範囲内の加速電位によってキャッピングGCIBガスクラスタイオンを加速するステップを備えており、
前記加速されたキャッピングGCIBを方向付けるステップは前記一つ以上の銅相互接続表面の少なくとも一つに送達される約1×1014から約1×1017ガスクラスタイオン(ions)/cm2の範囲内の照射量という結果をもたらす、請求項34に記載の方法。 - 前記形成および方向付けステップに先立って、前記減圧されたチャンバ内で加速された洗浄GCIBを形成するステップと、
前記加速された洗浄GCIBが方向付けられる前記少なくとも一つの表面を洗浄するように前記加速された洗浄GCIBを前記一つ以上の銅相互接続表面と前記一つ以上の障壁層表面とに方向付けるステップとを更に備える、請求項34に記載の方法。 - 前記加速された洗浄GCIBはAr、N2、NH3およびH2からなるグループ内の少なくとも一つのガス分子からなる、請求項41に記載の方法。
- 前記加速された洗浄GCIBを形成するステップは約3kVから約50kVの範囲内の加速電位によって洗浄GCIBガスクラスタイオンを加速するステップを備えており、
前記洗浄GCIBを方向付けるステップは前記加速された洗浄GCIBが方向付けられる前記一つ以上の表面を洗浄するように前記一つ以上の銅相互接続表面と前記一つ以上の障壁層表面とのうちの少なくとも一つに送達される約5×1013から約5×1016ガスクラスタイオン(ions)/cm2の照射量という結果をもたらす、請求項41に記載の方法。 - 前記加速されたエッチングGCIBを形成するステップは約200sccmから約3000sccmのノズルガス流量で流れるソースガスからガスクラスタイオンを生成するステップと、
約10kVから約50kVの範囲内の加速電位によって前記ガスクラスタイオンを加速するステップと、を備える、請求項34に記載の方法。 - その表面にGCIB注入されたキャッピング構造体を備える銅相互接続体。
- 前記キャッピング構造体は表面の上の薄膜である、請求項45に記載の銅相互接続体。
- 前記薄膜は導電性である、請求項46に記載の銅相互接続体。
- 前記薄膜は誘電体フィルムである、請求項46に記載の銅相互接続体。
- 前記薄膜はC、N、O、Si、B、Ge、Ti、FおよびSからなるグループから選択される少なくとも一つの元素からなる、請求項46に記載の銅相互接続体。
- 前記薄膜は酸化物、炭化物および窒化物からなるグループから選択される少なくとも一つの材料からなる、請求項46に記載の銅相互接続体。
- 前記薄膜はSi3N4、SiCN、BN、CuF2、TiO2、CuCO3、B、Tiおよびホウケイ酸ガラスからなるグループから選択される材料からなる、請求項46に記載の銅相互接続体。
- 上に重なる誘電体拡散障壁フィルムを更に備える、請求項45に記載の銅相互接続体。
- 前記誘電体拡散障壁フィルムはSi3N4、SiCNおよびSiCからなるグループから選択される材料からなる、請求項52に記載の銅相互接続体。
- その表面上にGCIB注入薄膜キャッピング構造体を含むレベル間誘電体層。
- 前記薄膜はC、N、O、Si、B、Ge、Ti、FおよびSからなるグループから選択される少なくとも一つの元素からなる、請求項54に記載のレベル間誘電体層。
- その表面上にGCIB注入薄膜キャッピング構造体を含むハードマスク層。
- 前記薄膜はBおよびTiからなるグループから選択される一つ以上の元素からなる、請求項56に記載のハードマスク層。
- Si3N4、SiCNおよびSiCからなるグループから選択される材料からなる、上に重なる誘電体拡散障壁フィルムを更に備える、請求項54に記載のレベル間誘電体層。
- Si3N4、SiCNおよびSiCからなるグループから選択される材料からなる、上に重なる誘電体拡散障壁フィルムを更に備える、請求項56に記載のハードマスク層。
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JP2010541247A (ja) * | 2007-09-27 | 2010-12-24 | ティーイーエル エピオン インコーポレイテッド | 半導体デバイスにおける電気漏れ特性の改善及びエレクトロマイグレーションの抑制を行う方法 |
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JP2017520912A (ja) * | 2014-05-21 | 2017-07-27 | ソニー株式会社 | メモリセルおよびソース線を酸化させずにマスキング層のドライエッチングを行う方法 |
KR20170129475A (ko) * | 2016-05-17 | 2017-11-27 | 에이에스엠 아이피 홀딩 비.브이. | 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법 |
KR102592471B1 (ko) | 2016-05-17 | 2023-10-20 | 에이에스엠 아이피 홀딩 비.브이. | 금속 배선 형성 방법 및 이를 이용한 반도체 장치의 제조 방법 |
Also Published As
Publication number | Publication date |
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CN100472739C (zh) | 2009-03-25 |
KR101184529B1 (ko) | 2012-09-20 |
WO2006052958A3 (en) | 2007-04-12 |
US20060105570A1 (en) | 2006-05-18 |
EP1815507A4 (en) | 2010-10-06 |
KR20070085814A (ko) | 2007-08-27 |
CN101107699A (zh) | 2008-01-16 |
WO2006052958A2 (en) | 2006-05-18 |
US7291558B2 (en) | 2007-11-06 |
EP1815507A2 (en) | 2007-08-08 |
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