JP2008518767A - 基板を保持する回転式装置 - Google Patents
基板を保持する回転式装置 Download PDFInfo
- Publication number
- JP2008518767A JP2008518767A JP2007539532A JP2007539532A JP2008518767A JP 2008518767 A JP2008518767 A JP 2008518767A JP 2007539532 A JP2007539532 A JP 2007539532A JP 2007539532 A JP2007539532 A JP 2007539532A JP 2008518767 A JP2008518767 A JP 2008518767A
- Authority
- JP
- Japan
- Prior art keywords
- support
- substrate
- support surface
- fluid
- support device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
- B08B11/02—Devices for holding articles during cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
2 支持装置
3 加熱装置
4 流体供給装置
5 パイプライン
6 孔
7 開口
8 ノズル
11 面
21 支持面
22 部分
23 環状溝
24 縁部領域
Claims (15)
- 平坦な基板(1)を保持及び回転、特に、基板の露出面をスプレーコーティングによって処理する装置において、
軸(A)の回りに回転できると共に、軸(A)に垂直に延在する支持面(21)上に基板(1)を載置及び保持する支持装置(2)と、支持装置(2)を回転させる回転装置と、支持面(21)に対向する基板(1)の面(11)において支持面(21)から半径方向に外方へ突出する部分に流体を供給する流体供給装置(4)とを備え、又、支持面(21)の直径が基板の直径より小さい装置。 - 支持装置(2)の回転中に流体供給装置を作動させることができる請求項1に記載の装置。
- 支持装置(2)を加熱する加熱装置(3)を備える請求項1又は2に記載の装置。
- 支持装置(2)が回転していない時に加熱装置(3)を支持装置(2)に当接させ得る請求項3に記載の装置。
- 加熱装置(3)と支持装置(2)が同軸に配置された請求項3又は4に記載の装置。
- 加熱装置(3)が、接触面により支持装置(2)を加熱するように、軸方向に移動自在である請求項5に記載の装置。
- 流体供給装置(4)が、支持装置(2)の支持面(21)と反対の側に、軸(A)と同軸な環状溝(23)を有し、更に、環状溝(23)が、供給ライン(5)を介して流体を導入すると共に、大略半径方向の孔(6)を介して支持面(21)内の開口(7)と連通する請求項1乃至6のいずれかに記載の装置。
- 支持面(21)に対して段を付けた縁部(22)が、支持面(21)の周囲に設けられると共に、開口(7)が、段付き縁部(22)の領域内に形成された請求項7に記載の装置。
- 流体供給装置が、移動自在のスプレーヘッド(4’)として形成された請求項1乃至6のいずれかに記載の装置。
- 段付き縁部の高さ(H)が約0.2mmである請求項8又は9に記載の装置。
- 段付き縁部(22)の半径方向幅が、約3mm〜10mm、好ましくは、5mmである請求項8乃至10のいずれかに記載の装置。
- 加熱装置(3)が抵抗ヒータを備える請求項3乃至11のいずれかに記載の装置。
- 支持装置(2)が、金属、好ましくは、アルミニウムから成る請求項1乃至12のいずれかに記載の装置。
- 支持面(21)の半径が、約100mm〜約200mmである請求項1乃至13のいずれかに記載の装置。
- 支持装置(2)と同軸の縁部領域(24)を更に備え、縁部領域(24)が、縁部領域(24)と支持装置(2)の基板に対向する面が同面である第1位置(図3(a))と、基板に対向する縁部領域(24)の面が基板から離隔した第2位置(図3(b)及び図3(c))との間で、支持装置に対して軸方向に移動自在である請求項1乃至14のいずれかに記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004053139.0 | 2004-11-03 | ||
DE102004053139A DE102004053139A1 (de) | 2004-11-03 | 2004-11-03 | Drehbare Vorrichtung zum Halten eines Substrats |
PCT/EP2005/011776 WO2006048287A1 (de) | 2004-11-03 | 2005-11-03 | Drehbare vorrichtung zum halten eines substrats |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008518767A true JP2008518767A (ja) | 2008-06-05 |
JP4836958B2 JP4836958B2 (ja) | 2011-12-14 |
Family
ID=35985504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007539532A Expired - Fee Related JP4836958B2 (ja) | 2004-11-03 | 2005-11-03 | 基板を保持する回転式装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7950347B2 (ja) |
EP (1) | EP1829084B1 (ja) |
JP (1) | JP4836958B2 (ja) |
KR (1) | KR101089189B1 (ja) |
DE (1) | DE102004053139A1 (ja) |
WO (1) | WO2006048287A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0919059D0 (en) * | 2009-10-30 | 2009-12-16 | Sencon Europ Ltd | Application and inspection system |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57201564A (en) * | 1981-06-01 | 1982-12-10 | Dainippon Printing Co Ltd | Coating method |
JPS6415925A (en) * | 1987-07-09 | 1989-01-19 | Nec Corp | Applicator for semiconductor device |
JPH02133475U (ja) * | 1989-04-10 | 1990-11-06 | ||
JPH03230518A (ja) * | 1990-02-05 | 1991-10-14 | Nec Corp | 薬液塗布装置 |
JPH04354560A (ja) * | 1991-06-03 | 1992-12-08 | Tokyo Ohka Kogyo Co Ltd | スピンナー |
JPH05343383A (ja) * | 1992-06-04 | 1993-12-24 | Tokyo Ohka Kogyo Co Ltd | 裏面洗浄装置 |
JPH06216018A (ja) * | 1993-01-18 | 1994-08-05 | Tokyo Electron Ltd | 塗布装置 |
JPH06224113A (ja) * | 1993-01-26 | 1994-08-12 | Tokyo Electron Ltd | 塗布装置 |
JPH0851064A (ja) * | 1994-08-08 | 1996-02-20 | Dainippon Screen Mfg Co Ltd | 基板裏面洗浄方法 |
JPH08139007A (ja) * | 1994-11-04 | 1996-05-31 | Hitachi Ltd | 洗浄方法および装置 |
JPH09153474A (ja) * | 1995-11-30 | 1997-06-10 | Dainippon Screen Mfg Co Ltd | 基板洗浄ユニット |
JPH1085652A (ja) * | 1996-09-18 | 1998-04-07 | Dainippon Printing Co Ltd | 基板回転装置 |
JPH11128808A (ja) * | 1997-10-27 | 1999-05-18 | Dainippon Screen Mfg Co Ltd | 回転式塗布装置および回転式塗布方法 |
JP2004022783A (ja) * | 2002-06-17 | 2004-01-22 | Sharp Corp | 処理装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61294819A (ja) * | 1985-06-21 | 1986-12-25 | Nec Corp | 塗布装置 |
JPH02133475A (ja) | 1988-11-14 | 1990-05-22 | Hitachi Maxell Ltd | 塗膜補強剤 |
US5580607A (en) * | 1991-07-26 | 1996-12-03 | Tokyo Electron Limited | Coating apparatus and method |
JPH0785891B2 (ja) | 1993-01-18 | 1995-09-20 | オリエンタル建設株式会社 | 中空pc鋼棒を利用した引張プレストレスの導入方法 |
JPH07284715A (ja) * | 1994-04-15 | 1995-10-31 | Dainippon Screen Mfg Co Ltd | 処理液塗布装置及び処理液塗布方法 |
JP2590438B2 (ja) * | 1994-06-30 | 1997-03-12 | 工業技術院長 | 薄膜形成方法および薄膜形成装置 |
JP4087000B2 (ja) * | 1999-03-08 | 2008-05-14 | 日鉱金属株式会社 | レードル及びレードルのライニング方法 |
US6558053B2 (en) * | 2001-04-19 | 2003-05-06 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus |
JP4075527B2 (ja) | 2002-08-28 | 2008-04-16 | 日本電気株式会社 | レジスト塗布方法およびレジスト塗布装置 |
-
2004
- 2004-11-03 DE DE102004053139A patent/DE102004053139A1/de not_active Withdrawn
-
2005
- 2005-11-03 US US11/718,572 patent/US7950347B2/en not_active Expired - Fee Related
- 2005-11-03 KR KR1020077012607A patent/KR101089189B1/ko active IP Right Grant
- 2005-11-03 EP EP05811027A patent/EP1829084B1/de not_active Not-in-force
- 2005-11-03 WO PCT/EP2005/011776 patent/WO2006048287A1/de active Application Filing
- 2005-11-03 JP JP2007539532A patent/JP4836958B2/ja not_active Expired - Fee Related
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57201564A (en) * | 1981-06-01 | 1982-12-10 | Dainippon Printing Co Ltd | Coating method |
JPS6415925A (en) * | 1987-07-09 | 1989-01-19 | Nec Corp | Applicator for semiconductor device |
JPH02133475U (ja) * | 1989-04-10 | 1990-11-06 | ||
JPH03230518A (ja) * | 1990-02-05 | 1991-10-14 | Nec Corp | 薬液塗布装置 |
JPH04354560A (ja) * | 1991-06-03 | 1992-12-08 | Tokyo Ohka Kogyo Co Ltd | スピンナー |
JPH05343383A (ja) * | 1992-06-04 | 1993-12-24 | Tokyo Ohka Kogyo Co Ltd | 裏面洗浄装置 |
JPH06216018A (ja) * | 1993-01-18 | 1994-08-05 | Tokyo Electron Ltd | 塗布装置 |
JPH06224113A (ja) * | 1993-01-26 | 1994-08-12 | Tokyo Electron Ltd | 塗布装置 |
JPH0851064A (ja) * | 1994-08-08 | 1996-02-20 | Dainippon Screen Mfg Co Ltd | 基板裏面洗浄方法 |
JPH08139007A (ja) * | 1994-11-04 | 1996-05-31 | Hitachi Ltd | 洗浄方法および装置 |
JPH09153474A (ja) * | 1995-11-30 | 1997-06-10 | Dainippon Screen Mfg Co Ltd | 基板洗浄ユニット |
JPH1085652A (ja) * | 1996-09-18 | 1998-04-07 | Dainippon Printing Co Ltd | 基板回転装置 |
JPH11128808A (ja) * | 1997-10-27 | 1999-05-18 | Dainippon Screen Mfg Co Ltd | 回転式塗布装置および回転式塗布方法 |
JP2004022783A (ja) * | 2002-06-17 | 2004-01-22 | Sharp Corp | 処理装置 |
Also Published As
Publication number | Publication date |
---|---|
KR101089189B1 (ko) | 2011-12-05 |
JP4836958B2 (ja) | 2011-12-14 |
WO2006048287A1 (de) | 2006-05-11 |
KR20070089690A (ko) | 2007-08-31 |
US20090000544A1 (en) | 2009-01-01 |
EP1829084A1 (de) | 2007-09-05 |
EP1829084B1 (de) | 2012-07-25 |
DE102004053139A1 (de) | 2006-06-01 |
US7950347B2 (en) | 2011-05-31 |
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