JP2008516083A5 - - Google Patents
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- Publication number
- JP2008516083A5 JP2008516083A5 JP2007535073A JP2007535073A JP2008516083A5 JP 2008516083 A5 JP2008516083 A5 JP 2008516083A5 JP 2007535073 A JP2007535073 A JP 2007535073A JP 2007535073 A JP2007535073 A JP 2007535073A JP 2008516083 A5 JP2008516083 A5 JP 2008516083A5
- Authority
- JP
- Japan
- Prior art keywords
- electrolyte according
- metal layer
- electropolishing
- electrolytic polishing
- phosphoric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003792 electrolyte Substances 0.000 claims 11
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 8
- 238000005498 polishing Methods 0.000 claims 8
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 5
- 239000000654 additive Substances 0.000 claims 4
- 230000000996 additive effect Effects 0.000 claims 4
- 235000011187 glycerol Nutrition 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
Claims (10)
- 燐酸、酢酸、および少なくとも１個のヒドロキシル基を有するアルコール添加剤を有する、半導体製造において使用するための電解研磨電解質において、電解研磨下での金属層上のアルコール添加剤の接触角が酸性溶液の接触角より小さいことを特徴とする半導体製造において使用するための電解研磨電解質。
- アルコール添加剤がメタノール、エタノールおよびグリセリンからなる群から選択される請求項１記載の電解研磨電解質。
- アルコール添加剤がグリセリンである請求項１記載の電解研磨電解質。
- グリセリンと燐酸の体積比が１：５０〜１：２００である請求項３記載の電解研磨電解質。
- グリセリンと燐酸の体積比が１：１００である請求項３記載の電解研磨電解質。
- メタノールと燐酸の体積比が１：１００〜１：１５０である請求項２記載の電解研磨電解質。
- エタノールと燐酸の体積比が１：１００〜１：１５０である請求項２記載の電解研磨電解質。
- 酢酸の濃度が１００００〜１２０００ｐｐｍである請求項１記載の電解研磨電解質。
- 金属層が少なくとも１つの凹面および１つの凸面を有する、金属層を平坦化する方法において、請求項１から８までのいずれか１項記載の電解研磨電解質を使用し、その際電解研磨電解質が凸面での研磨速度が凹面での研磨速度より速くなるように、凹面と凸面の間に濃度勾配を形成することを特徴とする、金属層を平坦化する方法。
- 金属層が銅を含む請求項９記載の金属層を平坦化する方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093130211A TWI294923B (en) | 2004-10-06 | 2004-10-06 | Electropolishing electrolyte and method for planarizing a metal layer using the same |
| PCT/EP2005/010628 WO2006037584A1 (en) | 2004-10-06 | 2005-10-01 | Electropolishing electrolyte and method for planarizing a metal layer using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008516083A JP2008516083A (ja) | 2008-05-15 |
| JP2008516083A5 true JP2008516083A5 (ja) | 2008-11-20 |
Family
ID=35636650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007535073A Withdrawn JP2008516083A (ja) | 2004-10-06 | 2005-10-01 | 電解研磨電解質および前記電解質を使用して金属層を平坦化する方法 |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US7501051B2 (ja) |
| EP (1) | EP1935013A1 (ja) |
| JP (1) | JP2008516083A (ja) |
| KR (1) | KR20070061579A (ja) |
| AT (1) | AT503087A2 (ja) |
| CH (1) | CH698385B1 (ja) |
| DE (1) | DE112005002414T5 (ja) |
| GB (1) | GB2434159B (ja) |
| IL (1) | IL182224A0 (ja) |
| MY (1) | MY141248A (ja) |
| RU (1) | RU2007116697A (ja) |
| TW (1) | TWI294923B (ja) |
| WO (1) | WO2006037584A1 (ja) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100783006B1 (ko) * | 2007-08-09 | 2007-12-07 | 신승균 | 동 도금된 마그네슘합금 및 그 형성방법 |
| CN105420805B (zh) * | 2009-11-23 | 2018-10-23 | 梅特康有限责任公司 | 电解质溶液和电抛光方法 |
| US8580103B2 (en) | 2010-11-22 | 2013-11-12 | Metcon, Llc | Electrolyte solution and electrochemical surface modification methods |
| CN102337569B (zh) * | 2011-09-19 | 2014-06-11 | 华南理工大学 | 一种钴-钨纳米合金镀层及其制备方法 |
| RU2471595C1 (ru) * | 2011-12-07 | 2013-01-10 | Открытое акционерное общество "Научно-производственное объединение "Сатурн" | Электролит для электрохимической обработки |
| KR101464860B1 (ko) * | 2013-02-06 | 2014-11-24 | 인천대학교 산학협력단 | 알릴 알콜을 포함하는 금속 씨앗층 평탄제 및 이를 이용한 씨앗층의 형성방법 |
| US9648723B2 (en) | 2015-09-16 | 2017-05-09 | International Business Machines Corporation | Process of fabricating printed circuit board |
| WO2020138976A1 (ko) * | 2018-12-26 | 2020-07-02 | 한양대학교에리카산학협력단 | 반도체 소자의 제조 방법 |
| DE102020200815A1 (de) | 2020-01-23 | 2021-07-29 | Mahle International Gmbh | Zusammensetzung als Elektrolyt zum Auflösen und/oder Abscheiden von Metallen, Metalloxiden und/oder Metalllegierungen sowie Verwendungen dieser Zusammensetzung |
| KR102258703B1 (ko) | 2020-09-07 | 2021-06-01 | 주식회사 근우 | 전기 전도율 향상을 위한 표면구조를 가지는 버스바 제조방법 |
| KR102258702B1 (ko) | 2020-09-07 | 2021-06-01 | 주식회사 근우 | 전기 전도율 향상을 위한 표면 구조를 가지는 버스바 |
| WO2022114330A1 (ko) * | 2020-11-30 | 2022-06-02 | 한국과학기술연구원 | Cis계 박막의 평탄화 방법, 이를 이용하여 제조된 cis계 박막 및 상기 cis계 박막을 포함하는 태양전지 |
| US11512400B2 (en) | 2020-12-10 | 2022-11-29 | Saudi Arabian Oil Company | Electrochemical reduction of carbon dioxide |
| US11447887B2 (en) * | 2020-12-10 | 2022-09-20 | Saudi Arabian Oil Company | Surface smoothing of copper by electropolishing |
| CN113337877A (zh) * | 2021-05-17 | 2021-09-03 | 安徽昀水表面科技有限公司 | 一种电解抛光药水及电解抛光加工工艺 |
| US11578016B1 (en) | 2021-08-12 | 2023-02-14 | Saudi Arabian Oil Company | Olefin production via dry reforming and olefin synthesis in a vessel |
| US11787759B2 (en) | 2021-08-12 | 2023-10-17 | Saudi Arabian Oil Company | Dimethyl ether production via dry reforming and dimethyl ether synthesis in a vessel |
| US11718575B2 (en) | 2021-08-12 | 2023-08-08 | Saudi Arabian Oil Company | Methanol production via dry reforming and methanol synthesis in a vessel |
| US11617981B1 (en) | 2022-01-03 | 2023-04-04 | Saudi Arabian Oil Company | Method for capturing CO2 with assisted vapor compression |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB726133A (en) * | 1952-10-09 | 1955-03-16 | Metro Cutanit Ltd | Improvements relating to the electrolytic treatment of metal wire and the like |
| JPS5242134B2 (ja) * | 1972-12-30 | 1977-10-22 | ||
| SU779453A1 (ru) * | 1978-04-24 | 1980-11-15 | Ленинградский Институт Ядерной Физики Им. Б.П.Константинова Ан Ссср | Раствор дл электрохимического полировани металлической поверхности |
| US4920361A (en) * | 1987-06-26 | 1990-04-24 | Canon Kabushiki Kaisha | Image recording method and apparatus therefor |
| US5066370A (en) * | 1990-09-07 | 1991-11-19 | International Business Machines Corporation | Apparatus, electrochemical process, and electrolyte for microfinishing stainless steel print bands |
| JP2649625B2 (ja) | 1991-12-10 | 1997-09-03 | 株式会社 ケミカル山本 | 含クロム合金鋼の電解琢磨用電解液 |
| FR2747399B1 (fr) | 1996-04-12 | 1998-05-07 | Commissariat Energie Atomique | Electrolyte pour l'electropolissage, procede d'electropolissage d'un acier inoxydable ou d'un alliage de nickel mettant en oeuvre cet electrolyte, et son application a la decontamination |
| US6491808B2 (en) * | 1997-09-11 | 2002-12-10 | Canon Kabushiki Kaisha | Electrolytic etching method, method for producing photovoltaic element, and method for treating defect of photovoltaic element |
| AT410043B (de) * | 1997-09-30 | 2003-01-27 | Sez Ag | Verfahren zum planarisieren von halbleitersubstraten |
| TW571005B (en) * | 2000-06-29 | 2004-01-11 | Ebara Corp | Method and apparatus for forming copper interconnects, and polishing liquid and polishing method |
| US7128825B2 (en) * | 2001-03-14 | 2006-10-31 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| TW567545B (en) * | 2002-06-04 | 2003-12-21 | Merck Kanto Advanced Chemical | Electropolishing electrolytic solution formulation |
-
2004
- 2004-10-06 TW TW093130211A patent/TWI294923B/zh not_active IP Right Cessation
-
2005
- 2005-02-04 US US11/051,163 patent/US7501051B2/en not_active Expired - Fee Related
- 2005-10-01 EP EP05797350A patent/EP1935013A1/en not_active Withdrawn
- 2005-10-01 CH CH00561/07A patent/CH698385B1/de not_active IP Right Cessation
- 2005-10-01 RU RU2007116697/28A patent/RU2007116697A/ru not_active Application Discontinuation
- 2005-10-01 KR KR1020077010183A patent/KR20070061579A/ko not_active Application Discontinuation
- 2005-10-01 GB GB0707076A patent/GB2434159B/en not_active Expired - Fee Related
- 2005-10-01 AT AT0939305A patent/AT503087A2/de not_active Application Discontinuation
- 2005-10-01 JP JP2007535073A patent/JP2008516083A/ja not_active Withdrawn
- 2005-10-01 WO PCT/EP2005/010628 patent/WO2006037584A1/en active Application Filing
- 2005-10-01 DE DE112005002414T patent/DE112005002414T5/de not_active Withdrawn
- 2005-10-06 MY MYPI20054707A patent/MY141248A/en unknown
-
2007
- 2007-03-27 IL IL182224A patent/IL182224A0/en unknown
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