JP2008311399A5 - - Google Patents

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JP2008311399A5
JP2008311399A5 JP2007157186A JP2007157186A JP2008311399A5 JP 2008311399 A5 JP2008311399 A5 JP 2008311399A5 JP 2007157186 A JP2007157186 A JP 2007157186A JP 2007157186 A JP2007157186 A JP 2007157186A JP 2008311399 A5 JP2008311399 A5 JP 2008311399A5
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Japan
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water
heat
sink
cooled
tandem
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JP2007157186A
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Japanese (ja)
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JP2008311399A (en
JP4953075B2 (en
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Priority to JP2007157186A priority Critical patent/JP4953075B2/en
Priority claimed from JP2007157186A external-priority patent/JP4953075B2/en
Publication of JP2008311399A publication Critical patent/JP2008311399A/en
Publication of JP2008311399A5 publication Critical patent/JP2008311399A5/ja
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Publication of JP4953075B2 publication Critical patent/JP4953075B2/en
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Claims (8)

作動流体を封入し、外表面部に電子素子の装着部を有してなる熱サイフォン部と、冷却水を通過させる水冷ジャケット部とを並設した水冷タンデム型ヒートシンクであって、前記電子素子と、下部に前記作動流体を封入した前記熱サイフォン部と、前記水冷ジャケット部とをシリーズに対向配置させ、前記電子素子で発生した熱を前記熱サイフォン部にサブクール沸騰による熱伝達で移送し、前記熱サイフォン部に移送された熱を前記水冷ジャケット部の冷却水に移送することを特徴する水冷タンデム型ヒートシンク。 A water-cooled tandem heat sink in which a working fluid is sealed and a thermosiphon part having a mounting part for an electronic element on an outer surface part and a water-cooling jacket part for allowing cooling water to pass therethrough , , and the thermal siphon portion enclosing the working fluid in the lower part, series is disposed opposite the said water cooling jacket, was transported in heat transfer by subcooled boiling heat generated by the electronic element to the thermosyphon unit, A water-cooled tandem heat sink, wherein the heat transferred to the thermosyphon part is transferred to cooling water in the water-cooling jacket part. 請求項１記載において、前記熱サイフォン部の内部では前記サブクール沸騰と凝縮の気液二相の状態を形成し、前記水ジャケット部では水の液単相の冷却状態を形成することを特徴とする水冷タンデム型ヒートシンク。 According to claim 1, wherein, in the interior of the thermosyphon unit to form a state of the subcooled boiling and condensation of the gas-liquid two-phase, in the water jacket portion and forming a cooled state of water in the liquid single-phase Water-cooled tandem heat sink. 請求項１記載において、前記熱サイフォン部と前記水ジャケット部とを単一の容器にて構成し、前記容器の内部に設けた区画部を介して前記熱サイフォン部の作動流体と前記水冷ジャケット部の冷却水とを近接させたことを特徴とする水冷タンデム型ヒートシンク。 According to claim 1 wherein said thermally siphon portion and said water jacket portion constituted by a single container, the working fluid of the heat siphon unit via a partition portion provided on the interior of the container cooling jacket unit cooled tandem heat sink is characterized in that in proximity to and cooling water. 請求項１記載において、前記熱サイフォン部を密閉構造に形成し、前記熱サイフォン部の圧力を大気圧以下に保ち、かつ前記電子素子からの熱流束を高く保持し、前記電子素子を耐熱温度以下で動作させることを特徴とする水冷タンデム型ヒートシンク。 According to claim 1, wherein, to form said thermosyphon unit in a closed structure, keeping the pressure of the thermosyphon unit below the atmospheric pressure, and high holds the heat flux of the electronic device or, et al., The electronic element heat resistant temperature A water-cooled tandem heat sink, which is operated as follows. 請求項１記載において、前記水冷ジャケットの伝熱面積を前記電子素子の伝熱面積の４〜８倍に形成したことを特徴とする水冷タンデム型ヒートシンク。 According to claim 1, wherein a water-cooled tandem sink, wherein a heat transfer area of the water cooling jacket formed in 4-8 times the heat transfer area of the electronic element. 請求項１記載において、前記熱サイフォン部の前記作動流体は、純水、アルコール、フロンからなる群から選ばれた一つであることを特徴とする水冷タンデム型ヒートシンク。 According to claim 1, wherein the working fluid of the heat siphon unit, pure water, alcohol, water cooled tandem sink, characterized in that the one selected from the group consisting of fluorocarbons. 請求項３記載において、前記容器を高い熱伝導性と高い抗腐食性を有する銅材料で形成したことを特徴とする水冷タンデム型ヒートシンク。 In claim 3, water cooled tandem sink, characterized in that the formation of the container with a copper material having high thermal conductivity and high anti-corrosive. 請求項３記載において、前記区画部を高い熱伝導性と高い抗腐食性を有する銅材料で形成したことを特徴とする水冷タンデム型ヒートシンク。 In claim 3, water cooled tandem sink, characterized in that the formation of the partition portion in the copper material having high thermal conductivity and high anti-corrosive.
JP2007157186A 2007-06-14 2007-06-14 heatsink Expired - Fee Related JP4953075B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007157186A JP4953075B2 (en) 2007-06-14 2007-06-14 heatsink

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Application Number Priority Date Filing Date Title
JP2007157186A JP4953075B2 (en) 2007-06-14 2007-06-14 heatsink

Publications (3)

Publication Number Publication Date
JP2008311399A JP2008311399A (en) 2008-12-25
JP2008311399A5 true JP2008311399A5 (en) 2010-02-25
JP4953075B2 JP4953075B2 (en) 2012-06-13

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JP2007157186A Expired - Fee Related JP4953075B2 (en) 2007-06-14 2007-06-14 heatsink

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110308709A1 (en) * 2008-12-12 2011-12-22 Joseph Ouellette Mandrel with integral heat pipe
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
KR102023228B1 (en) 2012-05-07 2019-09-19 포노닉, 인크. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US9593871B2 (en) 2014-07-21 2017-03-14 Phononic Devices, Inc. Systems and methods for operating a thermoelectric module to increase efficiency
CN209839498U (en) 2016-09-23 2019-12-24 古河电气工业株式会社 Heat insulation structure
JP7168850B2 (en) * 2018-11-27 2022-11-10 富士通株式会社 Evaporator and cooling system
JP2023126992A (en) * 2020-07-31 2023-09-13 尼得科超▲しゅう▼科技股▲ふん▼有限公司 cooling member

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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JPH0359645A (en) * 1989-07-28 1991-03-14 Konica Corp Silver halide photographic sensitive material subjected to antistatic treatment
JP2874100B2 (en) * 1990-10-16 1999-03-24 富士通株式会社 Electronic equipment cooling system
JP2002016204A (en) * 2000-06-28 2002-01-18 Ts Heatronics Co Ltd Heat-receiving and radiating structure
JP4201962B2 (en) * 2000-07-07 2008-12-24 財団法人電力中央研究所 Cooling method using refined boiling

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