JP2008300825A - 照明用ledモジュール及びその製造方法 - Google Patents
照明用ledモジュール及びその製造方法 Download PDFInfo
- Publication number
- JP2008300825A JP2008300825A JP2008121267A JP2008121267A JP2008300825A JP 2008300825 A JP2008300825 A JP 2008300825A JP 2008121267 A JP2008121267 A JP 2008121267A JP 2008121267 A JP2008121267 A JP 2008121267A JP 2008300825 A JP2008300825 A JP 2008300825A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- illumination
- led module
- led element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/933—Special insulation
- Y10S439/936—Potting material or coating, e.g. grease, insulative coating, sealant or, adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
【解決手段】照明用LEDモジュール100は、印刷回路基板(Printed Circuit Board)110と、その印刷回路基板110の上に実装された少なくとも一つのLED素子130と、印刷回路基板110、LED素子130の実装面に露出された印刷回路基板110、およびLED素子130の端子を取り囲む防水剤150と、を含んで構成される。
【選択図】 図2
Description
110、210 印刷回路基板
130、230 LED素子
150、250 防水剤
300 空圧式ディスペンサ装置
310 防水剤貯蔵室
330 ディスペンサ
370 吐出部
Claims (21)
- 印刷回路基板と、
前記印刷回路基板の上に実装された少なくとも一つのLED素子と、
前記印刷回路基板、前記LED素子の実装面に露出された印刷回路基板、及び前記LED素子の端子を取り囲む防水剤と、
を備えることを特徴とする照明用LEDモジュール。 - 前記印刷回路基板は、FR−4系の基板であることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記印刷回路基板は、メタルコア印刷回路基板であることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記印刷回路基板は、セラミック系の基板であることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記防水剤は、前記LED素子の実装された領域を除いた、前記印刷回路基板の上面を露出させることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記防水剤は、前記LED素子の側面に沿って局部に塗布されていることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記防水剤は、前記LED素子の上面及び側面を全てカバーすることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記防水剤は、前記LED素子の上面を露出させることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記防水剤は、シリコンであることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記シリコンは、シリコン樹脂エマルジョン被膜剤を含むことを特徴とする請求項9に記載の照明用LEDモジュール。
- 前記防水剤は、エポキシであることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記エポキシは、エポキシ樹脂被膜剤を含むことを特徴とする請求項11に記載の照明用LEDモジュール。
- 前記印刷回路基板は、両面テープによって設置物に固定されていることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記印刷回路基板は、螺合によって設置物に固定されていることを特徴とする請求項1に記載の照明用LEDモジュール。
- 前記印刷回路基板の上に、前記螺合用の孔が設けられていることを特徴とする請求項14に記載の照明用LEDモジュール。
- 印刷回路基板を用意するステップと、
前記印刷回路基板の上に少なくとも一つのLED素子を実装するステップと、
前記LED素子の側面に沿って、前記印刷回路基板及び前記LED素子の端子をカバーする防水剤を塗布するステップと、
を含むことを特徴とする照明用LEDモジュールの製造方法。 - 前記防水剤を塗布するステップは、空圧式ディスペンサ方法によって行われることを特徴とする請求項16に記載の照明用LEDモジュールの製造方法。
- 前記防水剤を塗布するステップは、チューブ圧送式ディスペンサ方法によって行われることを特徴とする請求項16に記載の照明用LEDモジュールの製造方法。
- 前記防水剤を塗布するステップは、前記LED素子の実装領域を除いた、前記印刷回路基板の上面を露出させるステップを含むことを特徴とする請求項16に記載の照明用LEDモジュールの製造方法。
- 前記防水剤を塗布するステップは、前記LED素子の上面及び側面に防水剤を塗布するステップを含むことを特徴とする請求項19に記載の照明用LEDモジュールの製造方法。
- 前記防水剤を塗布するステップは、前記LED素子の上面が露出するように、前記LED素子の側面にのみ防水剤を塗布するステップを含むことを特徴とする請求項19に記載の照明用LEDモジュールの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070052246A KR100862343B1 (ko) | 2007-05-29 | 2007-05-29 | 조명용 led 모듈 및 그 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008300825A true JP2008300825A (ja) | 2008-12-11 |
Family
ID=40088802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008121267A Pending JP2008300825A (ja) | 2007-05-29 | 2008-05-07 | 照明用ledモジュール及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7674111B2 (ja) |
JP (1) | JP2008300825A (ja) |
KR (1) | KR100862343B1 (ja) |
TW (1) | TWI399144B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI316381B (en) * | 2007-01-24 | 2009-10-21 | Phoenix Prec Technology Corp | Circuit board and fabrication method thereof |
EP2128862A1 (en) * | 2008-05-30 | 2009-12-02 | Deutsche Thomson OHG | Flat actuator made from one piece of PCB |
EP2353179A4 (en) * | 2008-10-17 | 2012-10-03 | Occam Portfolio Llc | SOLDER-FREE FLEXIBLE CIRCUIT ARRANGEMENTS AND METHODS OF MANUFACTURING THE SAME |
JP5778999B2 (ja) * | 2010-08-06 | 2015-09-16 | 日亜化学工業株式会社 | 発光装置および画像表示ユニット |
KR20180014903A (ko) * | 2016-08-01 | 2018-02-12 | 삼성디스플레이 주식회사 | 전자 소자, 이의 실장 방법 및 이를 포함하는 표시 장치의 제조 방법 |
US10436416B2 (en) | 2017-07-19 | 2019-10-08 | Ford Global Technologies, Llc | Vehicle light assembly with heat sink |
KR102415812B1 (ko) * | 2017-09-22 | 2022-07-01 | 삼성디스플레이 주식회사 | 발광 장치 및 발광 장치의 제조 방법 |
WO2023152538A1 (en) * | 2022-02-09 | 2023-08-17 | Pure Impact Fzco | Light emitting diode (led) for optical efficiency |
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JPH0964237A (ja) * | 1995-08-21 | 1997-03-07 | Hitachi Ltd | 実装用半導体装置とその実装方法 |
JP2001160628A (ja) * | 1999-12-02 | 2001-06-12 | Sony Corp | 表示装置およびその保護部材の形成方法 |
JP2003243704A (ja) * | 2002-02-07 | 2003-08-29 | Lumileds Lighting Us Llc | 発光半導体デバイス及び方法 |
JP2006188573A (ja) * | 2005-01-04 | 2006-07-20 | Hitachi Chem Co Ltd | 液状エポキシ樹脂組成物、該組成物を用いた電子部品装置及びその製造方法 |
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KR100680654B1 (ko) | 2006-08-07 | 2007-02-08 | 해성쏠라(주) | 발광소자가 일체형으로 구비된 태양전지모듈 |
-
2007
- 2007-05-29 KR KR1020070052246A patent/KR100862343B1/ko active IP Right Grant
-
2008
- 2008-04-30 TW TW097115994A patent/TWI399144B/zh active
- 2008-05-07 JP JP2008121267A patent/JP2008300825A/ja active Pending
- 2008-05-13 US US12/153,040 patent/US7674111B2/en active Active
Patent Citations (6)
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JPS633167U (ja) * | 1986-06-25 | 1988-01-11 | ||
JPH07140916A (ja) * | 1993-11-16 | 1995-06-02 | Yamau:Kk | 多色模様発光装置、及びその製造方法 |
JPH0964237A (ja) * | 1995-08-21 | 1997-03-07 | Hitachi Ltd | 実装用半導体装置とその実装方法 |
JP2001160628A (ja) * | 1999-12-02 | 2001-06-12 | Sony Corp | 表示装置およびその保護部材の形成方法 |
JP2003243704A (ja) * | 2002-02-07 | 2003-08-29 | Lumileds Lighting Us Llc | 発光半導体デバイス及び方法 |
JP2006188573A (ja) * | 2005-01-04 | 2006-07-20 | Hitachi Chem Co Ltd | 液状エポキシ樹脂組成物、該組成物を用いた電子部品装置及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100862343B1 (ko) | 2008-10-13 |
TW200847870A (en) | 2008-12-01 |
US7674111B2 (en) | 2010-03-09 |
US20080299787A1 (en) | 2008-12-04 |
TWI399144B (zh) | 2013-06-11 |
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