JP2008300802A5 - - Google Patents
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- Publication number
- JP2008300802A5 JP2008300802A5 JP2007148537A JP2007148537A JP2008300802A5 JP 2008300802 A5 JP2008300802 A5 JP 2008300802A5 JP 2007148537 A JP2007148537 A JP 2007148537A JP 2007148537 A JP2007148537 A JP 2007148537A JP 2008300802 A5 JP2008300802 A5 JP 2008300802A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- forming
- ridge portion
- flat portion
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 6
- 238000005530 etching Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000005253 cladding Methods 0.000 claims 2
- 239000011800 void material Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007148537A JP2008300802A (ja) | 2007-06-04 | 2007-06-04 | 半導体レーザ素子およびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007148537A JP2008300802A (ja) | 2007-06-04 | 2007-06-04 | 半導体レーザ素子およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008300802A JP2008300802A (ja) | 2008-12-11 |
JP2008300802A5 true JP2008300802A5 (enrdf_load_stackoverflow) | 2010-03-25 |
Family
ID=40173988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007148537A Pending JP2008300802A (ja) | 2007-06-04 | 2007-06-04 | 半導体レーザ素子およびその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2008300802A (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5343687B2 (ja) * | 2009-04-28 | 2013-11-13 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
JP5510212B2 (ja) * | 2010-09-08 | 2014-06-04 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子及びその製造方法 |
CN108512031B (zh) * | 2017-02-28 | 2020-02-14 | 山东华光光电子股份有限公司 | 一种微通道半导体激光器芯片结构及其制作方法 |
CN106887789B (zh) * | 2017-03-13 | 2019-10-18 | 中国科学院苏州纳米技术与纳米仿生研究所 | 半导体激光器及其制作方法 |
CN110875575B (zh) * | 2018-08-31 | 2021-04-06 | 山东华光光电子股份有限公司 | 一种半导体激光器窄脊条结构的制作方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62242382A (ja) * | 1986-04-14 | 1987-10-22 | Omron Tateisi Electronics Co | 半導体レ−ザの端面保護装置 |
JPH04196284A (ja) * | 1990-11-27 | 1992-07-16 | Sharp Corp | 半導体レーザ装置及びその製造方法 |
JPH0722704A (ja) * | 1993-07-06 | 1995-01-24 | Honda Motor Co Ltd | 半導体レーザ |
JP3672272B2 (ja) * | 1995-04-07 | 2005-07-20 | 三菱電機株式会社 | 光半導体デバイス |
JP2001091543A (ja) * | 1999-09-27 | 2001-04-06 | Hitachi Ltd | 半導体検査装置 |
US7440482B2 (en) * | 2005-11-01 | 2008-10-21 | Nichia Corporation | Nitride semiconductor laser element and method for manufacturing the same |
JP4952184B2 (ja) * | 2005-11-01 | 2012-06-13 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子及びその製造方法 |
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2007
- 2007-06-04 JP JP2007148537A patent/JP2008300802A/ja active Pending