JP2008294331A5 - - Google Patents

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Publication number
JP2008294331A5
JP2008294331A5 JP2007140141A JP2007140141A JP2008294331A5 JP 2008294331 A5 JP2008294331 A5 JP 2008294331A5 JP 2007140141 A JP2007140141 A JP 2007140141A JP 2007140141 A JP2007140141 A JP 2007140141A JP 2008294331 A5 JP2008294331 A5 JP 2008294331A5
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JP
Japan
Prior art keywords
substrate
electronic component
component
surface side
disposed
Prior art date
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Granted
Application number
JP2007140141A
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English (en)
Japanese (ja)
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JP2008294331A (ja
JP4975523B2 (ja
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Priority to JP2007140141A priority Critical patent/JP4975523B2/ja
Priority claimed from JP2007140141A external-priority patent/JP4975523B2/ja
Publication of JP2008294331A publication Critical patent/JP2008294331A/ja
Publication of JP2008294331A5 publication Critical patent/JP2008294331A5/ja
Application granted granted Critical
Publication of JP4975523B2 publication Critical patent/JP4975523B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007140141A 2007-05-28 2007-05-28 部品内蔵基板 Active JP4975523B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007140141A JP4975523B2 (ja) 2007-05-28 2007-05-28 部品内蔵基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007140141A JP4975523B2 (ja) 2007-05-28 2007-05-28 部品内蔵基板

Publications (3)

Publication Number Publication Date
JP2008294331A JP2008294331A (ja) 2008-12-04
JP2008294331A5 true JP2008294331A5 (cg-RX-API-DMAC10.html) 2010-04-15
JP4975523B2 JP4975523B2 (ja) 2012-07-11

Family

ID=40168723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007140141A Active JP4975523B2 (ja) 2007-05-28 2007-05-28 部品内蔵基板

Country Status (1)

Country Link
JP (1) JP4975523B2 (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5619372B2 (ja) * 2009-04-16 2014-11-05 大日本印刷株式会社 撮像素子モジュール
KR101051540B1 (ko) * 2009-09-23 2011-07-22 삼성전기주식회사 인쇄회로기판
JP2014170893A (ja) * 2013-03-05 2014-09-18 Taiyo Yuden Co Ltd カメラモジュール
JP6314070B2 (ja) * 2014-10-07 2018-04-18 新光電気工業株式会社 指紋認識用半導体装置、指紋認識用半導体装置の製造方法及び半導体装置
WO2017088729A1 (zh) * 2015-11-27 2017-06-01 苏州晶方半导体科技股份有限公司 影像传感芯片封装结构及其封装方法
JP6990029B2 (ja) * 2017-03-09 2022-01-12 株式会社アムコー・テクノロジー・ジャパン 電子機器および電子機器の製造方法
WO2023135720A1 (ja) * 2022-01-14 2023-07-20 キヤノン株式会社 モジュールおよび機器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007472A (ja) * 1999-06-17 2001-01-12 Sony Corp 電子回路装置およびその製造方法
JP2004079779A (ja) * 2002-08-19 2004-03-11 Seiko Precision Inc 固体撮像装置
JP4475875B2 (ja) * 2003-02-26 2010-06-09 イビデン株式会社 プリント配線板
JPWO2006035528A1 (ja) * 2004-09-29 2008-05-15 株式会社村田製作所 スタックモジュール及びその製造方法

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