BRPI0808020A2 - Módulo de câmera e dispositivo de formação de imagem - Google Patents

Módulo de câmera e dispositivo de formação de imagem

Info

Publication number
BRPI0808020A2
BRPI0808020A2 BRPI0808020-8A2A BRPI0808020A BRPI0808020A2 BR PI0808020 A2 BRPI0808020 A2 BR PI0808020A2 BR PI0808020 A BRPI0808020 A BR PI0808020A BR PI0808020 A2 BRPI0808020 A2 BR PI0808020A2
Authority
BR
Brazil
Prior art keywords
flank
flexible substrate
printed wiring
wiring substrate
substrate
Prior art date
Application number
BRPI0808020-8A2A
Other languages
English (en)
Inventor
Takehiko Nakayama
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of BRPI0808020A2 publication Critical patent/BRPI0808020A2/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Air Bags (AREA)
  • Lens Barrels (AREA)
  • Closed-Circuit Television Systems (AREA)
BRPI0808020-8A2A 2007-12-03 2008-12-03 Módulo de câmera e dispositivo de formação de imagem BRPI0808020A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007312023A JP4992687B2 (ja) 2007-12-03 2007-12-03 カメラモジュールおよび撮像装置
PCT/JP2008/071966 WO2009072523A1 (ja) 2007-12-03 2008-12-03 カメラモジュールおよび撮像装置

Publications (1)

Publication Number Publication Date
BRPI0808020A2 true BRPI0808020A2 (pt) 2014-06-17

Family

ID=40717702

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0808020-8A2A BRPI0808020A2 (pt) 2007-12-03 2008-12-03 Módulo de câmera e dispositivo de formação de imagem

Country Status (10)

Country Link
US (1) US8102467B2 (pt)
EP (1) EP2124434B1 (pt)
JP (1) JP4992687B2 (pt)
KR (1) KR20100097594A (pt)
CN (1) CN101601282B (pt)
AT (1) ATE554598T1 (pt)
BR (1) BRPI0808020A2 (pt)
RU (1) RU2485564C2 (pt)
TW (1) TWI392355B (pt)
WO (1) WO2009072523A1 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101036427B1 (ko) * 2009-08-06 2011-05-23 삼성전기주식회사 카메라 모듈 및 이를 이용한 휴대용 단말기
CN102238319A (zh) * 2010-04-26 2011-11-09 鸿富锦精密工业（深圳）有限公司 摄像装置
JP6459961B2 (ja) * 2013-03-15 2019-01-30 株式会社ニコン 受光装置
US20150103238A1 (en) * 2013-10-11 2015-04-16 Microsoft Corporation Interface Geometry for Camera Mounting
JP6719941B2 (ja) * 2016-03-27 2020-07-08 日本電産コパル株式会社 電子部品搭載部材、及び撮像装置
WO2018212744A1 (en) * 2017-05-15 2018-11-22 Carestream Health, Inc. Flexible substrate module and fabrication method
JP7336261B2 (ja) * 2019-05-22 2023-08-31 キヤノン株式会社 撮像ユニット及び撮像装置
KR102295107B1 (ko) * 2019-12-27 2021-08-31 삼성전기주식회사 광학 장치
WO2021148139A1 (en) * 2020-01-24 2021-07-29 Huawei Technologies Co., Ltd. Electro-mechanical arrangement for optical zoom camera

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07193738A (ja) * 1993-12-27 1995-07-28 Sony Corp ビデオカメラ
JP3571979B2 (ja) 1997-08-12 2004-09-29 山一電機株式会社 カードイン稼動形電子機器
RU2119276C1 (ru) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный гибкий электронный модуль
KR100777864B1 (ko) * 2000-02-29 2007-11-21 교세라 가부시키가이샤 휴대용 정보 단말 및 휴대용 정보 단말 제어 방법
JP2001245217A (ja) * 2000-03-02 2001-09-07 Olympus Optical Co Ltd 小型撮像モジュール
JP2004274164A (ja) 2003-03-05 2004-09-30 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器
JP2005157107A (ja) * 2003-11-27 2005-06-16 Sony Corp カメラユニット
TWI264224B (en) * 2004-07-28 2006-10-11 Fujitsu Ltd Imaging apparatus
JP2006165105A (ja) * 2004-12-03 2006-06-22 Fuji Photo Film Co Ltd 配線基板及びカメラモジュール
JP2006166202A (ja) * 2004-12-09 2006-06-22 Konica Minolta Photo Imaging Inc 光学装置及びデジタルカメラ
CN1805219A (zh) * 2005-01-12 2006-07-19 华为技术有限公司 一种连接装置
JP2006217475A (ja) * 2005-02-07 2006-08-17 Fujinon Corp イメージセンサの取付方法、抑え板、保持機構、及び撮像装置
JP2006254310A (ja) * 2005-03-14 2006-09-21 Sony Corp 撮像素子ユニット、レンズ鏡筒および撮像装置
JP4332130B2 (ja) * 2005-04-26 2009-09-16 新光電気工業株式会社 カメラモジュール
TWM283188U (en) * 2005-06-08 2005-12-11 E Pin Optical Industry Co Ltd Assembly structure of lens modules
JP4855001B2 (ja) * 2005-07-25 2012-01-18 Ｈｏｙａ株式会社 撮像モジュール
TWI299427B (en) * 2005-12-02 2008-08-01 Premier Image Technology Corp Digital camera

Also Published As

Publication number Publication date
EP2124434A4 (en) 2010-12-29
TWI392355B (zh) 2013-04-01
TW200939757A (en) 2009-09-16
EP2124434B1 (en) 2012-04-18
US20100007757A1 (en) 2010-01-14
JP4992687B2 (ja) 2012-08-08
ATE554598T1 (de) 2012-05-15
JP2009135853A (ja) 2009-06-18
CN101601282B (zh) 2011-06-01
RU2009129518A (ru) 2011-02-10
WO2009072523A1 (ja) 2009-06-11
RU2485564C2 (ru) 2013-06-20
US8102467B2 (en) 2012-01-24
KR20100097594A (ko) 2010-09-03
CN101601282A (zh) 2009-12-09
EP2124434A1 (en) 2009-11-25

Similar Documents

Publication Publication Date Title
BRPI0808020A2 (pt) Módulo de câmera e dispositivo de formação de imagem
CN102207798B (zh) 触控模块
TW200733724A (en) Image pickup apparatus, camera module, electronic device, and fabrication method for image pickup apparatus
EP1708476A3 (en) Optical device module
WO2006012139A3 (en) System and method for mounting an image capture device on a flexible substrate
TW200509379A (en) Manufacturing method of solid-state imaging apparatus
EP1708279A3 (en) Optical device module, and method of fabricating the optical device module
EP2693264A3 (en) Camera module
WO2006110634A3 (en) Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
WO2005093862A3 (en) Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module
ATE483285T1 (de) Optisches transpondermodul mit flexibler schaltung mit doppelter platte
TW200727744A (en) Multilayer wiring board
EP2141808A3 (en) Electronic device having touch sensor film
DK1956653T3 (da) Kredsløbsapparat med bundet SMD-komponent
CN105657296A (zh) 具有互连层间隙的图像感测设备及相关方法
HK1083292A1 (en) Method for mounting electronic component
EP2781994A3 (en) Touch module and electronic apparatus
US8982257B2 (en) Image sensor module and camera module using same
US20140111685A1 (en) Camera module with lens holder and connecting plate both positioned on same substrate
JP2007019267A5 (pt)
TWI540469B (zh) 高靜電防護之電子裝置
WO2009054191A1 (ja) 配線基板の受台及びこれを用いた配線基板の接続装置、接続方法
JP2008294331A5 (pt)
TW200733834A (en) Mounting method for electric components
TW200744374A (en) Detachable image sensor module and portable electronic apparatus applying the same

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 3A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2277 DE 26/08/2014.