JP2008292337A - 球状外部電極を有する半導体装置の検査方法 - Google Patents
球状外部電極を有する半導体装置の検査方法 Download PDFInfo
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- JP2008292337A JP2008292337A JP2007138760A JP2007138760A JP2008292337A JP 2008292337 A JP2008292337 A JP 2008292337A JP 2007138760 A JP2007138760 A JP 2007138760A JP 2007138760 A JP2007138760 A JP 2007138760A JP 2008292337 A JP2008292337 A JP 2008292337A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000007689 inspection Methods 0.000 claims abstract description 31
- 239000000523 sample Substances 0.000 claims description 9
- 238000005259 measurement Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241001272720 Medialuna californiensis Species 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Abstract
【解決手段】
本発明の球状外部電極を有する半導体装置の電気的特性の検査方法は、先端が平面でその周縁がエッジを有し、先端部の断面径が球状外部電極の半径よりも大きく、所定位置において支持板に支持されているカンチレバー型の接触子を2本一対で複数使用する。支持板あるいは半導体装置を押圧したとき、2本一対の接触子が支持される2点の中間を通る球状外部電極の中心線で分割される球状外部電極の表面のそれぞれに2本一対の接触子の各エッジが接触してケルビンコンタクトする。さらに支持板あるいは半導体装置をオーバードライブさせたとき、接触子のエッジが球状外部電極の表面を摺動してワイピングが行われることを特徴とする。
【選択図】 図1
Description
1a、11a…梁部
1b、11b…探針部
2、12、22半導体装置
3、13、23…バンプボール(球状外部電極)
4…エッジ
5…ワイピング跡
26…プランジャ
27…ボディ部
28…コイルスプリング
Claims (2)
- 裏面に球状外部電極を有する半導体装置の電気的特性の検査に適用され、2本一対の接触子の先端を1つの該球状外部電極に接触させるケルビンコンタクト法での半導体装置の検査方法において、
先端が平面でその周縁に弧状のエッジを有し、先端付近の断面径が該球状外部電極の半径よりも大きい探針部と、支持板の所定位置に支持される梁部とを有するカンチレバー型の該接触子を2本一対で複数使用し、
(a)該支持板あるいは該半導体装置を押圧したとき、該2本一対の接触子が支持される2点の中間を通る該球状外部電極の中心線で分割される該球状外部電極の表面のそれぞれに該2本一対の接触子の各エッジが接触し、
(b)該支持板あるいは該半導体装置をオーバードライブさせたとき、該接触子の該エッジが該球状外部電極の表面を摺動してワイピングが行われる
動作を含むことを特徴とする球状外部電極を有する半導体装置の検査方法。 - 前記2本一対の接触子は前記梁部が互いに平行にならないように前記支持板に支持されていることを特徴とする請求項1に記載した球状外部電極を有する半導体装置の検査方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007138760A JP4313827B2 (ja) | 2007-05-25 | 2007-05-25 | 球状外部電極を有する半導体装置の検査方法 |
US12/154,196 US7710133B2 (en) | 2007-05-25 | 2008-05-21 | Testing method for semiconductor device having ball-shaped external electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007138760A JP4313827B2 (ja) | 2007-05-25 | 2007-05-25 | 球状外部電極を有する半導体装置の検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008292337A true JP2008292337A (ja) | 2008-12-04 |
JP4313827B2 JP4313827B2 (ja) | 2009-08-12 |
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Application Number | Title | Priority Date | Filing Date |
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JP2007138760A Expired - Fee Related JP4313827B2 (ja) | 2007-05-25 | 2007-05-25 | 球状外部電極を有する半導体装置の検査方法 |
Country Status (2)
Country | Link |
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US (1) | US7710133B2 (ja) |
JP (1) | JP4313827B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011099698A (ja) * | 2009-11-04 | 2011-05-19 | Micronics Japan Co Ltd | プローブ針ガイド部材及びこれを備えたプローブカード並びにそれを用いる半導体装置の試験方法 |
US8445295B2 (en) | 2009-07-29 | 2013-05-21 | Renesas Electronics Corporation | Semiconductor device and method for manufacturing the same |
WO2018163755A1 (ja) * | 2017-03-10 | 2018-09-13 | 山一電機株式会社 | ケルビン検査用端子の位置決め機構、および、それを備えるicソケット |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104204818B (zh) * | 2012-03-23 | 2017-05-24 | 爱德万测试公司 | 用于半导体测试的横向驱动探针 |
US9678108B1 (en) | 2014-02-06 | 2017-06-13 | Advantest America, Inc. | Methods to manufacture semiconductor probe tips |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2620525B2 (ja) * | 1994-09-08 | 1997-06-18 | 山一電機株式会社 | 球面形バンプとの接触構造 |
DE69832010T2 (de) * | 1997-07-24 | 2006-07-13 | Mitsubishi Denki K.K. | Prüfspitze für Halbleiterschaltungen und Verfahren zu ihrer Herstellung |
JPH1164385A (ja) | 1997-08-21 | 1999-03-05 | Hitachi Electron Eng Co Ltd | 検査用基板のプローブ |
US20030102878A1 (en) * | 2001-10-24 | 2003-06-05 | Montoya Thomas T. | Bore probe card and method of testing |
CN100392408C (zh) * | 2001-12-25 | 2008-06-04 | 住友电气工业株式会社 | 接触探头 |
US6911834B2 (en) * | 2002-01-25 | 2005-06-28 | Texas Instruments Incorporated | Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing |
JP2003270267A (ja) | 2002-03-13 | 2003-09-25 | Sumitomo Electric Ind Ltd | プローブユニット、プローブカード、測定装置及びプローブカードの製造方法 |
JP2004335613A (ja) | 2003-05-02 | 2004-11-25 | Ricoh Co Ltd | 接触子案内部材、プローブカード及び半導体装置試験装置、並びに半導体装置の試験方法 |
JP2004347565A (ja) * | 2003-05-26 | 2004-12-09 | Nec Electronics Corp | プロ−ブカ−ドおよび半導体装置の検査方法 |
JP4562122B2 (ja) | 2004-03-30 | 2010-10-13 | 有限会社清田製作所 | 半田ボール検査用2探針ケルビンプローブ |
US7271606B1 (en) * | 2005-08-04 | 2007-09-18 | National Semiconductor Corporation | Spring-based probe pin that allows kelvin testing |
US7688085B2 (en) * | 2006-06-13 | 2010-03-30 | Formfactor, Inc. | Contactor having a global spring structure and methods of making and using the contactor |
-
2007
- 2007-05-25 JP JP2007138760A patent/JP4313827B2/ja not_active Expired - Fee Related
-
2008
- 2008-05-21 US US12/154,196 patent/US7710133B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8445295B2 (en) | 2009-07-29 | 2013-05-21 | Renesas Electronics Corporation | Semiconductor device and method for manufacturing the same |
JP2011099698A (ja) * | 2009-11-04 | 2011-05-19 | Micronics Japan Co Ltd | プローブ針ガイド部材及びこれを備えたプローブカード並びにそれを用いる半導体装置の試験方法 |
WO2018163755A1 (ja) * | 2017-03-10 | 2018-09-13 | 山一電機株式会社 | ケルビン検査用端子の位置決め機構、および、それを備えるicソケット |
Also Published As
Publication number | Publication date |
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JP4313827B2 (ja) | 2009-08-12 |
US7710133B2 (en) | 2010-05-04 |
US20080290887A1 (en) | 2008-11-27 |
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