JP2008288598A - 制御されたアニーリング方法 - Google Patents

制御されたアニーリング方法 Download PDF

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Publication number
JP2008288598A
JP2008288598A JP2008132074A JP2008132074A JP2008288598A JP 2008288598 A JP2008288598 A JP 2008288598A JP 2008132074 A JP2008132074 A JP 2008132074A JP 2008132074 A JP2008132074 A JP 2008132074A JP 2008288598 A JP2008288598 A JP 2008288598A
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Japan
Prior art keywords
substrate
amount
lamps
annealing
power
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Pending
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JP2008132074A
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English (en)
Japanese (ja)
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JP2008288598A5 (enExample
Inventor
Joseph Michael Ranish
マイケル ラニッシュ ジョセフ
Balasubramanian Ramachandran
ラマチャンドラン バラスブラマニアン
Ravi Jallepally
ジャレパリー ラヴァイ
Sundar Ramamurthy
ラママーフィー サンダー
S Achutaraman Bedaplam
エス． アチュタラマン ヴェダプラム
Brian Haas
ハース ブライアン
Aaron Hunter
ハンター アーロン
Wolfgang Aderhold
アダーホールド ウォルフギャング
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2008288598A publication Critical patent/JP2008288598A/ja
Publication of JP2008288598A5 publication Critical patent/JP2008288598A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Furnace Details (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tunnel Furnaces (AREA)
JP2008132074A 2007-05-20 2008-05-20 制御されたアニーリング方法 Pending JP2008288598A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/751,027 US20080090309A1 (en) 2003-10-27 2007-05-20 Controlled annealing method

Publications (2)

Publication Number Publication Date
JP2008288598A true JP2008288598A (ja) 2008-11-27
JP2008288598A5 JP2008288598A5 (enExample) 2011-07-07

Family

ID=39493369

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008132074A Pending JP2008288598A (ja) 2007-05-20 2008-05-20 制御されたアニーリング方法

Country Status (6)

Country Link
US (1) US20080090309A1 (enExample)
EP (1) EP1995766A3 (enExample)
JP (1) JP2008288598A (enExample)
KR (1) KR100976649B1 (enExample)
CN (1) CN101431005B (enExample)
TW (1) TWI455208B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
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JP2013520801A (ja) * 2010-02-19 2013-06-06 アプライド マテリアルズ インコーポレイテッド 高効率／高精度ヒータドライバ
WO2016014174A1 (en) * 2014-07-25 2016-01-28 Applied Materials, Inc. Light pipe arrays for thermal chamber applications and thermal processes
JP2024514140A (ja) * 2021-04-13 2024-03-28 アプライド マテリアルズ インコーポレイテッド マスク洗浄用シュラウド付き焼成チャンバ

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TWI395272B (zh) * 2008-05-02 2013-05-01 Applied Materials Inc 用於旋轉基板之非徑向溫度控制系統
KR101447163B1 (ko) * 2008-06-10 2014-10-06 주성엔지니어링(주) 기판처리장치
US8700199B2 (en) * 2011-03-21 2014-04-15 International Business Machines Corporation Passive resonator, a system incorporating the passive resonator for real-time intra-process monitoring and control and an associated method
TW201251189A (en) * 2011-03-25 2012-12-16 Bloom Energy Corp Rapid thermal processing for SOFC manufacturing
CN103515192A (zh) * 2012-06-26 2014-01-15 无锡华润上华科技有限公司 快速热退火方法
US8772055B1 (en) * 2013-01-16 2014-07-08 Applied Materials, Inc. Multizone control of lamps in a conical lamphead using pyrometers
CN104124184B (zh) * 2013-04-24 2017-07-04 北京北方微电子基地设备工艺研究中心有限责任公司 等离子设备及其控制方法
CN105088353B (zh) * 2014-05-04 2018-07-06 北京北方华创微电子装备有限公司 等离子反应设备及其温度监控方法
CN105225983B (zh) * 2014-06-04 2018-04-06 北京北方华创微电子装备有限公司 耦合窗的加热装置及应用其的反应腔室
JP6512089B2 (ja) * 2015-12-15 2019-05-15 東京エレクトロン株式会社 基板処理装置及び基板処理装置の調整方法
CN105762075A (zh) * 2016-05-11 2016-07-13 上海华虹宏力半导体制造有限公司 用于改善器件电学性能的方法以及半导体制造方法
CN107255571A (zh) * 2017-06-25 2017-10-17 苏州金钜松机电有限公司 一种激光退火机的状态监控方法
JP6960344B2 (ja) * 2018-01-26 2021-11-05 株式会社Ｓｃｒｅｅｎホールディングス 熱処理方法および熱処理装置
DE102018203945B4 (de) 2018-03-15 2023-08-10 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben
US11915953B2 (en) 2020-04-17 2024-02-27 Applied Materials, Inc. Apparatus, systems, and methods of measuring edge ring distance for thermal processing chambers
US20230350438A1 (en) * 2022-04-29 2023-11-02 Semes Co., Ltd. Process measurement apparatus and method

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JPH07201753A (ja) * 1993-12-29 1995-08-04 Nippon Steel Corp 薄膜製造方法およびその装置
JPH08148423A (ja) * 1994-11-18 1996-06-07 Mitsubishi Electric Corp レーザアニーリング方法
JPH08162463A (ja) * 1994-12-09 1996-06-21 Hitachi Ltd 熱処理方法およびその処理装置
JP2002075901A (ja) * 2000-08-31 2002-03-15 Tokyo Electron Ltd アニール装置、メッキ処理システム、および半導体デバイスの製造方法
JP2003133248A (ja) * 2001-10-26 2003-05-09 Dainippon Screen Mfg Co Ltd 基板の熱処理方法
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013520801A (ja) * 2010-02-19 2013-06-06 アプライド マテリアルズ インコーポレイテッド 高効率／高精度ヒータドライバ
US9612020B2 (en) 2010-02-19 2017-04-04 Applied Materials, Inc. High efficiency high accuracy heater driver
WO2016014174A1 (en) * 2014-07-25 2016-01-28 Applied Materials, Inc. Light pipe arrays for thermal chamber applications and thermal processes
US10699922B2 (en) 2014-07-25 2020-06-30 Applied Materials, Inc. Light pipe arrays for thermal chamber applications and thermal processes
JP2024514140A (ja) * 2021-04-13 2024-03-28 アプライド マテリアルズ インコーポレイテッド マスク洗浄用シュラウド付き焼成チャンバ
JP7659656B2 (ja) 2021-04-13 2025-04-09 アプライド マテリアルズ インコーポレイテッド マスク洗浄用シュラウド付き焼成チャンバ

Also Published As

Publication number Publication date
TWI455208B (zh) 2014-10-01
TW200903649A (en) 2009-01-16
EP1995766A3 (en) 2012-09-19
CN101431005B (zh) 2011-11-16
CN101431005A (zh) 2009-05-13
US20080090309A1 (en) 2008-04-17
KR20080102335A (ko) 2008-11-25
KR100976649B1 (ko) 2010-08-18
EP1995766A2 (en) 2008-11-26

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