JP2008288551A5 - - Google Patents
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- Publication number
- JP2008288551A5 JP2008288551A5 JP2008002577A JP2008002577A JP2008288551A5 JP 2008288551 A5 JP2008288551 A5 JP 2008288551A5 JP 2008002577 A JP2008002577 A JP 2008002577A JP 2008002577 A JP2008002577 A JP 2008002577A JP 2008288551 A5 JP2008288551 A5 JP 2008288551A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- connection
- circuit
- circuit member
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012790 adhesive layer Substances 0.000 claims description 35
- 239000002313 adhesive film Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000004925 Acrylic resin Substances 0.000 claims 2
- 229920000178 Acrylic resin Polymers 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 239000009719 polyimide resin Substances 0.000 claims 2
- 239000004695 Polyether sulfone Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920006393 polyether sulfone Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008002577A JP5181220B2 (ja) | 2007-04-19 | 2008-01-09 | 回路接続用接着フィルム、接続構造体及びその製造方法 |
| CN201210096198.9A CN102638944B (zh) | 2007-04-19 | 2008-04-17 | 电路连接用粘接薄膜、连接结构体以及其制造方法 |
| KR1020097023996A KR101139073B1 (ko) | 2007-04-19 | 2008-04-17 | 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법 |
| PCT/JP2008/057534 WO2008133186A1 (ja) | 2007-04-19 | 2008-04-17 | 回路接続用接着フィルム、接続構造体及びその製造方法 |
| CN2008800049491A CN101611659B (zh) | 2007-04-19 | 2008-04-17 | 电路连接用粘接薄膜、连接结构体以及其制造方法 |
| TW097114352A TWI399420B (zh) | 2007-04-19 | 2008-04-18 | Circuit connecting adhesive film, connection structure and a manufacturing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007110385 | 2007-04-19 | ||
| JP2007110385 | 2007-04-19 | ||
| JP2008002577A JP5181220B2 (ja) | 2007-04-19 | 2008-01-09 | 回路接続用接着フィルム、接続構造体及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008288551A JP2008288551A (ja) | 2008-11-27 |
| JP2008288551A5 true JP2008288551A5 (enrdf_load_stackoverflow) | 2010-10-14 |
| JP5181220B2 JP5181220B2 (ja) | 2013-04-10 |
Family
ID=40147951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008002577A Active JP5181220B2 (ja) | 2007-04-19 | 2008-01-09 | 回路接続用接着フィルム、接続構造体及びその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5181220B2 (enrdf_load_stackoverflow) |
| KR (1) | KR101139073B1 (enrdf_load_stackoverflow) |
| CN (2) | CN102638944B (enrdf_load_stackoverflow) |
| TW (1) | TWI399420B (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5521848B2 (ja) | 2010-07-21 | 2014-06-18 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体及びそれらの製造方法 |
| JP5823117B2 (ja) * | 2010-11-16 | 2015-11-25 | デクセリアルズ株式会社 | 異方性導電フィルム、接合体、及び接合体の製造方法 |
| JP5972009B2 (ja) * | 2012-03-30 | 2016-08-17 | デクセリアルズ株式会社 | 回路接続材料、及びこれを用いた実装体の製造方法 |
| CN105225729B (zh) * | 2015-08-26 | 2017-02-22 | 京东方科技集团股份有限公司 | 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法 |
| JP2017098077A (ja) * | 2015-11-24 | 2017-06-01 | デクセリアルズ株式会社 | 異方性導電フィルム、及び接続方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3800631B2 (ja) * | 1997-02-27 | 2006-07-26 | セイコーエプソン株式会社 | 異方導電性接着剤の製造方法、接続構造体の製造方法及び液晶装置の製造方法 |
| JP4214416B2 (ja) * | 1997-02-27 | 2009-01-28 | セイコーエプソン株式会社 | 接着方法及び液晶装置の製造方法 |
| JP4011157B2 (ja) * | 1997-08-08 | 2007-11-21 | 日立化成フィルテック株式会社 | 包装用ラップフィルムの収納ケース |
| US7208105B2 (en) * | 2000-04-25 | 2007-04-24 | Hitachi Chemical Co., Ltd. | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure |
| JP4747396B2 (ja) * | 2000-05-17 | 2011-08-17 | 日立化成工業株式会社 | 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造 |
| JP2003049152A (ja) * | 2001-08-02 | 2003-02-21 | Hitachi Chem Co Ltd | 回路接続用接着剤及びそれを用いた接続方法、接続構造体 |
| JP4325379B2 (ja) * | 2003-12-02 | 2009-09-02 | 日立化成工業株式会社 | 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法 |
-
2008
- 2008-01-09 JP JP2008002577A patent/JP5181220B2/ja active Active
- 2008-04-17 KR KR1020097023996A patent/KR101139073B1/ko active Active
- 2008-04-17 CN CN201210096198.9A patent/CN102638944B/zh active Active
- 2008-04-17 CN CN2008800049491A patent/CN101611659B/zh active Active
- 2008-04-18 TW TW097114352A patent/TWI399420B/zh active
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