CN101360386B - 电路板粘合胶层及包括该粘合胶层的电路板 - Google Patents

电路板粘合胶层及包括该粘合胶层的电路板 Download PDF

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CN101360386B
CN101360386B CN2007100756131A CN200710075613A CN101360386B CN 101360386 B CN101360386 B CN 101360386B CN 2007100756131 A CN2007100756131 A CN 2007100756131A CN 200710075613 A CN200710075613 A CN 200710075613A CN 101360386 B CN101360386 B CN 101360386B
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circuit board
line
hole
binding face
bonding glue
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CN101360386A (zh
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黄凤艳
刘兴泽
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Peng Ding Polytron Technologies Inc
Avary Holding Shenzhen Co Ltd
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Hongsheng Technology Co ltd
Fukui Precision Component Shenzhen Co Ltd
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    • H—ELECTRICITY
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    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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Abstract

本发明涉及一种电路板粘合胶层，其包括粘性本体，所述粘性本体具有第一贴合面和与第一贴合面相对的第二贴合面，所述粘性本体开设有至少一个贯通第一贴合面和第二贴合面的通孔，所述至少一个通孔中填充满粘结剂。本发明涉及一种包括该电路板粘合胶层的电路板。该电路板粘合胶层，其具有充满通孔的粘结剂以增强粘性本体的第一贴合面和第二贴合面粘着力，从而防止电路板的弯折结构因脱胶而发生变形。

Description

电路板粘合胶层及包括该粘合胶层的电路板
技术领域
本发明涉及印刷电路板，尤其涉及一种电路板粘合胶层及包括该粘合胶层的电路板。
背景技术
软性电路板(Flexible Printed Circuit Board，FPCB)由于具有轻、薄、短、小以及可弯折之特点而被广泛应用于各种电子产品中，用于各种电子产品中不同电路之间的电性连接。参见文献Segawa，M.Kimura，M.Ooi，K.Sugi，S.，A micro miniaturized CCD color camerautilizing a newly developed CCD packaging technique，IEEETransactions on Consumer Electronics，1995，41(3)：946-953.
传统的软性电路板弯折后，通常采用双面胶带固定形成弯折结构。如图1所示，软性电路板10具有180度弯折结构，该软性电路板10包括第一基板11、弯折部12和第二基板13，该第二基板13通过弯折部12与第一基板11实现弯折连接，该第一基板11与第二基板13之间通过双面胶带14粘接。但是，由于双面胶带14的耐反弹性较差，因此，双面胶带14与第一基板11和第二基板12之间的结合力不强，容易导致双面胶带14与第一基板11或第二基板13分开，如图2和图3所示，从而使软性电路板10的弯折结构因双面胶带14粘结力不强脱胶而发生变形，影响软性电路板10的使用效果。
发明内容
因此，有必要提供一种电路板粘合胶层及包括该粘合胶层的电路板，以防止电路板的弯折结构因粘合胶层粘结力不强脱胶而发生变形。
以下将以实施例说明一种电路板粘合胶层及包括该粘合胶层的电路板。
所述电路板粘合胶层，其包括粘性本体，该粘性本体具有第一贴合面和与第一贴合面相对的第二贴合面所述粘性本体开设有至少一个贯通第一贴合面和第二贴合面的通孔，该至少一个通孔中填充满粘结剂。
所述电路板，其包括第一电路板、第二电路板以及设置于该第一电路板与第二电路板之间的至少一层电路板粘合胶层，该电路板粘合胶层包括粘性本体，该粘性本体具有第一贴合面和与第一贴合面相对的第二贴合面，该粘性本体开设有至少一个贯通第一贴合面和第二贴合面的通孔，该至少一个通孔中填充满粘结剂。
与现有技术相比，首先，所述粘合胶层包括粘性本体，该粘性本体包括相对的第一贴合面和第二贴合面，该粘性本体开设有至少一个贯通第一贴合面和第二贴合面的通孔，该至少一个通孔中填充满粘结剂，充满通孔中的粘结剂可以增强粘性本体的第一贴合面和第二贴合面粘着力。当该粘合胶用于粘合固定电路板时，该粘合胶的第一贴合面和第二贴合面可分别与电路板的第一电路板和第二电路板牢固结合，以防止电路板的因脱胶而发生变形。
附图说明
图1是现有技术软性电路板弯折结构示意图。
图2是现有技术软性电路板弯折结构第一种脱胶变形示意图。
图3是现有技术软性电路板弯折结构第二种脱胶变形示意图。
图4是本技术方案实施例提供的第一种电路板粘合胶层的第一贴合面的结构示意图。
图5是本技术方案实施例提供的第一种电路板粘合胶层沿图4中V-V线的剖视示意图。
图6是本技术方案实施例提供的第二种电路板粘合胶层的第一贴合面的结构示意图。
图7是本技术方案实施例提供的第二种电路板粘合胶层沿图4中VII-VII线的剖视示意图。
图8是本技术方案实施例提供的第一种电路板的结构示意图。
图9是本技术方案实施例提供的第二种电路板的结构示意图。
具体实施方式
下面结合附图及实施例对本技术方案提供的电路板粘合胶层及包括该粘合胶层的电路板作进一步说明。
请一并参阅图4和图5，其为本技术方案实施例提供的第一种电路板粘合胶层20。该电路板粘合胶层20包括粘性本体22。该粘性本体22可以为感压胶(Pressure Sensitive Adhesive，PSA)。该粘性本体22具有第一贴合面221和与第一贴合面221相对的第二贴合面222。该粘性本体22开设有多个通孔23，用于填充粘结剂24，该多个通孔23贯通第一贴合面221和第二贴合面222。该多个通孔23的数量、排列和孔径的大小可根据实际需要粘合的面积来确定。该多个通孔23的形状可以为圆形、方形、椭圆形、梅花形以及其他任何不规则的形状，该多个通孔23的形状可以相同也可以不相同。本实施例中，该多个通孔23为圆形通孔，呈规则排列均匀分布设置。
该多个通孔23中填充满粘结剂24，此时，粘结剂24从粘性本体22的第一贴合面221和第二贴合面222露出，由于粘结剂24的粘结作用，增强了粘性本体22的第一贴合面221和第二贴合面222的粘着力。该粘结剂24可以为快干胶(丙烯酸酯胶)。快干胶能在常温下快速固化且粘接强度大，填充满多个通孔23中可以大大增强粘性本体22的第一贴合面221和第二贴合面222的粘着力。
此外，该粘性本体22也可仅开设一个通孔，当然，该通孔可设置较大的孔径，以确保填充于通孔中的粘结剂的粘贴面积。
请一并参阅图6和图7，其为本技术方案实施例提供的第二种电路板粘合胶层30。该电路板粘合胶层30包括粘性本体32，该粘性本体32可以为感压胶。该粘性本体32具有第一贴合面321和与第一贴合面321相对的第二贴合面322。粘性本体32开设有多个通孔33。该电路板粘合胶层30与电路板粘合胶层20的区别在于，所述多个通孔33为连孔结构。每个通孔33包括第一通孔331及第二通孔332，该第一通孔331和第二通孔332相互连通，从而形成连孔结构以增加粘结剂34粘结的面积，以进一步增强粘性本体32的第一贴合面321和第二贴合面322的粘着力。该多个通孔33的数量及排列可根据实际需要粘合的面积来确定。该第一通孔331及第二通孔332的形状可以为圆形、方形、椭圆形、梅花形以及其他任何不规则的形状，该多个通孔23的形状可以相同也可以不相同，该第一通孔331及第二通孔332的大小可根据实际需要粘合的面积来确定。本实施例中，该第一通孔331及第二通孔332均为圆形通孔并相互连通，该多个通孔33呈规则排列均匀分布设置。
请参阅图8，其为本技术方案实施例提供的第一种使用本技术方案实施例的电路板粘合胶层20的电路板40。该电路板40包括第一电路板41、弯折部42、第二电路板43以及电路板粘合胶层20。该第二电路板43通过弯折部42与第一电路板41实现弯折相连。因此，该第一电路板41、弯折部42、第二电路板43可以均是软性电路板，也可以是弯折部42和第二电路板43为软性电路板，也可以仅是弯折部42为软性电路板。本实施例中，该第一电路板41、弯折部42、第二电路板43均是软性电路板。该第一电路板41具有第一表面411和与第一表面411相对的第二表面412。该第二电路板43具有第三表面431和与第三表面431相对的第四表面432。该第二电路板43通过弯折部42的弯折设置于第一电路板41，该第一电路板41与第二电路板42之间设置有电路板粘合胶层20，该第二电路板43经弯折部42弯折后通过电路板粘合胶层20粘合于第一电路板41，从而使得该电路板粘合胶层20的第一贴合面221与第二电路板43的第二表面432贴合，第二贴合面222与第一电路板41的第一表面431贴合，从而将第一电路板41和第二电路板43粘合起来形成弯折结构的电路板40。而且电路板粘合胶层20由于粘接剂24填充于通孔23中，不会影响电路板40的整体厚度。当然，该电路板40也可以使用电路板粘合胶层30来粘合第一电路板41和第二电路板43。
当然，电路板粘合胶层20和30的使用并不仅限于此，其也可用于多层电路板之间的粘结。例如，当电路板40不包括弯折部42时，即第二电路板43与第一电路板41未通过弯折部42弯折相连时，该电路板40即可视为多层电路板。
请参阅图9，其为本技术方案实施例提供的第二种使用本技术方案实施例的电路板粘合胶层20的电路板50。该电路板50包括第一电路板51、弯折部52、第二电路板53、第一电路板粘合胶层201、补强板54和第二电路板粘合胶层202。该第二电路板53通过弯折部52与第一电路板51实现弯折相连。因此，该第一电路板51、弯折部52、第二电路板53可以均是软性电路板，也可以是弯折部52和第二电路板53为软性电路板，也可以仅是弯折部52为软性电路板。本实施例中，该第一电路板51、弯折部52、第二电路板53均是软性电路板。该第一电路板51与第二电路板53之间依次设置有第一电路板粘合胶层201、补强板54和第二电路板粘合胶层202。该第一电路板51与第二电路板53通过第一电路板粘合胶层201和第二电路板粘合胶层202分别与补强板54的相对两表面粘合。第一电路板粘合胶层201的一个贴合面与补强板54的一个表面粘合，第一电路板粘合胶层201的另一个贴合面与第一电路板51粘合，同时，第二电路板粘合胶层202的一个贴合面与补强板54的另一个表面与粘合，第二电路板粘合胶层202的另一个表面与第二电路板53粘合，从而将第一电路板51和第二电路板53粘合起来形成具有补强板54的电路板50。
该补强板54可以为玻璃纤维板(如FR-4)、聚酰亚胺或金属片。当补强板54为金属片时，根据第一电路板51和第二电路板53的电连接需求，在粘合胶20的多个通孔23中填充的粘结剂24可以为导电胶，由于导电胶中具有导电粒子，可以在粘合第一电路板51和第二电路板53的同时实现第一电路板51和第二电路板53的电连接。由于电路板粘合胶层20多个通孔23中填充有粘接剂24，该粘接剂24增强了电路板粘合胶层20与第一电路板51和第二电路板53或补强板54之间的结合力，从而有效防止电路板50的弯折结构因脱胶而发生变形。当然，该电路板50也可以使用电路板粘合胶层30来粘合第一电路板51、补强板54和第二电路板53形成弯折结构。
同样，若电路板50不包括弯折部52时，即第二电路板53与第一电路板51未通过弯折部52弯折相连时，该电路板50也可视为多层电路板。
可以理解的是，对于本领域的普通技术人员来说，可以根据本发明的技术构思做出其它各种相应的改变与变形，而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (5)

1.一种电路板，其包括第一电路板、第二电路板、弯折部以及设置于所述第一电路板与第二电路板之间的至少一层电路板粘合胶层，所述第二电路板通过弯折部与第一电路板实现弯折相连，所述弯折部为软性电路板，所述电路板粘合胶层包括粘性基体，该粘性基体具有第一贴合面和与第一贴合面相对的第二贴合面，其特征在于，所述粘性基体开设有至少一个贯通第一贴合面和第二贴合面的通孔，所述至少一个通孔中填充满粘结剂。
2.如权利要求1所述的电路板，其特征在于，所述粘结剂为快干胶或导电胶。
3.如权利要求1所述的电路板，其特征在于，所述通孔包括第一通孔和第二通孔，该第一通孔和第二通孔相互连通。
4.如权利要求1所述的电路板，其特征在于，所述粘性基体为感压胶。
5.如权利要求1所述的电路板，其特征在于，所述第一电路板及第二电路板均为软性电路板。
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