JP2008270827A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2008270827A
JP2008270827A JP2008146650A JP2008146650A JP2008270827A JP 2008270827 A JP2008270827 A JP 2008270827A JP 2008146650 A JP2008146650 A JP 2008146650A JP 2008146650 A JP2008146650 A JP 2008146650A JP 2008270827 A JP2008270827 A JP 2008270827A
Authority
JP
Japan
Prior art keywords
wiring
dummy metal
wiring layer
semiconductor device
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008146650A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008270827A5 (cg-RX-API-DMAC7.html
Inventor
Akiyuki Araki
章之 荒木
Fumihiro Kimura
文浩 木村
Junichi Shimada
純一 嶋田
Kazuhisa Fujita
和久 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2008146650A priority Critical patent/JP2008270827A/ja
Publication of JP2008270827A publication Critical patent/JP2008270827A/ja
Publication of JP2008270827A5 publication Critical patent/JP2008270827A5/ja
Withdrawn legal-status Critical Current

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  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2008146650A 2008-06-04 2008-06-04 半導体装置 Withdrawn JP2008270827A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008146650A JP2008270827A (ja) 2008-06-04 2008-06-04 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008146650A JP2008270827A (ja) 2008-06-04 2008-06-04 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004268769A Division JP4164056B2 (ja) 2004-09-15 2004-09-15 半導体装置の設計方法及び半導体装置

Publications (2)

Publication Number Publication Date
JP2008270827A true JP2008270827A (ja) 2008-11-06
JP2008270827A5 JP2008270827A5 (cg-RX-API-DMAC7.html) 2010-01-28

Family

ID=40049822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008146650A Withdrawn JP2008270827A (ja) 2008-06-04 2008-06-04 半導体装置

Country Status (1)

Country Link
JP (1) JP2008270827A (cg-RX-API-DMAC7.html)

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