JP2008268196A - コンタクトプローブ及びコンタクトプローブの製造方法 - Google Patents
コンタクトプローブ及びコンタクトプローブの製造方法 Download PDFInfo
- Publication number
- JP2008268196A JP2008268196A JP2008082383A JP2008082383A JP2008268196A JP 2008268196 A JP2008268196 A JP 2008268196A JP 2008082383 A JP2008082383 A JP 2008082383A JP 2008082383 A JP2008082383 A JP 2008082383A JP 2008268196 A JP2008268196 A JP 2008268196A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- probe
- contact portion
- inspection object
- beam portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000523 sample Substances 0.000 title claims abstract description 263
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000000758 substrate Substances 0.000 claims abstract description 76
- 238000007689 inspection Methods 0.000 claims abstract description 65
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims description 94
- 238000010030 laminating Methods 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 16
- 238000007517 polishing process Methods 0.000 claims description 12
- 230000003746 surface roughness Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 51
- 229910000531 Co alloy Inorganic materials 0.000 description 29
- 239000010408 film Substances 0.000 description 29
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 28
- 238000009713 electroplating Methods 0.000 description 21
- 238000007747 plating Methods 0.000 description 15
- 239000010948 rhodium Substances 0.000 description 15
- 235000019557 luminance Nutrition 0.000 description 12
- 230000005484 gravity Effects 0.000 description 11
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 229910052703 rhodium Inorganic materials 0.000 description 8
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 8
- 239000000654 additive Substances 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000005201 scrubbing Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 4
- 235000019592 roughness Nutrition 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000012789 electroconductive film Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910002708 Au–Cu Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008082383A JP2008268196A (ja) | 2007-03-28 | 2008-03-27 | コンタクトプローブ及びコンタクトプローブの製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007085422 | 2007-03-28 | ||
| JP2008082383A JP2008268196A (ja) | 2007-03-28 | 2008-03-27 | コンタクトプローブ及びコンタクトプローブの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008268196A true JP2008268196A (ja) | 2008-11-06 |
| JP2008268196A5 JP2008268196A5 (enExample) | 2011-04-07 |
Family
ID=40047864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008082383A Withdrawn JP2008268196A (ja) | 2007-03-28 | 2008-03-27 | コンタクトプローブ及びコンタクトプローブの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008268196A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010249538A (ja) * | 2009-04-10 | 2010-11-04 | Nps Inc | ４探針プローブ及びそれを用いた抵抗率測定装置 |
| WO2010096711A3 (en) * | 2009-02-19 | 2011-01-20 | Touchdown Technologies, Inc. | Probe head for a microelectronic contactor assembly, and methods of making same |
| KR20230118187A (ko) * | 2021-04-23 | 2023-08-10 | 재팬 일렉트로닉 메트리얼스 코오포레이숀 | 프로브 카드 및 프로브 카드 보수 방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127121A (ja) * | 1999-10-29 | 2001-05-11 | Nec Corp | プローブカード |
| JP2002040052A (ja) * | 2000-07-19 | 2002-02-06 | Mitsubishi Materials Corp | コンタクトプローブとその製造方法 |
| JP2004138393A (ja) * | 2002-10-15 | 2004-05-13 | Umc Japan | カンチレバー式プローブカード、およびその製造方法 |
-
2008
- 2008-03-27 JP JP2008082383A patent/JP2008268196A/ja not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127121A (ja) * | 1999-10-29 | 2001-05-11 | Nec Corp | プローブカード |
| JP2002040052A (ja) * | 2000-07-19 | 2002-02-06 | Mitsubishi Materials Corp | コンタクトプローブとその製造方法 |
| JP2004138393A (ja) * | 2002-10-15 | 2004-05-13 | Umc Japan | カンチレバー式プローブカード、およびその製造方法 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010096711A3 (en) * | 2009-02-19 | 2011-01-20 | Touchdown Technologies, Inc. | Probe head for a microelectronic contactor assembly, and methods of making same |
| US8232818B2 (en) | 2009-02-19 | 2012-07-31 | Advantest America, Inc. | Probe head for a microelectronic contactor assembly, the probe head having SMT electronic components thereon |
| US8305101B2 (en) | 2009-02-19 | 2012-11-06 | Advantest America, Inc | Microelectronic contactor assembly, structures thereof, and methods of constructing same |
| US8901950B2 (en) | 2009-02-19 | 2014-12-02 | Advantest America, Inc | Probe head for a microelectronic contactor assembly, and methods of making same |
| JP2010249538A (ja) * | 2009-04-10 | 2010-11-04 | Nps Inc | ４探針プローブ及びそれを用いた抵抗率測定装置 |
| KR20230118187A (ko) * | 2021-04-23 | 2023-08-10 | 재팬 일렉트로닉 메트리얼스 코오포레이숀 | 프로브 카드 및 프로브 카드 보수 방법 |
| KR102760918B1 (ko) | 2021-04-23 | 2025-02-03 | 재팬 일렉트로닉 메트리얼스 코오포레이숀 | 프로브 카드 및 프로브 카드 보수 방법 |
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