JP2008258353A - 電子部品用パッケージおよびそのろう付け構造 - Google Patents
電子部品用パッケージおよびそのろう付け構造 Download PDFInfo
- Publication number
- JP2008258353A JP2008258353A JP2007098115A JP2007098115A JP2008258353A JP 2008258353 A JP2008258353 A JP 2008258353A JP 2007098115 A JP2007098115 A JP 2007098115A JP 2007098115 A JP2007098115 A JP 2007098115A JP 2008258353 A JP2008258353 A JP 2008258353A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- alloy
- joined
- package
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 136
- 238000010276 construction Methods 0.000 title abstract 2
- 239000010931 gold Substances 0.000 claims abstract description 129
- 229910052737 gold Inorganic materials 0.000 claims abstract description 119
- 239000000956 alloy Substances 0.000 claims abstract description 118
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 118
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 113
- 238000007747 plating Methods 0.000 claims abstract description 90
- 239000000203 mixture Substances 0.000 claims abstract description 56
- 229910015363 Au—Sn Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 238000010438 heat treatment Methods 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 26
- 239000000919 ceramic Substances 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 93
- 238000005304 joining Methods 0.000 claims description 49
- 230000005496 eutectics Effects 0.000 claims description 42
- 239000013078 crystal Substances 0.000 claims description 41
- 238000002844 melting Methods 0.000 claims description 32
- 230000008018 melting Effects 0.000 claims description 32
- 238000003303 reheating Methods 0.000 claims description 17
- 229910017401 Au—Ge Inorganic materials 0.000 claims description 11
- 230000007704 transition Effects 0.000 claims description 10
- 238000009792 diffusion process Methods 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 abstract description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 14
- 239000012071 phase Substances 0.000 description 24
- 239000000945 filler Substances 0.000 description 9
- 238000010587 phase diagram Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 229910002056 binary alloy Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910018731 Sn—Au Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007098115A JP2008258353A (ja) | 2007-04-04 | 2007-04-04 | 電子部品用パッケージおよびそのろう付け構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007098115A JP2008258353A (ja) | 2007-04-04 | 2007-04-04 | 電子部品用パッケージおよびそのろう付け構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008258353A true JP2008258353A (ja) | 2008-10-23 |
| JP2008258353A5 JP2008258353A5 (enrdf_load_stackoverflow) | 2010-05-06 |
Family
ID=39981635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007098115A Pending JP2008258353A (ja) | 2007-04-04 | 2007-04-04 | 電子部品用パッケージおよびそのろう付け構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008258353A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170748A (ja) * | 2008-01-18 | 2009-07-30 | Daishinku Corp | 電子部品の本体筐体部材、電子部品、および電子部品の製造方法 |
| JP2010177810A (ja) * | 2009-01-27 | 2010-08-12 | Daishinku Corp | 圧電振動デバイスおよび圧電振動デバイスの製造方法 |
| JP2017139734A (ja) * | 2016-02-04 | 2017-08-10 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | 音響波フィルター装置、音響波フィルター装置製造用パッケージ、及び音響波フィルター装置の製造方法 |
| KR20200144144A (ko) * | 2018-10-29 | 2020-12-28 | 미쓰비시 마테리알 가부시키가이샤 | 패키지용 덮개재의 제조 방법 및 패키지의 제조 방법 |
| US11264534B2 (en) | 2018-10-29 | 2022-03-01 | Mitsubishi Materials Corporation | Method for manufacturing package lid member and method for manufacturing package |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005322727A (ja) * | 2004-05-07 | 2005-11-17 | Sumitomo Metal Mining Co Ltd | ハーメチックシールカバーおよびその製造方法 |
-
2007
- 2007-04-04 JP JP2007098115A patent/JP2008258353A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005322727A (ja) * | 2004-05-07 | 2005-11-17 | Sumitomo Metal Mining Co Ltd | ハーメチックシールカバーおよびその製造方法 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009170748A (ja) * | 2008-01-18 | 2009-07-30 | Daishinku Corp | 電子部品の本体筐体部材、電子部品、および電子部品の製造方法 |
| JP2010177810A (ja) * | 2009-01-27 | 2010-08-12 | Daishinku Corp | 圧電振動デバイスおよび圧電振動デバイスの製造方法 |
| JP2017139734A (ja) * | 2016-02-04 | 2017-08-10 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | 音響波フィルター装置、音響波フィルター装置製造用パッケージ、及び音響波フィルター装置の製造方法 |
| KR20200144144A (ko) * | 2018-10-29 | 2020-12-28 | 미쓰비시 마테리알 가부시키가이샤 | 패키지용 덮개재의 제조 방법 및 패키지의 제조 방법 |
| KR102263552B1 (ko) | 2018-10-29 | 2021-06-09 | 미쓰비시 마테리알 가부시키가이샤 | 패키지용 덮개재의 제조 방법 및 패키지의 제조 방법 |
| US11264534B2 (en) | 2018-10-29 | 2022-03-01 | Mitsubishi Materials Corporation | Method for manufacturing package lid member and method for manufacturing package |
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| A521 | Written amendment |
Effective date: 20100323 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
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| A621 | Written request for application examination |
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| A977 | Report on retrieval |
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| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120718 |
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| A02 | Decision of refusal |
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