JP2008231376A - Inorganic powder-containing resin composition, and method of manufacturing transfer film and flat display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inorganic powder-containing resin composition which is capable of forming a component of a FPD excellent in pattern form (e.g., a dielectric layer, a partition, an electrode, a resistor, a phosphor, a color filter, or a black matrix) without deteriorating flammability or development speed. <P>SOLUTION: The inorganic powder-containing resin composition comprises (a) an inorganic powder, (b) a binder resin represented by formula (1), (c) polyfunctional (meth)acrylate, and (d) a compound represented by formula (2). <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inorganic powder-containing resin composition and a transfer film obtained using the same. Specifically, the present invention relates to an inorganic powder-containing resin composition and a transfer film suitable for forming a panel material constituting a flat display panel.

  In recent years, flat panel displays (hereinafter also referred to as “FPD”) such as plasma display panels (hereinafter also referred to as “PDP”) and field emission displays (hereinafter also referred to as “FED”) have attracted attention as flat fluorescent displays. Has been. FIG. 1 is a schematic diagram showing a cross-sectional shape of an AC type PDP. In the figure, reference numerals 1 and 2 denote glass substrates arranged opposite to each other, 3 denotes a partition, and cells are defined by the glass substrate 1, the glass substrate 2, and the partition 3. 4 is a transparent electrode fixed to the glass substrate 1, 5 is a bus electrode formed on the transparent electrode 4 for the purpose of reducing the resistance of the transparent electrode 4, 6 is an address electrode fixed to the glass substrate 2, and 7 is Fluorescent material held in the cell, 8 is a dielectric layer formed on the surface of the glass substrate 1 so as to cover the transparent electrode 4 and the bus electrode 5, and 9 is on the surface of the glass substrate 2 so as to cover the address electrode 6. The formed dielectric layers 10 are protective films made of, for example, magnesium oxide. In the color FPD, a color filter (red, green, blue) or a black matrix may be provided between the glass substrate and the dielectric layer in order to obtain a high contrast image.

  As a method for manufacturing such FPD dielectric layers, barrier ribs, electrodes, phosphors, color filters, and black stripes (matrix), a photosensitive inorganic particle-containing resin layer is formed on a substrate, and a photomask is formed on the film. A pattern is left on the substrate by developing after exposure by a method of irradiating ultraviolet rays through a laser or a method of direct drawing by scanning with a laser beam, and a photolithography method for firing the pattern is preferably used. ing.

Japanese Patent Laid-Open No. 11-162339 JP 2001-84833 A JP 2002-245932 A JP 2003-51250 A

  In principle, the photolithography method is excellent in pattern accuracy. In particular, in a method using a transfer film, a pattern having excellent film thickness uniformity and surface uniformity can be formed. However, in the conventional photolithography method, in order to perform patterning while ensuring the film thickness of the inorganic powder-containing resin layer necessary for the panel material to be formed, the sensitivity of the inorganic powder-containing resin layer is insufficient, There was a problem that the shape of the obtained pattern was difficult to be good. When the sensitivity in the film thickness direction of the inorganic powder-containing resin layer is reduced, if the photosensitive resin is a negative type, only the vicinity of the surface is cured, so an undercut occurs during development, resulting in a reverse tapered pattern. Many. The forward-tapered pattern provides a good post-baking pattern, but the reverse-tapered pattern is difficult to obtain a good post-baking pattern and causes problems such as peeling of the film from the substrate. Also, if the photoinitiator is increased to ensure sensitivity, the flammability of the organic matter in the firing process is reduced, and when the electrode is formed, the resistance value is high, or when the partition is formed There was a problem that the resulting partition wall was likely to be colored. Further, there has been a problem that the developing speed in the developing process is lowered, and the workability is deteriorated and the pattern is easily cracked.

The present invention has been made based on the above situation.
The first object of the present invention is to provide an FPD component (for example, a dielectric layer, a partition wall, an electrode, a resistor, a phosphor, a color filter, a black matrix, which has an excellent pattern shape without reducing the combustibility and the development speed. Is to provide an inorganic powder-containing resin composition that can be suitably formed.

  The second object of the present invention is to provide a transfer film that is capable of forming an FPD component excellent in workability and pattern shape.

A third object of the present invention is to provide an FPD manufacturing method capable of forming an FPD component excellent in workability and pattern shape.
Further objects of the present invention will become apparent from the following description.

  The inorganic powder-containing resin composition of the present invention (hereinafter, also simply referred to as “the composition of the present invention”) includes (a) inorganic powder, (b) a binder resin represented by the following formula (1), ( c) containing a polyfunctional (meth) acrylate and (d) a compound represented by the following formula (2) (hereinafter also referred to as “compound (I)”).

（式（１）中、Ｒ¹ は水素原子またはメチル基であり、Ｒ² は炭素数１〜５のアルキル基であり、ｍおよびｎは１〜５の整数、かつ、ｍ≠ｎであり、ａは１〜１００の整数であり、ｂは０〜１００の整数である。）

(In the formula (1), R ¹ is a hydrogen atom or a methyl group, R ² is an alkyl group having 1 to 5 carbon atoms, m and n are integers of 1 to 5 and m ≠ n. a is an integer of 1 to 100, and b is an integer of 0 to 100.)

〔式（２）において、Ｘはハロゲン原子又はアルキル基を示し、Ｒ^３、Ｒ^４、及びＲ^５は、各々独立に、Ｒ、ＯＲ、ＣＯＲ、ＳＲ、ＣＯＮＲＲ’又はＣＮを表し、Ｒ及びＲ’は、アルキル基、アリール基、アラルキル基又は複素環基を表し、これらはハロゲン原子及び／又は複素環基で置換されていてもよく、また、Ｒ及びＲ’は一緒になって環を形成していてもよい。Ｙ１は酸素原子、硫黄原子又はセレン原子を表し、Ｙ２は単結合またはカルボニル基を表し、Ａは複素環基を表し、rは０〜４の整数を表し、ｐは０〜５の整数を表し、ｑは０又は１を表す。〕

[In Formula (2), X represents a halogen atom or an alkyl group, R ³ , R ⁴ , and R ⁵ each independently represent R, OR, COR, SR, CONRR ′, or CN; 'Represents an alkyl group, an aryl group, an aralkyl group or a heterocyclic group, which may be substituted with a halogen atom and / or a heterocyclic group, and R and R' together form a ring. You may do it. Y1 represents an oxygen atom, a sulfur atom or a selenium atom, Y2 represents a single bond or a carbonyl group, A represents a heterocyclic group, r represents an integer of 0 to 4, and p represents an integer of 0 to 5 , Q represents 0 or 1. ]

The transfer film of the present invention is characterized in that a layer made of the inorganic powder-containing resin composition of the present invention is formed on a support film.
In the FPD manufacturing method of the present invention, an inorganic powder-containing resin layer comprising the inorganic powder-containing resin composition of the present invention is formed on a substrate, and the inorganic powder-containing resin layer is exposed to light so that a latent image of the pattern is formed. The inorganic powder-containing resin layer is developed to form a pattern layer, and the pattern layer is baked to form a panel member having an inorganic pattern.

According to the method for producing an inorganic powder-containing resin composition, a transfer film, and a flat display panel of the present invention, it is possible to form an inorganic pattern that has excellent workability and has an excellent pattern shape and good adhesion. it can. The inorganic powder-containing resin composition and transfer film of the present invention can be suitably used for forming a panel member of a flat display panel.

The transfer film having an inorganic powder-containing resin layer made of the inorganic powder-containing resin composition of the present invention obtained by using a specific photopolymerization initiator is an inorganic pattern having excellent patterning performance that is smooth and without warping. The panel member of the plasma display which can form can be provided.

  Hereinafter, an inorganic powder-containing resin composition according to the present invention, a transfer film having a layer made of the resin composition, and a method for producing an FPD member using the transfer film will be described in detail.

<Inorganic powder-containing resin composition>
The inorganic powder-containing resin composition of the present invention comprises (A) inorganic powder, (B) a polymer having a specific structural unit, (C) a polyfunctional (meth) acrylate, and (D) a photopolymerization initiator. It is the paste-like composition formed.

Inorganic powder As an inorganic substance which comprises the inorganic powder (A) used for the inorganic powder containing resin composition of this invention, it is not specifically limited, The use of the sintered compact formed with the said composition It can be appropriately selected according to (type of PDP component).

  Here, the inorganic powder contained in the composition for forming the “dielectric layer” and the “partition wall” constituting the FPD has a softening point in the range of 350 to 700 ° C. (preferably 400 to 620 ° C.). The glass powder inside can be mentioned. When the softening point of the glass powder is less than 400 ° C., the glass powder melts at a stage where organic substances such as the binder resin are not completely decomposed and removed in the baking process of the film forming material layer by the composition. Therefore, a part of the organic substance remains in the formed glass sintered body. As a result, the lifetime of the phosphor is reduced due to diffusion of outgas into the panel, and the obtained partition wall (glass sintered body) is colored. Therefore, the light transmittance tends to decrease. On the other hand, when the softening point of the glass powder exceeds 620 ° C., the glass substrate needs to be baked at a temperature higher than 620 ° C., so that the glass substrate is likely to be distorted.

As the glass powder suitably used for the resin composition of the present invention,
(1) Lead oxide, boron oxide, silicon oxide, calcium oxide (PbO—B ₂ O ₃ —SiO ₂
-CaO system),
(2) Zinc oxide, boron oxide, silicon oxide type (ZnO—B ₂ O ₃ —SiO ₂ type),
(3) Lead oxide, boron oxide, silicon oxide, aluminum oxide system (PbO—B ₂ O ₃ —SiO ₂ —Al ₂ O ₃ system),
(4) Lead oxide, zinc oxide, boron oxide, silicon oxide system (PbO—ZnO—B ₂ O ₃ —SiO ₂ system),
(5) Lead oxide, zinc oxide, boron oxide, silicon oxide, titanium oxide system (PbO—ZnO—B ₂ O ₃ —SiO ₂ —TiO ₂ system),
(6) Bismuth oxide, boron oxide, silicon oxide system (Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ system),
(7) Bismuth oxide, zinc oxide, boron oxide, silicon oxide system (Bi ₂ O ₃ —ZnO—B ₂ O ₃ —SiO ₂ system),
(8) Zinc oxide, phosphorus oxide, silicon oxide type (ZnO—P ₂ O ₅ —SiO ₂ type),
(9) Zinc oxide, boron oxide, potassium oxide system (ZnO—B ₂ O ₃ —K ₂ O system),
(10) Phosphorus oxide, boron oxide, aluminum oxide system (P ₂ O ₅ —B ₂ O ₃ —Al ₂ O ₃ system),
(11) Zinc oxide, phosphorus oxide, titanium oxide-based (ZnO—P ₂ O ₅ —TiO ₂ -based) mixture and the like can be mentioned.

  You may mix and use inorganic oxide powders, such as aluminum oxide, chromium oxide, manganese oxide, for example to the said glass powder.

  The glass powder may be contained (combined) in a composition for forming another component, for example, an electrode, a resistor, a phosphor, a color filter, and a black matrix. When using together the said glass powder and inorganic powders other than this glass powder with the resin composition of this invention, this glass powder is normally used in the quantity of 90 mass% or less with respect to the inorganic powder whole quantity.

  Examples of the inorganic powder used in the composition for forming the “electrode” constituting the FPD, for example, the transparent electrode 104, the bus electrode 105, and the address electrode 106 in FIG. 1, include Ag, Au, Al, Ni, Ag. -Metal powder made of -Pd alloy, Cu, Cr or the like.

Examples of the inorganic powder used in the composition for forming the “resistor” constituting the FPD include inorganic powders such as RuO ₂ .

As inorganic powders used in the composition for forming the “phosphor” constituting the FPD, Y ₂ O ₃ : Eu ³⁺ , Y ₂ SiO ₅ : Eu ³⁺ , Y ₃ Al ₅ O ₁₂ : Eu ³⁺ , YVO ₄ : Eu ³⁺ , (Y
, Gd) red fluorescent material having a composition such as BO ₃ : Eu ³⁺ , Zn ₃ (PO ₄ ) ₂ : Mn;
Zn ₂ SiO ₄ : Mn, BaAl ₁₂ O ₁₉ : Mn, BaMgAl ₁₄ O ₂₃ : Mn, LaPO ₄ :
A green phosphor having a composition such as (Ce, Tb), Y ₃ (Al, Ga) ₅ O ₁₂ : Tb;
Y ₂ SiO ₅ : Ce, BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , BaMgAl ₁₄ O ₂₃ : Eu ²⁺ , (Ca, Sr, Ba) ₁₀ (PO ₄ ) ₆ C ₁₂ : Eu ²⁺ , (Zn, Cd) S: Inorganic powder made of a fluorescent material for blue having a composition such as Ag.

Inorganic powders used in the composition for forming the “color filter” constituting the FPD include red materials such as Fe ₂ O ₃ and Pb ₃ O ₄ , green materials such as Cr ₂ O ₃ , 2 Examples thereof include inorganic powders made of blue materials such as (Al ₂ Na ₂ Si ₃ O ₁₀ ) · Na ₂ S ₄ .

Examples of the inorganic powder used in the composition for forming the “black matrix” constituting the FPD include metal powders composed of Mn, Fe, Cr, Co, and the like.

(B) Polymer The polymer (B) used in the present invention is a water-soluble polymer having a structural unit represented by the above formula (1) (hereinafter also referred to as “structural unit (1)”). It has a role as a resin. The “water-soluble” in the present invention refers to a property having solubility to such an extent that a target development process can be performed by a development step in the method for producing an FPD member of the present invention described later.

  The content of the structural unit (1) in the polymer (B) is not particularly limited, but is preferably 20 to 99.9 mol%, more preferably 25 to 90 mol%, and particularly preferably 30 to 80 mol%. is there.

  By using the polymer (B) as described above, since the interaction with the inorganic powder is not too strong as compared with other resins, an inorganic powder-containing resin composition having excellent storage stability can be obtained.

  The polymer (B) having the structural unit (1) can be obtained by (co) polymerizing a compound represented by the following formula (3).

In Formula (3), R ¹ is a hydrogen atom or a methyl group, R ² is an alkyl group having 1 to 5 carbon atoms, m and n are integers of 1 to 5 and m ≠ n, and a Is an integer from 1 to 100, and b is an integer from 0 to 100.

As the compound represented by the above formula (3),
Methoxy polyethylene glycol mono (meth) acrylate (m = 2, b = 0),
Methoxy polypropylene glycol mono (meth) acrylate (m = 3, b = 0),
Methoxypolybutylene glycol mono (meth) acrylate (m = 4, b = 0),
And methoxypoly (ethylene glycol-propylene glycol) mono (meth) acrylate (m = 2, n = 3) and methoxypoly (propylene glycol-butylene glycol) mono (meth) acrylate (m = 3, n = 4). . Of these, methoxypolyethylene glycol mono (meth) acrylate is particularly preferred.

  Examples of commercially available products of the above-mentioned compounds include “Blemmer” series manufactured by Nippon Oil & Fats Co., Ltd., particularly “Blemmer PME-100”, “Same PME-200”, “Same PME-350” and the like.

As other constituent monomers in the polymer (B) used in the present invention, for example,
Hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate;
Acrylates such as phenolic hydroxyl group-containing monomers such as o-hydroxystyrene, m-hydroxystyrene, and p-hydroxystyrene;
(Meth) acrylamide, N, N-dimethylacrylamide, N, N-dimethylaminopropylacrylamide, N, N-diethylacrylamide, N-isopropylacrylamide,
Amide group-containing monomers such as acryloylmorpholine;
Examples include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, vinyl acetate, vinyl propionate, vinyl butyrate, vinyl trimethyl acetate, and vinyl phenyl acetate.

  Among the other constituent monomers, hydroxyl group-containing monomers, phenolic hydroxyl group-containing monomers and amide group-containing monomers are preferred, hydroxyl group-containing monomers and amide group-containing monomers are more preferred, and particularly hydroxyl group-containing monomers and amides. It is preferable to use together with group-containing monomers.

  The content of the structural unit derived from the other constituent monomer in the polymer (B) is not particularly limited, but is preferably 0.1 to 70 mol%, more preferably 5 to 65 mol%, and particularly preferably 10 to 60. Mol%. By containing the structural unit derived from the above other constituent monomers in such a range, both handling property when transferred to a transfer film and transfer property to a substrate are excellent, water developability, pattern adhesion, and film storage stability. A transfer film with good properties can be obtained.

  When using a hydroxyl group-containing monomer as another constituent monomer, the content of the constituent unit derived from the monomer is preferably 40 mol% or less, more preferably 10 to 30 mol%. By containing the structural unit derived from a hydroxyl group-containing monomer in such a range, a composition and a transfer film excellent in water developability and pattern adhesion can be obtained.

  Moreover, when using an amide group containing monomer as another structural monomer, content of the structural unit derived from the monomer is preferably 50 mol% or less, more preferably 10 to 40 mol%. By containing a structural unit derived from an amide group-containing monomer in such a range, a composition and a transfer film excellent in water developability and resolution can be obtained.

  Further, when the hydroxyl group-containing monomer and the amide group-containing monomer are used in combination as the other constituent monomer, the moles of the content of the structural unit derived from the hydroxyl group-containing monomer and the content of the structural unit derived from the amide group-containing monomer. The ratio (hydroxyl group: amide group) is 1: 5 to 5: 1, preferably 1: 4 to 4: 1, particularly preferably 1: 3 to 3: 1. By using a hydroxyl group-containing monomer and an amide group-containing monomer in such a molar ratio, a composition and transfer film excellent in water developability and pattern adhesion can be obtained, and further handled when formed into a transfer film. There is an advantage of superiority.

  The polymer (B) has a weight average molecular weight (Mw) of preferably 5,000 to 5,000,000, particularly preferably 10,000 to 300,000. When Mw is in the above range, the film-forming property when the transfer film is formed is good, and the patterning property is also excellent. In addition, said Mw is the weight average molecular weight of polystyrene conversion by GPC measurement.

  Moreover, the glass transition temperature (Tg) of a polymer (B) becomes like this. Preferably it is 0-70 degreeC, More preferably, it is 10-50 degreeC. When Tg is in such a range, handling property, storage stability, and transfer property to a substrate are improved when the transfer film is formed.

  The content of the polymer (B) in the composition of the present invention is usually 1 to 50 parts by weight, preferably 10 to 45 parts by weight, particularly preferably 20 to 40 parts by weight based on 100 parts by weight of the inorganic powder. Parts by weight. When the content of the polymer (B) is in the above range, the effects of the present invention are sufficiently exhibited.

In the composition of the present invention, as the binder resin, a polymer other than the polymer (B) is used in combination as long as the effect of the present invention is not impaired and water development is possible when forming the FPD member. May be.

(C) Polyfunctional (meth) acrylate The polyfunctional (meth) acrylate (C) constituting the composition of the present invention is polymerized by exposure, and the exposed portion becomes insoluble or hardly soluble in the developer. Have

  Examples of the polyfunctional (meth) acrylate (C) used in the present invention include di (meth) acrylates of alkylene glycol such as ethylene glycol and propylene glycol; di (meth) acrylate of polyalkylene glycol such as polyethylene glycol and polypropylene glycol ( (Meth) acrylates; di (meth) acrylates of hydroxylated polymers at both ends such as both ends hydroxypolybutadiene, both ends hydroxypolyisoprene, and both ends hydroxypolycaprolactone; glycerin, 1,2,4-butanetriol, trimethylol Poly (meth) acrylates of trihydric or higher polyhydric alcohols such as alkane, tetramethylolalkane, pentaerythritol, dipentaerythritol, etc .; polyalkylenes of trihydric or higher polyhydric alcohols Poly (meth) acrylates of recall adducts; poly (meth) acrylates of cyclic polyols such as 1,4-cyclohexanediol and 1,4-benzenediol; polyester (meth) acrylate, epoxy (meth) acrylate, Examples thereof include oligo (meth) acrylates such as urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) acrylate, and spirane resin (meth) acrylate. These may be used alone or in combination of two or more. Of these, trimethylolpropane triacrylate and the like are particularly preferably used. The molecular weight of the polyfunctional (meth) acrylate (C) is preferably 100 to 2,000.

The content of the polyfunctional (meth) acrylate (C) in the inorganic powder-containing resin composition of the present invention is usually 0.1 to 50 parts by weight with respect to 100 parts by weight of the inorganic powder (A). The amount is preferably 1 to 40 parts by weight.
(D) Compound (I)
Compound (I) constituting the composition of the present invention is contained as a photopolymerization initiator. By using the compound (I), a composition having a high sensitivity and a good curing depth can be obtained, and therefore, the resulting component has a good pattern shape. Moreover, since content of the whole photoinitiator can be decreased, the composition excellent in combustibility and developability can be obtained.

  As the photopolymerization initiator (D) used in the present invention, a compound represented by the above formula (2) is used.

  Examples of such a compound include 1- [9-ethyl-6- (2-methylbenzoyl) -9.H.-carbazol-3-yl] -ethane-1-one oxime-O-acetate, the following formula (4): (Ethanone, 1- [9-ethyl-6- [2-methyl-4- (2,2-dimethyl-1,3-dioxolanyl) methoxybenzoyl] -9.H.-carbazole-3- Yl]-, 1- (O-acetyloxime)) and a compound represented by the following formula (5) (ethanone, 1- [9-ethyl-6- [2-methyl-4-tetrahydrofuranylmethoxybenzoyl]- 9. Carbonyl compounds such as H.-carbazol-3-yl]-, 1- (O-acetyloxime)).

前記光重合開始剤（Ｄ）を用いて得られた本発明の無機粉体含有樹脂組成物からなる無機粉体含有樹脂層を有する転写フィルムはパターンニング性能の良好でかつ反りのないプラズマディスプレイのパネル部材を提供することができる。

The transfer film having an inorganic powder-containing resin layer made of the inorganic powder-containing resin composition of the present invention obtained by using the photopolymerization initiator (D) is a plasma display having good patterning performance and no warpage. A panel member can be provided.

  As a content rate of compound (I) in the composition of this invention, it is 0.01-100 weight part normally with respect to 100 weight part of polyfunctional (meth) acrylate, Preferably, it is 0.1-50. 0.0 part by mass.

  In the composition of the present invention, a photopolymerization initiator other than the compound (I) may be used in combination. Specific examples of other photopolymerization initiators include benzyl, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethoxy. 2-phenylacetophenone, 2-methyl- [4 ′-(methylthio) phenyl] -2-morpholino-1-propanone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butane-1 Carbonyl compounds such as -one; azo compounds or azide compounds such as azoisobutyronitrile and 4-azidobenzaldehyde; organic sulfur compounds such as mercaptan disulfide; benzoyl peroxide, di-tert-butyl peroxide, tert-butyl hydroper Oxides Organic peroxides such as hydrogen peroxide and paraffin hydroperoxide; 1,3-bis (trichloromethyl) -5- (2′-chlorophenyl) -1,3,5-triazine, 2- [2- (2- Furanyl) ethylenyl] -4,6-bis (trichloromethyl) -1,3,5-triazine and the like; 2,2′-bis (2-chlorophenyl) 4,5,4 ′, 5′-tetraphenyl Examples thereof include imidazole dimers such as 1,2'-biimidazole. These can be used alone or in combination of two or more.

The content ratio of the other photopolymerization initiator is 50% by mass or less, preferably 30% by mass or less, based on the total amount of the photopolymerization initiator.

(E) Dissolution Accelerator The composition of the present invention preferably contains a dissolution accelerator (E) for the purpose of expressing sufficient solubility in a developer described later. As the dissolution accelerator (E), a surfactant is preferably used. Examples of such surfactants include fluorine-based surfactants, silicone-based surfactants, and nonionic surfactants.

  Examples of the fluorosurfactant include “BM-1000” and “BM-1100” manufactured by BM CHIMIE, “Megafac F142D”, “Same F172” and “Same F172” manufactured by Dainippon Ink & Chemicals, Inc. "F173", "F183", "Florard FC-135", "FC-170C", "FC-430", "FC-431" manufactured by Sumitomo 3M Limited, "Asahi Glass Co., Ltd." “Surflon S-112”, “S-113”, “S-131”, “S-141”, “S-145”, “S-382”, “SC-101”, “Same” Commercial products such as “SC-102”, “SC-103”, “SC-104”, “SC-105”, and “SC-106” can be mentioned.

  Examples of the silicone surfactant include “SH-28PA”, “SH-190”, “SH-193”, “SZ-6032”, “SF-8428” manufactured by Toray Dow Corning Silicone Co., Ltd. ”,“ DC-57 ”,“ DC-190 ”,“ KP341 ”manufactured by Shin-Etsu Chemical Co., Ltd.,“ F-top EF301 ”,“ same EF303 ”,“ same EF352 ”manufactured by Shin-Akita Kasei Co., Ltd., etc. Can be mentioned.

  Examples of the nonionic surfactant include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; polyoxyethylene distyrenated phenyl ether, polyoxyethylene octyl Examples include polyoxyethylene aryl ethers such as phenyl ether and polyoxyethylene nonylphenyl ether; polyoxyethylene dialkyl esters such as polyoxyethylene dilaurate and polyoxyethylene distearate.

Examples of commercially available nonionic surfactants include “Emulgen A-60”, “A-90”, “A-500”, “B-66”, and “PP-290” manufactured by Kao Corporation. Manufactured by Kyoeisha Chemical Co., Ltd.
Acrylic acid copolymer polyflow no. 57 "," No. 90 ", and the like.

  Among the above surfactants, nonionic surfactants, specifically polyoxyethylene aryl ethers, are preferred, since the removal of the unexposed portion of the inorganic powder-containing resin layer is easy during development. A compound represented by formula (i) is preferred.

In said formula (i), R < ³ > is a C1-C5 alkyl group, Preferably it is a methyl group, s is an integer of 1-5, u is an integer of 1-5, Preferably it is 2, t is an integer of 1 to 100, preferably an integer of 10 to 20.

The content of the dissolution accelerator (E) in the composition of the present invention is preferably 0.001 to 20 parts by weight, more preferably 0.01 to 15 parts by weight, particularly preferably 100 parts by weight of the binder resin. Preferably it is 0.1-10 weight part. When the content of the dissolution accelerator (E) is in the above range, a composition excellent in solubility in a developer can be obtained.

  The inorganic powder-containing resin composition of the present invention usually contains a solvent for imparting appropriate fluidity or plasticity and good film-forming properties. As a solvent to be used, the affinity with inorganic powder and the solubility of the binder resin are good, and it can impart an appropriate viscosity to the inorganic powder-containing resin composition and is easily dried. It is preferable that it can be removed by evaporation.

  Particularly preferred solvents include ketones, alcohols and esters (hereinafter referred to as “specific solvents”) having a normal boiling point (boiling point at 1 atm) of 100 to 200 ° C.

  Specific examples of the specific solvent include ketones such as diethyl ketone, methyl butyl ketone, dipropyl ketone, and cyclohexanone; alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol, and diacetone alcohol. Ether ether alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether; saturated aliphatic monocarboxylic acids such as n-butyl acetate and amyl acetate Alkyl esters; lactic acid esters such as ethyl lactate and lactic acid-n-butyl; methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl acetate Examples include ether esters such as diacetate and ethyl-3-ethoxypropionate. Among these, methyl butyl ketone, cyclohexanone, diacetone alcohol, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, lactic acid Ethyl, propylene glycol monomethyl ether acetate, ethyl-3-ethoxypropionate and the like are preferable. These specific solvents can be used alone or in combination of two or more.

  Specific examples of solvents other than the specific solvent include turpentine oil, ethyl cellosolve, methyl cellosolve, terpineol, butyl carbitol acetate, butyl carbitol, isopropyl alcohol, benzyl alcohol and the like.

The content ratio of the solvent in the inorganic powder-containing resin composition of the present invention can be appropriately selected within a range in which good film forming properties (fluidity or plasticity) are obtained.

  What is necessary is just to select suitably content of the said solvent in the composition of this invention in the range in which favorable film-forming property (fluidity or plasticity) is obtained.

  The composition of the present invention preferably further contains an ultraviolet absorber. The ultraviolet absorber is preferably made of an organic dye because it does not remain in the fired member and does not deteriorate the member characteristics. Among them, an organic dye having a high UV absorption coefficient in the wavelength range of 400 to 500 nm is preferable. Preferably used.

  Specifically, azo compounds, triazine compounds, amino ketone compounds, xanthene compounds, quinoline compounds, quinone compounds, benzophenone compounds, benzoic acid compounds, cyanoacrylate compounds, spiro compounds, fluorenone compounds, fulgide compounds, imidazole compounds, perylene compounds, phenazines Compound, phenothiazine compound, polyene compound, diphenylmethane compound, triphenylmethane compound, polymethine compound, acridine compound, acridinenon compound, carboostyryl compound, coumarin compound, diphenylamine compound, quinacridone compound, quinophthalone compound, phenoxazine compound, phthaloperinone compound, A phthalocyanine compound can be used. Among them, azo compounds represented by 1-phenylazo-2-naphthol, 1-phenyl-3-methyl-4- (4-methylphenylazo) -5-oxypyrazole and the like, represented by 1,4-diamilaminoanthraquinone Particularly preferred are quinone compounds and phenolic compounds represented by curcumin.

When using organic dye, the addition amount is 0.05-10 with respect to the total content of a polymer (B), a polyfunctional (meth) acrylate (C), and a photoinitiator (D). % By weight, preferably about 0.5 to 5% by weight. If the addition amount is less than the above range, the effect of adding the ultraviolet absorber is not so much, and if it exceeds the above range, the characteristics of the obtained FPD member may be deteriorated.

  In addition, the inorganic powder-containing resin composition of the present invention includes, as optional components, plasticizers, dispersants, development accelerators, adhesion assistants, antihalation agents, leveling agents, storage stabilizers, antifoaming agents, and antioxidants. Various additives such as an agent, an ultraviolet absorber, a sensitizer, and a chain transfer agent may be contained.

  The inorganic powder-containing resin composition of the present invention comprises the above-mentioned inorganic powder, binder resin, photopolymerizable monomer, photopolymerization initiator and solvent and, if necessary, the above optional components, a roll kneader, a mixer, a homomixer It can be prepared by kneading using a kneader such as a ball mill or a bead mill.

  The inorganic powder-containing resin composition prepared as described above is a paste-like composition having fluidity suitable for coating, and its viscosity is usually 100 to 1,000,000 cp, preferably 500 to 300,000 cp.

<Transfer film>
The transfer film of the present invention is obtained by forming a layer obtained by applying the inorganic powder-containing resin composition of the present invention on a support film and drying the coating film. The support film constituting the transfer film is preferably a resin film having heat resistance and solvent resistance and flexibility. When the support film has flexibility, the paste-like composition can be applied by a roll coater, and the inorganic powder-containing resin layer can be stored and supplied in a state of being wound in a roll. Examples of the resin forming the support film include polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, polyfluoroethylene, and other fluorine-containing resins, nylon, and cellulose. The thickness of the support film may be in a range suitable for use, and is, for example, 20 to 100 μm.

As a method of applying the inorganic powder-containing resin composition on the support film, it is possible to efficiently form a coating film having a large film thickness (for example, 10 μm or more) excellent in film thickness uniformity. Specifically, a coating method using a roll coater, a coating method using a doctor blade, a coating method using a curtain coater, a coating method using a die coater, a coating method using a wire coater, and the like can be mentioned as preferable examples.

  The surface of the support film to which the inorganic powder-containing resin composition is applied is preferably subjected to a release treatment. Thereby, the peeling operation of a support film can be easily performed in the case of FPD component formation.

  As drying conditions of a coating film, it is set as about 0.5 to 30 minutes, for example at 50-150 degreeC, and the residual ratio (content rate in an inorganic powder containing resin layer) after drying is 2 mass% normally. It is assumed to be within.

  The thickness of the inorganic powder-containing resin layer formed on the support film as described above is, for example, 5 to 500 μm, although it varies depending on the content and size of the inorganic powder.

Examples of the protective film layer that may be provided on the surface of the inorganic powder-containing resin layer include a polyethylene film and a polyvinyl alcohol film.

<Method for manufacturing FPD member>
The manufacturing method of the present invention is preferably used for manufacturing FPD components. These members are formed by forming an inorganic powder-containing resin layer on a substrate using the inorganic powder-containing resin composition of the present invention or the transfer film of the present invention, and exposing the resin layer to form a latent image of the pattern. Then, the resin layer is developed to form a pattern layer, and the pattern layer is baked.

(I) Step of forming inorganic powder-containing resin layer The inorganic powder-containing resin layer is formed by applying the inorganic powder-containing resin composition of the present invention on a substrate or using the transfer film of the present invention. It can be formed by transferring an inorganic powder-containing resin layer.

  According to the method using a transfer film, a resin layer excellent in film thickness uniformity can be easily formed, and the film thickness of the formed pattern can be made uniform. Moreover, you may form the laminated body which has a resin layer of n layer (n shows an integer greater than or equal to 2) by repeating transcription | transfer n times using the said transfer film. Or you may form the said laminated body by batch-transferring on the board | substrate using the transfer film in which the laminated body which consists of a resin layer of n layers was formed on the support film.

  Examples of the method for applying the composition of the present invention on a substrate include various methods such as screen printing, roll coating, spin coating, and cast coating. After applying the composition by such a method, the resin layer can be formed by drying the coating film. In addition, you may form the laminated body which consists of n layer by repeating the said process n times.

  An example of a transfer process using a transfer film is as follows. After peeling off the protective film layer of the transfer film used as necessary, the transfer film is overlaid so that the surface of the resin layer is in contact with the surface of the substrate, and this transfer film is thermocompression bonded with a heating roller, etc. The support film is peeled off from the layer. As a result, the resin layer is transferred and adhered to the surface of the substrate.

As the transfer conditions, for example, the surface temperature of the heating roller is 40 to 140 ° C., the roll pressure by the heating roller is 0.1 to 10 kg / cm ² , and the moving speed of the heating roller is 0.1 to 10 m / min. Moreover, the board | substrate may be preheated and the preheating temperature is 40-140 degreeC, for example.

(Ii) Exposure Step The surface of the inorganic powder-containing resin layer is selectively irradiated (exposed) with radiation such as ultraviolet rays through an exposure mask to form a pattern latent image on the resin layer. The radiation irradiation apparatus used in the exposure is not particularly limited, but an ultraviolet irradiation apparatus generally used in a photolithography method, an exposure apparatus used in manufacturing a semiconductor or a liquid crystal display device, and the like. Can be mentioned.

  In addition, when the inorganic powder-containing resin layer is formed by transfer, it is preferable to perform the exposure without peeling off the support film coated on the resin layer.

(Iii) Development step The exposed resin layer is developed to form a resin layer pattern. Development methods (for example, immersion method, rocking method, shower method, spray method, paddle method, etc.) and development processing conditions (for example, developer type / composition / concentration, development time, development temperature, etc.) are inorganic powders. What is necessary is just to select and set suitably according to the kind of containing resin layer.

(Vi) Firing Step In order to burn off the organic substance in the resin layer remaining portion after development, the pattern of the formed resin layer is subjected to a firing treatment. The firing treatment condition requires that the organic substance in the inorganic powder-containing resin layer (residual part) be burned off, and the firing temperature is usually 400 to 600 ° C. and the firing time is 10 to 90 minutes.

  By the manufacturing method of the present invention including the above steps, FPD members such as partition walls, electrodes, resistors, dielectrics, phosphors, color filters, and black matrices can be formed. In addition, the manufacturing method of this invention is preferable as a method of forming a partition, a dielectric material, and an electrode among these, and is especially preferable as a method of forming a front partition. The film thickness of the pattern obtained according to the present invention is, for example, 1 to 200 μm, although it varies depending on the use and the content of the inorganic powder.

Next, materials and various conditions used in the above steps will be described.
(substrate)
Examples of the substrate material used in the present invention include a plate-like member made of an insulating material such as glass, silicone, polycarbonate, polyester, aromatic amide, polyamideimide, and polyimide. If necessary, the surface of the plate-like member may be subjected to chemical treatment with a silane coupling agent or the like; plasma treatment; thin film formation treatment by an ion plating method, a sputtering method, a gas phase reaction method, a vacuum deposition method, or the like. Processing may be performed.

  In the present invention, a glass substrate having heat resistance is preferably used as the substrate. An example of such a glass substrate is PD200 manufactured by Asahi Glass Co., Ltd.

(Exposure mask)
The exposure pattern of the exposure mask used in the exposure step in the production method of the present invention is generally a stripe having a width of 10 to 500 μm, although it varies depending on the material.

(Developer)
As the developer used in the development step in the production method of the present invention, water, particularly ultrapure water is preferably used. Since the inorganic powder contained in the inorganic powder-containing resin layer is uniformly dispersed by the binder resin, the polymer (B) constituting the binder resin is dissolved in the developer and washed. The inorganic powder is also removed at the same time. Further, an alkaline developer may be used as the developer.

  As an active ingredient of the alkaline developer, for example, lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, dihydrogen phosphate Ammonium, potassium dihydrogen phosphate, sodium dihydrogen phosphate, lithium silicate, sodium silicate, potassium silicate, lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, sodium borate, potassium borate, ammonia, etc. Inorganic alkaline compounds: tetramethylammonium hydroxide, trimethylhydroxyethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropyl Piruamin, and organic alkaline compounds such as ethanol amine. The alkaline developer may contain additives such as nonionic surfactants and organic solvents. In addition, after the development process with an alkali developer is performed, a washing process is usually performed.

〔Example〕
EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example, this invention is not limited to these Examples.

In the following, “part” means “part by weight”, and the weight average molecular weight (Mw) is a weight average molecular weight in terms of polystyrene measured under the following conditions using gel permeation chromatography (GPC).
(Measurement condition)
GPC measuring device: HLC-8220 GPC manufactured by Tosoh Corporation
GPC column: TSKgelSuperHZN-M manufactured by Tosoh Corporation
Measuring solvent: Tetrahydrofuran Measuring temperature: 40 ° C
Moreover, the storage stability of the obtained composition was evaluated by the following method. First, after transferring the transfer film immediately after preparation to the substrate, i-line (ultraviolet light having a wavelength of 365 nm) was exposed with an ultra-high pressure mercury lamp through the above-described exposure mask under an irradiation dose of 400 mJ / cm ² , and by a shower method. Development was performed. The development time at that time was set as an initial value. Next, the developability was measured periodically while the composition was stored at 5 ° C. under shading conditions, and the storage stability was evaluated by the number of days until the initial value changed by 10 seconds or more.

<Synthesis Example 1>
80 parts of methoxypolyethylene glycol monomethacrylate (“Blemmer PME-100” manufactured by Nippon Oil & Fats Co., Ltd. m = 2, a = 2, b = 0 represented by formula (3)), 10 parts of methyl methacrylate, 2- 10 parts of hydroxypropyl methacrylate and 0.5 part of N, N′-azobisisobutyronitrile were charged into an autoclave equipped with a stirrer and stirred at room temperature in a nitrogen atmosphere until uniform. After stirring, the mixture is polymerized at 70 ° C. for 3 hours, further added with 0.25 part of N, N′-azobisisobutyronitrile, polymerized for 1 hour, and the polymerization reaction is continued at 70 ° C. for 1 hour, and then to room temperature. Upon cooling, a polymer solution was obtained. The obtained polymer solution had a polymerization rate of 100%, and the copolymer (resin I) precipitated from this polymer solution had a Mw of 160,000.

<Synthesis Example 2>
Copolymers [resins (2) to (11)] were obtained in the same manner as in Synthesis Example 1 except that the monomer composition in Synthesis Example 1 was changed to the monomer composition shown in Table 1 below. In Table 1, HPMA is 2-hydroxypropyl methacrylate, HEMA is 2-hydroxyethyl methacrylate, and MMA is methyl methacrylate.

<Example 1>
(1) Preparation of Resin Composition Containing Inorganic Powder As inorganic powder (A), 100 parts of ZnO—B ₂ O ₃ —SiO ₂ low melting point glass frit (indefinite shape, softening point 570 ° C.), or ZnO—Bi 100 parts of ₂ O ₃ —B ₂ O ₃ —SiO ₂ low melting point glass frit (indefinite shape, softening point 450 ° C.),
As water-soluble resin (B), 30 parts of resin 1 obtained in Synthesis Example 1;
As polyfunctional (meth) acrylate compound (C), 6 parts of trimethylolpropane triacrylate,
As photopolymerization initiator (D), ethanone, 1- [9-ethyl-6- [2-methyl-4- (2,2-dimethyl-1,3-dioxolanyl) methoxybenzoyl] -9. H. -Carbazol-3-yl]-, 1- (O-acetyloxime) (compound represented by formula (4)) (hereinafter also simply referred to as “photopolymerization initiator d-1”) 3 parts, or ( Ethanone, 1- [9-ethyl-6- [2-methyl-4-tetrahydrofuranylmethoxybenzoyl] -9.H.-carbazol-3-yl]-, 1- (O-acetyloxime)) (formula (5 )) (Hereinafter also simply referred to as “photopolymerization initiator d-2”) 3 parts,
As a solvent, 20 parts of propylene glycol monomethyl ether acetate,
As a dispersant, 1.2 parts of normal decyltrimethoxysilane,
As a dissolution accelerator (surfactant) (E), 3.75 parts “Emulgen A-60” manufactured by Kao Corporation, and as a UV absorber, 1-phenyl-3-methyl-4- (4-methylphenylazo) ) After kneading 0.09 part of 5-oxypyrazole with a bead mill, an inorganic powder-containing resin composition was prepared by filtering with a stainless mesh (400 mesh, 38 μm diameter).

  When the storage stability of the obtained composition was evaluated, storage stability of 60 days or more was obtained.

(2) Preparation of transfer film The obtained inorganic powder-containing resin composition was applied onto a support film (width 200 mm, length 30 m, thickness 38 μm) made of a PET film using a blade coater, and the coating film was coated with 100 By drying at 5 ° C. for 5 minutes to completely remove the solvent, an inorganic powder-containing photosensitive resin layer having an average film thickness of 46 μm was formed. Next, a protective film made of a PET film that had been subjected to a release treatment in advance was thermocompression-bonded on the resin layer, thereby preparing a transfer film in which a support film, an inorganic powder-containing photosensitive resin layer, and a protective film were laminated in this order.

(3) Formation of members
(i) Transfer process of inorganic powder-containing resin layer After peeling off and removing the protective film of the obtained transfer film, the transfer film is applied to the dielectric layer (film thickness 20 μm) formed on the surface of the glass substrate for 6-inch panels. Were laminated so that the surface of the resin layer was in contact, and this transfer film was thermocompression bonded with a heating roller. The pressure bonding conditions at this time were such that the surface temperature of the heating roller was 90 ° C., the roll pressure was 2 kg / cm ² , and the moving speed of the heating roller was 0.5 m / min. As a result, the photosensitive resin layer containing the inorganic powder was transferred and adhered to the surface of the glass substrate.

(ii) Exposure process and development process of photosensitive resin layer The photosensitive resin layer formed as described above is subjected to i-line by an ultrahigh pressure mercury lamp through an exposure mask (a stripe pattern having a width of 400 μm). (Ultraviolet light having a wavelength of 365 nm) was irradiated at a dose of 400 mJ / cm ² .

  After completion of the exposure process, the support film was peeled off from the resin layer, and then the exposed resin layer was subjected to a development process by a shower method using ultrapure water (30 ° C.) as a developer for 30 seconds. . Thereby, the uncured resin layer that was not irradiated with ultraviolet rays was removed, and a pattern of the resin layer containing inorganic powder was formed.

(iii) Baking process of resin layer pattern The glass substrate on which the resin layer pattern was formed on the dielectric layer was baked in a baking furnace in a temperature atmosphere of 590 ° C for 50 minutes. When the cross-sectional shape of the partition wall in the obtained panel material was observed with a scanning electron microscope and the width and height of the bottom surface of the cross-sectional shape were measured, the width of the bottom surface was 400 μm and the height was 20 μm. A fired pattern was obtained. As a result, a panel material in which partition walls were formed on the dielectric layer was obtained.

<Examples 2 to 8>
Except having changed the water-soluble resin into what is shown in Table 1, it carried out similarly to Example 1, and prepared the inorganic powder containing resin composition, and evaluated the storage stability. Next, a transfer film was produced using the composition, a panel material was produced using the transfer film, and transferability and pattern shape were evaluated. The results are shown in Table 2.

(Developability)
Evaluation method: After transferring the transfer film to the substrate, i-line (ultraviolet light having a wavelength of 365 nm) is exposed with an ultra-high pressure mercury lamp through the above-described exposure mask at a dose of 400 mJ / cm ² , and 30 to 30 by a shower method. Development was performed in the range of 300 seconds.
Evaluation criteria: “Good” means ◯, “Unexposed portion undissolved part” means Δ, and “Unexposed part insoluble part” means “poor”.

(Storage stability)
Evaluation method: First, after transferring the transfer film immediately after preparation to the substrate, i-line (ultraviolet light having a wavelength of 365 nm) was exposed with an ultrahigh pressure mercury lamp through the above-described exposure mask under an irradiation dose of 400 mJ / cm ² , Development was performed by the shower method. The development time at that time was set as an initial value. Next, the developability was measured periodically while the composition was stored at 5 ° C. under shading conditions, and the storage stability was evaluated by the number of days until the initial value changed by 10 seconds or more.
Evaluation criteria: The case where the number of days until the developability changes from the initial value by 10 seconds or more is O, the case where it is 1 week or more and less than 60 days is Δ, and the case where it is within 1 week is X.

(Pattern shape)
Evaluation method: The cross-sectional shape of the pattern was observed using an electron microscope.
Evaluation criteria: A good one (forward taper or straight) was marked with ◯, and a bad one (reverse taper) was marked with x.

TMP; trimethylolpropane triacrylate

<Comparative Examples 1-4>
2-Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one as a photopolymerization initiator (D) (trade name: IRG.369, manufactured by (Ciba Special Chemicals)) (Hereinafter, also simply referred to as “photopolymerization initiator d-3”.) Inorganic powder was obtained in the same manner as in Example 1 except that the water-soluble resin was changed to that shown in Table 1 by using 2.5 parts. The containing resin composition was prepared and the storage stability was evaluated. Next, a transfer film was produced using the composition, a panel material was produced using the transfer film, and transferability and pattern shape were evaluated. The results are shown in Table 3.

Claims (10)

(A) inorganic powder (B) a polymer having a structural unit represented by the following formula (1),
(C) Polyfunctional (meth) acrylate (D) An inorganic powder-containing resin composition containing a compound represented by the following formula (2).

(In the formula (1), R ¹ is a hydrogen atom or a methyl group, R ² is an alkyl group having 1 to 5 carbon atoms, m and n are integers of 1 to 5 and m ≠ n. a is an integer of 1 to 100, and b is an integer of 0 to 100.)

[In Formula (2), X represents a halogen atom or an alkyl group, R ³ , R ⁴ , and R ⁵ each independently represent R, OR, COR, SR, CONRR ′, or CN; 'Represents an alkyl group, an aryl group, an aralkyl group or a heterocyclic group, which may be substituted with a halogen atom and / or a heterocyclic group, and R and R' together form a ring. You may do it. Y ¹ represents an oxygen atom, a sulfur atom or a selenium atom, Y ² represents a single bond or a carbonyl group, A represents a heterocyclic group, r represents an integer of 0 to 4, and p represents an integer of 0 to 5 Q represents 0 or 1. ]   The inorganic powder-containing resin composition according to claim 1, further comprising (E) a dissolution accelerator.   The inorganic powder-containing resin composition according to claim 2, wherein the dissolution accelerator (E) is a polyoxyethylene aryl ether.   The inorganic powder-containing resin composition according to claim 1, wherein the inorganic powder (A) is a glass powder having a softening point of 400 to 650 ° C.   The inorganic powder-containing resin composition according to claim 1, wherein the polymer (B) further has a structural unit derived from a hydroxyl group-containing monomer.   A transfer film comprising an inorganic powder-containing resin composition obtained from the inorganic powder-containing resin composition according to claim 1. (I) forming an inorganic powder-containing resin layer obtained from the inorganic powder-containing resin composition according to any one of claims 1 to 5 on a substrate;
(II) a step of exposing the inorganic powder-containing resin layer to form a latent image of a pattern;
(III) A pattern forming method comprising: a step of developing the exposed inorganic powder-containing resin layer to form a pattern; and (IV) a step of baking the pattern.   The pattern forming method according to claim 7, wherein in the step (I), the inorganic powder-containing resin layer constituting the transfer film according to claim 6 is transferred onto a substrate.   A method of forming at least one display panel member selected from a dielectric, an electrode, a resistor, a phosphor, a barrier, a color filter, and a black matrisk by the pattern forming method according to claim 7 or 8. A method for manufacturing a flat panel display.   The method of manufacturing a flat panel display according to claim 9, wherein the flat display panel is a plasma display panel.