JP2008227264A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
- Publication number
- JP2008227264A JP2008227264A JP2007065074A JP2007065074A JP2008227264A JP 2008227264 A JP2008227264 A JP 2008227264A JP 2007065074 A JP2007065074 A JP 2007065074A JP 2007065074 A JP2007065074 A JP 2007065074A JP 2008227264 A JP2008227264 A JP 2008227264A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- substrate
- load lock
- lock chamber
- inert gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 238000010438 heat treatment Methods 0.000 claims abstract description 24
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 239000011261 inert gas Substances 0.000 claims description 82
- 239000007789 gas Substances 0.000 claims description 20
- 239000012535 impurity Substances 0.000 abstract description 13
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 66
- 230000007246 mechanism Effects 0.000 description 37
- 239000003507 refrigerant Substances 0.000 description 25
- 230000003028 elevating effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000005192 partition Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007065074A JP2008227264A (ja) | 2007-03-14 | 2007-03-14 | 基板処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007065074A JP2008227264A (ja) | 2007-03-14 | 2007-03-14 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008227264A true JP2008227264A (ja) | 2008-09-25 |
JP2008227264A5 JP2008227264A5 (enrdf_load_stackoverflow) | 2010-04-30 |
Family
ID=39845511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007065074A Pending JP2008227264A (ja) | 2007-03-14 | 2007-03-14 | 基板処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2008227264A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010231572A (ja) * | 2009-03-27 | 2010-10-14 | Sumitomo Heavy Ind Ltd | チャンバ圧力調整装置 |
US8607752B2 (en) | 2008-09-11 | 2013-12-17 | Denso Corporation | Valve timing control apparatus |
CN115206835A (zh) * | 2021-04-01 | 2022-10-18 | 细美事有限公司 | 支承单元及基板处理设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06260487A (ja) * | 1993-03-03 | 1994-09-16 | Tokyo Electron Tohoku Ltd | 熱処理装置 |
JPH1022292A (ja) * | 1996-07-08 | 1998-01-23 | Sony Corp | 熱処理装置およびこれを用いた熱処理方法 |
JPH11204447A (ja) * | 1998-01-12 | 1999-07-30 | Tokyo Electron Ltd | 枚葉式の熱処理装置 |
JP2001068425A (ja) * | 1999-08-31 | 2001-03-16 | Hitachi Kokusai Electric Inc | 半導体熱処理装置及び方法 |
-
2007
- 2007-03-14 JP JP2007065074A patent/JP2008227264A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06260487A (ja) * | 1993-03-03 | 1994-09-16 | Tokyo Electron Tohoku Ltd | 熱処理装置 |
JPH1022292A (ja) * | 1996-07-08 | 1998-01-23 | Sony Corp | 熱処理装置およびこれを用いた熱処理方法 |
JPH11204447A (ja) * | 1998-01-12 | 1999-07-30 | Tokyo Electron Ltd | 枚葉式の熱処理装置 |
JP2001068425A (ja) * | 1999-08-31 | 2001-03-16 | Hitachi Kokusai Electric Inc | 半導体熱処理装置及び方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8607752B2 (en) | 2008-09-11 | 2013-12-17 | Denso Corporation | Valve timing control apparatus |
US9085997B2 (en) | 2008-09-11 | 2015-07-21 | Denso Corporation | Valve timing control apparatus |
US9759101B2 (en) | 2008-09-11 | 2017-09-12 | Denso Corporation | Valve timing control apparatus |
JP2010231572A (ja) * | 2009-03-27 | 2010-10-14 | Sumitomo Heavy Ind Ltd | チャンバ圧力調整装置 |
CN115206835A (zh) * | 2021-04-01 | 2022-10-18 | 细美事有限公司 | 支承单元及基板处理设备 |
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