JP2008227195A - 液処理装置 - Google Patents

液処理装置 Download PDF

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Publication number
JP2008227195A
JP2008227195A JP2007064317A JP2007064317A JP2008227195A JP 2008227195 A JP2008227195 A JP 2008227195A JP 2007064317 A JP2007064317 A JP 2007064317A JP 2007064317 A JP2007064317 A JP 2007064317A JP 2008227195 A JP2008227195 A JP 2008227195A
Authority
JP
Japan
Prior art keywords
liquid
substrate
processing
developer
processing liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007064317A
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English (en)
Japanese (ja)
Inventor
Hiroshi Fukuda
浩 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2007064317A priority Critical patent/JP2008227195A/ja
Priority to TW97107861A priority patent/TW200843868A/zh
Priority to CNA2008100853757A priority patent/CN101266414A/zh
Publication of JP2008227195A publication Critical patent/JP2008227195A/ja
Pending legal-status Critical Current

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Liquid Crystal (AREA)
JP2007064317A 2007-03-14 2007-03-14 液処理装置 Pending JP2008227195A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007064317A JP2008227195A (ja) 2007-03-14 2007-03-14 液処理装置
TW97107861A TW200843868A (en) 2007-03-14 2008-03-06 Liquid treatment device
CNA2008100853757A CN101266414A (zh) 2007-03-14 2008-03-14 液体处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007064317A JP2008227195A (ja) 2007-03-14 2007-03-14 液処理装置

Publications (1)

Publication Number Publication Date
JP2008227195A true JP2008227195A (ja) 2008-09-25

Family

ID=39845453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007064317A Pending JP2008227195A (ja) 2007-03-14 2007-03-14 液処理装置

Country Status (3)

Country Link
JP (1) JP2008227195A (enrdf_load_stackoverflow)
CN (1) CN101266414A (enrdf_load_stackoverflow)
TW (1) TW200843868A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017164126A1 (ja) * 2016-03-25 2017-09-28 東レ株式会社 現像装置及び回路基板の製造方法
JP2019057637A (ja) * 2017-09-21 2019-04-11 旭化成株式会社 現像装置及び現像方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103131A (ja) * 2008-10-21 2010-05-06 Tokyo Electron Ltd 液処理装置及び液処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213668A (ja) * 1996-02-01 1997-08-15 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000114221A (ja) * 1998-10-02 2000-04-21 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001255668A (ja) * 2000-03-10 2001-09-21 Matsushita Electric Ind Co Ltd 湿式処理方法及び装置
JP2002252200A (ja) * 2001-02-22 2002-09-06 Hitachi Electronics Eng Co Ltd 基板処理装置及び処理方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213668A (ja) * 1996-02-01 1997-08-15 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000114221A (ja) * 1998-10-02 2000-04-21 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2001255668A (ja) * 2000-03-10 2001-09-21 Matsushita Electric Ind Co Ltd 湿式処理方法及び装置
JP2002252200A (ja) * 2001-02-22 2002-09-06 Hitachi Electronics Eng Co Ltd 基板処理装置及び処理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017164126A1 (ja) * 2016-03-25 2017-09-28 東レ株式会社 現像装置及び回路基板の製造方法
JP2019057637A (ja) * 2017-09-21 2019-04-11 旭化成株式会社 現像装置及び現像方法

Also Published As

Publication number Publication date
TWI343842B (enrdf_load_stackoverflow) 2011-06-21
TW200843868A (en) 2008-11-16
CN101266414A (zh) 2008-09-17

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