JP2008189951A5 - - Google Patents

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Publication number
JP2008189951A5
JP2008189951A5 JP2007023402A JP2007023402A JP2008189951A5 JP 2008189951 A5 JP2008189951 A5 JP 2008189951A5 JP 2007023402 A JP2007023402 A JP 2007023402A JP 2007023402 A JP2007023402 A JP 2007023402A JP 2008189951 A5 JP2008189951 A5 JP 2008189951A5
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JP
Japan
Prior art keywords
film
vapor deposition
partition
forming material
blowing
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Application number
JP2007023402A
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English (en)
Japanese (ja)
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JP2008189951A (ja
JP5020650B2 (ja
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Priority claimed from JP2007023402A external-priority patent/JP5020650B2/ja
Priority to JP2007023402A priority Critical patent/JP5020650B2/ja
Priority to PCT/JP2008/051395 priority patent/WO2008093726A1/ja
Priority to CN2008800037795A priority patent/CN101600815B/zh
Priority to DE112008000313T priority patent/DE112008000313T5/de
Priority to US12/525,093 priority patent/US20100104751A1/en
Priority to KR1020097018192A priority patent/KR101212276B1/ko
Priority to TW097103753A priority patent/TW200907081A/zh
Publication of JP2008189951A publication Critical patent/JP2008189951A/ja
Publication of JP2008189951A5 publication Critical patent/JP2008189951A5/ja
Publication of JP5020650B2 publication Critical patent/JP5020650B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007023402A 2007-02-01 2007-02-01 蒸着装置、蒸着方法および蒸着装置の製造方法 Expired - Fee Related JP5020650B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2007023402A JP5020650B2 (ja) 2007-02-01 2007-02-01 蒸着装置、蒸着方法および蒸着装置の製造方法
US12/525,093 US20100104751A1 (en) 2007-02-01 2008-01-30 Evaporating apparatus, evaporating method and manufacturing method of evaporating apparatus
CN2008800037795A CN101600815B (zh) 2007-02-01 2008-01-30 蒸镀装置、蒸镀方法及蒸镀装置的制造方法
DE112008000313T DE112008000313T5 (de) 2007-02-01 2008-01-30 Bedampfungseinrichtung, Bedampfungsverfahren sowie Herstellverfahren für die Bedampfungseinrichtung
PCT/JP2008/051395 WO2008093726A1 (ja) 2007-02-01 2008-01-30 蒸着装置、蒸着方法および蒸着装置の製造方法
KR1020097018192A KR101212276B1 (ko) 2007-02-01 2008-01-30 증착 장치, 증착 방법 및 증착 장치의 제조 방법
TW097103753A TW200907081A (en) 2007-02-01 2008-01-31 Vapor deposition system, vapor deposition method and manufacturing method of vapor deposition system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007023402A JP5020650B2 (ja) 2007-02-01 2007-02-01 蒸着装置、蒸着方法および蒸着装置の製造方法

Publications (3)

Publication Number Publication Date
JP2008189951A JP2008189951A (ja) 2008-08-21
JP2008189951A5 true JP2008189951A5 (enExample) 2009-05-28
JP5020650B2 JP5020650B2 (ja) 2012-09-05

Family

ID=39674034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007023402A Expired - Fee Related JP5020650B2 (ja) 2007-02-01 2007-02-01 蒸着装置、蒸着方法および蒸着装置の製造方法

Country Status (7)

Country Link
US (1) US20100104751A1 (enExample)
JP (1) JP5020650B2 (enExample)
KR (1) KR101212276B1 (enExample)
CN (1) CN101600815B (enExample)
DE (1) DE112008000313T5 (enExample)
TW (1) TW200907081A (enExample)
WO (1) WO2008093726A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5179739B2 (ja) * 2006-09-27 2013-04-10 東京エレクトロン株式会社 蒸着装置、蒸着装置の制御装置、蒸着装置の制御方法および蒸着装置の使用方法
KR101226518B1 (ko) * 2008-09-30 2013-01-25 도쿄엘렉트론가부시키가이샤 증착 장치, 증착 방법 및 프로그램을 기억한 기억 매체
JP2012169225A (ja) * 2011-02-16 2012-09-06 Tokyo Electron Ltd 成膜装置
JP2014095131A (ja) * 2012-11-09 2014-05-22 Tokyo Electron Ltd 成膜装置
WO2015136857A1 (ja) * 2014-03-11 2015-09-17 株式会社Ｊｏｌｅｄ 蒸着装置及びその制御方法、蒸着装置を用いた蒸着方法、及びデバイスの製造方法
CN108026630B (zh) * 2015-09-24 2020-07-07 夏普株式会社 蒸镀源和蒸镀装置以及蒸镀膜制造方法
CN107604337A (zh) * 2017-08-28 2018-01-19 武汉华星光电半导体显示技术有限公司 一种线性蒸发源侦测装置及其侦测方法
CN107858651B (zh) * 2017-11-27 2020-02-04 合肥鑫晟光电科技有限公司 一种蒸镀设备
KR102229219B1 (ko) * 2019-10-29 2021-03-17 주식회사 파인에바 증착 장비용 가열 어셈블리
JP7473892B2 (ja) * 2020-03-10 2024-04-24 株式会社昭和真空 蒸着源
US20230137506A1 (en) * 2020-08-21 2023-05-04 Applied Materials, Inc. Processing system for processing a flexible substrate and method of measuring at least one of a property of a flexible substrate and a property of one or more coatings on the flexible substrate

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939665B2 (ja) 1981-10-06 1984-09-25 工業技術院長 金属箔の表面に太陽熱選拓吸収皮膜を形成する方法
JPS62230966A (ja) * 1986-04-01 1987-10-09 Canon Inc 結晶成長装置
JPS63230966A (ja) 1987-03-19 1988-09-27 Nkk Corp 光化学原動装置
JP3360098B2 (ja) * 1995-04-20 2002-12-24 東京エレクトロン株式会社 処理装置のシャワーヘッド構造
US6337102B1 (en) * 1997-11-17 2002-01-08 The Trustees Of Princeton University Low pressure vapor phase deposition of organic thin films
JP3734239B2 (ja) 1999-04-02 2006-01-11 キヤノン株式会社 有機膜真空蒸着用マスク再生方法及び装置
JP2003077662A (ja) * 2001-06-22 2003-03-14 Junji Kido 有機エレクトロルミネッセンス素子の製造方法および製造装置
JP4513329B2 (ja) * 2004-01-16 2010-07-28 東京エレクトロン株式会社 処理装置
JP4911555B2 (ja) * 2005-04-07 2012-04-04 国立大学法人東北大学 成膜装置および成膜方法
JP5173175B2 (ja) * 2006-09-29 2013-03-27 東京エレクトロン株式会社 蒸着装置

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