JP2008121098A - 蒸発源およびこれを用いた真空蒸着装置 - Google Patents
蒸発源およびこれを用いた真空蒸着装置 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
Abstract
【解決手段】蒸着材料を加熱により気化または昇華させることで生成された蒸気が長尺のノズル開口2より帯状に吐出される。一方、前記ノズル開口2に対峙した状態で、当該ノズル開口の長手方向に直交する方向に被蒸着基板3が矢印A方向に搬送されるように構成されている。前記ノズル開口2の長手方向における単位面積あたりの蒸気の吐出流量が、ノズル開口の中央部よりも基板端部の位置と同じノズル幅方向位置の部分において最大となるように構成されると共に、ノズル開口2内には蒸気の流れに指向性を付与する複数の仕切り板4が配置されている。
【選択図】図1
Description
1A 筐体部
1B 蒸発室(るつぼ)
2 ノズル開口
3 被蒸着基板
4 仕切り板
4a 整流板
5 ヒータ
6 蒸着材料
7 制御板
7a 蒸気通過孔
8 空間部
9 可動制御板
9a 蒸気通過孔
Claims (5)
- 蒸着材料が収容され前記蒸着材料を加熱により気化または昇華させて、前記蒸着材料の蒸気を発生させる蒸発室と、前記蒸発室に連通して前記蒸発室において生成された蒸気を、長尺のノズル開口より帯状に吐出させる筐体部とを具備した蒸発源であって、
前記ノズル開口の長手方向における単位面積あたりの蒸気の吐出流量Q(Kg/m2 sec)が、当該ノズル開口の中央部よりも基板端部の位置と同じノズル幅方向位置の部分において最大となるように蒸気の通過孔を形成した制御板が、前記筐体部内に配置されると共に、前記制御板と前記ノズル開口との間には、前記通過孔を経た蒸気の流れに指向性を付与する複数の仕切り板が配置されていることを特徴とする蒸発源。 - 前記ノズル開口の単位面積あたりの蒸気の吐出流量Q(Kg/m2 sec)が、当該ノズル開口の中央部から端部に向かって単調に増加し、基板端部の位置で最大となった後は単調に減少する流量分布を有することを特徴とする請求項1に記載された蒸発源。
- 前記複数の仕切り板の配列ピッチが、長手方向に沿って形成されたノズル開口の中央部における配列ピッチに対して両端部分における配列ピッチが狭く設定されていることを特徴とする請求項1または請求項2に記載された蒸発源。
- 請求項1ないし請求項3のいずれか1項に記載された前記蒸発源と被蒸着基板とが真空容器内に配置され、当該真空容器内において、前記蒸発源のノズル開口に対峙した状態で、当該ノズル開口の長手方向に直交する方向に前記被蒸着基板が搬送されるように構成されていることを特徴とする真空蒸着装置。
- 前記被蒸着基板の幅方向の端部に対峙する前記ノズル開口の単位面積あたりの蒸気の吐出流量Q1(Kg/m2 sec)と、前記ノズル開口の中央部におけるノズル開口の単位面積あたりの蒸気の吐出流量Q0(Kg/m2 sec)との流量比率をβ(=Q1/Q0)とし、前記βを、前記ノズル開口の端部と前記被蒸着基板との距離H(m)で割った値α(=β/H)が、10≦α≦30の範囲に設定されていることを特徴とする請求項4に記載された真空蒸着装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006309798A JP4768584B2 (ja) | 2006-11-16 | 2006-11-16 | 蒸発源およびこれを用いた真空蒸着装置 |
TW096142517A TWI386498B (zh) | 2006-11-16 | 2007-11-09 | 蒸鍍源及使用該蒸鍍源之真空蒸鍍機 |
KR1020070116037A KR101450339B1 (ko) | 2006-11-16 | 2007-11-14 | 증발원 및 이것을 이용한 진공 증착 장치 |
EP07022102A EP1927674B1 (en) | 2006-11-16 | 2007-11-14 | Evaporation source and vacuum evaporator using the same |
CN2007101694645A CN101182627B (zh) | 2006-11-16 | 2007-11-16 | 蒸发源以及使用该蒸发源的真空蒸镀装置 |
US11/941,117 US8177912B2 (en) | 2006-11-16 | 2007-11-16 | Evaporation source and vacuum evaporator using the same |
Applications Claiming Priority (1)
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JP2006309798A JP4768584B2 (ja) | 2006-11-16 | 2006-11-16 | 蒸発源およびこれを用いた真空蒸着装置 |
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JP2008121098A true JP2008121098A (ja) | 2008-05-29 |
JP4768584B2 JP4768584B2 (ja) | 2011-09-07 |
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Country Status (6)
Country | Link |
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US (1) | US8177912B2 (ja) |
EP (1) | EP1927674B1 (ja) |
JP (1) | JP4768584B2 (ja) |
KR (1) | KR101450339B1 (ja) |
CN (1) | CN101182627B (ja) |
TW (1) | TWI386498B (ja) |
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Publication number | Publication date |
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EP1927674B1 (en) | 2012-07-18 |
TW200825192A (en) | 2008-06-16 |
EP1927674A3 (en) | 2010-08-25 |
KR20080044775A (ko) | 2008-05-21 |
CN101182627B (zh) | 2011-06-22 |
US20080115729A1 (en) | 2008-05-22 |
TWI386498B (zh) | 2013-02-21 |
US8177912B2 (en) | 2012-05-15 |
JP4768584B2 (ja) | 2011-09-07 |
EP1927674A2 (en) | 2008-06-04 |
CN101182627A (zh) | 2008-05-21 |
KR101450339B1 (ko) | 2014-10-14 |
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