JP2008186618A - Organic electroluminescent device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic electroluminescent device of long life, compact, stably emitting light for a long period of time without getting oversized, and easy to be electrically connected. <P>SOLUTION: The device is provided with a first substrate with translucency, a first electrode formed on a surface of the first substrate, an element part intercalated between the first electrode and a second electrode opposed to the former and equipped with an emitting function layer including an organic layer, a second substrate arranged in opposition to the first substrate so as to pinch the element part and equipped with a first and a second electrode terminals for external connection, a sealing part formed between the first and the second substrates so as to surround the element part, a first connecting part connecting the first electrode to the first electrode terminal, and a second connecting part connecting the second electrode to the second electrode terminal, the first connecting part arranged further outside than the sealing part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an organic electroluminescence light emitting device, and more particularly to an electrode lead-out structure of an organic electroluminescence light emitting device used for a flat panel display, a sign light source, an illumination light source, a liquid crystal display backlight, and the like.

  2. Description of the Related Art Conventionally, organic electroluminescence elements (hereinafter referred to as organic EL elements) are known as electroluminescent elements used in units and pixels of display devices of various industrial equipment.

  The basic structure of the organic EL element used in this organic electroluminescence light emitting device is a simple structure in which an organic layer is sandwiched between an anode and a cathode. The formation of the electrode and the organic layer in a thin film can be easily performed by processing techniques such as chemical vapor deposition, sputtering, vapor deposition, spin coating, ink jet, and printing. Compared with devices that require epitaxial growth, such as light emitting diodes and light emitting diodes, there is an advantage that reduction in manufacturing cost can be suppressed and an increase in area is easy.

  For example, in a light-emitting device using an organic EL element, an anode made of a translucent material is formed on the surface of a translucent glass substrate, and an organic phosphor thin film, an organic hole transport layer, or the like is further formed on the anode. A layer having a light emitting function (hereinafter referred to as a light emitting functional layer) is formed and laminated, and a cathode made of metal and formed so as to cross the anode is laminated by vacuum deposition or the like.

  One end of each anode and cathode is connected to an external power source by a conductive anode lead electrode or cathode lead electrode. By the way, since the light emitting functional layer is vulnerable to moisture, in order to maintain its performance, for example, a sealing plate made of metal is bonded to a glass substrate using an adhesive, and the anode, the light emitting functional layer, and the cathode are sealed inside. And formed to be shielded from moisture in the atmosphere.

  However, in order to extend the life as much as possible, it is necessary to increase the area of the joint between the glass substrate and the sealing plate, and accordingly, the area of the glass substrate must be increased, which is the light emitting area for the device of the organic EL element. It was difficult to increase the effective area of.

  Further, as the take-out electrode, an anode made of a light-transmitting material formed on a glass substrate and a take-out electrode whose top is covered with a metal plating layer or the like are used, so that a stable electrical connection is made with a socket or the like. Have the disadvantages that they are not strong enough to break, such as breaking the glass substrate.

  Therefore, for example, in Patent Document 1, a double-sided wiring board and a glass substrate in which a conductive pattern on one surface and a conductive pattern on the other surface are electrically connected to each other through a through hole are joined at the outer periphery. A method of sealing and connecting the conductive pattern on one surface to the anode and the cathode has been proposed.

However, in this method, when connecting the glass substrate and the double-sided wiring substrate at the outer periphery, or when connecting the cathode terminal and the conductive pattern, the solder is connected by melting in a thermostatic bath using cream solder or solder balls. Therefore, the organic material is crystallized due to the influence of heat, and there is a possibility that the life or the characteristics may be deteriorated. In addition, there is a drawback in that the organic EL element is deteriorated due to the gas generated from the solder due to the heat during connection.
In addition, it was difficult to expand the effective area of the light emitting area as a whole system including peripheral devices because there was a restriction in mounting and an increase in mounting area.

JP-A-9-219288

  The present invention has been made in view of the above circumstances, and is an organic electroluminescence light emitting device that has a long life, is small and stably emits light for a long time without causing an increase in the size of the device, and is easily electrically connected. An object is to provide an apparatus.

Therefore, an organic electroluminescence light emitting device of the present invention includes a first substrate having translucency, a first electrode formed on the surface of the first substrate, and a second electrode facing the first electrode. An element part provided with a light emitting functional layer including an organic layer interposed between the electrode and the first substrate so as to sandwich the element part is disposed, and is used for external connection. A second substrate provided with first and second electrode terminals, a sealing portion formed between the first substrate and the second substrate so as to surround the element portion, and the first substrate A first connection part for connecting an electrode to the first electrode terminal; and a second connection part for connecting the second electrode to the second electrode terminal, wherein the first connection part comprises: It is arranged outside the sealing part.
According to this configuration, since the first connection portion is disposed outside the sealing portion, the joining portion is further away from the element portion, and even when solder bonding is necessary, heat is applied to the element portion. It is possible to prevent adverse effects. The second connection portion connected to the second electrode located on the second substrate side may be directly connected to the second electrode terminal inside without necessarily joining on the outside. In this case, Since the joint is located far from the first substrate, there is little influence on the first substrate. The entire circumference of the first substrate and the second substrate is joined to each other using a sealing resin inside the electrical connection portion, thereby forming an organic compound by a gas generated when the electrical connection portion is joined with cream solder or the like. Since the light emitting functional layer can be prevented from deteriorating over time and sealed in an airtight state, the light emitting functional layer can be isolated from moisture in the atmosphere, and the lifetime of the device can be extended.

Moreover, this invention includes the said organic electroluminescent light-emitting device in which the said 2nd connection part is arrange | positioned outside the said sealing part.
According to this configuration, since the first and second connecting portions are disposed outside the sealing portion, the joining portion is further away from the element portion, and even when soldering is necessary, heat is generated. The element portion can be prevented from being adversely affected. In addition, when the first and second connection portions are formed over the entire circumference of the element portion, the electrical connectivity is good, and when viewed from the element portion, the periphery of the element portion is connected to the sealing portion and the second portion. It will be composed of two layers of the first and second connection portions, and the sealing performance will be further improved. In addition, it is possible to supply power safely from the second substrate having high mechanical strength, and the area ratio of the light emitting portion to the area of the first substrate is increased, so that the cost can be reduced.

In the organic electroluminescence light emitting device according to the present invention, the first connection portion is in contact with a first conductor pattern disposed on the second substrate and connected to the first connection terminal. The first connection terminal includes one that protrudes beyond the end face of the first substrate.
According to this configuration, since the first connection terminal is formed in a region protruding from the end surface of the first substrate, external connection is easy. Since power can be supplied from the light emitting surface side with the second substrate attached to the wall surface, the apparatus can be made thin.

In the organic electroluminescence light emitting device according to the present invention, one end of the second connection portion is connected to a conductor pattern on the same layer as the first electrode on the first substrate, and the other end is the first connection. 2 is disposed on the second substrate and is in contact with the second conductor pattern connected to the second connection terminal.
According to this configuration, it can be configured in the same layer as the first electrode formed on the first substrate, can be realized only by adjusting a mask for patterning, and can be easily manufactured and easily connected. It is. For example, when the first electrode is made of ITO (indium tin oxide), the solder bondability is also good, and the adhesion with the sealing resin constituting the sealing portion is also good.

Moreover, this invention includes the said organic electroluminescent light-emitting device whose said 1st connection part is a plating layer.
According to this configuration, it can be easily formed from the wiring portion of the second substrate, and has excellent malleability, so that the bonding property with the first substrate is also good.

Moreover, this invention includes the said organic electroluminescent light-emitting device in which the said 2nd connection part is a plating layer.
According to this configuration, it can be easily formed from the wiring portion of the second substrate and has excellent malleability, so that the bonding property with the first substrate is also good.

Further, the present invention includes the organic electroluminescence light emitting device, wherein the first connection portion or the second connection portion is provided through the second substrate.
According to this configuration, both the first and second terminals can be formed on any surface of the second substrate, and the degree of freedom in mounting increases.

Further, the present invention includes the above organic electroluminescence light emitting device, wherein the first connection portion or the second connection portion is formed of cream solder having a melting point of 120 ° C. or lower.
According to this structure, it can connect favorably using cream solder and can reduce the thermal damage to a light emission function part.

The present invention includes the organic electroluminescence light emitting device, wherein the second substrate is a flexible substrate having a conductor pattern formed on both sides.
According to this configuration, even when the first substrate is a glass substrate, it can be favorably held by the flexibility of the second substrate, and the adhesiveness is also improved.

According to the present invention, in the organic electroluminescence light emitting device, an inner region surrounded by the first substrate, the second substrate, and the sealing portion is an insulating material that is inactive with respect to the constituent material of the element portion. Including filled ones.
According to this structure, the space of a junction part can be made compact and stable joining can be performed. Further, deterioration of the element portion can be prevented, and reliability can be improved.

Since it comprised as mentioned above, by joining the perimeter inside the electrical connection part of a 1st board | substrate and a 2nd board | substrate, it is made from organic material by the gas generated when joining an electrical connection part with cream solder. Thus, the light emitting functional layer can be prevented from being deteriorated over time and sealed in an airtight state, so that the light emitting functional layer can be isolated from moisture in the atmosphere and the lifetime of the element can be extended.
In addition, power can be safely supplied from the second substrate having high mechanical strength, and the area ratio of the light emitting portion with respect to the area of the first substrate can be increased, so that the cost can be reduced.
In addition, since power can be supplied from the light emitting surface side with the second substrate attached to the wall surface, the apparatus can be thinned.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(Embodiment 1)
FIG. 1 is a cross-sectional view of an essential part of an organic electroluminescence light emitting device according to Embodiment 1 of the present invention, and FIG. 2 is a diagram showing a manufacturing process thereof.
In this organic electroluminescence light emitting device, an element portion made of an organic electroluminescence element formed on a glass substrate 1 as a first substrate having translucency is formed on the first substrate 1 and a double-sided wiring is formed. The second substrate 10 made of a flexible film is enclosed and sealed with a sealing portion 7 using a sealing resin, and the columnar first connecting portion 9 made of a plating layer is formed on the outer side in the plane direction. The second connection portion 8 is formed, the first connection portion 9 is connected to the first connection terminal 10c that is the take-out electrode of the first electrode 2, and the second electrode 4 is the take-out electrode of the second electrode 4. The connection terminals are arranged on both surfaces of the second substrate 10 by connecting the second connection portion 8 to the two connection terminals 10a. Accordingly, the first and second connection terminals 10a and 10c are formed on both sides of the first surface located inside the second substrate 10 and the second surface located outside, respectively, and are connected to the drive circuit and the like. Is done. Here, the first electrode is an anode and the second electrode is a cathode.

Here, the element part includes a light emitting functional layer 3 comprising a hole transport layer comprising an organic layer, a light emitting layer and an electron transport layer on a first electrode 2 comprising an ITO pattern formed on the glass substrate 1, and a second layer. The electrode 4 is composed of an organic electroluminescence element in which aluminum electrodes are sequentially stacked.
Further, the second electrode 4 is formed so as to cover a part of the conductor pattern 2P formed along the side surface of the light emitting functional layer 3 and spaced from the first electrode 2 by a predetermined distance, on the conductor pattern 2P. A second connection portion 8 made of a plating layer is connected. The second connection terminal 10a is a plating layer formed on a part of the second conductor pattern 10a that is formed on the second substrate 10 and constitutes the second connection terminal.
Further, the first electrode 2 is connected to the first conductor pattern 10c by a plating metal provided through the base 10b, and is formed so as to protrude to the side on which the second conductor pattern 10a is provided. The first contact portion 9 made of a layer is abutted and soldered.

Next, a method for manufacturing this organic electroluminescence light emitting device will be described.
First, as shown in FIG. 2A, an ITO thin film having a thickness of about 100 to 200 nm is formed on a glass substrate 1 by a sputtering method, and this is patterned to form a first electrode 2 and a second electrode. The conductive pattern 2P for connection with the other electrode is formed. Thereafter, a light-emitting functional layer 3 composed of a hole transport layer composed of an aromatic diamine compound such as α-NPD, a light-emitting layer composed of Alq 3, and an electron transport layer composed of coumarin, and a second electrode 4 as a sputtering method 100 to 200 nm aluminum electrodes formed in the above are sequentially laminated and patterned to form an organic electroluminescence element constituting the element portion. Then, a sealing resin 7 made of an epoxy resin with filler is supplied onto the conductive pattern 2P formed on the light emitting functional layer 3 and the same ITO layer as the first electrode by using a dispenser (FIG. 2A )).

  Thereafter, a flexible film 10 having a conductor layer formed on both sides is prepared and patterned to form a desired pattern by photolithography and etching to form first and second conductor patterns 10c and 10a. Here, the second conductor pattern 10a is formed on the first surface on the organic electroluminescence element side, and the first conductor pattern 10c is formed on the second surface on the outside. Then, a columnar plating layer as the second connection portion 9 is formed through a through hole penetrating the base 10 made of an insulating film so as to be electrically connected to the first conductor pattern, and the inner second conductor pattern A columnar plating layer is formed as the second connection portion 8 connected to 10a.

Then, these are aligned and overlapped as shown in FIG. 2 (c), joined in a sealing resin 7 in an inert gas atmosphere, and electrically connected via the first and second connecting portions. While achieving the connection, the element part is sealed by the sealing part 7 with high confidentiality.
Thereafter, the organic electrode shown in FIG. 1 is soldered between the first electrode 2 and the first connecting portion 9 and between the conductor pattern 2P for connecting to the second electrode and the second connecting portion 8. An electroluminescent light emitting device is formed.

  According to the above configuration, since the first and second connecting portions 9 and 8 are disposed outside the sealing portion 7, the joint portion is further from the element portion and needs to be soldered. However, heat can be prevented from adversely affecting the element portion.

  Further, if the first and second connection portions are formed over almost the entire circumference of the element portion, the electrical connection is good, and when viewed from the element portion, the periphery of the element portion is sealed. And the first and second connecting portions, a resin layer is formed inside the metal layer, and the sealing performance is further improved.

  Note that the second connection portion connected to the second electrode located on the second substrate side may be directly connected to the second electrode inside without necessarily joining on the outside. In this case, Since the bonding portion is located far from the first substrate, the influence on the first substrate is small.

  Here, the plating layer is used for the first connection portion, but cream solder may be used. Similarly, a plating layer or cream solder may be used for the second connection portion. That is, the columnar cream solder as the second connection portion 9 is formed through the through-hole penetrating the base body 10b made of an insulating film so as to conduct to the second conductor pattern, and the inner first You may make it form the columnar cream solder as the 1st connection part 8 connected to the pattern 10a.

  Here, the first and second connection portions may be columnar or may be formed in a wall shape so as to cover the element portion.

(Embodiment 2)
Next, as Embodiment 2 of the present invention, another example of a method for manufacturing the organic electroluminescence light emitting device shown in FIG. 1 will be described.
As in the first embodiment, first, as shown in FIG. 3A, an organic electroluminescent element constituting an element portion is formed on a glass substrate 1. Here, there is no supply of sealing resin, and the glass substrate 1 on which the element portion is formed remains as it is.

  Thereafter, a flexible film 10 having a conductor layer formed on both surfaces is prepared and patterned to form a desired pattern by etching to form first and second conductor patterns 10c and 10a. Here, the second conductor pattern 10a is formed on the first surface on the organic electroluminescence element side, and the first conductor pattern 10c is formed on the second surface on the outside. And the through hole H which penetrates the base | substrate 10 which consists of an insulating film so that it may conduct | electrically_connect to a 2nd conductor pattern is formed (FIG.3 (b)).

Then, these are aligned and superimposed as shown in FIG. 3C to form columnar cream solder as the first and second connecting portions 9 and 8, and to form the sealing portion 7 An epoxy resin is formed on the glass substrate 1 as a first substrate using a dispenser, bonded in an inert gas atmosphere to achieve electrical connection via the first and second connection portions, and sealed. The element portion is sealed by the stopper 7 with high confidentiality.
Thereafter, the cream solder portion is partially heated and metallized to form the organic electroluminescent light emitting device shown in FIG.

  According to this method, since the conductive resin for connection and the sealing resin constituting the sealing portion are supplied in a state where the first and second substrates are overlapped, mounting is easy, and cracks are not generated. Occurrence is also suppressed.

(Embodiment 3)
Next, as a third embodiment of the present invention, an example in which the configuration of the connection unit 9 is different will be described.
In this example, as shown in FIG. 4, the first connecting portion 9 s connected to the first electrode 2 is joined to the first and second substrates via the sealing portion 7, and then the silver paste is supplied. Thus, the second connecting portion 9S is formed.

Except for the second connection portion 9S, it is formed in the same manner as the organic electroluminescence light emitting device of the first embodiment shown in FIG.
In mounting, it is formed in the same manner as in the first or second embodiment except that the first connection portion 9S is formed last.

That is, as in the first or second embodiment, a sealing resin to be a sealing portion is formed on the ITO film pattern of the second substrate 10 and the second is formed on the ITO film pattern of the first substrate. A columnar plating layer to be the connection portion 8 is formed and joined. Alternatively, the first and second substrates are overlapped and bonded while supplying the conductive resin constituting the first connection portion and the resin constituting the sealing portion 7. In this way, as shown in FIG. 5, other regions except for the first connection portion are formed. Thereafter, a silver paste is formed on the first electrode 2 over the first conductor pattern 10c to complete the first connection portion 9S.
In this configuration, since it is possible to manufacture without forming a through hole penetrating the second substrate 10, an organic electroluminescence light emitting device can be easily manufactured.
Here, the first connection portion 9 is not limited to silver paste, and can be changed as appropriate, such as wire bonding.

(Embodiment 4)
Next, as Embodiment 4 of the present invention, an organic electroluminescence light emitting device having a structure in which the second substrate protrudes from the first substrate and the connection terminals can be easily externally connected will be described.
In this example, as shown in FIG. 6, the second substrate of the organic electroluminescence light emitting device of FIG. 4 described in the third embodiment is extended. External connection is facilitated, such as connecting to a connector with the extended portion 10T.
Other portions are formed in the same manner as the organic electroluminescence light emitting device shown in FIG.

(Embodiment 5)
Next, as a fifth embodiment of the present invention, the second substrate is protruded from the first substrate, and the extension portion 10T shown in FIG. A bump 11 protruding from the conductor pattern 10c through the film substrate 10b and protruding toward the first substrate is provided as a first connection terminal.
According to this configuration, even when the back side is a wall, both connection terminals can be formed on the front side, and external connection is surely and easily performed.

(Embodiment 6)
Next, as Embodiment 6 of the present invention, as shown in FIG. 8, the sealing portion 7 was formed so as to cover the upper surface of the second electrode 4 of the element portion so as to cover the entire element portion. The other structure is the same as that of the fifth embodiment shown in FIG.
Prior to forming the sealing portion 7 by covering it with a sealing resin made of an epoxy resin, the element portion is covered with a protective film 5 such as polyimide, and the outside thereof is covered with the sealing portion 7.
The outside is connected to the first and second conductor patterns 10c, 10a by the first and second connecting portions 9, 8.
According to this configuration, since the sealing portion covers not only the side surface of the element portion but also the upper surface, the protection can be further improved.

(Embodiment 7)
Next, as a seventh embodiment of the present invention, a moisture absorption layer 6 may be interposed as shown in FIG. In this example, in the organic electroluminescence light emitting device of the sixth embodiment shown in FIG. 8, a hygroscopic layer 6 containing barium oxide particles is formed between the protective film 5 and the sealing portion 7, and other configurations are described. Is formed in the same manner as in the sixth embodiment shown in FIG.
According to this configuration, the moisture absorption layer 6 prevents moisture from entering the element portion, and a more reliable organic electroluminescence light-emitting device can be formed.

  In the embodiment described above, the first and second connection portions may be columnar or may be formed in a wall shape so as to cover the element portion.

(Embodiment 8)
Next, as an eighth embodiment of the present invention, an example in which the first and second connection portions are formed in a wall shape and the sealing portion is also formed in a wall shape will be described. FIG. 10 is an explanatory plan view showing the first substrate 1 and the element portion and the first and second connection portions 9 and 8. FIG. 11 is a view showing the ITO pattern of the first substrate 1, FIG. 13 is a view showing the AA cross section and the BB cross section of FIG. 10, and FIG. 14 is an exploded plan view of the second substrate.
In this example, the ITO thin film constituting the first electrode 2 of the first substrate 1 is patterned on both sides of the first electrode 2 as a second electrode extraction conductor pattern 2P as shown in FIG. ing.

Then, as shown in FIGS. 10, 12, and 13, the above-described light emitting functional layer 3 is applied and formed so as to cover the first electrode 2, and an aluminum layer as a second electrode is further formed on the upper layer. The conductive pattern 2P is patterned so as to overlap the conductive pattern 2P. Here, the second electrode is connected to the second connection portion 8 via the conductor pattern 2P, and is electrically connected to the second conductor pattern 10a on the second substrate. The second substrate is composed of the first conductor pattern 10c, the film base 10b, and the second conductor pattern 10a, and the first and second connection terminals 12a and 12b are led out.
In the second substrate, as shown in exploded plan views in FIGS. 14A to 14D, a base body 10b provided with conductive patterns on both sides constituting the first and second electrode portions 10a and 10c, The first and second connection portions 9 and 8 connected to the first and second conductor patterns 10a and 10c are configured to surround the light emitting portion in a wall shape. FIG. 14A is a view of the film base 10b as viewed from the first substrate side. FIG. 14B is a view of the second substrate 10 as viewed from the side opposite to the first substrate. The other portions are solder resists so that the first and second connection terminals 12a and 12b are exposed, respectively. Covered with. FIG. 14C is a view of the second conductor pattern 10a and the first conductor pattern 10c of the second substrate 10 as viewed from the side opposite to the first substrate, and FIG. It is the figure which looked at the 2nd conductor pattern 10a of the board | substrate 10 from the 1st board | substrate side.

  Here, the light emitting functional layer 3 is interposed between the first and second electrodes so as to completely separate the first and second electrodes.

  On the other hand, the epoxy resin constituting the sealing part 7 constitutes a wall part so as to form a frame shape on the first electrode 2. In addition, there are some areas that are in direct contact with the glass substrate and all are on the ITO thin film, and there is no area that makes contact with the aluminum layer, which is the second electrode. A sealed body can be formed.

  Each member is not limited to those used in the above embodiment, but the following materials are also applicable.

(Translucent substrate)
As the light-transmitting substrate, when light emitted from the organic light emitting layer is emitted through the light-transmitting substrate, any light-transmitting substrate can be used. In addition to the above, those that are slightly colored or ground glass are also applicable. For example, translucent glass plates such as soda lime glass and non-alkali glass, plastic films or plastic plates made by any method from resins such as polyester, polyolefin, polyamide, epoxy resin, and fluorine resin may be used. Is possible.

(anode)
The first electrode as the anode is an electrode for injecting holes into the light emitting functional layer as described above, and an electrode material made of a metal, an alloy, an electrically conductive compound, or a mixture thereof having a high work function is used. It is preferable to use a material having a work function of 4 eV or more. Specific examples of such a material for the anode include metals such as gold and conductive light-transmitting materials such as CuI, ITO, SnO ₂ , and ZnO. The anode is formed by forming these electrode materials into a thin film on the surface of a light-transmitting substrate formed of a light-transmitting material such as glass or a light-transmitting resin by a method such as vacuum deposition or sputtering. It can be produced. In addition, when light emitted from the light emitting functional layer is transmitted to the outside through the anode, the light transmittance of the anode is preferably set to 70% or more. Furthermore, the sheet resistance of the anode is preferably several hundred Ω / □ or less, and particularly preferably 100 Ω / □ or less. Here, the film thickness of the anode varies depending on the material in order to control the characteristics such as light transmittance and sheet resistance of the anode as described above, but is set to 500 nm or less, preferably in the range of 100 to 200 nm. Good.

(Hall transport layer)
The hole transport material constituting the hole transport layer has the ability to transport holes, has a hole injection effect from the anode, and has an excellent hole injection effect for the organic light emitting layer or light emitting material, Moreover, the compound which prevented the movement to the hole transport layer of an electron and was excellent in the thin film formation capability can be mentioned. Specifically, phthalocyanine derivatives, naphthalocyanine derivatives, porphyrin derivatives, N, N′-bis (3-methylphenyl)-(1,1′-biphenyl) -4, 4′-diamine (TPD) and 4, 4 ′ -Aromatic diamine compounds such as bis [N- (naphthyl) -N-phenyl-amino] biphenyl (α-NPD), oxazole, oxadiazole, triazole, imidazole, imidazolone, stilbene derivative, pyrazoline derivative, tetrahydroimidazole, poly Arylalkanes, butadiene, 4, 4 ′, 4 ″ -tris (N- (3-methylphenyl) N-phenylamino) triphenylamine (m-MTDATA), and polyvinylcarbazole, polysilane, polyethylene dioxide thiophene (PEDOT) Polymer materials such as conductive polymers such as But it is lower, but the invention is not limited thereto.

(Electron transport layer)
The electron transport material constituting the electron transport layer has the ability to transport electrons, has an electron injection effect from the cathode, and has an excellent electron injection effect for the organic light emitting layer or the light emitting material, Furthermore, the compound which prevented the movement to the electron carrying layer of a hole, and was excellent in the thin film formation capability can be mentioned. Specifically, fluorene, bathophenanthroline, bathocuproine, anthraquinodimethane, diphenoquinone, oxazole, oxadiazole, triazole, imidazole, anthraquinodimethane, etc. and their compounds, metal complex compounds or nitrogen-containing five-membered ring derivatives is there. Specifically, examples of the metal complex compound include tris (8-hydroxyquinolinate) aluminum, tri (2-methyl-8-hydroxyquinolinato) aluminum, tris (8-hydroxyquinolinato) gallium, bis ( 10-hydroxybenzo [h] quinolinato) beryllium, bis (10-hydroxybenzo [h] quinolinato) zinc, bis (2-methyl-8-quinolinato) (o-cresolate) gallium, bis (2-methyl-8-quinolinato) ) (1-naphtholato) aluminum, but is not limited thereto. The nitrogen-containing five-membered ring derivative is preferably an oxazole, thiazole, oxadiazole, thiadiazole or triazole derivative. Specifically, 2,5-bis (1-phenyl) -1,3,4-oxazole, 2,5-bis (1-phenyl) -1,3,4-thiazole, 2,5-bis (1 -Phenyl) -1,3,4-oxadiazole, 2- (4′-tert-butylphenyl) -5- (4 ″ -biphenyl) 1,3,4-oxadiazole, 2,5-bis ( 1-naphthyl) -1,3,4-oxadiazole, 1,4-bis [2- (5-phenylthiadiazolyl)] benzene, 2,5-bis (1-naphthyl) -1,3,4 -Triazole, 3- (4-biphenylyl) -4-phenyl-5- (4-t-butylphenyl) -1,2,4-triazole and the like, but are not limited thereto. Polymer materials used in polymer organic electroluminescence devices are also used. It can be. For example, polyparaphenylene and its derivatives, fluorene and its derivatives.

(Organic light emitting layer)
Examples of the light emitting material or doping material that can be used for the light emitting functional layer include anthracene, naphthalene, pyrene, tetracene, coronene, perylene, phthaloperylene, naphthaloperylene, diphenylbutadiene, tetraphenylbutadiene, coumarin, oxadiazole, bisbenzoxazoline, Bisstyryl, cyclopentadiene, quinoline metal complex, tris (8-hydroxyquinolinato) aluminum complex, tris (4-methyl-8-quinolinato) aluminum complex, tris (5-phenyl-8-quinolinato) aluminum complex, aminoquinoline metal Complexes, benzoquinoline metal complexes, tri- (p-terphenyl-4-yl) amine, 1-aryl-2,5-di (2-thienyl) pyrrole derivatives, pyran, quinacridone, rubrene, disty Examples include, but are not limited to, rubenzene derivatives, distilarylene derivatives, and various fluorescent dyes. It is also preferable to include 80 to 99.9 parts by weight of a light emitting material selected from these compounds and 0.1 to 20 parts by weight of a doping material. The organic light emitting layer 3 has a thickness of 0.5 to 500 nm, more preferably 0.5 to 200 nm.

(cathode)
On the other hand, the cathode as the second electrode for injecting electrons into the light emitting functional layer is preferably an electrode material made of a metal, an alloy, an electrically conductive compound, and a mixture thereof having a small work function. Is preferably 5 eV or less. Examples of electrode materials for such cathodes include sodium, sodium-potassium alloy, lithium, magnesium, aluminum, magnesium-silver mixture, magnesium-indium mixture, aluminum-lithium alloy, Al / Al ₂ O ₃ mixture, Al / LiF mixture. And so on. The cathode 1 can be produced by, for example, forming these electrode materials into a thin film by a method such as vacuum deposition or sputtering. In addition, when the light emitted from the light emitting functional layer is transmitted to the outside through the cathode, the light transmittance of the cathode is preferably set to 10% or more. This applies not only to the cathode but also to the anode, and the film thickness of the electrode in this case varies depending on the material in order to control the characteristics such as the light transmittance of the electrode as described above, but is usually 500 nm or less. The thickness is preferably in the range of 100 to 200 nm.

(Sealing part)
As the material of the insulating sealant constituting the sealing part, a photo-curing adhesive resin, a thermosetting adhesive resin, a two-component curable adhesive resin made of epoxy resin, acrylic resin, silicone resin, etc. Alternatively, a thermoplastic adhesive resin made of an acid-modified product such as polyethylene or polypropylene can be used. In particular, it is preferable to use an epoxy thermosetting adhesive resin that is excellent in moisture resistance and water resistance and has little shrinkage during curing.
As a method for forming the adhesive layer, a coating method such as roll coating, spin coating, screen printing, spray coating, or the like can be used depending on the material. Further, it is desirable to mix a desiccant such as barium oxide or calcium oxide in order to remove moisture contained in the adhesive layer.

(Second substrate)
A conductor pattern is formed on both sides, and the base material is an insulating material such as an insulating film, such as ceramic, glass, plastic (vinyl chloride resin, polystyrene, ABS, polyethylene, polypropylene, nylon, acrylic resin, fluorine resin, polycarbonate, Methylpentene resin, polyurethane, phenol resin, melamine resin, epoxy resin, rubber) and the like can be used. Copper, aluminum, silver, and gold can be used for the conductive pattern. The shape may be plate, foil, or rod.

(First and second connection parts)
A conductive material, such as tin-bismuth alloy plating, tin-silver alloy plating, tin plating, gold plating, silver plating, palladium plating, electroless nickel plating, high-purity nickel plating, copper plating, or the like can be used.

  As described above, the organic electroluminescence light-emitting device of the present invention can be thinned, can be easily attached, and can have a long lifetime. Therefore, a flat panel display, a light source for illumination, and a liquid crystal display It can be used for a backlight.

It is sectional drawing which shows the organic electroluminescent light-emitting device of Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the organic electroluminescent light-emitting device of Embodiment 1 of this invention. It is sectional drawing which shows the manufacturing process of the organic electroluminescent light-emitting device of Embodiment 2 of this invention. It is sectional drawing which shows the organic electroluminescent light-emitting device of Embodiment 3 of this invention. It is sectional drawing which shows the manufacturing process of the organic electroluminescent light-emitting device of Embodiment 3 of this invention. It is sectional drawing which shows the organic electroluminescent light-emitting device of Embodiment 4 of this invention. It is sectional drawing which shows the organic electroluminescent light-emitting device of Embodiment 5 of this invention. It is sectional drawing which shows the organic electroluminescent light-emitting device of Embodiment 6 of this invention. It is sectional drawing which shows the organic electroluminescent light-emitting device of Embodiment 7 of this invention. It is a top view which shows the 1st board | substrate (state which mounted the element part) of the organic electroluminescent light-emitting device of Embodiment 8 of this invention. It is a top view which shows the 1st board | substrate of the organic electroluminescent light-emitting device of Embodiment 8 of this invention. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is an exploded top view which shows the 2nd board | substrate of the organic electroluminescent light-emitting device of Embodiment 8 of this invention.

Explanation of symbols

1 First substrate (translucent substrate)
2 1st electrode 3 light emission functional layer 4 2nd electrode 5 protective layer 6 moisture absorption layer 7 insulating sealing layer 8 1st connection part 9 2nd connection part 10 2nd board | substrate 10a 2nd board | substrate electrode part (Second conductor pattern)
10b Insulating part (film substrate) of second substrate
10c Electrode part of the second substrate (first conductor pattern)
11 Bump 12 Electrode terminal H Through hole

Claims (8)

A first substrate having translucency;
A device comprising a first electrode formed on the surface of the first substrate and a light emitting functional layer including an organic layer interposed between a second electrode facing the first electrode And
A second substrate disposed opposite to the first substrate so as to sandwich the element portion, and provided with first and second electrode terminals for external connection;
A sealing portion formed between the first substrate and the second substrate so as to surround the element portion;
A first connecting portion for connecting the first electrode to the first electrode terminal; and a second connecting portion for connecting the second electrode to the second electrode terminal;
The organic electroluminescence light-emitting device, wherein the first connection portion is disposed on the outer side in the plane direction than the sealing portion. The organic electroluminescence light-emitting device according to claim 1,
The organic electroluminescence light-emitting device, wherein the second connection portion is disposed on the outer side in the planar direction from the sealing portion. The organic electroluminescence light-emitting device according to claim 1 or 2,
The first connecting portion is disposed on the second substrate and abuts on a first conductor pattern connected to the first connecting terminal, and the first connecting terminal is connected to the first substrate. An organic electroluminescence light emitting device protruding from the end face. The organic electroluminescence light-emitting device according to claim 1,
One end of the second connection portion is connected to the conductor pattern in the same layer as the first electrode on the first substrate, the other end is disposed on the second substrate, and the second connection portion An organic electroluminescence light emitting device in contact with a second conductor pattern connected to a connection terminal. The organic electroluminescence light-emitting device according to claim 1,
An organic electroluminescence light emitting device in which a first connection portion or a second connection portion is provided so as to penetrate the second substrate. The organic electroluminescence light-emitting device according to claim 1,
An organic electroluminescence light-emitting device in which the first connection portion or the second connection portion is formed of cream solder having a melting point of 120 ° C. or lower. An organic electroluminescence light-emitting device according to any one of claims 1 to 6,
The second substrate is an organic electroluminescence light-emitting device, which is a flexible substrate having conductor patterns formed on both sides. An organic electroluminescence light-emitting device according to any one of claims 1 to 7,
An organic electroluminescence light-emitting device in which an inner region surrounded by the first substrate, the second substrate, and a sealing portion is filled with an insulating material that is inactive with respect to the constituent material of the element portion.

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