KR20150071374A - Organic light emitting diode display device - Google Patents

Abstract

The present invention relates to an organic light emitting diode display device which has power supply wiring, supplies power voltage to an upper end of the substrate in which a printed circuit substrate is not formed, and can prevent voltage drop. The organic light emitting diode display device comprises: the substrate in which an organic light emitting cell is formed on a display area; an encapsulation layer formed to cover the organic light emitting cell; a power supply source formed on the encapsulation layer; the printed circuit substrate formed on a lower end of the substrate to correspond to a non-display area of the substrate, connected with the power supply source, and providing power voltage to the organic light emitting cell; and the power supply wiring formed on the encapsulation layer, and supplying power voltage of the power supply source or the printed circuit substrate to the upper end of the substrate.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED) display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an organic light emitting diode display device, and more particularly, to an organic light emitting diode display device capable of preventing power supply voltage drop.

The image display device that implements various information on the screen is a key technology in the era of information and communication, and it is progressing in the direction of being thinner, lighter, more portable, but higher performance. An organic light emitting diode (OLED) display device that controls the amount of emitted light of an organic light emitting layer using a flat panel display device has recently been attracting attention as a flexible display capable of bending due to space and convenience.

The organic light emitting diode display device includes a substrate on which a plurality of subpixels are defined on a substrate, a substrate on which a thin film transistor (TFT) is formed for each subpixel, an organic light emitting cell connected to each thin film transistor, Encapsulation layer. The organic light emitting cell includes a first electrode, a second electrode, and a light emitting layer formed between the first electrode and the second electrode. Electrons and holes are injected and transferred into the light emitting layer by applying an electric field to the first electrode and the second electrode, and electrons and holes paired in the light emitting layer emit light while falling from the excited state to the ground state.

The organic light emitting diode display device is supplied with driving voltage from an external power supply source. A power supply source is connected to the printed circuit board, and a power supply voltage is supplied to each subpixel through the printed circuit board.

1A and 1B are plan views of a general organic light emitting diode display device.

As shown in FIG. 1A, a printed circuit board 11 is provided only on one side of a substrate 10, and is generally provided at a lower end of the substrate 10. However, as the organic light emitting diode display device becomes larger, the sub-pixels spaced apart from the printed circuit board 11 receiving the power supply voltage (VDD) from a power supply source (not shown) A reduced power supply voltage VDD is supplied.

That is, a power supply voltage drop in which the same power supply voltage VDD is not supplied to each subpixel occurs, the luminance uniformity of the organic light emitting diode display device is lowered, and the display quality is degraded. Also, in the high-resolution organic light emitting diode display device, the width of the wiring is narrow, and the resistance of the wiring becomes large, so that a power supply voltage drop occurs.

In order to prevent the above-described problems, a printed circuit board 11 may be provided on the top of the substrate 10 as shown in FIG. However, in this case, since the number of the printed circuit boards 11 is increased, the manufacturing cost is increased and the width of the bezel of the display device is increased.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an organic light emitting diode (OLED) display device capable of preventing power supply voltage drop by providing a power supply wiring extending to an upper end of a substrate.

According to an aspect of the present invention, there is provided an organic light emitting diode display comprising: a substrate having an organic light emitting cell formed on a display region; An encapsulation layer formed to cover the organic light emitting cell; A power supply source provided on the encapsulation layer; A printed circuit board provided at a lower end of the substrate to correspond to a non-display area of the substrate and connected to the power supply source to supply a power voltage to the organic light emitting cells; And a power supply wiring formed on the encapsulation layer and supplying the power supply source or the power supply voltage of the printed circuit board to the top of the substrate.

And driving power is applied to the organic light emitting cells at the top of the substrate.

The encapsulation layer may be formed of a metal material or a non-metal material, or may be formed of a laminate of a metal material and a non-metal material.

When the encapsulation layer is formed of the metal material, an insulating material is formed on the encapsulation layer, and then the power supply wiring is formed on the insulating material.

When the encapsulation layer is formed of the non-metallic material, the power supply wiring is formed directly on the encapsulation layer.

When the encapsulation layer is formed by stacking the metal material and the non-metal material, the power supply wiring is formed by patterning the metal material of the encapsulation layer.

One side of the power supply wiring is connected to a first connection part of the power supply source, and the other side of the power supply wiring is connected to a second connection part formed on the substrate.

And the other side of the power supply wiring and the second connection portion are connected via a film-on glass.

One side of the power supply wiring is connected to a third connection part of the printed circuit board, and the other side of the power supply wiring is connected to a second connection part formed on the substrate.

A substrate on which an organic light emitting cell is formed in a display region; An encapsulation layer formed to cover the organic light emitting cell; A power supply source provided on the encapsulation layer; A printed circuit board provided at a lower end of the substrate to correspond to a non-display area of the substrate and connected to the power supply source to supply a power voltage to the organic light emitting cells; And a power supply line formed on the encapsulation layer and connected to the power supply source and the printed circuit board to supply the power supply voltage to an upper end of the substrate.

The organic light emitting diode display device of the present invention includes a power supply line connected to an upper end of a substrate on which a printed circuit board is not provided. Therefore, since the power supply voltage is applied from both sides of the organic light emitting cell, the voltage drop can be prevented even if a single printed circuit board is provided. Thus, the image quality of the display device is improved.

1A and 1B are plan views of a general organic light emitting diode display device.
2A is a plan view of an organic light emitting diode display device according to a first embodiment of the present invention.
2B is a cross-sectional view taken along line I-I 'of FIG. 2A.
FIG. 2C is a cross-sectional view illustrating a structure in which the power supply source and the encapsulation layer of FIG. 2A are spaced apart. FIG.
3A and 3B are plan views showing another form of the power supply wiring of the present invention.
4A is a plan view of an organic light emitting diode display device according to a second embodiment of the present invention.
4B is a cross-sectional view taken along line I-I 'of FIG. 4A.
4C is a sectional view of II-II 'of FIG. 4A.
5 is a plan view of an organic light emitting diode display device according to a third embodiment of the present invention.

Hereinafter, the organic light emitting diode display device of the present invention will be described in detail with reference to the accompanying drawings.

2A is a plan view of an organic light emitting diode display device according to a first embodiment of the present invention. FIG. 2B is a cross-sectional view taken along the line I-I 'of FIG. 2A, and FIG. 2C is a cross-sectional view illustrating a structure in which the power supply source and the encapsulation layer of FIG. 3A and 3B are plan views showing another form of the power supply wiring of the present invention.

2A, an organic light emitting diode display device according to a first embodiment of the present invention includes an encapsulation layer 130 formed to cover an organic light emitting cell formed on a substrate 100, At least one power supply wiring 140 is formed.

More specifically, an organic light emitting cell is formed in a display region of the substrate 100, and a plurality of driving integrated circuits 120a (not shown) connected to the data wirings and the gate wirings to apply a data signal and a scan signal to the non- . The driving integrated circuit 120a drives the organic light emitting cells in response to a control signal supplied from the printed circuit board 110. [ Generally, the organic light emitting cells and the printed circuit board 110 are connected through a tape carrier package (TCP) 120b.

The printed circuit board 110 is connected to a power supply source 160 and receives a control signal and a power supply voltage from the power supply source 160. A control signal and a power source voltage are applied to the organic light emitting cells through a first pad unit (not shown). The power supply source 160 is provided on the encapsulation layer 130 formed to cover the organic light emitting cells. Although not shown, the power supply source 160 includes a timing controller (T / C) and a power supply unit to transmit a control signal and a power supply voltage to the printed circuit board 110.

However, as described above, a general organic light emitting diode display device has a printed circuit board only at the lower end of the substrate. Accordingly, as the organic light emitting diode display device is enlarged, a power supply voltage that is lower than the sub-pixels at the lower end of the substrate adjacent to the printed circuit board is supplied to sub-pixels at the upper end of the substrate remote from the printed circuit board. That is, in a general organic light emitting diode display device, a power supply voltage drop occurs in which the same power voltage is not supplied to each sub-pixel, luminance uniformity of the organic light emitting diode display is lowered, and display quality is lowered.

Further, in order to prevent the above-described problems, the printed circuit board may be provided at the upper and lower ends of the board, but in this case, the number of printed circuit boards is increased. As a result, the manufacturing cost is increased, the thickness of the display device is increased, and the width of the bezel of the display device is increased.

Therefore, the organic light emitting diode display of the present invention is capable of supplying power to the organic light emitting cells even at the top of the substrate 100 on which the printed circuit board 110 is not formed, A power supply wiring 140 connected to the source 160 is formed.

Specifically, as shown in FIG. 2B, the power supply wiring 140 is patterned on the encapsulation layer 130 with a metal material. The power supply wiring 140 is connected to the power supply source 160 to receive the power supply voltage from the power supply source 160. At this time, the power supply source 160 has a first connection portion 160a in a region corresponding to the power supply wiring 140, and the power supply source 160 and the power supply wiring 140 are connected.

The other side of the power supply wiring 140 is connected to the second connection part 100a formed on the substrate 100 so that the power supply voltage delivered from the power supply source 160 is transferred to the organic light emitting cells. At this time, the other side of the second connection part 100a and the power supply wiring 140 is connected through a connection part 150 such as a film on glass (FOG) or the like. Although not shown, the second connection part 100a is connected to the second pad part of the organic light emitting cell.

That is, the first pad unit of the organic light emitting diode display device of the present invention is formed at the lower end of the substrate 100 having the printed circuit board 110, and the second pad unit is formed of the substrate 100 having no printed circuit board 110 100). Therefore, the power supply voltage is applied from both sides of the organic light emitting cell through the first and second pad portions.

The power supply source 160 is formed in close contact with the encapsulation layer 130 so that the power supply source 160 is in contact with the encapsulation layer 130 and the power supply wiring 140 is in contact with the encapsulation layer 130, 1 connection portion 160a.

2C, the power supply source 160 may be spaced apart from the encapsulation layer 130 by a predetermined distance. In this case, the first connection part 160a of the encapsulation layer 130 and the power supply source 160 A connection pattern 200a is further formed in a region where the supply wiring 140 corresponds. A gap holding portion 200b may be further formed between the encapsulation layer 130 and the power supply source 160 to maintain a gap between the encapsulation layer 130 and the power supply source 160. [ have.

Although two power supply lines 140 are shown in the drawing, the power supply lines 140 may be formed as shown in FIGS. 3A and 3B, and the number and pattern of the power supply lines 140 are not limited thereto.

In particular, the encapsulation layer 130 may be formed of a metal material or a non-metal material, or may be formed of a laminate of a metal material and a non-metal material. For example, when the encapsulation layer 130 is formed of a metal material, an insulating material is provided between the power supply wiring 140 and the encapsulation layer 130. When the encapsulation layer 130 is formed of a non-metallic material, the power supply wiring 140 is formed directly on the encapsulation layer 130. In addition, when the encapsulation layer 130 has a structure in which a metal material and a non-metal material are stacked, the power supply wiring 140 may be formed by patterning the metal material of the encapsulation layer 130. In this case, the encapsulation layer 130 and the power supply wiring 140 are formed integrally.

4A is a plan view of an organic light emitting diode display device according to a second embodiment of the present invention. 4B is a cross-sectional view taken along the line I-I 'of FIG. 4A, and FIG. 4C is a cross-sectional view taken along the line II-II' of FIG. 4A.

4A, the power supply wiring 140 of the organic light emitting diode display device according to the second embodiment of the present invention is connected to the printed circuit board 110 provided at the lower end of the substrate 100. That is, one side of the power supply wiring 140 is connected to the printed circuit board 110, and the other side of the power supply wiring 140 is connected to the second side of the substrate 100 on which the printed circuit board 110 is not provided. And connected to the pad portion.

4B, the printed circuit board 110 includes a third connecting portion 110a in a region corresponding to the power supply wiring 140, and is electrically connected to the printed circuit board 110 through the third connecting portion 110a. And the power supply wiring 140 are connected to each other. 4C, the other side of the power supply wiring 140 is connected to the second connection part 100a formed on the substrate 100, and the power supply voltage transmitted from the power supply source 160 is transmitted to the organic light emitting cells do. The other side of the second connection part 100a and the power supply wiring 140 is connected via a connection part 150 such as a film on glass (FOG) or the like.

5 is a plan view of an organic light emitting diode display device according to a third embodiment of the present invention.

5, the power supply wiring 140 of the organic light emitting diode display device of the third embodiment of the present invention is connected to the printed circuit board 110 and the power supply source 160. As shown in FIG. That is, the power supply voltage supplied to the upper end of the substrate 100 on which the printed circuit board 110 is not formed is supplied through the printed circuit board 110 and the power supply source 160. At this time, the method of connecting the power supply wiring 140 to the other side of the printed circuit board 110, the power supply source 160, and the substrate 100 is the same as in the first and second embodiments.

That is, the organic light emitting diode display device of the present invention is connected to the printed circuit board 100 or the power supply source 160, or the power supply wiring 140 connected to the printed circuit board 100 and the power supply source 160 . Accordingly, the power source voltage is applied through the printed circuit board 100 at the lower end of the organic light emitting cell, and the power source voltage is applied through the power supply wiring 140 at the upper end, so that the power source voltage is applied from both sides of the organic light emitting cell . Therefore, the voltage drop can be prevented without providing one printed circuit board 110, and the image quality of the display device is improved. Further, since the power supply wiring 140 is connected to the second connection portion 100a of the substrate 100 through a connection portion such as a film on glass, connection can be easily performed without a contact hole.

In particular, the power supply wiring 140 may be formed on the encapsulation layer 130 as described above, or may be formed on the back cover surrounding the back surface of the organic light emitting diode display. When the power supply wiring 140 is formed on the back cover, the power supply wiring 140 is formed on the inner surface of the back cover surrounding the organic light emitting diode display.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Will be apparent to those of ordinary skill in the art.

100: substrate 100a: second connection portion
110: printed circuit board 110a: third connecting portion
120a: drive integrated circuit 120b: tape carrier package
130: encapsulation layer 140: power supply wiring
150: connection 160: power supply source
160a: first connection part 200a: connection pattern
200b:

Claims (10)

A substrate on which an organic light emitting cell is formed in a display region;
An encapsulation layer formed to cover the organic light emitting cell;
A power supply source provided on the encapsulation layer;
A printed circuit board provided at a lower end of the substrate to correspond to a non-display area of the substrate and connected to the power supply source to supply a power voltage to the organic light emitting cells; And
And a power supply wiring formed on the encapsulation layer and supplying the power supply source or the power supply voltage of the printed circuit board to an upper end of the substrate. The method according to claim 1,
And driving power is applied to the organic light emitting cell at an upper end of the substrate. The method according to claim 1,
Wherein the encapsulation layer is formed of a metal material or a non-metallic material, or a structure in which a metallic material and a non-metallic material are laminated. The method of claim 3,
Wherein when the encapsulation layer is formed of the metal material, an insulating material is formed on the encapsulation layer, and then the power supply wiring is formed on the insulating material. The method of claim 3,
Wherein when the encapsulation layer is formed of the non-metallic material, the power supply wiring is formed directly on the encapsulation layer. The method of claim 3,
Wherein the power supply wiring is formed by patterning the metal material of the encapsulation layer when the encapsulation layer is formed of a lamination structure of the metal material and the non-metal material. The method according to claim 1,
One side of the power supply wiring is connected to a first connection of the power supply source,
And the other side of the power supply wiring is connected to a second connection portion formed on the substrate. 8. The method of claim 7,
And the other side of the power supply wiring and the second connection portion are connected to each other through a film on glass. The method according to claim 1,
Wherein one side of the power supply wiring is connected to a third connecting portion of the printed circuit board,
And the other side of the power supply wiring is connected to a second connection portion formed on the substrate. A substrate on which an organic light emitting cell is formed in a display region;
An encapsulation layer formed to cover the organic light emitting cell;
A power supply source provided on the encapsulation layer;
A printed circuit board provided at a lower end of the substrate to correspond to a non-display area of the substrate and connected to the power supply source to supply a power voltage to the organic light emitting cells; And
And a power supply wiring formed on the encapsulation layer and connected to the power supply source and the printed circuit board to supply the power supply voltage to an upper end of the substrate.

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