CN107819082A - A kind of OLED encapsulating structures and method for packing - Google Patents
A kind of OLED encapsulating structures and method for packing Download PDFInfo
- Publication number
- CN107819082A CN107819082A CN201711113455.4A CN201711113455A CN107819082A CN 107819082 A CN107819082 A CN 107819082A CN 201711113455 A CN201711113455 A CN 201711113455A CN 107819082 A CN107819082 A CN 107819082A
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- oled
- lower glass
- side closed
- encapsulating structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000012856 packing Methods 0.000 title claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 99
- 239000000758 substrate Substances 0.000 claims abstract description 90
- 238000009434 installation Methods 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 30
- 239000000377 silicon dioxide Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- 238000010276 construction Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention proposes a kind of OLED encapsulating structures and method for packing,Including lower glass substrate,OLED chip electrodes are provided among the upper surface of the lower glass substrate,The top of OLED chip electrodes is provided with top glass substrate,And connection ring seat is provided with the top surface edge of lower glass substrate,The lower surface side edge of the top glass substrate is provided with clamping ring,Clamping ring and connection ring seat are corresponding up and down,The upper surface side edge of the lower glass substrate and the lower surface side edge of top glass substrate are equipped with side closed plate,It can be closed for the first time by clamping ring and connection ring seat,So that closing is more rigorous,Can thoroughly it be closed by the connection of side closed-loop and side closed plate,So that closing is more thorough,So that OLED service lifes are longer,The OLED encapsulating structures and method for packing,It is simple in construction,It is easy for installation,Step is simple,Not only so that closing is more rigorous,Sealing,And encapsulation is more convenient.
Description
Technical field
The present invention relates to OLED encapsulation technologies field, specially a kind of OLED encapsulating structures and method for packing.
Background technology
Luminescent device is that this studied to obtain considerable content in recent years, and display of organic electroluminescence OLED is as a kind of
Emerging flat-panel monitor, especially attract the concern of people, because they have application and dived in many electroluminescent devices
In application value, it is known that traditional OLED displays have luminous good color contrast, active, wide viewing angle, energy slim
Change, fast response time and the advantages that low energy consumption, but traditional OLED displays, be particularly at electrode therein and organic
Layer, it is easy to make hydraulic performance decline because leaking in surrounding environment and being acted on into the oxygen in OLED displays and moisture, serious shadow
OLED service life is rung, if the electrode in OLED displays and organic layer opened with the isolation of surrounding environment air hermetic,
Then the life-span of OLED displays will dramatically increase, but this process for sealing that hermetically sealing is carried out for active display
Desirable is extremely difficult to, has a strong impact on OLED life-span.
The content of the invention
The technical problem to be solved in the present invention is to overcome the defects of existing, there is provided a kind of OLED encapsulating structures and encapsulation side
Method, simple in construction, easy for installation, step is simple, not only make it that closing is more rigorous, sealing, and encapsulate it is more convenient, can be with
Effectively solve the problems, such as in background technology.
To achieve the above object, the present invention proposes：A kind of OLED encapsulating structures, including lower glass substrate, the lower glass
OLED chip electrodes are provided among the upper surface of substrate, the top of OLED chip electrodes is provided with top glass substrate, and lower glass
Connection ring seat is provided with the top surface edge of glass substrate, the lower surface side edge of the top glass substrate is provided with clamping ring, clamping
Ring and connection ring seat are corresponding up and down, and the upper surface side edge of the lower glass substrate and the lower surface side edge of top glass substrate are equal
Provided with side closed plate, side closed plate is positioned at connection ring seat and the outside of clamping ring.
As a preferred technical solution of the present invention：Side closed plate in the lower glass substrate and top glass substrate
Correspond to up and down, the outside of the side closed plate is provided with side closed-loop.
As a preferred technical solution of the present invention：The section of the side closed plate is L-type structure, is closed with side
Side closed-loop corresponding to plate is concave character type structure.
As a preferred technical solution of the present invention：Done between the lower glass substrate and top glass substrate provided with silica gel
Dry layer, silica dehydrator layer are located at the inner side of side closed plate.
As a preferred technical solution of the present invention：The section of the connection ring seat be U-shape structure, the clamping ring and
The groove for connecting ring seat is corresponding.
As a preferred technical solution of the present invention：The lower glass substrate and top glass substrate are clear glass,
And lower glass substrate and top glass substrate correspond to up and down.
The present invention also provides a kind of method for packing of OLED encapsulating structures：Comprise the following steps：
S1）OLED chip electrodes are installed：OLED chip electrodes are installed to the upper surface of lower glass substrate first；
S2）Silica dehydrator layer is fixed：Then the upper surface of lower glass substrate is fixed on by silica dehydrator layer, makes silica dehydrator layer
It is fixed on the outside of connection ring seat；
S3）Top glass substrate is fixed：The groove of the connection ring seat of lower glass substrate is subjected to brush coating, then again by top glass substrate
Clamping ring outside carry out brush coating, then by the connection ring seat of the clamping ring of top glass substrate and lower glass substrate fasten,
S4）Close ring seal in side：Brush coating will be carried out on the outside of the structure side combined, then side closed-loop is fixed to combination
On the outside of good structure, lower glass substrate is connected with two side closed plates of top glass substrate with this, installed with this.
As a preferred technical solution of the present invention：First to lower glass base before installation OLED chip electrodes installation
The upper surface of plate is cleared up, and during installation, the lower surface of OLED chip electrodes is clung to the upper surface of lower glass substrate.
As a preferred technical solution of the present invention：In the clamping ring to top glass substrate and the connection of lower glass substrate
Cleared up before ring seat brush coating, and it is dried by hot blast after installing.
As a preferred technical solution of the present invention：The front and rear side and side to combining structure of closed-loop installation in side
Cleared up in the groove of banding closed loop, install and drying is continued to combining structure by hot gas after terminating
Compared with prior art, the beneficial effects of the invention are as follows：Connection ring seat and clamping ring are provided with this OLED encapsulating structures,
It can be closed for the first time by clamping ring and connection ring seat so that closing is more rigorous, is sealed by side closed-loop and side
The connection of closing plate can be closed thoroughly so that closing it is more thorough so that OLED service lifes are longer, the OLED encapsulating structures and
Method for packing, simple in construction, easy for installation, step is simple, not only make it that closing is more rigorous, seals, and encapsulate more square
Just.
Brief description of the drawings
Fig. 1 is a kind of structure chart of OLED encapsulating structures of the present invention；
Fig. 2 is a kind of structure chart in OLED encapsulating structures section of the present invention；
Fig. 3 is the structure chart amplified at a kind of OLED encapsulating structures A of the present invention.
In figure：1 top glass substrate, 2 side closed plates, 3 lower glass substrates, 4 OLED chip electrodes, 5 connection ring seats, 6
Clamping ring, 7 side closed-loops, 8 silica dehydrator layers.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Fig. 1-3 are referred to, the present invention provides following technical scheme：A kind of OLED encapsulating structures, including lower glass substrate 3,
OLED chip electrodes 4 are provided among the upper surface of lower glass substrate 3, the top of OLED chip electrodes 4 is provided with top glass substrate
1, lower glass substrate 3 and top glass substrate 1 are clear glass, and lower glass substrate 3 and top glass substrate correspond to about 1,
And connection ring seat 5 is provided with the top surface edge of lower glass substrate 3, the lower surface side edge of top glass substrate 1 is provided with clamping
Ring 6, clamping ring 6 with connection ring seat about 5 it is corresponding, by clamping ring 6 and connection ring seat 5 can be closed for the first time so that envelope
Close more rigorous, the upper surface side edge of lower glass substrate 3 and the lower surface side edge of top glass substrate 1 are equipped with side closing
Plate 2, side of the side closed plate 2 in connection ring seat 5 and the outside of clamping ring 6, lower glass substrate 3 and top glass substrate 1
Closed plate corresponds to about 2, and the outside of side closed plate 2 is provided with side closed-loop 7, and the section of side closed plate 2 is L-type structure,
Side corresponding with side closed plate 2 closed-loop 7 is concave character type structure, and silicon is provided between lower glass substrate 3 and top glass substrate 1
Glue drying layer 8, can thoroughly it be closed by the connection of side closed-loop 7 and side closed plate 2 so that closing is more thorough, makes
OLED service lifes it is longer, silica dehydrator layer 8 is located at the inner side of side closed plate 2, can be to air by silica dehydrator layer 8
In water filtered, OLED chip electrodes 4 are protected with this so that the service life of OLED chip electrodes 4 is longer,
The section of connection ring seat 5 is U-shape structure, and clamping ring 6 is corresponding with the groove for connecting ring seat 5, passes through clamping ring 6 and connection ring seat
5 groove is corresponding so that clamping ring 6 connects even closer, the OLED encapsulating structures and method for packing with being connected ring seat 5, knot
Structure is simple, easy for installation, and step is simple, not only make it that closing is more rigorous, seals, and encapsulate and more facilitate.
A kind of method for packing of OLED encapsulating structures, comprises the following steps：
S1OLED chip electrodes are installed：OLED chip electrodes 4 are installed to the upper surface of lower glass substrate 3 first, installed
OLED chip electrodes 4 are cleared up the upper surface of lower glass substrate 3 first before installing so that the upper surface of lower glass substrate 3
It is more convenient, during installation, the lower surface of OLED chip electrodes 4 is clung to the upper surface of lower glass substrate 3；
S2 silica dehydrator layers are fixed：Then the upper surface of lower glass substrate 3 is fixed on by silica dehydrator layer 8, makes silica dehydrator
Layer 8 is fixed on the outside of connection ring seat 5；
S3 top glass substrates are fixed：The groove of the connection ring seat 5 of lower glass substrate 3 is subjected to brush coating, then again by upper glass base
The outside of the clamping ring 6 of plate 1 carries out brush coating, then the clamping ring 6 of top glass substrate 1 and the connection ring seat 5 of lower glass substrate 3 are detained
Close, cleared up before the clamping ring 6 to top glass substrate 1 and the brush coating of connection ring seat 5 of lower glass substrate 3, and after installation
It is dried by hot blast；
Close ring seal in S4 sides：Brush coating will be carried out on the outside of the structure side combined, then side closed-loop 7 is fixed to combination
On the outside of good structure, two side closed plates 2 of lower glass substrate 3 and top glass substrate 1 are connected with this, pacified with this
Dress, front and rear to being cleared up in the side of combining structure and the groove of side closed-loop 7, installation knot is installed in side closed-loop 7
Drying is continued to combining structure by hot gas after beam.
Benefit of the present invention：It can be closed for the first time by clamping ring 6 and connection ring seat 5 so that closing is more rigorous, leads to
Crossing the connection of side closed-loop 7 and side closed plate 2 can thoroughly close so that closing is more thorough so that OLED uses the longevity
Order longer, the OLED encapsulating structures and method for packing, simple in construction, easy for installation, step is simple, not only make it that closing is tighter
Sincerely, seal, and encapsulate and more facilitate.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of OLED encapsulating structures, including lower glass substrate（3）, it is characterised in that：The lower glass substrate（3）Upper surface
Centre is provided with OLED chip electrodes（4）, OLED chip electrodes（4）Top be provided with top glass substrate（1）, and lower glass base
Plate（3）Top surface edge at be provided with connection ring seat（5）, the top glass substrate（1）Lower surface side edge be provided with clamping ring
（6）, clamping ring（6）With being connected ring seat（5）Correspond to up and down, the lower glass substrate（3）Upper surface side edge and upper glass base
Plate（1）Lower surface side edge be equipped with side closed plate（2）, side closed plate（2）Positioned at connection ring seat（5）With clamping ring
（6）Outside.
A kind of 2. OLED encapsulating structures according to claim 1, it is characterised in that：The lower glass substrate（3）With upper glass
Substrate（1）On side closed plate（2）Correspond to up and down, the side closed plate（2）Outside be provided with side closed-loop（7）.
A kind of 3. OLED encapsulating structures according to claim 2, it is characterised in that：The side closed plate（2）Section be L
Type structure, with side closed plate（2）Corresponding side closed-loop（7）For concave character type structure.
A kind of 4. OLED encapsulating structures according to claim 1, it is characterised in that：The lower glass substrate（3）With upper glass
Substrate（1）Between be provided with silica dehydrator layer（8）, silica dehydrator layer（8）Positioned at side closed plate（2）Inner side.
A kind of 5. OLED encapsulating structures according to claim 1, it is characterised in that：The connection ring seat（5）Section to be U-shaped
Structure, the clamping ring（6）With being connected ring seat（5）Groove it is corresponding.
A kind of 6. OLED encapsulating structures according to claim 1, it is characterised in that：The lower glass substrate（3）With upper glass
Substrate（1）It is clear glass, and lower glass substrate（3）And top glass substrate（1）Correspond to up and down.
A kind of 7. method for packing of OLED encapsulating structures, it is characterised in that：Comprise the following steps：
S1）OLED chip electrodes are installed：First by OLED chip electrodes（4）It is installed to lower glass substrate（3）Upper surface；
S2）Silica dehydrator layer is fixed：Then silica dehydrator layer is passed through（8）It is fixed on lower glass substrate（3）Upper surface, make silica gel
Drying layer（8）It is fixed on connection ring seat（5）Outside；
S3）Top glass substrate is fixed：By lower glass substrate（3）Connection ring seat（5）Groove carry out brush coating, then again by upper glass
Glass substrate（1）Clamping ring（6）Outside carry out brush coating, then by top glass substrate（1）Clamping ring（6）With lower glass substrate
（3）Connection ring seat（5）Fasten；
S4）Close ring seal in side：It will carry out brush coating on the outside of the structure side combined, then by side closed-loop（7）It is fixed to
On the outside of the structure that combines, with this by lower glass substrate（3）And top glass substrate（1）Two side closed plates（2）Connection, with
This is installed.
A kind of 8. method for packing of OLED encapsulating structures according to claim 7, it is characterised in that：In installation OLED chips
Electrode（4）First to lower glass substrate before installation（3）Upper surface cleared up, during installation, make OLED chip electrodes（4）'s
Lower surface clings to lower glass substrate（3）Upper surface.
A kind of 9. method for packing of OLED encapsulating structures according to claim 7, it is characterised in that：To top glass substrate
（1）Clamping ring（6）And lower glass substrate（3）Connection ring seat（5）Cleared up before brush coating, and pass through hot blast pair after installing
It is dried.
A kind of 10. method for packing of OLED encapsulating structures according to claim 7, it is characterised in that：In side closed-loop（7）
The front and rear side and side closed-loop to combining structure of installation（7）Groove in cleared up, installation terminate after by hot gas pair
Combining structure continues drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711113455.4A CN107819082B (en) | 2017-11-13 | 2017-11-13 | OLED packaging structure and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711113455.4A CN107819082B (en) | 2017-11-13 | 2017-11-13 | OLED packaging structure and packaging method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107819082A true CN107819082A (en) | 2018-03-20 |
| CN107819082B CN107819082B (en) | 2024-05-28 |
Family
ID=61609509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711113455.4A Active CN107819082B (en) | 2017-11-13 | 2017-11-13 | OLED packaging structure and packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107819082B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346623A (en) * | 2018-11-14 | 2019-02-15 | 信利（惠州）智能显示有限公司 | AMOLED shows product edge bonding method, edge sealing structure and display product |
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-
2017
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|---|---|---|---|---|
| KR100635508B1 (en) * | 2005-08-12 | 2006-10-17 | 삼성에스디아이 주식회사 | Organic electroluminescence display device |
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| CN109346623A (en) * | 2018-11-14 | 2019-02-15 | 信利（惠州）智能显示有限公司 | AMOLED shows product edge bonding method, edge sealing structure and display product |
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| Publication number | Publication date |
|---|---|
| CN107819082B (en) | 2024-05-28 |
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