CN107819082B - OLED packaging structure and packaging method - Google Patents
OLED packaging structure and packaging method Download PDFInfo
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- CN107819082B CN107819082B CN201711113455.4A CN201711113455A CN107819082B CN 107819082 B CN107819082 B CN 107819082B CN 201711113455 A CN201711113455 A CN 201711113455A CN 107819082 B CN107819082 B CN 107819082B
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- glass substrate
- side edge
- oled
- edge sealing
- lower glass
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 105
- 239000000758 substrate Substances 0.000 claims abstract description 102
- 238000007789 sealing Methods 0.000 claims abstract description 72
- 238000001035 drying Methods 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000741 silica gel Substances 0.000 claims description 16
- 229910002027 silica gel Inorganic materials 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 11
- 230000001680 brushing effect Effects 0.000 claims description 10
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an OLED packaging structure and a packaging method, wherein an OLED chip electrode is arranged in the middle of the upper surface of a lower glass substrate, an upper glass substrate is arranged above the OLED chip electrode, a connecting ring seat is arranged at the edge of the upper surface of the lower glass substrate, a clamping ring is arranged at the side edge of the lower surface of the upper glass substrate, the clamping ring corresponds to the connecting ring seat up and down, side sealing plates are arranged at the side edge of the upper surface of the lower glass substrate and the side edge of the lower surface of the upper glass substrate, primary sealing can be carried out through the clamping ring and the connecting ring seat, sealing is more rigorous, sealing is more thorough through connection of the side sealing rings and the side sealing plates, the service life of the OLED packaging structure and the packaging method is longer, the structure and the packaging method are simple in structure, convenient to install, the steps are simple, sealing is more rigorous, sealing is more convenient, and packaging is more convenient.
Description
Technical Field
The invention relates to the technical field of OLED packaging, in particular to an OLED packaging structure and an OLED packaging method.
Background
Light emitting devices are quite a lot of content studied in recent years, and organic electroluminescent displays (OLED) are particularly attractive as an emerging flat panel display, because they have application and potential application values in many electroluminescent devices, and conventional OLED displays are known to have advantages of good color contrast, active light emission, wide viewing angle, thinness, fast response speed, low energy consumption, etc., however conventional OLED displays, particularly electrodes and organic layers located therein, are easily degraded due to the effect of oxygen and moisture leaked into the OLED display from the surrounding environment, seriously affecting the service life of the OLED, and if the electrodes and organic layers in the OLED display are hermetically isolated from the surrounding environment, the service life of the OLED display will be significantly increased, however, the sealing process for hermetically sealing the light emitting display is difficult to achieve ideal requirements, and seriously affecting the service life of the OLED.
Disclosure of Invention
The invention aims to overcome the existing defects, and provides the OLED packaging structure and the OLED packaging method, which are simple in structure, convenient to install and simple in steps, not only enable sealing to be more strict and sealing, but also enable packaging to be more convenient, and can effectively solve the problems in the background art.
To achieve the above object, the present invention proposes: the utility model provides an OLED packaging structure, includes glass substrate down, be equipped with OLED chip electrode in the middle of glass substrate's the upper surface down, OLED chip electrode's top is equipped with glass substrate down to glass substrate's upper surface edge is equipped with the go-between seat down, glass substrate's lower surface side department is equipped with the joint ring, and the joint ring corresponds from top to bottom with the go-between seat, glass substrate's upper surface side department and glass substrate's lower surface side department all are equipped with the side closure plate down, and the side closure plate is located the outside of go-between seat and joint ring.
As a preferred technical scheme of the invention: the side edge sealing plates on the lower glass substrate and the upper glass substrate correspond up and down, and side edge sealing rings are arranged on the outer sides of the side edge sealing plates.
As a preferred technical scheme of the invention: the cross section of the side edge sealing plate is of an L-shaped structure, and the side edge sealing ring corresponding to the side edge sealing plate is of a concave structure.
As a preferred technical scheme of the invention: and a silica gel drying layer is arranged between the lower glass substrate and the upper glass substrate and is positioned on the inner side of the side sealing plate.
As a preferred technical scheme of the invention: the cross section of the connecting ring seat is of a U-shaped structure, and the clamping ring corresponds to the groove of the connecting ring seat.
As a preferred technical scheme of the invention: the lower glass substrate and the upper glass substrate are transparent glass, and the lower glass substrate and the upper glass substrate correspond up and down.
The invention also provides a packaging method of the OLED packaging structure, which comprises the following steps: the method comprises the following steps:
S1) OLED chip electrode mounting: firstly, mounting an OLED chip electrode on the upper surface of a lower glass substrate;
S2) fixing a silica gel drying layer: then the upper surface of the lower glass substrate is fixed by a silica gel drying layer, so that the silica gel drying layer is fixed on the outer side of the connecting ring seat;
s3) fixing the upper glass substrate: brushing glue on the groove of the connecting ring seat of the lower glass substrate, brushing glue on the outer side of the clamping ring of the upper glass substrate, buckling the clamping ring of the upper glass substrate with the connecting ring seat of the lower glass substrate,
S4) side closed loop sealing: and brushing glue on the outer side of the side edge of the combined structure, and fixing a side edge sealing ring on the outer side of the combined structure, so that the two side edge sealing plates of the lower glass substrate and the upper glass substrate are connected, and the side edge sealing rings are installed.
As a preferred technical scheme of the invention: before the OLED chip electrode is installed, the upper surface of the lower glass substrate is cleaned, and when the OLED chip electrode is installed, the lower surface of the OLED chip electrode is tightly attached to the upper surface of the lower glass substrate.
As a preferred technical scheme of the invention: cleaning is carried out before the clamping ring of the upper glass substrate and the connecting ring seat of the lower glass substrate are brushed, and the upper glass substrate and the connecting ring seat are dried through hot air after being installed.
As a preferred technical scheme of the invention: cleaning the side edges of the combined structure and grooves of the side edge sealing rings before and after the side edge sealing rings are installed, and continuously drying the combined structure through hot air after the installation is finished
Compared with the prior art, the invention has the beneficial effects that: this OLED packaging structure has set up go-between seat and joint ring, can carry out primary closure through joint ring and go-between seat for it is more rigorous to seal, can thoroughly seal through the connection of side closed ring and side closure plate, makes to seal more thoroughly, makes OLED life longer, and this OLED packaging structure and encapsulation method, simple structure, simple to operate, the step is simple, not only makes to seal more rigorously, sealed, and it is more convenient to encapsulate moreover.
Drawings
FIG. 1 is a block diagram of an OLED package structure according to the present invention;
FIG. 2 is a block diagram of a cross-section of an OLED package structure according to the present invention;
Fig. 3 is an enlarged view of the structure of an OLED package structure a according to the present invention.
In the figure: 1 upper glass substrate, 2 side edge closing plate, 3 lower glass substrate, 4 OLED chip electrode, 5 connecting ring seat, 6 joint ring, 7 side edge closing ring, 8 silica gel drying layer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-3, the present invention provides the following technical solutions: an OLED packaging structure comprises a lower glass substrate 3, wherein an OLED chip electrode 4 is arranged in the middle of the upper surface of the lower glass substrate 3, an upper glass substrate 1 is arranged above the OLED chip electrode 4, the lower glass substrate 3 and the upper glass substrate 1 are transparent glass, the lower glass substrate 3 and the upper glass substrate 1 correspond up and down, a connecting ring seat 5 is arranged at the edge of the upper surface of the lower glass substrate 3, a clamping ring 6 is arranged at the side edge of the lower surface of the upper glass substrate 1, the clamping ring 6 corresponds up and down with the connecting ring seat 5, primary sealing can be carried out through the clamping ring 6 and the connecting ring seat 5, sealing is more strict, side sealing plates 2 are arranged at the side edge of the upper surface of the lower glass substrate 3 and the side edge of the lower surface of the upper glass substrate 1, the side sealing plates 2 are positioned at the outer sides of the connecting ring seat 5 and the clamping ring 6, the side sealing plates 2 on the lower glass substrate 3 and the upper glass substrate 1 correspond up and down, the outside of the side edge sealing plate 2 is provided with a side edge sealing ring 7, the cross section of the side edge sealing plate 2 is of an L-shaped structure, the side edge sealing ring 7 corresponding to the side edge sealing plate 2 is of a concave structure, a silica gel drying layer 8 is arranged between the lower glass substrate 3 and the upper glass substrate 1, the side edge sealing ring 7 and the side edge sealing plate 2 are connected to be thoroughly sealed, the sealing is more thorough, the service life of the OLED is longer, the silica gel drying layer 8 is positioned at the inner side of the side edge sealing plate 2, water in the air can be filtered through the silica gel drying layer 8, the OLED chip electrode 4 is protected, the service life of the OLED chip electrode 4 is longer, the cross section of the connecting ring seat 5 is of a U-shaped structure, the clamping ring 6 corresponds to the groove of the connecting ring seat 5, the OLED packaging structure and the packaging method have the advantages that the clamping ring 6 is tightly connected with the connecting ring seat 5, the structure is simple, the mounting is convenient, the steps are simple, the sealing is more strict and sealing is realized, and the packaging is more convenient.
An encapsulation method of an OLED encapsulation structure comprises the following steps:
s1, mounting an electrode of an OLED chip: firstly, the OLED chip electrode 4 is mounted on the upper surface of the lower glass substrate 3, and the upper surface of the lower glass substrate 3 is cleaned before the OLED chip electrode 4 is mounted, so that the upper surface of the lower glass substrate 3 is more convenient, and the lower surface of the OLED chip electrode 4 is tightly attached to the upper surface of the lower glass substrate 3 during mounting;
s2, fixing a silica gel drying layer: then the upper surface of the lower glass substrate 3 is fixed by a silica gel drying layer 8, so that the silica gel drying layer 8 is fixed on the outer side of the connecting ring seat 5;
S3, fixing the glass substrate: brushing glue on the grooves of the connecting ring seat 5 of the lower glass substrate 3, brushing glue on the outer sides of the clamping rings 6 of the upper glass substrate 1, buckling the clamping rings 6 of the upper glass substrate 1 with the connecting ring seat 5 of the lower glass substrate 3, cleaning before brushing glue on the clamping rings 6 of the upper glass substrate 1 and the connecting ring seat 5 of the lower glass substrate 3, and drying the glass substrate by hot air after installation;
S4, side edge sealing ring sealing: and brushing glue on the outer side of the combined structure, fixing the side sealing ring 7 on the outer side of the combined structure, connecting the two side sealing plates 2 of the lower glass substrate 3 and the upper glass substrate 1, installing, cleaning the grooves of the side and the side sealing ring 7 of the combined structure before and after the side sealing ring 7 is installed, and continuously drying the combined structure through hot air after the installation is finished.
The invention has the following advantages: the OLED packaging structure and the packaging method have the advantages that primary sealing can be carried out through the clamping ring 6 and the connecting ring seat 5, sealing is more strict, the sealing can be thoroughly realized through connection of the side sealing ring 7 and the side sealing plate 2, sealing is more thorough, the service life of the OLED is longer, the structure is simple, the mounting is convenient, the steps are simple, sealing is more strict, and the packaging is more convenient.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides an OLED packaging structure, includes glass substrate (3) down, be equipped with OLED chip electrode (4) in the middle of the upper surface of glass substrate (3) down, the top of OLED chip electrode (4) is equipped with glass substrate (1) down to the upper surface edge of glass substrate (3) is equipped with go-between seat (5), the lower surface side department of going up glass substrate (1) is equipped with joint ring (6), and joint ring (6) correspond from top to bottom with go-between seat (5), the upper surface side department of glass substrate (3) down and the lower surface side department of going up glass substrate (1) all are equipped with side closure plate (2), and side closure plate (2) are located the outside of go-between seat (5) and joint ring (6), its characterized in that: the side edge sealing plates (2) on the lower glass substrate (3) and the upper glass substrate (1) are vertically corresponding, the clamping ring (6) of the upper glass substrate (1) is buckled with the connecting ring seat (5) of the lower glass substrate (3), a side edge sealing ring (7) is arranged on the outer side of the side edge sealing plate (2), the side edge sealing ring (7) is used for connecting the lower glass substrate (3) with the two side edge sealing plates (2) of the upper glass substrate (1), the section of the side edge sealing plate (2) is of an L-shaped structure, and the side edge sealing ring (7) corresponding to the side edge sealing plate (2) is of a concave structure; the section of the connecting ring seat (5) is of a U-shaped structure, and the clamping ring (6) corresponds to the groove of the connecting ring seat (5).
2. The OLED packaging structure of claim 1, wherein: a silica gel drying layer (8) is arranged between the lower glass substrate (3) and the upper glass substrate (1), and the silica gel drying layer (8) is positioned on the inner side of the side sealing plate (2).
3. The OLED packaging structure of claim 1, wherein: the lower glass substrate (3) and the upper glass substrate (1) are transparent glass, and the lower glass substrate (3) and the upper glass substrate (1) are vertically corresponding.
4. The encapsulation method of the OLED encapsulation structure is characterized by comprising the following steps of: the method comprises the following steps: s1) OLED chip electrode mounting: firstly, mounting an OLED chip electrode (4) on the upper surface of a lower glass substrate (3); s2) fixing a silica gel drying layer: then the upper surface of the lower glass substrate (3) is fixed by a silica gel drying layer (8), so that the silica gel drying layer (8) is fixed on the outer side of the connecting ring seat (5); s3) fixing the upper glass substrate: brushing glue on the grooves of the connecting ring seat (5) of the lower glass substrate (3), brushing glue on the outer sides of the clamping rings (6) of the upper glass substrate (1), and buckling the clamping rings (6) of the upper glass substrate (1) with the connecting ring seat (5) of the lower glass substrate (3); s4) side closed loop sealing: the side outside of the combined structure is brushed with glue, and then the side sealing ring (7) is fixed to the side outside of the combined structure, so that the two side sealing plates (2) of the lower glass substrate (3) and the upper glass substrate (1) are connected, and the combined structure is installed, and is characterized in that: before the OLED chip electrode (4) is installed, firstly cleaning the upper surface of the lower glass substrate (3), and when the OLED chip electrode is installed, enabling the lower surface of the OLED chip electrode (4) to be clung to the upper surface of the lower glass substrate (3); cleaning before brushing glue on the clamping ring (6) of the upper glass substrate (1) and the connecting ring seat (5) of the lower glass substrate (3), and drying the upper glass substrate (3) through hot air after installation; cleaning the side edges of the combined structure and the grooves of the side edge sealing rings (7) before and after the side edge sealing rings (7) are installed, and continuously drying the combined structure through hot air after the installation is finished; the side edge sealing plates (2) on the lower glass substrate (3) and the upper glass substrate (1) are vertically corresponding, the cross section of each side edge sealing plate (2) is of an L-shaped structure, and the side edge sealing rings (7) corresponding to the side edge sealing plates (2) are of concave structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711113455.4A CN107819082B (en) | 2017-11-13 | 2017-11-13 | OLED packaging structure and packaging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711113455.4A CN107819082B (en) | 2017-11-13 | 2017-11-13 | OLED packaging structure and packaging method |
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| Publication Number | Publication Date |
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| CN107819082A CN107819082A (en) | 2018-03-20 |
| CN107819082B true CN107819082B (en) | 2024-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711113455.4A Active CN107819082B (en) | 2017-11-13 | 2017-11-13 | OLED packaging structure and packaging method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109346623B (en) * | 2018-11-14 | 2020-12-29 | 信利（惠州）智能显示有限公司 | AMOLED display product edge sealing method, edge sealing structure and display product |
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|---|---|---|---|---|
| KR100635508B1 (en) * | 2005-08-12 | 2006-10-17 | 삼성에스디아이 주식회사 | Organic electroluminescence display device |
| JP2008186618A (en) * | 2007-01-26 | 2008-08-14 | Matsushita Electric Works Ltd | Organic electroluminescent device |
| CN204271142U (en) * | 2014-12-22 | 2015-04-15 | 昆山国显光电有限公司 | OLED module package structure |
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| CN106784373A (en) * | 2016-12-27 | 2017-05-31 | 武汉华星光电技术有限公司 | The encapsulating structure and its method for packing of OLED diaphragms |
| CN207459002U (en) * | 2017-11-13 | 2018-06-05 | 潘景航 | A kind of OLED encapsulating structures |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100778518B1 (en) * | 2006-12-06 | 2007-11-22 | 삼성에스디아이 주식회사 | Organic light emitting display device |
| CN103311445B (en) * | 2012-12-24 | 2016-03-16 | 上海天马微电子有限公司 | Organic light-emitting diode packaging structure and forming method thereof |
| CN103676337A (en) * | 2013-12-11 | 2014-03-26 | 北京京东方光电科技有限公司 | Display panel, manufacturing method thereof and display device |
-
2017
- 2017-11-13 CN CN201711113455.4A patent/CN107819082B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100635508B1 (en) * | 2005-08-12 | 2006-10-17 | 삼성에스디아이 주식회사 | Organic electroluminescence display device |
| JP2008186618A (en) * | 2007-01-26 | 2008-08-14 | Matsushita Electric Works Ltd | Organic electroluminescent device |
| CN204271142U (en) * | 2014-12-22 | 2015-04-15 | 昆山国显光电有限公司 | OLED module package structure |
| CN105140418A (en) * | 2015-08-25 | 2015-12-09 | 深圳市华星光电技术有限公司 | Organic light-emitting diode packaging part and display apparatus comprising same |
| CN106784373A (en) * | 2016-12-27 | 2017-05-31 | 武汉华星光电技术有限公司 | The encapsulating structure and its method for packing of OLED diaphragms |
| CN207459002U (en) * | 2017-11-13 | 2018-06-05 | 潘景航 | A kind of OLED encapsulating structures |
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