CN104538555A - OLED packaging structure and OLED packaging method - Google Patents
OLED packaging structure and OLED packaging method Download PDFInfo
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- CN104538555A CN104538555A CN201410723471.5A CN201410723471A CN104538555A CN 104538555 A CN104538555 A CN 104538555A CN 201410723471 A CN201410723471 A CN 201410723471A CN 104538555 A CN104538555 A CN 104538555A
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- cover plate
- oled
- encapsulation cover
- substrate
- encapsulation
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000004806 packaging method and process Methods 0.000 title abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 69
- 239000002274 desiccant Substances 0.000 claims abstract description 9
- 238000005538 encapsulation Methods 0.000 claims description 126
- 239000003292 glue Substances 0.000 claims description 38
- 230000000994 depressogenic effect Effects 0.000 claims description 12
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 6
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 6
- 239000001110 calcium chloride Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 24
- 229910052760 oxygen Inorganic materials 0.000 abstract description 24
- 239000001301 oxygen Substances 0.000 abstract description 24
- 230000008595 infiltration Effects 0.000 abstract description 18
- 238000001764 infiltration Methods 0.000 abstract description 18
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Provided in the invention is an OLED packaging structure and an OLED packaging method. The OLED packaging structure comprises a packaging cover plate (1), a substrate (2), an OLED device (21), a drying agent (11), and a frame adhesive (12); and the drying agent (11) located at the periphery of the OLED device (21) is arranged on the packaging cover plate (1) and the frame adhesive (12) located at the periphery of the drying agent (11) is used for bonding the packaging cover plate (1) and the substrate (2). A loop of groove (103) is formed in the periphery, corresponding to the area of the OLED device (21), of the packaging cover plate (1); and multiple loops of concave-convex structures (101) are formed at the periphery of the groove (103). The drying agent (11) is arranged in the groove (103); and the frame adhesive (12) is arranged between the concave-convex structures (101) and the substrate. According to the OLED packaging structure, the bonding strength between the packaging cover plate and the substrate can be improved and the distance between the packaging cover plate and the substrate is reduced; and thus infiltration of the moisture and oxygen can be effectively blocked.
Description
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of OLED encapsulating structure and OLED encapsulation method.
Background technology
In Display Technique field, liquid crystal display (LCD, Liquid Crystal Display), Organic Light Emitting Diode (OLED, Organic Light-Emitting Diode) flat panel display such as display progressively replaced cathode-ray picture tube (CRT, Cathode Ray Tube) display.Wherein, OLED has self-luminous, driving voltage is low, luminous efficiency is high, the response time is short, definition and high, the nearly 180 ° of visual angles of contrast, serviceability temperature wide ranges, the plurality of advantages such as Flexible Displays and large area total colouring can be realized, and be widely used in mobile phone screen, computer monitor, full-color TV etc., being known as by industry is the display unit having development potentiality most.
OLED has the anode be formed at successively on substrate, organic luminous layer and negative electrode.The greatest problem of restriction OLED industry development and the greatest drawback of OLED are that the life-span of OLED is shorter, the reason causing the OLED life-span shorter mainly form the electrode of OLED and luminescent layer organic material all very responsive for the pollutant in air, steam and oxygen, in the environment containing steam, oxygen, easily there is electrochemical corrosion, OLED is caused damage.Therefore, effectively must encapsulate OLED, prevention steam, oxygen enter OLED inside.
OLED encapsulation mainly comprises following several mode: drier encapsulation, UV rubber seal dress (also known as Damonly encapsulation), UV glue and filling rubber seal dress (encapsulating also known as Dam & Fill), glass cement encapsulation (also known as Frit encapsulation) etc.Wherein, UV rubber seal packing technique is OLED encapsulation is also the most frequently used technology the earliest, and it has following features: do not use solvent or use a small amount of solvent, decreases the pollution of solvent to environment; Power consumption is few, and low-temperature curable, is applicable to the material to UV sensitivity; Curing rate is fast, and efficiency is high, can use in high-speed production lines, and curing apparatus floor space is little.But, the fluid sealant used in UV rubber seal dress is organic material, after its solidification, molecular gap is larger, adopt traditional OLED encapsulation method, because fluid sealant has solidification defect, porousness, reasons such as adhesion is weak with substrate, encapsulation cover plate, steam is easier to infiltrate through inner seal region through gap with oxygen ratio, thus causes the performance of OLED comparatively fast to be degenerated, the lost of life.
Therefore, by effectively encapsulating OLED, ensureing the inner good sealing of OLED, reducing the contact of OLED and oxygen, steam in external environment condition as much as possible, for the stable performance of OLED and the useful life of prolongation OLED most important.Reach better packaging effect still to need to improve existing encapsulating structure and method for packing further, to intercept the path that steam and oxygen infiltrate OLED encapsulating structure inside.
Summary of the invention
The object of the present invention is to provide a kind of OLED encapsulating structure, the bond strength between encapsulation cover plate and substrate can be improved, and the distance reduced between encapsulation cover plate and substrate, the infiltration of effective stop steam and oxygen, packaging effect is better, contribute to the performance improving OLED, extend the useful life of OLED.
Another object of the present invention is to provide a kind of OLED encapsulation method, encapsulation cover plate and substrate firmly can be bonded together, and the distance reduced between encapsulation cover plate and substrate, the infiltration of effective stop steam and oxygen, contribute to the performance improving OLED, extend the useful life of OLED, and processing procedure is simple, packaging effect is better.
For achieving the above object, the invention provides a kind of OLED encapsulating structure, comprise the substrate that encapsulation cover plate and described encapsulation cover plate be oppositely arranged, the OLED be located between described encapsulation cover plate and substrate on described substrate, be positioned at described OLED region outer be located in the drier on described encapsulation cover plate and be positioned at described drier periphery to bond the frame glue of described encapsulation cover plate and substrate;
On described encapsulation cover plate, the outer of corresponding described OLED region is arranged with a circle groove, and described groove periphery is provided with a few concaveconvex structures, and described drier is located in described groove, and described frame glue is located between described concaveconvex structure and substrate.
Described encapsulation cover plate and substrate are glass substrate.
Described concaveconvex structure comprises the lug boss and adjacent with described lug boss and recessed described encapsulation cover plate depression in the surface portion that protrude described encapsulation cover plate surface, and described frame glue is filled described depressed part completely and covered described lug boss.
The cross section of described lug boss and depressed part is all in trapezoidal.
The height that described lug boss protrudes described encapsulation cover plate surface is 0.1 ~ 10um; The surface of described concaveconvex structure and groove is rough surface.Described drier is calcium chloride, and described drier is concordant with the surface of described encapsulation cover plate.
The present invention also provides a kind of OLED encapsulation method, comprises the steps:
Step 1, provide encapsulation cover plate and substrate, described substrate is provided with OLED;
Step 2, on described encapsulation cover plate, make a few concaveconvex structures in the outside in the described OLED region of correspondence;
Step 3, on described encapsulation cover plate inside described concaveconvex structure, the outside in corresponding described OLED region makes a circle groove, and carries out rough surface process to described concaveconvex structure and described groove;
Step 4, on described concaveconvex structure, be coated with frame glue;
Step 5, desiccant-filled in described inside grooves;
Step 6, to fit relative under vacuum to described encapsulation cover plate and substrate, and use UV illumination to penetrate to make described frame adhesive curing, thus by described encapsulation cover plate together with substrate bonding, complete the encapsulation to OLED.
Described OLED encapsulation method, adopts etching method to make described concaveconvex structure and groove; Surface Treatment with Plasma method is adopted to carry out rough surface process to described concaveconvex structure and groove.
Described concaveconvex structure comprises the lug boss and adjacent with described lug boss and recessed described encapsulation cover plate depression in the surface portion that protrude described encapsulation cover plate surface, and described frame glue is filled described depressed part completely and covered described lug boss.
The cross section of described lug boss and depressed part is all in trapezoidal; The height that described lug boss protrudes described encapsulation cover plate surface is 0.1 ~ 10um; Described drier is calcium chloride, and described drier is concordant with the surface of described encapsulation cover plate.
Beneficial effect of the present invention: a kind of OLED encapsulating structure provided by the invention, by the position being coated with frame glue on encapsulation cover plate, concaveconvex structure is set, ensure have enough spaces to load frame glue between encapsulation cover plate and substrate, improve the bond strength between encapsulation cover plate and substrate, and the distance reduced between encapsulation cover plate and substrate, intercept the infiltration path of steam and oxygen, the infiltration of effective stop steam and oxygen, packaging effect is better, simultaneously by arranging drier to reduce through frame glue penetration to the steam of OLED inner seal region, contribute to the performance improving OLED, extend the useful life of OLED.The invention provides a kind of OLED encapsulation method, position encapsulation cover plate being coated with frame glue is made into concaveconvex structure, ensure have enough spaces to load frame glue between encapsulation cover plate and substrate, improve the bond strength between encapsulation cover plate and substrate, and the distance reduced between encapsulation cover plate and substrate, intercept the infiltration path of steam and oxygen, the infiltration of effective stop steam and oxygen, simultaneously by desiccant-filled, decrease through frame glue penetration to the steam of OLED inner seal region, contribute to the performance improving OLED, extend the useful life of OLED, and processing procedure is simple, packaging effect is better.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention describe in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In accompanying drawing,
Fig. 1 is the schematic diagram of OLED encapsulating structure of the present invention;
Fig. 2 is the flow chart of OLED encapsulation method of the present invention;
Fig. 3 is the schematic diagram of the step 1 of OLED encapsulation method of the present invention;
Fig. 4 is the schematic diagram of the step 2 of OLED encapsulation method of the present invention;
Fig. 5 is the schematic diagram of the step 3 of OLED encapsulation method of the present invention;
Fig. 6 is the schematic diagram of the step 4 of OLED encapsulation method of the present invention;
Fig. 7 is the schematic diagram of the step 5 of OLED encapsulation method of the present invention;
Fig. 8 is the schematic diagram of the step 6 of OLED encapsulation method of the present invention.
Embodiment
For further setting forth the technological means and effect thereof that the present invention takes, be described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
Refer to Fig. 1, the invention provides a kind of OLED encapsulating structure, comprise the substrate 2 that encapsulation cover plate 1 and described encapsulation cover plate 1 be oppositely arranged, the OLED 21 be located between described encapsulation cover plate 1 and substrate 2 on described substrate 2, be positioned at described OLED 21 region outer be located in the drier 11 on described encapsulation cover plate 1 and be positioned at described drier 11 periphery bond the frame glue 12 of described encapsulation cover plate 1 and substrate 2.
Concrete, on described encapsulation cover plate 1, corresponding the outer of described OLED 21 region is arranged with a circle groove 103, be arranged with a few concaveconvex structures 101 outside described groove 103, described drier 11 is located in described groove 103, and described frame glue 12 is located between described concaveconvex structure 101 and substrate 2.Described concaveconvex structure 101 makes have enough spaces to load frame glue 12 between encapsulation cover plate 1 and substrate 2, can improve the bond strength between encapsulation cover plate 1 and substrate 2.
Described encapsulation cover plate 1 is transparency carrier with substrate 2, and preferably, described encapsulation cover plate 1 is glass substrate with substrate 2.
Further, described concaveconvex structure 101 comprises the lug boss 102 and adjacent with described lug boss 102 and recessed described encapsulation cover plate 1 depression in the surface portion 104 that protrude described encapsulation cover plate 1 surface.Described frame glue 12 is filled described depressed part 104 completely and is covered described lug boss 102, due to lug boss 102 protrusion surperficial relative to encapsulation cover plate 1 certain altitude, reduce the distance between encapsulation cover plate 1 and substrate 2, intercept the infiltration path of steam and oxygen, the infiltration of effective stop steam and oxygen, reduces the infiltration rate of steam, oxygen.
The cross section of described lug boss 102 and depressed part 104 is all in trapezoidal.Preferably, described lug boss 102 protrudes the height on described encapsulation cover plate 1 surface is 0.1 ~ 10um.
Further, the surface preferably rough surface of described concaveconvex structure 101 and groove 103 is more firm with what make frame glue 12 bond.
Described drier 11 is preferably calcium chloride, and described drier 11 is concordant with the inner surface of described encapsulation cover plate 1.
In above-mentioned OLED encapsulating structure, the position described encapsulation cover plate 1 being coated with frame glue 12 arranges concaveconvex structure 101, ensure have enough spaces to load frame glue 12 between encapsulation cover plate 1 and substrate 2, improve the bond strength between encapsulation cover plate 1 and substrate 2, and the distance reduced between encapsulation cover plate 1 and substrate 2, intercept the infiltration path of steam and oxygen, the infiltration of effective stop steam and oxygen, packaging effect is better, reduce by arranging drier 11 steam infiltrating into OLED inner seal region through frame glue 12 simultaneously, contribute to the performance improving OLED, extend the useful life of OLED.Refer to Fig. 2, the present invention also provides a kind of OLED encapsulation method, comprises the steps:
Step 1, as shown in Figure 3, provide encapsulation cover plate 1 and substrate 2, described substrate 2 is provided with OLED 21.
Described encapsulation cover plate 1 is transparency carrier with substrate 2, and preferably, described encapsulation cover plate 1 is glass substrate with substrate 2.
Step 2, as shown in Figure 4, described encapsulation cover plate 1 makes a few concaveconvex structures 101 in the outside in correspondence described OLED 21 region.
Concrete, etching method or other method can be adopted to make described concaveconvex structure 101.
Described concaveconvex structure 101 comprises the lug boss 102 and adjacent with described lug boss 102 and recessed described encapsulation cover plate 1 depression in the surface portion 104 that protrude described encapsulation cover plate 1 surface.Further, the cross section of described lug boss 102 and depressed part 104 is all in trapezoidal, and preferably, the height that described lug boss 102 protrudes described encapsulation cover plate 1 surface is 0.1 ~ 10um.
Step 3, as shown in Figure 5, on described encapsulation cover plate 1 inside described concaveconvex structure 101, the outside in corresponding described OLED 21 region makes a circle groove 103, and carries out rough surface process to described concaveconvex structure 101 with described groove 103.
Concrete, etching method or additive method can be adopted to make described groove 103; Surface Treatment with Plasma (plasma) method is adopted to carry out rough surface process to described concaveconvex structure 101 and groove 103.
Step 4, as shown in Figure 6, described concaveconvex structure 101 is coated with frame glue 12, makes described frame glue 12 fill described depressed part 104 completely and cover described lug boss 102.
Step 5, as shown in Figure 7, at described groove 103 inside coating drier 11.
Described drier 11 is for being preferably calcium chloride; Described drier 11 is concordant with the surface of described encapsulation cover plate 1.
Step 6, as shown in Figure 8, to fit relative under vacuum to described encapsulation cover plate 1 and substrate 2, and use UV illumination to penetrate described frame glue 12 is solidified, thus described encapsulation cover plate 1 is bonded together with substrate 2, complete the encapsulation to OLED 21.
In above-mentioned OLED encapsulation method, position encapsulation cover plate 1 being coated with frame glue 12 is made into concaveconvex structure 101, ensure have enough spaces to load frame glue 12 between encapsulation cover plate 1 and substrate 2, improve the bond strength between encapsulation cover plate 1 and substrate 2, and the distance reduced between encapsulation cover plate 1 and substrate 2, intercept the infiltration path of steam and oxygen, effectively block the infiltration of steam and oxygen, simultaneously by desiccant-filled 11, decrease the steam infiltrating into OLED inner seal region through frame glue 12, contribute to the performance improving OLED, extend the useful life of OLED, and processing procedure is simple, packaging effect is better.
In sum, OLED encapsulating structure of the present invention, by the position being coated with frame glue on encapsulation cover plate, concaveconvex structure is set, ensure have enough spaces to load frame glue between encapsulation cover plate and substrate, improve the bond strength between encapsulation cover plate and substrate, and the distance reduced between encapsulation cover plate and substrate, intercept the infiltration path of steam and oxygen, the infiltration of effective stop steam and oxygen, packaging effect is better, simultaneously by arranging drier to reduce through frame glue penetration to the steam of OLED inner seal region, contribute to the performance improving OLED, extend the useful life of OLED.OLED encapsulation method of the present invention, position encapsulation cover plate being coated with frame glue is made into concaveconvex structure, ensure have enough spaces to load frame glue between encapsulation cover plate and substrate, improve the bond strength between encapsulation cover plate and substrate, and the distance reduced between encapsulation cover plate and substrate, intercept the infiltration path of steam and oxygen, the infiltration of effective stop steam and oxygen, simultaneously by desiccant-filled, decrease through frame glue penetration to the steam of OLED inner seal region, contribute to the performance improving OLED, extend the useful life of OLED, and processing procedure is simple, packaging effect is better.
The above, for the person of ordinary skill of the art, can make other various corresponding change and distortion according to technical scheme of the present invention and technical conceive, and all these change and be out of shape the protection range that all should belong to the claims in the present invention.
Claims (10)
1. an OLED encapsulating structure, it is characterized in that, comprise encapsulation cover plate (1), and described encapsulation cover plate (1) be oppositely arranged substrate (2), be positioned at the OLED (21) be located between described encapsulation cover plate (1) and substrate (2) on described substrate (2), be positioned at described OLED (21) region outer be located in the drier (11) on described encapsulation cover plate (1) and be positioned at described drier (11) periphery bond the frame glue (12) of described encapsulation cover plate (1) and substrate (2);
Upper the outer of corresponding described OLED (21) region of described encapsulation cover plate (1) is arranged with a circle groove (103), a few concaveconvex structures (101) are arranged with outside described groove (103), described drier (11) is located in described groove (103), and described frame glue (12) is located between described concaveconvex structure (101) and substrate (2).
2. OLED encapsulating structure as claimed in claim 1, is characterized in that, described encapsulation cover plate (1) and substrate (2) are glass substrate.
3. OLED encapsulating structure as claimed in claim 1, it is characterized in that, described concaveconvex structure (101) comprises the lug boss (102) and adjacent with described lug boss (102) and recessed described encapsulation cover plate (1) depression in the surface portion (104) that protrude described encapsulation cover plate (1) surface, and described frame glue (12) is filled described depressed part (104) completely and covered described lug boss (102).
4. OLED encapsulating structure as claimed in claim 3, is characterized in that, the cross section of described lug boss (102) and depressed part (104) is all in trapezoidal.
5. OLED encapsulating structure as claimed in claim 4, is characterized in that, the height that described lug boss (102) protrudes described encapsulation cover plate (1) surface is 0.1 ~ 10um; Described concaveconvex structure (101) is rough surface with the surface of groove (103).
6. OLED encapsulating structure as claimed in claim 1, it is characterized in that, described drier (11) is calcium chloride, and described drier (11) is concordant with the surface of described encapsulation cover plate (1).
7. an OLED encapsulation method, is characterized in that, comprises the steps:
Step 1, provide encapsulation cover plate (1) and substrate (2), described substrate (2) is provided with OLED (21);
Step 2, on described encapsulation cover plate (1), make a few concaveconvex structures (101) in the outside in the described OLED of correspondence (21) region;
Step 3, on described encapsulation cover plate (1), make circle groove (103) in the outside in described concaveconvex structure (101) inner side, corresponding described OLED (21) region, and rough surface process is carried out to described concaveconvex structure (101) and described groove (103);
Step 4, coating frame glue (12) on described concaveconvex structure (101);
Step 5, in described groove (103) inner desiccant-filled (11);
Step 6, to fit relative under vacuum with substrate (2) for described encapsulation cover plate (1), and use UV illumination to penetrate described frame glue (12) is solidified, thus described encapsulation cover plate (1) and substrate (2) are bonded together, complete the encapsulation to OLED (21).
8. OLED encapsulation method as claimed in claim 7, is characterized in that, adopts etching method to make described concaveconvex structure (101) and groove (103); Surface Treatment with Plasma method is adopted to carry out rough surface process to described concaveconvex structure (101).
9. OLED encapsulation method as claimed in claim 7, it is characterized in that, described concaveconvex structure (101) comprises the lug boss (102) and adjacent with described lug boss (102) and recessed described encapsulation cover plate (1) depression in the surface portion (104) that protrude described encapsulation cover plate (1) surface, and described frame glue (12) is filled described depressed part (104) completely and covered described lug boss (102).
10. OLED encapsulation method as claimed in claim 9, it is characterized in that, the cross section of described lug boss (102) and depressed part (104) is all in trapezoidal; The height that described lug boss (102) protrudes described encapsulation cover plate (1) surface is 0.1 ~ 10um; Described drier (11) is calcium chloride, and described drier (11) is concordant with the surface of described encapsulation cover plate (1).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410723471.5A CN104538555A (en) | 2014-12-02 | 2014-12-02 | OLED packaging structure and OLED packaging method |
| PCT/CN2015/072494 WO2016086538A1 (en) | 2014-12-02 | 2015-02-09 | Oled encapsulation structure and oled encapsulation method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410723471.5A CN104538555A (en) | 2014-12-02 | 2014-12-02 | OLED packaging structure and OLED packaging method |
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| CN104538555A true CN104538555A (en) | 2015-04-22 |
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| CN201410723471.5A Pending CN104538555A (en) | 2014-12-02 | 2014-12-02 | OLED packaging structure and OLED packaging method |
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| WO (1) | WO2016086538A1 (en) |
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| CN105140418A (en) * | 2015-08-25 | 2015-12-09 | 深圳市华星光电技术有限公司 | Organic light-emitting diode packaging part and display apparatus comprising same |
| CN105304642A (en) * | 2015-09-24 | 2016-02-03 | 南京中电熊猫液晶显示科技有限公司 | Array substrate and manufacturing method thereof |
| CN105470410A (en) * | 2016-02-24 | 2016-04-06 | 上海天马有机发光显示技术有限公司 | Display panel and packaging method thereof |
| CN105576148A (en) * | 2016-01-04 | 2016-05-11 | 京东方科技集团股份有限公司 | Package method of organic light emitting diode (OLED) display panel, OLED display panel and OLED display device |
| CN106025092A (en) * | 2016-07-19 | 2016-10-12 | 京东方科技集团股份有限公司 | Organic electroluminescent device, preparation method thereof and displaying device |
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