CN101866943B - Organic light-emitting diode display and packaging method thereof - Google Patents
Organic light-emitting diode display and packaging method thereof Download PDFInfo
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Abstract
The invention discloses an organic light-emitting diode (OLED) display and a packaging method thereof. One surface of a rear cover of the organic light-emitting diode display facing a substrate is provided with a light emitting region corresponding to a pixel display region matrix on the substrate; and the rear cover also comprises at least one ring of continuous bumps surrounding the light emitting region at the periphery of the light emitting region. The method comprises the following steps of: coating a packaging adhesive at the periphery of the light emitting region of the rear cover, wherein the packaging adhesive surrounds the light emitting region and completely covers the at least one ring of bumps surrounding the light emitting region; aligning and pressing the rear cover coated with the packaging adhesive and the substrate; and curing the packaging adhesive. By forming the bumps at the periphery of the light emitting region of the rear cover, the required adhesive strength can be ensured during the packaging of the OLED, the distance between the rear cover and the substrate can be greatly reduced, the capability of the OLED of preventing the penetration of vapor and oxygen can be enhanced, and the service life of the OLED can be effectively prolonged.
Description
Technical field
The present invention relates to the electronic apparatus technical field, particularly relate to a kind of display of organic electroluminescence and method for packing thereof.
Background technology
Display of organic electroluminescence (OLED, Organic Light-Emitting Diode) be current emerging a kind of flat-panel monitor, due to OLED have active illuminating, contrast high, can slimming, the plurality of advantages such as fast response time, be acknowledged as the main force of display of future generation.
The typical structure of existing OLED as shown in Figure 1, comprise: base plate glass 1, deposit anode 2 on described base plate glass 1, cover the organic function layer 3 on anode 2 and be positioned at the negative electrode 4 on organic function layer 3, the bonnet 6 corresponding with base plate glass 1, be attached to the drier 5 of bonnet 6 on the luminous zone of negative electrode 4 one sides, and the packaging plastic 7 that is positioned at glass substrate 1 and bonnet 6 contact positions.
Because the luminous organic material in organic function layer 3 is met steam oxygen and easily lost efficacy, so must add bonnet 6 and drier 5 is encapsulated, in order to reduce the damage of steam oxygen to organic function layer, extend the useful life of OLED.
Even but using bonnet and drier, the steam oxygen that still has considerable dosage penetrates in OLED, damages organic function layer.Be still a difficult problem urgently to be resolved hurrily at present the useful life that how to extend OLED.
Summary of the invention
The purpose of this invention is to provide a kind of display of organic electroluminescence and method for packing thereof, to extend the useful life of OLED.
The invention provides a kind of display of organic electroluminescence, comprising:
Substrate, be formed with pixel display area matrix on described substrate;
Bonnet, described bonnet is formed with the luminous zone corresponding with the pixel display area matrix on substrate towards the one side of substrate, and described bonnet also comprises the continuous projection of at least one circle of surrounding described luminous zone in periphery, described luminous zone;
Packaging plastic, be positioned at the contact-making surface of substrate and bonnet, described packaging plastic around described luminous zone and complete covering protruding around at least one circle of described luminous zone.
Preferably, described bonnet also is formed with groove between described luminous zone and described projection, and described groove, between described luminous zone and adjacent with a described luminous zone circle projection, is filled with drier in described groove.
Concrete, described groove is continuous or discrete distribution.
Preferably, the degree of depth of described groove is not more than half of bonnet thickness of glass.
Concrete, the degree of depth of described groove is 0.1～0.4mm, width is 0.1～10mm.
Concrete, the height of described projection is 5～100 μ m, width is 5～200 μ m.
Preferably, the cross section of described projection is inverted trapezoidal.
Concrete, the distance between described projection and substrate is 0.1～2 μ m.
The present invention also provides a kind of method for packing of display of organic electroluminescence, the bonnet of described display of organic electroluminescence is formed with the luminous zone corresponding with the pixel display area matrix on substrate towards the one side of substrate, and described bonnet also comprises the continuous projection of at least one circle of surrounding described luminous zone in periphery, described luminous zone; Described method comprises:
At the peripheral coating in the luminous zone of described bonnet packaging plastic; Also complete covering is protruding around at least one circle of described luminous zone around described luminous zone for described packaging plastic;
To scribble the bonnet of packaging plastic and substrate contraposition, pressing, and solidify described packaging plastic.
If described bonnet also comprises the groove between described luminous zone and described projection, described groove is between described luminous zone and adjacent with a described luminous zone circle projection,, before described coating packaging plastic, can also comprise: in described groove, load drier.
Concrete, described coating packaging plastic, bonnet and substrate contraposition, pressing and cure package glue are all completed in inert atmosphere.
Preferably, the pressure of the inert atmosphere in described pressing and cure package glue process is 0.1～20Torr.
OLED of the present invention and method for packing thereof, by the peripheral projection that forms in the bonnet luminous zone, when encapsulating, OLED both can guarantee required bonding strength, can significantly reduce the distance between bonnet and substrate again, strengthen the ability that OLED stops that steam oxygen infiltrates, effectively extended the useful life of OLED; By further be formed for loading the groove of drier on bonnet, further extended the useful life of OLED; Owing to need not attaching in the bonnet luminous zone drier, therefore need be on the bonnet luminous zone etching for attaching the depressed area of drier, can strengthen the mechanical strength of bonnet on the one hand, simplify manufacturing process, on the other hand, when encapsulation OLED, can save the process that attaches drier, package speed is faster.
The accompanying drawing explanation
Fig. 1 is the typical section schematic diagram of existing OLED;
Fig. 2 is the schematic cross-section of OLED of the present invention;
Fig. 3 is the elevational schematic view of rear cover glass of the present invention before cutting;
Fig. 4 is the enlarged diagram at I place in Fig. 3;
Fig. 5 is the enlarged diagram at K place in Fig. 2;
Fig. 6 is the schematic cross-section of an embodiment of bonnet of the present invention;
Fig. 7 is the schematic cross-section of another embodiment of bonnet of the present invention;
Fig. 8 is the schematic cross-section that uses the OLED of bonnet in Fig. 7;
Fig. 9 is the schematic flow sheet of OLED method for packing of the present invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with the drawings and specific embodiments, the embodiment of the present invention is described in further detail.
The inventor finds through research: the steam oxygen penetrated in OLED is mainly to infiltrate by packaging plastic, and and bonnet and substrate between distance dependent: distance is larger, and the speed that steam oxygen infiltrates is just faster, and the life-span of OLED is just shorter.But consider the bond strength of bonnet and substrate, the thickness of packaging plastic can not be excessively thin.The present invention will provide a kind of OLED exactly, can under the prerequisite of the bond strength that guarantees bonnet and substrate, significantly reduce the distance of bonnet and substrate, stops the infiltration of steam oxygen, extends the useful life of OLED.
Embodiment mono-
Fig. 2 is the schematic cross-section of OLED of the present invention.The invention provides a kind of OLED, as shown in Figure 2, described OLED comprises: substrate 10, bonnet 20, packaging plastic 30.
Be formed with pixel display area matrix on substrate 10; Each pixel display area in described pixel display area matrix comprises transparent anode 101, organic function layer 102 and the negative electrode 103 be deposited on successively on substrate 10.If what select when preparing substrate 10 is special-purpose electro-conductive glass, the anode that on described electro-conductive glass, the ITO of pre-deposition (Indium Tin Oxide, tin indium oxide) coating can be used as OLED is used.
Please be simultaneously referring to Fig. 3, Fig. 4, wherein, Fig. 3 is the elevational schematic view of rear cover glass of the present invention before cutting, Fig. 4 is the enlarged diagram at I place in Fig. 3, also can regard the schematic diagram of a bonnet as.Existing production technology is considered the problem of efficiency; usually rear cover glass and base plate glass can be carried out respectively to contraposition, pressing, also curing described packaging plastic before cutting into a plurality of bonnets and substrate; no matter but be first to cut or cutting afterwards, the OLED structure finally obtained is all as shown in Figure 2.
On bonnet 20, the height of projection 202 can be 5～100 μ m, and width can be 5～200 μ m.
When bonnet 20 and substrate 10 involution, because packaging plastic 30 can be embedded into the sunk area between projection 202, make packaging plastic between bonnet 20 and substrate 10 there is certain thickness, guaranteed the intensity that both are bonding.Projection 202 can reach 0.1～2 μ m with the distance between substrate 10, and projection 202 is continuous one whole circle encirclement luminous zones 201, therefore, can significantly strengthen the blocking capability to steam oxygen, extends thus the useful life of OLED.
Described protruding 202 cross section preferably is the inverted trapezoidal shown in Fig. 5, and this structure is easier to packaging plastic 30 and is embedded into the sunk area between projection 202, guarantees bonding strength.The Cross Section Morphology that the concentration of etching liquid that can be by controlling etching projection 202 and time are controlled projection 202.Described etching liquid is the acid solution that contains fluorine ion, and concentration is 10%～40%, and etch period is 1～20 minute.
The cross section of 201 peripheries, luminous zone also can be as shown in Figure 6, equal with projection 202 in the bonnet glass height of protruding 202 peripheries.Just can reach required bonding strength and height at protruding 202 places due to packaging plastic 30, therefore the bonnet glass structure of protruding 202 peripheries does not affect the effect that the rear OLED of encapsulation stops steam oxygen.
In addition, the ability of infiltrating due to the OLED opposing steam oxygen that uses described bonnet encapsulation to form improves greatly, can in luminous zone, not attach drier, and therefore described bonnet also is applicable to the OLED of top light emitting and lighting at two sides; Simultaneously, in the process of bonnet processing, can save on bonnet etching for attaching the depressed area (referring to Fig. 1, the about 0.2mm of the described depressed area degree of depth) of drier (can be the solid block that calcium oxide, barium monoxide or its composition etc. form), manufacturing process is simpler.Use the OLED life-span of described bonnet can reach 3～5 years, with respect to being significantly increased in 100～200 days of existing OLED.
To requiring higher OLED useful life, can also between the luminous zone 201 of bonnet 20 and projection 202, form groove 203, described groove 203 is between described luminous zone 201 and a circle projection 202 adjacent with described luminous zone 201.Form the bonnet cross section of groove 203 as shown in Figure 7, be filled with drier 204 (referring to Fig. 8) in groove 203, be preferably liquid drier.Groove 203 can continuous distribution, around luminous zone, 201 forms a complete circle, also can discretely distribute.
Consider the mechanical strength of bonnet 20, preferably, the degree of depth of groove 203 is not more than half of bonnet thickness of glass.The degree of depth of groove 203 can be 0.1～0.4mm, and width can be 0.1～10mm, can use syringe needle filling liquid drier, is advisable.
With the bonnet 20 of described groove 203, due to luminous zone 201 light-permeable that is not blocked, therefore, still go for the OLED of top light emitting and lighting at two sides.
Described liquid drier can be at inert gas (as N
2) with substrate 10, encapsulate after solidifying under atmosphere.Use is with reaching more than 10 years the useful life of the OLED of the bonnet encapsulation formation of projection and the groove that is filled with drier.
OLED of the present invention, by the peripheral projection that forms in the bonnet luminous zone, when encapsulating, OLED both can guarantee required bonding strength, can significantly reduce the distance between bonnet and substrate again, strengthen the ability that OLED stops that steam oxygen infiltrates, effectively extended the useful life of OLED; By further be formed for loading the groove of drier on bonnet, further extended the useful life of OLED.
Embodiment bis-
The present invention also provides the method for packing of a kind of OLED, the bonnet of described OLED is formed with the luminous zone corresponding with the pixel display area matrix on substrate towards the one side of substrate, and described bonnet also comprises the continuous projection of at least one circle of surrounding described luminous zone in periphery, described luminous zone; As shown in Figure 9, described method comprises:
S10, at the peripheral coating in the luminous zone of described bonnet packaging plastic; Also complete covering is protruding around at least one circle of described luminous zone around described luminous zone for described packaging plastic;
S20, will scribble the bonnet of packaging plastic and substrate contraposition, pressing, and solidify described packaging plastic.
Because the bonnet used in the present invention has continuous projection in the periphery, luminous zone, after packaging plastic is to substrate and bonnet encapsulation, sunk area between projection makes packaging plastic have the bonding strength that enough thickness guarantees substrate and bonnet, and the distance between projection and substrate can reach 0.1～2 μ m, strengthen OLED and stopped the ability that steam oxygen infiltrates, therefore need be on the bonnet luminous zone etching for attaching the depressed area of drier, can strengthen the bonnet mechanical strength on the one hand, simplify manufacturing process, on the other hand, when encapsulation OLED, can save the process that attaches drier, package speed is faster.
To requiring higher OLED useful life, described bonnet can also comprise the groove between described luminous zone and described projection, described groove is between described luminous zone and adjacent with a described luminous zone circle projection, described method is before described coating packaging plastic, can also comprise step: load drier in described groove, described drier is preferably liquid drier.Described liquid drier can be at inert gas (as N
2) solidify under atmosphere.
Above-mentioned coating packaging plastic, bonnet and substrate contraposition, pressing and cure package glue are all completed in inert atmosphere.The pressure of the inert atmosphere in described pressing and cure package glue process is 0.1～20Torr.
Detailed operating process can be with reference to following content:
1) bonnet is carried out after cleaning, drying, be passed in the glove box of high pure nitrogen environment, liquid drier on point in the groove of bonnet, and liquid drier is carried out to hot curing.Then at the peripheral coating in the luminous zone of bonnet packaging plastic, also complete covering is around at least one circle projection of described luminous zone around each luminous zone to guarantee described packaging plastic, and this packaging plastic does not need pad.
2) will be sent in the encapsulation cavity with the bonnet of curing liquid drier and the upper packaging plastic of point and the substrate that deposits anode, organic function layer and negative electrode, the environment that the encapsulation cavity is high pure nitrogen, have very low steam oxygen content simultaneously.Bonnet and substrate are carried out to contraposition, afterwards the encapsulation cavity is vacuumized.When pressure drops to 0.1～20Torr scope, bonnet and substrate are carried out to pressing, and packaging plastic is carried out to UV solidifies and hot curing (70～80 ℃).Herein, the pressure used when bonnet and substrate are carried out to pressing is different from the 500Torr of prior art, thus, can not make in OLED to leave over too much N
2, avoid causing the quick-fried punching of packaging plastic and projection and substrate distance not to reach minimum, in bonnet and substrate pressing process, meeting further be compressed the atmosphere in OLED, makes the pressure after pressing can be a bit larger tham an atmospheric pressure, avoids forming negative pressure in OLED.
The method for packing of OLED of the present invention, by using the protruding bonnet of peripheral formation in luminous zone, can guarantee bonding strength required between bonnet and substrate, and significantly reduce the distance between bonnet and substrate, strengthen the ability that OLED stops that steam oxygen infiltrates, effectively extended the useful life of OLED; Owing to need not attaching in the bonnet luminous zone drier, therefore need be on the bonnet luminous zone etching for attaching the depressed area of drier, can strengthen the mechanical strength of bonnet on the one hand, simplify manufacturing process, on the other hand, when encapsulation OLED, can save the process that attaches drier, package speed is faster.
Because method for packing embodiment is more to the similar content of OLED embodiment, that therefore describes is simpler, and relevant part refers to OLED embodiment part, repeats no more herein.
It should be noted that, in this article, relational terms such as the first and second grades only is used for an entity or operation are separated with another entity or operating space, and not necessarily requires or imply between these entities or operation the relation of any this reality or sequentially of existing.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thereby make the process, method, article or the equipment that comprise a series of key elements not only comprise those key elements, but also comprise other key elements of clearly not listing, or also be included as the intrinsic key element of this process, method, article or equipment.In the situation that not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment that comprises described key element and also have other identical element.
The foregoing is only preferred embodiment of the present invention, be not intended to limit protection scope of the present invention.All any modifications of doing within the spirit and principles in the present invention, be equal to replacement, improvement etc., all be included in protection scope of the present invention.
Claims (8)
1. a display of organic electroluminescence, is characterized in that, comprising:
Substrate, be formed with pixel display area matrix on described substrate;
Bonnet, described bonnet is formed with the luminous zone corresponding with the pixel display area matrix on substrate towards the one side of substrate, described bonnet in periphery, described luminous zone, also comprise the multi-turn of surrounding described luminous zone continuous, by the acid solution by contain concentration be 10%～40% fluorine ion, the projection of etching etching formation in 1～20 minute, the height of described projection is 5～100 μ m, width is 5～200 μ m, and described projection and bonnet are one, and the distance between described projection and substrate is 0.1～2 μ m;
Packaging plastic, be positioned at the contact-making surface of substrate and bonnet, and described packaging plastic is around described luminous zone and the complete covering projection continuous around at least one circle of described luminous zone, and be embedded into the sunk area between projection, and the cross section of described projection is inverted trapezoidal.
2. display of organic electroluminescence as claimed in claim 1, it is characterized in that, described bonnet also is formed with groove between described luminous zone and described projection, and described groove, between described luminous zone and adjacent with a described luminous zone circle projection, is filled with drier in described groove.
3. display of organic electroluminescence as claimed in claim 2, is characterized in that, described groove is continuous or discrete distribution.
4. display of organic electroluminescence as claimed in claim 2, is characterized in that, the degree of depth of described groove is not more than half of bonnet thickness of glass.
5. display of organic electroluminescence as claimed in claim 4, is characterized in that, the degree of depth of described groove is 0.1～0.4mm, and width is 0.1～10mm.
6. the method for packing of a display of organic electroluminescence, it is characterized in that, the bonnet of described display of organic electroluminescence is formed with the luminous zone corresponding with the pixel display area matrix on substrate towards the one side of substrate, described bonnet also comprises that in periphery, described luminous zone the multi-turn of surrounding described luminous zone is continuous, projection that form by etching, the height of described projection is 5～100 μ m, width is 5～200 μ m, described projection and bonnet are one, and the distance between described projection and substrate is 0.1～2 μ m; Described method comprises:
At the peripheral coating in the luminous zone of described bonnet packaging plastic; Described packaging plastic is around described luminous zone and the complete covering projection continuous around at least one circle of described luminous zone, and is embedded into the sunk area between projection, and the cross section of described projection is inverted trapezoidal;
To scribble the bonnet of packaging plastic and substrate contraposition, pressing, and solidify described packaging plastic, described coating packaging plastic, bonnet and substrate contraposition, pressing and cure package glue are all completed in inert atmosphere.
7. method as claimed in claim 6, it is characterized in that, if described bonnet also comprises the groove between described luminous zone and described projection, described groove is between described luminous zone and adjacent with a described luminous zone circle projection,, before described coating packaging plastic, also comprise: in described groove, load drier.
8. method as claimed in claim 6, is characterized in that, the pressure of the inert atmosphere in described pressing and cure package glue process is 0.1～20Torr.
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| CN104538555A (en) * | 2014-12-02 | 2015-04-22 | 深圳市华星光电技术有限公司 | OLED packaging structure and OLED packaging method |
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