CN203300706U - Packaging cover plate of organic electroluminescent device, organic electroluminescent device and display - Google Patents
Packaging cover plate of organic electroluminescent device, organic electroluminescent device and display Download PDFInfo
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- CN203300706U CN203300706U CN201320354221XU CN201320354221U CN203300706U CN 203300706 U CN203300706 U CN 203300706U CN 201320354221X U CN201320354221X U CN 201320354221XU CN 201320354221 U CN201320354221 U CN 201320354221U CN 203300706 U CN203300706 U CN 203300706U
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- cover plate
- encapsulation cover
- organic electroluminescence
- electroluminescence device
- packaging
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Abstract
The utility model provides a packaging cover plate of an organic electroluminescent device, the organic electroluminescent device and a display. The packaging cover plate of the organic electroluminescent device has a packaging surface to be bonded with a substrate through packaging glue, and the periphery of the packaging surface of the packaging cover plate is provided with a groove structure for accommodating the packaging glue. Through the groove structure arranged on the packaging surface of the packaging cover plate, when the packaging cover plate is employed for packaging an OLED, packaging glue for bonding the packaging cover plate with the substrate is filled in the groove structure of the packaging cover plate, the gap between the packaging cover plate and the substrate is greatly minimized, a steam penetrating path is minimized, the packaging effect of the OLED is improved, and the service life of the OLED is prolonged.
Description
Technical field
The utility model includes organic electro luminescent Display Technique field, relates in particular to a kind of encapsulation cover plate, organic electroluminescence device of organic electroluminescence device and the display with this organic electroluminescence device.
Background technology
In recent years, organic electroluminescence device (Organic Light-Emitting Device, OLED) with its luminous soft, near excellent properties such as natural daylight, wide visual angle, fast response time, light and thin, high brightness, high efficiency and active illuminating, in fields such as panchromatic demonstration, backlight and illuminations, become the focus of research.
Organic electroluminescence device is very responsive to water, oxygen content, and the existence of water, oxygen can make component failure.Failure procedure water, oxygen often reacts by pin hole and the metal that is present in device metal negative electrode (being generally Al), metallic cathode is peeled off, pin hole develops into stain gradually, and stain is along with metallic cathode and water, oxygen are peeled off after reacting and increased until whole light-emitting zone gradually.So, in order to intercept the impact on organic electroluminescence device of water, oxygen, need to encapsulate device.
The most general mode adopts exactly encapsulation cover plate (encapsulation cover plate is glass material or other materials) and substrate to carry out bonding mode luminescent device is sealed in to a confined space in inert gas atmosphere, to reach the encapsulation purpose.As shown in Figure 1, the encapsulating face of the encapsulation cover plate 10 of traditional OLED is smooth flat, after on this smooth flat, applying adhesive glue with the involutory device package that completes of substrate 20.Gap between this mode encapsulation cover plate and substrate is large, and OLED encapsulation depends on packaging plastic 30, however packaging plastic 30 have curing defect, porousness, with the defects such as the adhesion of substrate is weak, very large deficiency is arranged on water vapor barrier property.Therefore, should reduce as far as possible the gap between encapsulation cover plate and substrate, the side direction area that minimizing water, oxygen penetrate can effectively increase packaging effect.In prior art, can reduce steam and penetrate by the packaging ring that adopts the projection that glass cement makes is set on the encapsulating face of encapsulation cover plate.This structure fabrication is easy, but shortcoming is glass cement, is high unit price material, adopts the OLED cost of this structure higher, and in addition, the height of the packaging ring of projection is wayward, and when especially height was less than 10 microns, during pressing, the glass clearance evenness degree can be not good.
The utility model content
The purpose of this utility model is to provide a kind of encapsulation cover plate of organic electroluminescence device, the display that has the organic electroluminescence device of this encapsulation cover plate and have this organic electroluminescence device, can improve OLED device package side direction barrier, block water oxygen, to the infiltration of OLED device inside, extends the useful life of OLED device effectively.
Technical scheme provided by the utility model is as follows:
A kind of encapsulation cover plate of organic electroluminescence device, described encapsulation cover plate have for the encapsulating face that bonds by packaging plastic with substrate, and the surrounding of the encapsulating face of described encapsulation cover plate is formed with the groove structure for accommodating packaging plastic.
Preferably, described groove structure comprises first groove in the form of a ring that forms around described encapsulating face surrounding continuously at least.
Preferably, described groove structure comprises the second groove of a curved shape that forms around described encapsulating face surrounding continuously at least.
Preferably, described groove structure also comprise at least one discontinuous around described encapsulating face surrounding form in the form of a ring or curvilinear the 3rd groove.
Preferably, the encapsulating face of described encapsulation cover plate middle part is formed with the containing cavity be used to anode layer, organic luminous layer and the cathode layer that is equipped with organic electroluminescence devices, and described groove structure is formed at the surrounding of described containing cavity.
Preferably, the encapsulation cover plate of described organic electroluminescence device is the glass packaging cover plate, and described groove structure adopts the etching mode to be formed on the encapsulating face of described glass packaging cover plate.
Preferably, the degree of depth of described groove structure is less than 100 microns.
A kind of organic electroluminescence device, comprise substrate, anode layer, organic luminous layer, cathode layer and encapsulation cover plate; Wherein said encapsulation cover plate is encapsulation cover plate as above.
A kind of display, it comprises organic electroluminescence device as above.
The beneficial effects of the utility model are as follows:
Above scheme, by on the encapsulating face of encapsulation cover plate, groove structure being set, when adopting this encapsulation cover plate to carry out the OLED device package, packaging plastic be used to bond encapsulation cover plate and substrate can be filled in the groove structure of encapsulation cover plate, thereby can significantly reduce the gap between encapsulation cover plate and substrate, thereby reduce steam, penetrate path, improve OLED device package effect, extend OLED device useful life.
In further scheme of the present utility model, encapsulation cover plate provided by the utility model adopts the glass packaging substrate, and groove structure adopts the mode of etching to be processed to form, easy to make, depth of groove is easily controlled, and be conducive to the clearance evenness degree between capping substrate and base material, and cost is lower.
The accompanying drawing explanation
Fig. 1 represents the structural representation of traditional OLED device;
Fig. 2 represents the cutaway view of the first embodiment of the encapsulation cover plate of organic electroluminescence device provided by the utility model;
Fig. 3 represents the cutaway view of organic electroluminescence device provided by the utility model;
Fig. 4 represents the front view of the first embodiment of the encapsulation cover plate of organic electroluminescence device provided by the utility model;
Fig. 5 represents the front view of the second embodiment of the encapsulation cover plate of organic electroluminescence device provided by the utility model;
Fig. 6 represents the front view of the 4th kind of embodiment of the encapsulation cover plate of organic electroluminescence device provided by the utility model.
Embodiment
Below in conjunction with accompanying drawing, principle of the present utility model and feature are described, example, only be used to explaining the utility model, is not intended to limit scope of the present utility model.
Figure 2 shows that the cutaway view of the encapsulation cover plate of the organic electroluminescence device that the utility model provides.As shown in Figure 2, the utility model provides a kind of encapsulation cover plate 100 of organic electroluminescence device, described encapsulation cover plate 100 has for the encapsulating face 101 that bonds by packaging plastic with substrate, and the surrounding of described encapsulating face 101 is formed with the groove structure 102 for accommodating described packaging plastic.
Wherein, the middle part of encapsulation cover plate 100 can also be provided with a containing cavity 103 for the anode layer, organic luminous layer and the cathode layer that hold the OLED device, and groove structure 102 is formed at the surrounding of described containing cavity 103.
Figure 3 shows that the structure cutaway view of the OLED device that adopts encapsulation cover plate 100 of the present utility model.As shown in Figure 3, when adopting encapsulation cover plate 100 of the present utility model to carry out the OLED device package, the luminescent device body 300 that is comprised of anode layer, organic luminous layer and cathode layer in the OLED device is placed in the containing cavity 103 of encapsulation cover plate 100, and be filled in this containing cavity 103 with fixing described luminescent device body 300 by packaging plastic, and in the groove structure 102 of encapsulating face 101 surroundings of encapsulation cover plate 100, also be filled with packaging plastic, so that encapsulation cover plate 100 and substrate 200 bondings are got up, thereby complete device package.Due to packaging plastic, be filled in the groove structure 102 of encapsulation cover plate 100, making gap between the substrate 200 of encapsulation cover plate 100 and OLED device, minimum (traditional OLED device package cover plate 100 can reach 10～30mm with substrate 200 gaps, adopt the encapsulation cover plate 100 of the OLED device of encapsulation cover plate 100 of the present utility model can be decreased to less than 5 μ m with substrate 200 gaps), therefore, the side direction area that extraneous water oxygen can penetrate in packaging reduces, effectively reduce thus water oxygen and penetrate path, improve the barrier of OLED device.
It should be noted that, in actual applications, on encapsulation cover plate 100, also can not be provided for the containing cavity 103 of anode layer, organic luminous layer and the cathode layer of accommodating OLED device, but coordinate and get final product with the substrate 200 of the OLED device that is provided with containing cavity 103.
In addition, groove structure 102 specific implementations on the encapsulation cover plate 100 of organic electroluminescence device provided by the utility model can have following several.
Be illustrated in figure 4 the front view of the first embodiment of encapsulation cover plate 100 provided by the utility model.As shown in Figure 4, in the first embodiment provided by the utility model, in the groove structure 102 on encapsulation cover plate 100, only comprise first a groove 102a in the form of a ring who forms around encapsulating face 101 surroundings of described encapsulation cover plate 100 continuously.Adopt such scheme, due to encapsulating face 101 surroundings of the first groove 102a continued circling encapsulation cover plate 100, can guarantee that the surrounding of encapsulation cover plate 100 and the gap between substrate 200 are even, to improve the surrounding side direction barrier of OLED device.
Be illustrated in figure 5 the front view of the second embodiment of encapsulation cover plate 100 provided by the utility model.As shown in Figure 5, in the second embodiment provided by the utility model, the groove structure 102 on encapsulation cover plate 100 comprises many first groove 102a in the form of a ring that are surrounded on continuously the encapsulating face 101 surroundings formation of described encapsulation cover plate 100.Adopt such scheme can guarantee further that steam can not infiltrate in the OLED device.
In the third embodiment provided by the utility model, the groove structure 102 on encapsulation cover plate 100 comprises the second groove of the curved shape that at least one encapsulating face 101 surroundings that are surrounded on continuously described encapsulation cover plate 100 form.Adopt such scheme, the second groove of curved shape, at least around 101 1 weeks of encapsulating face, all reduces to guarantee encapsulation cover plate 100 and the surrounding gap of substrate 200.Should be understood that, in actual applications, the quantity of the second groove of curved shape also can be many, at this, the quantity of the second groove is not limited.
Be illustrated in figure 6 the front view of the 4th kind of embodiment of encapsulation cover plate 100 provided by the utility model.As shown in Figure 6, in the 4th kind of embodiment provided by the utility model, described groove structure 102 comprise at least one continuously around the surrounding of described encapsulating face form in the form of a ring or curvilinear first groove 102a(Fig. 6 the first groove 102a structure in the form of a ring only is shown), can also comprise discontinuous the 3rd groove 102b in the form of a ring that described encapsulating face 101 surroundings form that is surrounded on.It should be noted that, in actual applications, the quantity of the 3rd groove also can be many, at this, the quantity of the 3rd groove is not limited.In addition, also it should be noted that, the 3rd groove can be also the surrounding that curved shape is surrounded on encapsulating face.
In addition, also it should be noted that, above-described embodiment only has been to provide several preferred implementations of encapsulation cover plate 100, and in actual applications, the concrete structure of groove structure 102 can be also the combination of above-mentioned several embodiment, also can be not limited to above-described embodiment.
In addition, in the encapsulation cover plate 100 of organic electroluminescence device provided by the utility model, preferably, this encapsulation cover plate 100 is the glass packaging cover plate 100 of glass material, and the groove structure 102 on this encapsulation cover plate 100 adopts the etched mode of exposure imaging to be processed to form.Adopt such scheme, make simply, cost is lower, and the degree of depth of groove structure 102 and width easily control, and is conducive to the clearance evenness degree between glass packaging cover plate 100 and substrate 200.
In addition, in the encapsulation cover plate 100 of organic electroluminescence device provided by the utility model, preferred, the depth H of groove structure 102 is no more than 100 μ m, can reduce thus due to the existence of groove structure 102 impact on the intensity of encapsulation cover plate 100.And in actual applications, the width of groove structure 102 can in the situation that do not affect the intensity of encapsulation cover plate 100, be adjusted according to the size of encapsulation cover plate 100.
In addition, as shown in Figure 2, in the utility model embodiment, also provide a kind of organic electroluminescence device, it comprises substrate 200, anode layer, organic luminous layer and cathode layer and encapsulation cover plate provided by the utility model 100.
In addition, in the utility model embodiment, also provide a kind of display with above-mentioned organic electroluminescence device.
It is more than preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection range of the present utility model.
Claims (9)
1. the encapsulation cover plate of an organic electroluminescence device, described encapsulation cover plate have for substrate by the encapsulating face that packaging plastic bonds, it is characterized in that, the surrounding of the encapsulating face of described encapsulation cover plate is formed with the groove structure for accommodating described packaging plastic.
2. the encapsulation cover plate of organic electroluminescence device according to claim 1, is characterized in that,
Described groove structure comprises first groove in the form of a ring that forms around described encapsulating face surrounding continuously at least.
3. the encapsulation cover plate of organic electroluminescence device according to claim 1, is characterized in that,
Described groove structure comprises the second groove of a curved shape that forms around described encapsulating face surrounding continuously at least.
4. the encapsulation cover plate of organic electroluminescence device according to claim 2, is characterized in that,
Described groove structure also comprise at least one discontinuous around described encapsulating face surrounding form in the form of a ring or curvilinear the 3rd groove.
5. the encapsulation cover plate of organic electroluminescence device according to claim 1, is characterized in that,
The encapsulating face middle part of described encapsulation cover plate is formed with the containing cavity be used to anode layer, organic luminous layer and the cathode layer that is equipped with organic electroluminescence devices, and described groove structure is formed at the surrounding of described containing cavity.
6. the encapsulation cover plate of organic electroluminescence device according to claim 1, is characterized in that,
The encapsulation cover plate of described organic electroluminescence device is the glass packaging cover plate, and described groove structure adopts the mode of etching to be formed on the encapsulating face of described glass packaging cover plate.
7. the encapsulation cover plate of organic electroluminescence device according to claim 1, is characterized in that, the degree of depth of described groove structure is less than 100 microns.
8. an organic electroluminescence device, comprise substrate, anode layer, organic luminous layer, cathode layer and encapsulation cover plate; It is characterized in that, described encapsulation cover plate is encapsulation cover plate as described as claim 1 to 7 any one.
9. a display, is characterized in that, comprises organic electroluminescence device as claimed in claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320354221XU CN203300706U (en) | 2013-06-19 | 2013-06-19 | Packaging cover plate of organic electroluminescent device, organic electroluminescent device and display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320354221XU CN203300706U (en) | 2013-06-19 | 2013-06-19 | Packaging cover plate of organic electroluminescent device, organic electroluminescent device and display |
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| CN203300706U true CN203300706U (en) | 2013-11-20 |
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| CN201320354221XU Expired - Lifetime CN203300706U (en) | 2013-06-19 | 2013-06-19 | Packaging cover plate of organic electroluminescent device, organic electroluminescent device and display |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325958A (en) * | 2013-06-19 | 2013-09-25 | 京东方科技集团股份有限公司 | Organic light-emitting device packaging cover plate, organic light-emitting device and displayer |
| CN105576148A (en) * | 2016-01-04 | 2016-05-11 | 京东方科技集团股份有限公司 | Package method of organic light emitting diode (OLED) display panel, OLED display panel and OLED display device |
| CN106960919A (en) * | 2016-01-12 | 2017-07-18 | 三星显示有限公司 | The manufacture method of display device |
| CN107994130A (en) * | 2017-11-27 | 2018-05-04 | 合肥京东方光电科技有限公司 | A kind of OLED display device and its method for packing |
| CN108987602A (en) * | 2017-12-13 | 2018-12-11 | 广东聚华印刷显示技术有限公司 | The encapsulating structure and production method of organic electroluminescence device |
-
2013
- 2013-06-19 CN CN201320354221XU patent/CN203300706U/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325958A (en) * | 2013-06-19 | 2013-09-25 | 京东方科技集团股份有限公司 | Organic light-emitting device packaging cover plate, organic light-emitting device and displayer |
| WO2014201759A1 (en) * | 2013-06-19 | 2014-12-24 | 京东方科技集团股份有限公司 | Packaging cover plate for organic electroluminescent device, organic electroluminescent device and display |
| CN105576148A (en) * | 2016-01-04 | 2016-05-11 | 京东方科技集团股份有限公司 | Package method of organic light emitting diode (OLED) display panel, OLED display panel and OLED display device |
| CN106960919A (en) * | 2016-01-12 | 2017-07-18 | 三星显示有限公司 | The manufacture method of display device |
| CN106960919B (en) * | 2016-01-12 | 2021-06-04 | 三星显示有限公司 | Method for manufacturing display device |
| CN107994130A (en) * | 2017-11-27 | 2018-05-04 | 合肥京东方光电科技有限公司 | A kind of OLED display device and its method for packing |
| CN107994130B (en) * | 2017-11-27 | 2019-08-09 | 合肥京东方光电科技有限公司 | A kind of OLED display device and its packaging method |
| US10559783B2 (en) | 2017-11-27 | 2020-02-11 | Boe Technology Group Co., Ltd. | Display device and method of producing the same |
| CN108987602A (en) * | 2017-12-13 | 2018-12-11 | 广东聚华印刷显示技术有限公司 | The encapsulating structure and production method of organic electroluminescence device |
| CN108987602B (en) * | 2017-12-13 | 2020-07-10 | 广东聚华印刷显示技术有限公司 | Packaging structure of organic electroluminescent device and manufacturing method |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
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Granted publication date: 20131120 |