CN106960919A - The manufacture method of display device - Google Patents
The manufacture method of display device Download PDFInfo
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- CN106960919A CN106960919A CN201710022471.6A CN201710022471A CN106960919A CN 106960919 A CN106960919 A CN 106960919A CN 201710022471 A CN201710022471 A CN 201710022471A CN 106960919 A CN106960919 A CN 106960919A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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Abstract
The present invention provides a kind of manufacture method of display device.The present invention includes the steps：Display part is formed on the first face of first substrate；In the state of cooling second substrate, high-temperature component is contacted to the marginal position on the second face of second substrate, so that the marginal position formation groove on the second face of second substrate；And second substrate is arranged in the way of the formation slotted second of second substrate is facing to the display part on first substrate, so that the seal member being located between first substrate and second substrate is contacted with groove.
Description
Technical field
Embodiments of the invention are related to a kind of manufacture method of display device, can improve close in particular to one kind
Seal the manufacture method of the display device of characteristic and mechanical strength.
Background technology
With the prosperity of information technology, as the connection medium between user and information display device market also therewith
Increase.These display devices are just developed in various form, wherein, organic light-emitting display device is as with such as slim
The display device of the excellent performance such as change, lightweight, low power consumption and attract attention.
Organic light-emitting display device possesses organic illuminating element in its viewing area, this organic illuminating element easily by
The influence of moisture and oxygen, it is therefore necessary to prevent the organic illuminating element caused by moisture-inhibiting and/or oxygen flow
Deterioration.Be used as one of above-mentioned method, it is possible to use seal member and engage upper substrate and lower basal plate, however,
In recent years in order to reduce the dead band (dead space) of organic light-emitting display device, the width for being used to reduce seal member is carried out
Various trial.
The content of the invention
However, for the situation of the manufacture method of existing flexible display apparatus, reducing the width of seal member
During, it there is the problem of bonding force between upper and lower base plate may be reduced.
The present invention is proposed to solve the various problems including above-mentioned the problem of, its object is to there is provided
A kind of manufacture method for the display device that can improve sealing characteristics and mechanical strength.But this problem is merely exemplary
, the scope of the present invention is not limited thereto.
According to the one side of the present invention, the present invention provides a kind of manufacture method of display device.Its method includes following
Step：Display part is formed on the first face of first substrate；In the state of cooling second substrate, to the second face of second substrate
On marginal position contact high-temperature component so that on the second face of second substrate marginal position formation groove；And with second
Being formed for substrate slotted second arranges second substrate facing to the mode of the display part on first substrate, so that being located in the
Seal member between one substrate and second substrate is contacted with groove.
Groove can round the central portion of second substrate.
The step of forming the groove can be the step of forming groove as follows：It is arranged in the second face of second substrate
During into towards display part on first substrate, groove is set to be arranged in the outside of display part.
The step of forming the groove can be the steps：In the second face of second substrate, high-temperature component is contacted
Partial at least a portion is peeled off；Or in the second face of second substrate, make at least a portion of the part of high-temperature component contact
Plastic deformation.
When contacting high-temperature component, while high-temperature component is touched second substrate, it is possible to use high-temperature component pair
Second substrate is pressurizeed.
Second substrate can include glass material.
Second substrate can include alkali-free glass material；And the step of formation groove can be the steps：
Second face of second substrate, makes at least a portion plastic deformation of the part of high-temperature component contact.
The temperature of high-temperature component can be more than the glass transition temperature (Tg) of second substrate.
When cooling down second substrate, second substrate can be cooled to less than 50 DEG C.
When cooling down second substrate, second substrate can be made to touch low-temperature components.
Groove can have bar shaped (strip) shape.
The width of groove can be less than 1000 μm, and depth can be less than 100 μm.
Groove can include multiple pilot trench.
Seal member can include organic matter.
It can also comprise the following steps：In the state of cooling first substrate, the edge on the first face of first substrate
Position contacts high-temperature component, so as to form extra groove on the marginal position on the first face of first substrate.
Described can be the steps the step of form the extra groove：So that extra groove is the of first substrate
Simultaneously the upper mode on the outside of display part forms extra groove.
According to the one embodiment of the invention constituted in method as described above, it is possible to achieve one kind can carried easily
The manufacture method of the display device in dead band can also be reduced while high sealing characteristic and mechanical strength.Certainly, it is of the invention
Scope is not limited to such effect.
Brief description of the drawings
Fig. 1 is to be diagrammatically denoted by utilizing being manufactured according to the manufacture method of the display device of one embodiment of the invention
The plan of display device.
Fig. 2 is the profile along Fig. 1 II-II' lines interception.
Fig. 3 to Fig. 7 is the profile of the manufacturing process for the display device for being diagrammatically denoted by Fig. 1.
Fig. 8 a and Fig. 8 b are the profiles of the example for the manufacturing process for showing Fig. 4.
Fig. 9 is the profile for being diagrammatically denoted by display device according to another embodiment of the present invention.
Figure 10 is the profile for being diagrammatically denoted by display device according to still another embodiment of the invention.
Figure 11 is the profile of one of the display part for being diagrammatically denoted by Fig. 1.
Symbol description
1000：Display device 100：First substrate
110：Second substrate 200：Display part
300：Seal member G：Groove
11：Low-temperature components 15：High-temperature component
16：Main part 17：Contact site
18：High frequency induction heater 19：Induction coil
Embodiment
The present invention can implement various conversion, it is possible to various embodiments, be shown in the drawings below specific
Embodiment, and in detailed description pin the present invention is described in detail.But its purpose and do not lie in and make limitation of the present invention
In specific form of implementation, it should be appreciated that it is all that thought of the present invention comprising the present invention and technical scope are included
Conversion, equivalent and substitute.When the present invention will be described, if it is determined that being carried out for related known technology
Illustrate to the present invention purport bring confusion, then save detail explanation.
The term of " first " as used in this specification, " second " etc. is used to describe various inscape, but
It is that such inscape should not be limited by terms above.Terms above is only used for will by an inscape and another composition
Element is distinguished.
Be described as in this manual the components such as layer, film, region, plate positioned at another component " on " or when " top ", this
Not only include the situation positioned at another component " immediately above ", the also situation including being provided with another component in the middle of it.
The x-axis, y-axis and z-axis used in this manual are not limited to three axles of rectangular coordinate system, can be by comprising this
Broadly explained to look like.For example, x-axis, y-axis and z-axis can be perpendicular to one another, or mutual out of plumb can be represented not
Same direction.
Hereinafter, embodiments in accordance with the present invention are described in detail referring to the drawings, and referring to the drawings to this hair
It is bright when illustrating, identical reference numeral will be assigned for substantially the same or corresponding inscape, and save pair
Its repeat specification.In the accompanying drawings, in order to multiple layers and region be clearly shown and enlarged representation its thickness.And attached
In figure, part layer and the thickness in region are illustrated for convenience of explanation and turgidly.
Fig. 1 is to be diagrammatically denoted by utilizing showing for manufacturing according to the display device manufacturing method of one embodiment of the invention
The plan of showing device；Fig. 2 is the profile along Fig. 1 II-II' lines interception.
Reference picture 1 and Fig. 2, possess first substrate 100, second according to the display device 1000 of one embodiment of the invention
Substrate 110, display part 200 and seal member 300.Second substrate 110 has to be arranged in the way of being contacted with seal member 300
Groove G (Groove).
First substrate 100 can be formed by glass material, plastic material and metal material etc..
Display part 200 is disposed with first face P1 of first substrate 100.To this particular content will reference picture 11 and
Hereinafter illustrate.
Second substrate 110 be arranged in first substrate 100 formation have display part 200 the first face P1 top.Accordingly,
First face P1 of one substrate 100 and the second face of second substrate 110 will be formed to.Second substrate 110 can be by with first
The identical material of substrate 100 is formed.Hereinafter, the situation of glass material is included in using first substrate 100 and second substrate 110
The heart and illustrate.This is also applied for following embodiments and its variation.
Second substrate 110 possesses groove G in its second face P2 marginal position.In order in the second face P2 of second substrate 110
Upper formation groove G, can use various methods such as Laser Processing, etching, but in the display according to one embodiment of the invention
In the manufacture method of device 1000, local add is carried out using the second face P2 of the second substrate 110 to being cooled to below normal temperature
Heat and remove the method for a part for second substrate 110 and form groove G.In this regard, will reference picture 4 and hereinafter retouched
State.
Seal member 300 is located between first substrate 100 and second substrate 110, so that by first substrate 110 and second
Substrate 110 is engaged.Now, seal member 300 in the way of the display part 200 for surrounding first substrate 100 to arrange.Accordingly, show
Portion 200 can be sealed by seal member 300, first substrate 100 and second substrate 110, so as to prevent to display
The phenomenons such as moisture-inhibiting, the oxygen flow in portion 200.
Seal member 300 can be arranged to and be arranged in the one of the distribution (not shown) of the marginal position of first substrate 100
Partly overlap.The distribution can perform following function：To the thin film transistor (TFT) (not shown) for being provided to display part 200 and
Organic illuminating element (OLED) applies electric signal and voltage.Now, the distribution and the drive division for driving the distribution
(not shown) can be connected to the pad PAD portions being arranged on first substrate 100.As described above, by making seal member 300
In with the position with line overlap, the dead band (dead space) of display device 1000 can be reduced.
As one, seal member 300 can be formed using inorganic matters such as frit (frit) etc..As another
Example, seal member 300 can be formed using organic matters such as thermosetting resins, or can utilize organic/inorganic composite material
And be formed.
Seal member 300 can be formed by such a way：In the one side of first substrate 100 or second substrate 110
On formed along the marginal position of substrate after seal member pattern, on the pattern irradiate laser and melted,
Hardened again afterwards.However, being formed at the situation of the marginal position on first substrate 100 with pattern in the seal member
Under, when irradiating laser with pattern to the seal member, the deterioration of display part 200 may be triggered, it is therefore desirable to note.With
Under, for convenience of description, center is used as using the situation that the marginal position on second substrate 110 forms the seal member pattern
And illustrate.This is equally applicable to following embodiments and its variation.
Seal member 300 touches the second base in the state of filling is formed at the second face P2 of second substrate 110 groove G
Plate 110.So as to which the contact area of seal member 300 and second substrate 110 will broaden.As described above, because of seal member 300
Contact area between second substrate 110 is broadened, and the bonding force between seal member 300 and second substrate 110 can be obtained
Improve.And then, the sealing characteristics and mechanical strength of display device 1000 can be improved.
As described above, as the contact area of seal member 300 and second substrate 110 broadens, seal member 300 not only may be used
To be formed using the material similar with the material of second substrate 110, it can also utilize different from the material of second substrate 110
Material and formed.For example, in the case where second substrate 110 includes glass material, seal member 300 can not only be utilized and the
The similar frit of the materials of two substrates 110 and formed, the organic matters different from the material of second substrate 110 can also be utilized
And formed.Furthermore, it is possible to the width of seal member 300 is correspondingly reduced with the raising degree of the bonding force of seal member 300, because
This can reduce the dead band of display device 1000.
As seal member 300 is contacted with the groove G of second substrate 110, groove G will be as seal member 300 by shape
Surrounded into the display part 200 in the central portion of first substrate 100, and positioned at the outside of display part 200.Therefore, groove G is with will be with first
100 pairs of substrate to the mode that rounds of central portion of second substrate 110 be arranged in the second face P2 of second substrate 110.
Fig. 3 to Fig. 7 is the profile of the manufacturing process for the display device for being diagrammatically denoted by Fig. 1.
First, as shown in figure 3, preparing first substrate 100, and display part is formed on the first face P1 of first substrate 100
200.Now, display part 200 is formed in the way of the central portion on the first face P1 positioned at first substrate 100.
Afterwards, as shown in figure 4, preparing second substrate 110, and second substrate 110 is cooled down.In cooling second substrate 110
Under state, contact high-temperature component 15 to add second substrate 110 to the marginal position on the second face P2 of second substrate 110
Heat.So as to which the part contacted in the high-temperature component 15 with second substrate 110 forms groove G.Now, second substrate 110 can be included
Glass material.
Various method can be utilized in order to cool down second substrate 110.That is, second substrate 110 is being kept into low temperature
Place is stacked the scheduled time, or second substrate 110 can be contacted on the part for keeping low temperature.Now, in order to prevent second
The temperature of substrate 110 rises in technical process, it is preferable that such as the latter, make second substrate 110 contacted with low-temperature components 11 and
Constantly cool down second substrate 110.
As described above, second substrate 110 can be cooled down in the state of being contacted with low-temperature components 11.Here, so-called
Second substrate 110 is cooled down, it is meant that the temperature of second substrate 110 gets lower than the temperature of periphery.Now, to the second base
For plate 110, the region for forming groove G optionally can also be only cooled down, but on temperature control this respect, is cooled down whole
Individual second substrate 110 is likely more stabilization.
Low-temperature components 11 can be maintained below the temperature of normal temperature, but in view of the temperature of Work places, low-temperature components
11 may remain in less than 50 DEG C.If, can be on second substrate 110 however, as little as less than 0 DEG C of the temperature of low-temperature components 11
Generation dew condensation phenomenon, or excessive energy can be needed in order to realize cooling, it is therefore desirable to note.
High-temperature component 15 can touch the regional area C of second substrate 110, so as to heat the partial zones in a short time
Domain C.This high-temperature component 15 can have a variety of, but be used as one, it is possible to use the high temperature based on high-frequency induction heating mode
Part.Hereinafter, more specific detail is carried out to the high-temperature component 15 based on high-frequency induction heating mode.
High-temperature component 15 can include the contact with the cone shape for being formed at the one end of main part 16 of shaft-like main part 16
Portion 17.The other end of main part 16 is fixed on substrate (Base) 14, so as to can support master when being contacted with second substrate 110
Body portion 16.In addition, main part 16 is heated by means of being connected to the induction coil of high frequency induction heater 18.This high frequency
Induction heating mode causes to utilize the inductor for the centre for being located at the coil for flowing through high frequency electric because electromagnetic induction is acted on
Vortex flow and some hysteresis (hysteresis) heat loss and by the method for the phenomenon of instant heating, the master of high-temperature component 15
The inductor that body portion 16 is corresponded in the middle of the coil.Energy efficient can be concentrated on and passed through by high frequency induction heater 18
The high-temperature component 15 of logical induction coil 19, rises so as to the temperature that makes high-temperature component 15 in a short time, and prevents and the
The reduction of the temperature of the high-temperature component 15 caused by contact between two substrates 110.
So-called high-temperature component 15 is contacted with the second face P2 of second substrate 110, it is meant that the contact site 17 of high-temperature component 15
The second face P2 of second substrate 110 is physically contacted.In addition, contact site 17 with predetermined pressure to the second of second substrate 110
Face P2 is pressurizeed, to adjust the width for the groove G for being formed at second substrate 110.Now, if contact site 17 is to second substrate
110 hypertonia applied, then may reduce the intensity of second substrate 110, and seriously second substrate 110 may be drawn
Play damage.If on the contrary, the hypotony that contact site 17 applies to second substrate 110, may reduce second substrate 110
Processing property.As one, high-temperature component 15 can be implemented to pressurize with 0.1kgf/cm2 to 3.0kgf/cm2 degree pressure.
The glass transition temperature for the glass material that the temperature of high-temperature component 15 will be included with second substrate 110
Value more than (Tg, glass transition temperature).Become easy for the processing that makes second substrate 110, high temperature
The glass transition temperature (Tg) that part 15 can remain the glass material included than second substrate 110 is high 50 DEG C to 500
The temperature of DEG C degree.As one, the temperature of high-temperature component 15 can be more than 1200 DEG C.As one, with second substrate 110
The regional area C of part that contacts of high-temperature component 15 be exposed to more than 1200 DEG C of high temperature, so as in a short time must
To heating.
If as described above, the regional area C of second substrate 110 is heated to more than glass transition temperature,
On two substrates 110, will occur temperature difference between the low-temperature region around regional area C and regional area C.Accordingly, with
Centered on the regional area C of two substrates 110, at least a portion of second substrate 110 may be stripped or occur plasticity change
Shape.Reference picture 8a and Fig. 8 b are described below on this particular content.
Afterwards, as shown in figure 5, centered on the regional area C of second substrate 110, at least a portion of second substrate 110
It is stripped or is plastically deformed, so as to forms groove G on the second face P2 of second substrate 110.Now, if excessive landform
Grooving G, then may reduce the intensity of second substrate 110, if on the contrary, very few landform grooving G, with seal member 300 it
Between contact area or bonding force be unable to reach desired level.Accordingly, it is considered to intensity to second substrate 110, with
Bonding force, the width of seal member 300 between seal member 300 etc., can make groove G less than 1000 μm of width formation, and
Groove G depth is set to be formed as less than 100 μm.
In addition, the relatively-high temperature part 15 of second substrate 110 carries out relative motion, so as to form bar shaped (strip) shape
The groove G of shape.Referring again to Fig. 4, second substrate 110 will in the state of high-temperature component 15 is fixed along X-direction with
And its opposite direction is moved.In addition, second substrate 110 can be in the state of high-temperature component 15 be fixed along the second base
The width motion of plate 110, i.e. moved along perpendicular to the direction of X/Y plane (Fig. 1 Z-direction and its opposite direction).
, can be in the state of second substrate 110 be fixed however, be not necessarily limited to this, high-temperature component 15 is along X-direction
And the motion of its opposite direction, or can also be moved along Z-direction and its opposite direction.Such second substrate 110 and
The translational speed of high-temperature component 15 be contemplated that groove shape, the species of glass material, temperature difference, pressure differential, productivity etc. and by
It is adjusted to appropriate value.As described above, with the motion of second substrate 110 and/or high-temperature component 15, groove G can be formed
For with bar shaped (strip) shape.As one, in the state of high-temperature component 15 is fixed on substrate 14, with the second base
Plate 110 is moved along X-direction, it will second substrate 110 marginal position formation groove G, and this groove G can have along
Bar shaped (strip) shape formed by X-direction extension.
Afterwards, it will such as Fig. 6 and as shown in Figure 7, with the marginal position institute shape for the second face P2 for filling second substrate 110
Into groove G mode form seal member pattern 301.Then, making the formation of second substrate 110 has seal member pattern
301 the second face P2 and first substrate 100 formation have the first face P1 of display part 200 to after, make first substrate 100 with
And second substrate 110 is engaged by seal member with pattern 301.
Fig. 8 a and Fig. 8 b are the profiles of the example for the manufacturing process for showing Fig. 4.
As one, shown in such as Fig. 8 a (i), if contacting high-temperature component 15 on the second face P2 of second substrate 110
Contact site 17, then contact site 17 will pressurize to the second face (P2) of second substrate 110, and hastily heat the second base
The regional area C of plate 110.Accordingly, will between regional area C and regional area C peripheral region in second substrate 110
Generation temperature difference.Due to this temperature difference, the high-temperature area HA centered on regional area C shows the tendency to be expanded, position
Low-temperature region LA around high-temperature area HA shows the relative tendency to be shunk.
Accordingly, as shown in Fig. 8 a (ii), at least a portion of the second substrate 110 centered on regional area C by
Higher rock deformation pressure and moment is stripped, accordingly, groove G can be formed on second substrate 110.Now, second substrate 110 can be with
Including the higher soda lime of thermal coefficient of expansion (soda-lime) glass material.
As another example, shown in such as Fig. 8 b (i), if the regional area C' on second substrate 110' the second face P2'
Contacted with the contact site 17 of high-temperature component 15, then due to the pressure that contact site 17 applies, second substrate 110' regional area C'
It will be plastically deformed.Now, second substrate 110' can be relatively lower than Fig. 8 a second substrate 110 comprising thermal coefficient of expansion
Glass material.For example, second substrate 110' can include alkali-free glass material.Therefore, second substrate 110' will be carried out not
The deformation for the form being same as shown in Fig. 8 a.That is, at least a portion of the second substrate 110' centered on regional area C' will
It is recessed because of the pressure applied of high-temperature component 15 with the shape of the contact site 17 corresponding to high-temperature component 15, rather than because of temperature
The rising of degree and be inflated.
Accordingly, as shown in Fig. 8 b (ii), at least a portion quilt of the second substrate 110b' centered on regional area C'
Depression, so that groove G' can be formed on second substrate 110'.Now, it may be formed because of the pressure applied of high-temperature component 15
The protrusion PR' abutted with groove G'.
Fig. 9 is the profile for being diagrammatically denoted by display device according to another embodiment of the present invention；Figure 10 is outline
Represent to property the profile of display device according to still another embodiment of the invention.
First, multiple pilot trench G1, G2 be could be formed with reference picture 9, second substrate 110a the second face P21.Accordingly, may be used
To extend the contact area between second substrate 110a and seal member 300a, so as to further increase second substrate 110a and close
The bonding force sealed between part 300a.Therefore, it is possible to which more sealing is formed on first substrate 100a the first face P11 securely
Display part 200a.
In order to form multiple pilot trench G1, G2 on second substrate 110a, the high-temperature component for heating second substrate 110a
(not shown) can contact many sub- regional area C1, C2 on second substrate 110a the second face P21.Now, high temperature
Part can possess multiple contact sites, son can also be formed by multiple process by the high-temperature component with a contact site
Groove G1, G2.
Reference picture 10, can be to touch the top of high-temperature component (not shown) in second substrate 110b the second face P22
Upper slot G3 is formed centered on regional area C3, while in first substrate 100b the first face P12, can be described to touch
Lower channel G4 is formed centered on the bottom regional area C4 of high-temperature component.Now, lower channel G4 it is relative with upper slot G3 to and
Arrangement.Accordingly, it can not only increase the bonding force between second substrate 110b and seal member 300b, can also increase first substrate
Bonding force between 100b and seal member 300b, so as to which more sealing is formed at the first of first substrate 100b securely
Display part 200b on the P12 of face.
In order to form lower channel G4 on first substrate 100b, reference picture 4 will cool down first substrate as described above
In the state of 100b, the high-temperature component is contacted to first substrate 100b bottom regional area C4, so as to first substrate
100b is heated.Afterwards, at least a portion of the first substrate 100b centered on the regional area C4 of bottom be stripped or
It is plastically deformed, so that lower channel G4 can be formed.In the process, the display to prevent from being arranged on first substrate 100b
Portion 200 is deteriorated, it is preferable that in the step of before display part 200 is formed, lower channel G4 is formed on first substrate 100b.
If as described above, using the manufacture method for the display device for according to of the invention one being embodiment, not only may be used
To improve the sealing characteristics and mechanical strength of display device, the dead band of display device can also be reduced.
Figure 11 is the profile of one of the display part for being diagrammatically denoted by Fig. 1.
Various form can be had according to the species of display device by being provided to the display element of display part 200.Hereinafter,
For convenience of explanation, illustrate centered on the situation that will possess organic illuminating element OLED as display element.
Reference picture 11, on first substrate 100, such as cushion 51, gate insulating film (gate insulating
Film) 53, the common layer such as interlayer dielectric 55 can be formed at the whole surface of first substrate 100, may also be formed with by pattern
The semiconductor layer 52 of change, the semiconductor layer 52 being patterned includes channel region 52a, source contact (sourc
Contact) region 52b and drain contact (Drain contact) region 52c, furthermore, it is possible to be formed with this by pattern
The semiconductor layer of change together constitutes with gate electrode 54, source electrode 56 and the drain electrode 57 of thin film transistor (TFT) TFT inscape.
In addition, diaphragm 58 and planarization film 59 are could be formed with the whole surface of first substrate 100, the protection
Film 58 is used to cover the thin film transistor (TFT) TFT, and the planarization film 59 is located on diaphragm 58, and its upper surface be bordering on it is flat
It is smooth.This planarization film 59 can be by so as to form, its organic illuminating element in the way of organic illuminating element OLED portions disposed thereon
OLED is included：The pixel electrode 61 of patterning, correspond roughly to first substrate 100 whole surface counter electrode 63 and
The intermediate layer 62 of sandwich construction, is located between pixel electrode 61 and counter electrode 63, and include luminescent layer.
Certainly, intermediate layer 62 can be with situation as depicted differently, and its part layer can correspond roughly to first
The common layer of the whole surface of substrate 100, another part layer can be to be patterned with the corresponding mode of pixel electrode 61
Patterned layer.Pixel electrode 61 can be electrically connected to thin film transistor (TFT) TFT by through hole.Of course, it is possible to shape as follows
Into on planarization film 59：Cover the marginal position of pixel electrode 61 and with the pixel for the opening for defining each pixel region
Define the whole surface that film 60 corresponds roughly to first substrate 100.
So, although a shown embodiment describes the present invention referring to the drawings, however this be it is exemplary, such as
Fruit is the personnel in this area with common knowledge, then it is to be understood that thus carrying out various deformation and embodiment
Deformation.Therefore, really technical protection scope should be determined the present invention by the technological thought of appended claims.
Claims (16)
1. a kind of manufacture method of display device, including the steps：
Display part is formed on the first face of first substrate；
In the state of cooling second substrate, high-temperature component is contacted to the marginal position on the second face of second substrate, so that
Marginal position formation groove on second face of second substrate；And
Second substrate is arranged in the way of the formation slotted second of second substrate is facing to the display part on first substrate, so that
Make to be located in the seal member between first substrate and second substrate to contact with groove.
2. the manufacture method of display device as claimed in claim 1, wherein,
Groove rounds the central portion of second substrate.
3. the manufacture method of display device as claimed in claim 1, wherein,
The step of forming the groove is the step of forming groove as follows：It is arranged in the second face of second substrate towards the
During display part on one substrate, groove is set to be arranged in the outside of display part.
4. the manufacture method of display device as claimed in claim 1, wherein,
The step of forming the groove is the steps：
In the second face of second substrate, at least a portion for the part that high-temperature component is contacted is peeled off；Or in second substrate
Second face, makes at least a portion plastic deformation of the part of high-temperature component contact.
5. the manufacture method of display device as claimed in claim 1, wherein,
When contacting high-temperature component, while high-temperature component is touched second substrate, using high-temperature component to second substrate
Pressurizeed.
6. the manufacture method of display device as claimed in claim 1, wherein,
Second substrate includes glass material.
7. the manufacture method of display device as claimed in claim 6, wherein,
Second substrate includes alkali-free glass material；
The step of forming the groove is the steps：In the second face of second substrate, make the part that high-temperature component is contacted extremely
Few part plastic deformation.
8. the manufacture method of display device as claimed in claim 6, wherein,
The temperature of high-temperature component is more than the glass transition temperature of second substrate.
9. the manufacture method of display device as claimed in claim 1, wherein,
When cooling down second substrate, second substrate is cooled to less than 50 DEG C.
10. the manufacture method of display device as claimed in claim 1, wherein,
When cooling down second substrate, second substrate is set to touch low-temperature components.
11. the manufacture method of display device as claimed in claim 1, wherein,
Groove has bar shape.
12. the manufacture method of display device as claimed in claim 1, wherein,
The width of groove is less than 1000 μm, and the depth of groove is less than 100 μm.
13. the manufacture method of display device as claimed in claim 1, wherein,
Groove includes multiple pilot trench.
14. the manufacture method of display device as claimed in claim 1, wherein,
Seal member includes organic matter.
15. the manufacture method of display device as claimed in claim 1, wherein,
Also comprise the following steps：In the state of cooling first substrate, contacted to the marginal position on the first face of first substrate
High-temperature component, so that the marginal position on the first face of first substrate forms extra groove.
16. the manufacture method of display device as claimed in claim 15, wherein,
Described is the steps the step of form the extra groove：So that extra groove is upper in the first face of first substrate
Mode on the outside of display part forms extra groove.
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| CN114446176A (en) * | 2022-02-09 | 2022-05-06 | 武汉华星光电半导体显示技术有限公司 | Foldable display device |
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| KR20170084737A (en) | 2017-07-21 |
| CN106960919B (en) | 2021-06-04 |
| KR102504127B1 (en) | 2023-02-28 |
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