CN106960919B - Method for manufacturing display device - Google Patents
Method for manufacturing display device Download PDFInfo
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- CN106960919B CN106960919B CN201710022471.6A CN201710022471A CN106960919B CN 106960919 B CN106960919 B CN 106960919B CN 201710022471 A CN201710022471 A CN 201710022471A CN 106960919 B CN106960919 B CN 106960919B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
Abstract
The invention provides a method for manufacturing a display device. The invention comprises the following steps: forming a display portion on a first surface of a first substrate; contacting the high-temperature member to an edge position on the second surface of the second substrate in a state where the second substrate is cooled, thereby forming a groove at the edge position on the second surface of the second substrate; and arranging the second substrate in such a manner that a second surface of the second substrate on which the groove is formed faces the display portion on the first substrate, thereby bringing the sealing member interposed between the first substrate and the second substrate into contact with the groove.
Description
Technical Field
Embodiments of the present invention relate to a method of manufacturing a display device, and more particularly, to a method of manufacturing a display device capable of improving sealing characteristics and mechanical strength.
Background
As information technology has developed, the market for display devices as a connection medium between users and information has also grown. These display devices are being developed in various forms, and among them, organic light emitting display devices are attracting attention as display devices having excellent performance such as slimness, light weight, and low power consumption.
Since an organic light emitting display device includes an organic light emitting element in its display region, and the organic light emitting element is extremely susceptible to moisture and oxygen, it is necessary to prevent deterioration of the organic light emitting element due to moisture permeation and/or oxygen permeation. As one of the above methods, the upper substrate and the lower substrate may be bonded by a sealing member, however, in recent years, various attempts have been made to reduce the width of the sealing member in order to reduce a dead space (dead space) of the organic light emitting display device.
Disclosure of Invention
However, in the case of the conventional method for manufacturing a flexible display device, there is a problem that the adhesive force between the upper and lower substrates may be reduced in the process of reducing the width of the sealing member.
The present invention has been made to solve various problems including the above-described problems, and an object of the present invention is to provide a method for manufacturing a display device capable of improving sealing characteristics and mechanical strength. However, such subject matter is merely exemplary, and the scope of the present invention is not limited thereto.
According to one aspect of the present invention, a method of manufacturing a display device is provided. The method comprises the following steps: forming a display portion on a first surface of a first substrate; contacting the high-temperature member to an edge position on the second surface of the second substrate in a state where the second substrate is cooled, thereby forming a groove at the edge position on the second surface of the second substrate; and arranging the second substrate in such a manner that a second surface of the second substrate on which the groove is formed faces the display portion on the first substrate, thereby bringing the sealing member interposed between the first substrate and the second substrate into contact with the groove.
The groove may surround a central portion of the second substrate.
The step of forming the groove may be a step of forming the groove in the following manner: when the second face of the second substrate is arranged toward the display portion on the first substrate, the groove is arranged outside the display portion.
The step of forming the groove may be a step of: peeling off at least a part of a portion of the second substrate, which is in contact with the high-temperature member; or plastically deforming at least a part of a portion of the second surface of the second substrate, which is in contact with the high-temperature component.
When the high-temperature member is brought into contact with the second substrate, the second substrate may be pressed by the high-temperature member.
The second substrate may include a glass material.
The second substrate may comprise an alkali-free glass material; and the step of forming the groove may be the steps of: at least a part of a portion of the second surface of the second substrate, which is in contact with the high-temperature component, is plastically deformed.
The temperature of the high-temperature member may be equal to or higher than the glass transition temperature (Tg) of the second substrate.
In cooling the second substrate, the second substrate may be cooled to 50 ℃ or less.
The second substrate may be brought into contact with the low temperature member while cooling the second substrate.
The slot may have a strip (strip) shape.
The width of the groove may be 1000 μm or less and the depth may be 100 μm or less.
The slot may include a plurality of subslots.
The sealing member may contain organic matter.
The method can also comprise the following steps: in a state where the first substrate is cooled, the high-temperature member is contacted to an edge position on the first surface of the first substrate, thereby forming an additional groove on the edge position on the first surface of the first substrate.
The step of forming the additional groove may be a step of: the additional groove is formed in such a manner that the additional groove is positioned outside the display part on the first surface of the first substrate.
According to an embodiment of the present invention configured as described above, a method of manufacturing a display device in which a dead space can be reduced while sealing characteristics and mechanical strength can be easily improved can be realized. Of course, the scope of the present invention is not limited to such effects.
Drawings
Fig. 1 is a plan view schematically showing a display device manufactured by a method of manufacturing a display device according to an embodiment of the present invention.
Fig. 2 is a sectional view taken along line II-II' of fig. 1.
Fig. 3 to 7 are sectional views schematically showing a manufacturing process of the display device of fig. 1.
Fig. 8a and 8b are cross-sectional views showing an example of the manufacturing process of fig. 4.
Fig. 9 is a sectional view schematically showing a display device according to another embodiment of the present invention.
Fig. 10 is a sectional view schematically showing a display device according to still another embodiment of the present invention.
Fig. 11 is a sectional view schematically showing an example of the display portion of fig. 1.
Description of the symbols
1000: the display device 100: first substrate
110: second substrate 200: display unit
300: sealing member G: trough
11: low-temperature component 15: high temperature component
16: main body portion 17: contact part
18: high-frequency induction heater 19: induction coil
Detailed Description
While the invention is susceptible to various modifications and alternative embodiments, specific embodiments thereof are shown in the drawings and will herein be described in detail. However, the present invention is not intended to be limited to the specific embodiments, and it should be understood that the present invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the present invention. In describing the present invention, if it is determined that the detailed description of the related known art will confuse the gist of the present invention, the detailed description thereof will be omitted.
Terms such as "first", "second", and the like used in the present specification are used to describe various constituent elements, but such constituent elements should not be limited by the above terms. The above terms are used only to distinguish one constituent element from another constituent element.
When a member described as a layer, a film, a region, a plate, or the like is located "on" or "over" another member in this specification, this includes not only a case where it is located "immediately over" another member but also a case where another member is provided in the middle thereof.
The x-axis, y-axis, and z-axis used in the present specification are not limited to three axes of a rectangular coordinate system, and can be interpreted in a broad sense including the same. For example, the x-axis, y-axis, and z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other.
Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings, and when the present invention is described with reference to the drawings, the same reference numerals will be given to substantially the same or corresponding constituent elements, and the repetitive description thereof will be omitted. In the drawings, the thickness of layers and regions are exaggerated for clarity. In the drawings, the thicknesses of a part of layers and a region are exaggerated for convenience of description.
Fig. 1 is a plan view schematically showing a display device manufactured by a method of manufacturing a display device according to an embodiment of the present invention; fig. 2 is a sectional view taken along line II-II' of fig. 1.
Referring to fig. 1 and 2, a display device 1000 according to an embodiment of the present invention includes a first substrate 100, a second substrate 110, a display portion 200, and a sealing member 300. The second substrate 110 has grooves g (grooves) arranged in contact with the sealing member 300.
The first substrate 100 may be formed of a glass material, a plastic material, a metal material, and the like.
The display portion 200 is disposed on the first plane P1 of the first substrate 100. The details of this will be described below with reference to fig. 11.
The second substrate 110 is disposed on the first substrate 100 at an upper portion of the first plane P1 where the display portion 200 is formed. Accordingly, the first side P1 of the first substrate 100 and the second side of the second substrate 110 face each other. The second substrate 110 may be formed of the same material as the first substrate 100. Hereinafter, the first substrate 100 and the second substrate 110 will be mainly described as including a glass material. This also applies to the following embodiments and modifications thereof.
The second substrate 110 is provided with a groove G at an edge position of the second plane P2 thereof. In order to form the groove G on the second face P2 of the second substrate 110, various methods such as laser processing, etching, and the like may be employed, but in the method of manufacturing the display device 1000 according to an embodiment of the present invention, the groove G is formed by removing a portion of the second substrate 110 by locally heating the second face P2 of the second substrate 110 cooled to a temperature equal to or lower than the normal temperature. This will be described below with reference to fig. 4.
The sealing member 300 is interposed between the first substrate 100 and the second substrate 110, thereby bonding the first substrate 110 and the second substrate 110. At this time, the sealing member 300 is disposed in a manner of surrounding the display part 200 of the first substrate 100. Accordingly, the display portion 200 can be sealed by the sealing member 300, the first substrate 100, and the second substrate 110, and moisture permeation, oxygen permeation, and the like to the display portion 200 can be prevented.
The sealing member 300 may be provided to overlap a portion of a wiring (not shown) disposed at an edge position of the first substrate 100. The wiring may perform the following functions: an electric signal and a voltage are applied to a thin film transistor (not shown) and an organic light emitting element (OLED) provided in the display portion 200. At this time, the wiring and a driving portion (not shown) for driving the wiring may be connected to a PAD portion disposed on the first substrate 100. As described above, by positioning the sealing member 300 at a position overlapping the wiring, the dead space (dead space) of the display device 1000 can be reduced.
For example, the sealing member 300 may be formed using an inorganic material such as glass frit (frit). As another example, the sealing member 300 may be formed using an organic material such as a thermosetting resin, or may be formed using an organic-inorganic composite material.
The sealing member 300 may be formed by: after a pattern for a sealing member is formed on one surface of the first substrate 100 or the second substrate 110 along an edge position of the substrate, the pattern is irradiated with laser light to be melted, and then hardened. However, in the case where the sealing member pattern is formed at an edge position on the first substrate 100, when the sealing member pattern is irradiated with laser light, deterioration of the display portion 200 may be caused, and thus attention is required. Hereinafter, for convenience of description, the case where the sealing member pattern is formed at the edge position on the second substrate 110 will be described as a center. The same applies to the following embodiments and modifications thereof.
The sealing member 300 contacts the second substrate 110 in a state of filling the groove G formed in the second plane P2 of the second substrate 110. Accordingly, the contact area of the sealing member 300 with the second substrate 110 will be widened. As described above, since the contact area between the sealing member 300 and the second substrate 110 is widened, the adhesive force between the sealing member 300 and the second substrate 110 may be improved. Further, the sealing property and mechanical strength of the display device 1000 can be improved.
As described above, as the contact area of the sealing member 300 and the second substrate 110 becomes wider, the sealing member 300 may be formed using not only a substance similar to the material of the second substrate 110 but also a substance different from the material of the second substrate 110. For example, in the case where the second substrate 110 includes a glass material, the sealing member 300 may be formed using not only a glass raw material similar to the material of the second substrate 110 but also an organic substance different from the material of the second substrate 110. Further, the width of the sealing member 300 can be reduced according to the degree of improvement in the adhesion of the sealing member 300, and thus the dead space of the display device 1000 can be reduced.
As the sealing member 300 comes into contact with the groove G of the second substrate 110, the groove G surrounds the display portion 200 formed at the central portion of the first substrate 100 and is located outside the display portion 200 like the sealing member 300. Therefore, the groove G is disposed on the second plane P2 of the second substrate 110 in such a manner as to surround the center portion of the second substrate 110 opposite to the first substrate 100.
Fig. 3 to 7 are sectional views schematically showing a manufacturing process of the display device of fig. 1.
First, as shown in fig. 3, the first substrate 100 is prepared, and the display portion 200 is formed on the first plane P1 of the first substrate 100. At this time, the display portion 200 is formed to be positioned at the center portion on the first plane P1 of the first substrate 100.
Thereafter, as shown in fig. 4, the second substrate 110 is prepared, and the second substrate 110 is cooled. In a state where the second substrate 110 is cooled, the high-temperature member 15 is contacted to an edge position on the second face P2 of the second substrate 110 to heat the second substrate 110. Thus, the groove G is formed at a portion contacting the high temperature member 15 of the second substrate 110. At this time, the second substrate 110 may include a glass material.
Various methods may be used to cool the second substrate 110. That is, the second substrate 110 may be stacked in a place maintained at a low temperature for a predetermined time, or the second substrate 110 may be contacted on a member maintained at a low temperature. At this time, in order to prevent the temperature of the second substrate 110 from rising during the process, it is preferable that the second substrate 110 is continuously cooled by contacting the second substrate 110 with the low temperature part 11, like the latter.
As described above, the second substrate 110 may be cooled in a state of being in contact with the low temperature part 11. Here, the second substrate 110 being cooled means that the temperature of the second substrate 110 is lower than the temperature of the surrounding area. At this time, it is also possible for the second substrate 110 to selectively cool only the region for forming the grooves G, but cooling the entire second substrate 110 may be more stable in terms of temperature control.
The low temperature part 11 may be maintained at a temperature lower than the normal temperature, however, the low temperature part 11 may be maintained below 50 ℃ in consideration of the temperature of the working place. However, if the temperature of the low-temperature member 11 is as low as 0 ℃ or lower, a condensation phenomenon occurs on the second substrate 110, or excessive energy is required for cooling, and thus attention is required.
The high temperature member 15 may contact the local area C of the second substrate 110 to heat the local area C in a short time. The high-temperature member 15 may be various, but for example, a high-temperature member based on a high-frequency induction heating system may be used. Hereinafter, the high-temperature member 15 based on the high-frequency induction heating method will be described in more detail.
The high-temperature member 15 may include a rod-shaped main body portion 16 and a conical contact portion 17 formed at one end of the main body portion 16. The other end of the main body portion 16 is fixed to the Base (Base)14 so as to be able to support the main body portion 16 when in contact with the second substrate 110. Further, the main body portion 16 is heated by means of an induction coil connected to a high-frequency induction heater 18. This high-frequency induction heating method utilizes a phenomenon that an inductor located in the middle of a coil through which a high-frequency current flows is rapidly heated by eddy current and partial hysteresis (hystersis) heat loss due to electromagnetic induction, and the main body portion 16 of the high-temperature member 15 corresponds to the inductor located in the middle of the coil. The high-frequency induction heater 18 can efficiently concentrate energy on the high-temperature component 15 penetrating the induction coil 19, thereby increasing the temperature of the high-temperature component 15 in a short time and preventing a decrease in the temperature of the high-temperature component 15 due to contact with the second substrate 110.
The contact of the high-temperature component 15 with the second plane P2 of the second substrate 110 means that the contact portion 17 of the high-temperature component 15 physically contacts the second plane P2 of the second substrate 110. Further, the contact portion 17 pressurizes the second plane P2 of the second substrate 110 at a predetermined pressure to adjust the width of the groove G formed in the second substrate 110. At this time, if the pressure applied to the second substrate 110 by the contact portion 17 is too high, the strength of the second substrate 110 may be reduced, and the second substrate 110 may be damaged if it is serious. In contrast, if the pressure applied to the second substrate 110 by the contact portion 17 is too low, the processing productivity of the second substrate 110 may be lowered. For example, the high-temperature member 15 may be pressurized at a pressure of about 0.1kgf/cm2 to 3.0kgf/cm 2.
The temperature of the high-temperature member 15 is set to a value equal to or higher than the glass transition temperature (Tg) of the glass material included in the second substrate 110. In order to facilitate the processing of the second substrate 110, the high-temperature member 15 may be maintained at a temperature that is about 50 ℃ to 500 ℃ higher than a glass transition temperature (Tg) of a glass material included in the second substrate 110. For example, the temperature of the high-temperature member 15 may be 1200 ℃. For example, the local region C of the portion of the second substrate 110 in contact with the high-temperature member 15 can be heated in a short time by being exposed to a high temperature of 1200 ℃.
As described above, if the local region C of the second substrate 110 is heated to the glass transition temperature or more, a temperature difference will occur between the local region C and the low temperature region around the local region C on the second substrate 110. Accordingly, at least a portion of the second substrate 110 may be peeled or plastically deformed around the local region C of the second substrate 110. Details regarding this will be described below with reference to fig. 8a and 8 b.
Thereafter, as shown in fig. 5, at least a portion of the second substrate 110 is peeled or plastically deformed around the partial region C of the second substrate 110, thereby forming a groove G on the second face P2 of the second substrate 110. At this time, if the groove G is excessively formed, the strength of the second substrate 110 may be reduced, and conversely, if the groove G is excessively formed, the contact area or the adhesive force with the sealing member 300 may not reach a desired level. Therefore, the width of the groove G may be set to 1000 μm or less and the depth of the groove G may be set to 100 μm or less, in consideration of the strength of the second substrate 110, the adhesion with the sealing member 300, the width of the sealing member 300, and the like.
In addition, the second substrate 110 is relatively moved with respect to the high temperature member 15, so that a stripe (strip) shaped groove G can be formed. Referring back to fig. 4, the second substrate 110 will move in the X-axis direction and the opposite direction thereof in a state where the high-temperature part 15 is fixed. Further, the second substrate 110 may be moved in the width direction of the second substrate 110, that is, in the direction perpendicular to the XY plane (the Z-axis direction of fig. 1 and the reverse direction thereof) in a state where the high-temperature part 15 is fixed. However, it is not necessarily limited thereto, and the high temperature part 15 may be moved in the X-axis direction and the opposite direction thereof in a state where the second substrate 110 is fixed, or may be moved in the Z-axis direction and the opposite direction thereof. The moving speed of the second substrate 110 and the high-temperature member 15 may be adjusted to an appropriate value in consideration of the shape of the groove, the type of the glass material, the temperature difference, the pressure difference, the productivity, and the like. As described above, the groove G may be formed to have a strip (strip) shape according to the movement of the second substrate 110 and/or the high temperature part 15. As an example, in a state where the high-temperature components 15 are fixed to the base 14, as the second substrate 110 moves in the X-axis direction, a groove G, which may have a stripe (strip) shape extending in the X-axis direction, is formed at an edge position of the second substrate 110.
Thereafter, as shown in fig. 6 and 7, the sealing member pattern 301 is formed so as to fill the groove G formed at the edge of the second surface P2 of the second substrate 110. Then, the second surface P2 of the second substrate 110 on which the sealing member pattern 301 is formed and the first surface P1 of the first substrate 100 on which the display portion 200 is formed are opposed to each other, and then the first substrate 100 and the second substrate 110 are bonded to each other via the sealing member pattern 301.
Fig. 8a and 8b are cross-sectional views showing an example of the manufacturing process of fig. 4.
For example, as shown in fig. 8a (i), if the contact portion 17 of the high-temperature member 15 is brought into contact with the second surface P2 of the second substrate 110, the contact portion 17 presses the second surface (P2) of the second substrate 110, thereby rapidly heating the local region C of the second substrate 110. Accordingly, in the second substrate 110, a temperature difference will occur between the local region C and the surrounding region of the local region C. Due to this temperature difference, the high temperature region HA centered on the local region C tends to expand, and the low temperature region LA located around the high temperature region HA tends to contract.
Accordingly, as shown in fig. 8a (ii), at least a portion of the second substrate 110 centered on the local region C is instantaneously peeled by the high deforming pressure, and thus the groove G can be formed in the second substrate 110. At this time, the second substrate 110 may include a soda-lime (soda-lime) glass material having a high thermal expansion coefficient.
As another example, as shown in (i) of fig. 8b, if the local region C ' on the second plane P2' of the second substrate 110' is in contact with the contact portion 17 of the high-temperature member 15, the local region C ' of the second substrate 110' is plastically deformed by the pressure applied by the contact portion 17. At this time, the second substrate 110' may include a glass material having a relatively lower thermal expansion coefficient than the second substrate 110 of fig. 8 a. For example, the second substrate 110' may include an alkali-free glass material. Therefore, the second substrate 110' will be deformed differently from the configuration shown in fig. 8 a. That is, at least a portion of the second substrate 110 'centered on the local region C' is recessed in a shape corresponding to the contact portion 17 of the high-temperature member 15 by the pressure applied by the high-temperature member 15, rather than being expanded by the increase in temperature.
Accordingly, as shown in fig. 8b (ii), at least a portion of the second substrate 110b 'centered on the local region C' is recessed, so that the groove G 'can be formed in the second substrate 110'. At this time, a raised portion PR 'adjacent to the groove G' may be formed by the pressure applied by the high-temperature member 15.
Fig. 9 is a sectional view schematically showing a display device according to another embodiment of the present invention; fig. 10 is a sectional view schematically showing a display device according to still another embodiment of the present invention.
First, referring to fig. 9, a plurality of sub-grooves G1, G2 may be formed on the second plane P21 of the second substrate 110 a. Accordingly, a contact area between the second substrate 110a and the sealing member 300a may be expanded, thereby further increasing an adhesive force between the second substrate 110a and the sealing member 300 a. Therefore, the display portion 200a formed on the first plane P11 of the first substrate 100a can be more firmly sealed.
In order to form the plurality of sub-grooves G1, G2 on the second substrate 110a, a high temperature member (not shown) for heating the second substrate 110a may contact the plurality of sub-partial regions C1, C2 on the second plane P21 of the second substrate 110 a. In this case, the high-temperature member may have a plurality of contact portions, and the sub-grooves G1 and G2 may be formed by a plurality of steps using a high-temperature member having one contact portion.
Referring to fig. 10, an upper groove G3 may be formed around an upper partial region C3 contacting a high temperature component (not shown) on the second plane P22 of the second substrate 110b, and a lower groove G4 may be formed around a lower partial region C4 contacting the high temperature component on the first plane P12 of the first substrate 100 b. At this time, the lower groove G4 is disposed opposite to the upper groove G3. Accordingly, not only the adhesive force between the second substrate 110b and the sealing member 300b but also the adhesive force between the first substrate 100b and the sealing member 300b are increased, and thus the display portion 200b formed on the first plane P12 of the first substrate 100b can be more firmly sealed.
In order to form the lower groove G4 on the first substrate 100b, referring to fig. 4, in a state where the first substrate 100b is to be cooled as described above, the high-temperature member is brought into contact with the lower partial region C4 of the first substrate 100b, thereby heating the first substrate 100 b. Thereafter, at least a portion of the first substrate 100b centered on the lower partial region C4 is peeled off or plastically deformed, thereby forming the lower groove G4. In this process, if the display portion 200 disposed on the first substrate 100b is to be prevented from being deteriorated, it is preferable that the lower groove G4 is formed on the first substrate 100b in a step before the display portion 200 is formed.
As described above, if the method for manufacturing a display device according to one embodiment of the present invention is used, not only the sealing property and the mechanical strength of the display device can be improved, but also the dead space of the display device can be reduced.
Fig. 11 is a sectional view schematically showing an example of the display portion of fig. 1.
The display elements provided in the display unit 200 may have various forms according to the type of the display device. Hereinafter, for convenience of description, a case where the organic light emitting element OLED is provided as a display element will be mainly described.
Referring to fig. 11, on the first substrate 100, common layers such as a buffer layer 51, a gate insulating film (gate insulating film)53, an interlayer insulating film 55, and the like may be formed on the entire surface of the first substrate 100, a patterned semiconductor layer 52 may be formed, the patterned semiconductor layer 52 including a channel region 52a, a source contact (Drain contact) region 52b, and a Drain contact (Drain contact) region 52c, and a gate electrode 54, a source electrode 56, and a Drain electrode 57, which constitute constituent elements of the thin film transistor TFT together with the patterned semiconductor layer, may be formed.
Further, a protective film 58 for covering the thin film transistor TFT and a planarizing film 59 may be formed on the entire surface of the first substrate 100, the planarizing film 59 being located on the protective film 58 with its upper surface being nearly flat. Such a planarization film 59 may be formed so that the organic light emitting element OLED is located above the planarization film, and the organic light emitting element OLED includes: the patterned pixel electrode 61, the counter electrode 63 substantially corresponding to the entire surface of the first substrate 100, and the intermediate layer 62 of a multilayer structure are interposed between the pixel electrode 61 and the counter electrode 63, and include a light-emitting layer.
Of course, the intermediate layer 62 may be different from that shown in the figure, and a part of the layers thereof may be a common layer corresponding to substantially the entire surface of the first substrate 100, and another part of the layers may be a patterned layer patterned in a manner corresponding to the pixel electrode 61. The pixel electrode 61 may be electrically connected to the thin film transistor TFT through a via hole. Of course, it may be formed on the planarization film 59 in the following manner: the pixel defining film 60 covering the edge position of the pixel electrode 61 and having openings defining respective pixel regions corresponds to substantially the entire surface of the first substrate 100.
Thus, although the invention has been described with reference to an embodiment shown in the drawings, this is by way of example only, and it will be understood that numerous variations and modifications of the embodiments may be made thereto, as known to those skilled in the art. Therefore, the true technical scope of the present invention should be determined by the technical idea of the appended claims.
Claims (12)
1. A method of manufacturing a display device, comprising the steps of:
forming a display portion on a first surface of a first substrate;
bringing the low-temperature member into contact with the first surface of the second substrate to cool the second substrate to 0 ℃ or higher and 50 ℃ or lower;
contacting a high-temperature member to an edge position on a second surface of a second substrate facing the first surface of the second substrate in a state where the low-temperature member is in contact with the first surface of the second substrate, thereby forming a groove at the edge position on the second surface of the second substrate; and
arranging the second substrate such that a second surface of the second substrate on which the groove is formed faces the display portion on the first substrate, thereby bringing the sealing member interposed between the first substrate and the second substrate into contact with the groove,
the step of forming the groove is the following steps:
peeling off at least a part of a portion of the second substrate, which is in contact with the high-temperature member; or plastically deforming at least a part of a portion of the second substrate, which is in contact with the high-temperature component,
when the high-temperature member is brought into contact with the second substrate, the second substrate is pressurized by the high-temperature member at a predetermined pressure to adjust the width of the groove.
2. The method of manufacturing a display device according to claim 1,
the groove surrounds the central part of the second substrate.
3. The method of manufacturing a display device according to claim 1,
the step of forming the groove is a step of forming a groove in such a manner that: when the second face of the second substrate is arranged toward the display portion on the first substrate, the groove is arranged outside the display portion.
4. The method of manufacturing a display device according to claim 1,
the second substrate comprises a glass material.
5. The method of manufacturing a display device according to claim 4,
the second substrate comprises an alkali-free glass material;
the step of forming the groove is the following steps: at least a part of a portion of the second surface of the second substrate, which is in contact with the high-temperature component, is plastically deformed.
6. The method of manufacturing a display device according to claim 4,
the temperature of the high-temperature member is equal to or higher than the glass transition temperature of the second substrate.
7. The method of manufacturing a display device according to claim 1,
the groove has a strip shape.
8. The method of manufacturing a display device according to claim 1,
the width of the groove is 1000 μm or less, and the depth of the groove is 100 μm or less.
9. The method of manufacturing a display device according to claim 1,
the slot includes a plurality of subslots.
10. The method of manufacturing a display device according to claim 1,
the sealing member contains organic matter.
11. The method of manufacturing a display device according to claim 1,
also comprises the following steps: in a state where the first substrate is cooled, the high-temperature member is contacted to an edge position on the first surface of the first substrate, thereby forming an additional groove at the edge position on the first surface of the first substrate.
12. The method of manufacturing a display device according to claim 11,
the step of forming the additional groove is a step of: the additional groove is formed in such a manner that the additional groove is positioned outside the display part on the first surface of the first substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160003677A KR102504127B1 (en) | 2016-01-12 | 2016-01-12 | Method for manufacturing display apparatus |
| KR10-2016-0003677 | 2016-01-12 |
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| Publication Number | Publication Date |
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| CN106960919A CN106960919A (en) | 2017-07-18 |
| CN106960919B true CN106960919B (en) | 2021-06-04 |
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| CN201710022471.6A Active CN106960919B (en) | 2016-01-12 | 2017-01-12 | Method for manufacturing display device |
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| CN108281566B (en) * | 2018-01-03 | 2020-04-10 | 深圳市华星光电半导体显示技术有限公司 | OLED panel and manufacturing method thereof |
| CN114446176B (en) * | 2022-02-09 | 2023-06-02 | 武汉华星光电半导体显示技术有限公司 | Foldable display device |
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| CN1622700A (en) * | 2003-11-29 | 2005-06-01 | 三星Sdi株式会社 | Organic electroluminescent devices |
| CN201752015U (en) * | 2010-03-23 | 2011-02-23 | 彩虹显示器件股份有限公司 | Organic electroluminescent display device for improving sealing property |
| CN102255056A (en) * | 2011-07-12 | 2011-11-23 | 上海大学 | Method for reinforcing sealing performance of Organic Light-Emitting Diode (OLED) device sealed by glass material |
| CN103337511A (en) * | 2013-07-05 | 2013-10-02 | 深圳市华星光电技术有限公司 | OLED panel and packaging method thereof |
| CN203300706U (en) * | 2013-06-19 | 2013-11-20 | 京东方科技集团股份有限公司 | Packaging cover plate of organic electroluminescent device, organic electroluminescent device and display |
| CN203481280U (en) * | 2013-09-24 | 2014-03-12 | 京东方科技集团股份有限公司 | Packaging structure of OLED device |
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| JP2007035536A (en) * | 2005-07-29 | 2007-02-08 | Rohm Co Ltd | Flat panel display |
| KR101405442B1 (en) * | 2012-08-01 | 2014-06-13 | 주식회사 라미넥스 | Method for cutting of corner of glass using |
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| CN1622700A (en) * | 2003-11-29 | 2005-06-01 | 三星Sdi株式会社 | Organic electroluminescent devices |
| CN201752015U (en) * | 2010-03-23 | 2011-02-23 | 彩虹显示器件股份有限公司 | Organic electroluminescent display device for improving sealing property |
| CN102255056A (en) * | 2011-07-12 | 2011-11-23 | 上海大学 | Method for reinforcing sealing performance of Organic Light-Emitting Diode (OLED) device sealed by glass material |
| CN203300706U (en) * | 2013-06-19 | 2013-11-20 | 京东方科技集团股份有限公司 | Packaging cover plate of organic electroluminescent device, organic electroluminescent device and display |
| CN103337511A (en) * | 2013-07-05 | 2013-10-02 | 深圳市华星光电技术有限公司 | OLED panel and packaging method thereof |
| CN203481280U (en) * | 2013-09-24 | 2014-03-12 | 京东方科技集团股份有限公司 | Packaging structure of OLED device |
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| KR102504127B1 (en) | 2023-02-28 |
| KR20170084737A (en) | 2017-07-21 |
| CN106960919A (en) | 2017-07-18 |
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