CN104167426A - Organic light-emitting diode display panel and manufacturing method thereof and display device - Google Patents
Organic light-emitting diode display panel and manufacturing method thereof and display device Download PDFInfo
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- CN104167426A CN104167426A CN201410242791.9A CN201410242791A CN104167426A CN 104167426 A CN104167426 A CN 104167426A CN 201410242791 A CN201410242791 A CN 201410242791A CN 104167426 A CN104167426 A CN 104167426A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 201
- 239000010410 layer Substances 0.000 claims description 79
- 239000012790 adhesive layer Substances 0.000 claims description 76
- 239000000565 sealant Substances 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 36
- 239000011241 protective layer Substances 0.000 claims description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 5
- 238000010884 ion-beam technique Methods 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000005240 physical vapour deposition Methods 0.000 claims description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- QENHCSSJTJWZAL-UHFFFAOYSA-N magnesium sulfide Chemical compound [Mg+2].[S-2] QENHCSSJTJWZAL-UHFFFAOYSA-N 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 9
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- 230000008569 process Effects 0.000 description 9
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
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- SMDQFHZIWNYSMR-UHFFFAOYSA-N sulfanylidenemagnesium Chemical compound S=[Mg] SMDQFHZIWNYSMR-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses an organic light-emitting diode display panel and a manufacturing method thereof and a display device. The organic light-emitting diode display panel includes a first substrate, a second substrate arranged opposite to the first substrate, an organic light-emitting element arranged between the first substrate and the second substrate, a periphery region between the first substrate and the second substrate, and a sealing layer used for packaging the organic light-emitting element between the first substrate and the second substrate in a sealing manner, wherein the sealing layer includes a supporting layer arranged on the first substrate and surrounding the periphery of the organic light-emitting element, and a bonding layer which is arranged between the supporting layer and the second substrate and covers the supporting layer. According to the manufacturing method in the invention, bubbles or a micro-crack phenomenon is not easy to occur in a packaging process of the organic light-emitting diode display panel, thereby simplifying manufacturing technology, reducing production cost, and improving the yield of organic light-emitting diode display panels.
Description
Technical field
The present invention relates to Display Technique field, be specifically related to a kind of organic LED display panel and preparation method thereof and display unit.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display has the advantages such as good color contrast, high color saturation, active illuminating, wide visual angle, energy slimming, fast response time and low-power consumption, is product rather well received in display of new generation.
But the organic luminous layer in organic light emitting diode device and electrode are easily subject to the invasion of steam and oxygen and are destroyed, cause reduce useful life, therefore conventionally need to carry out hermetically sealed to organic light emitting diode device.
In prior art, the general frit (Frit) that uses is used as packaging adhesive material, adopt laser welding glass technology (Laser-Frit) to form the good hermetically-sealed construction of air-tightness, thereby prevent that steam and oxygen from intruding in organic light emitting diode device.Fig. 1 is the encapsulating structure of available technology adopting frit as the organic light emitting diode display of packaging adhesive material, as shown in Figure 1, described organic light emitting diode display comprises substrate 11, cover plate 12, organic illuminating element 13 and packaging adhesive material 14, wherein, organic illuminating element 13 is positioned on substrate 11, packaging adhesive material 14 is by hermetically sealed described organic illuminating element 13 between substrate 11 and cover plate 12, and this packaged type can reduce the water oxygen value that intrudes into OLED inside.
While adopting frit as packaging adhesive material, OLED to be encapsulated, after generally frit being dissolved by infrared radiation by substrate and cover plate adhering and solidifying, but, while adopting frit as packaging adhesive material, OLED to be encapsulated, there is following problem: first aspect, while using infrared radiation, easily make frit produce bubble or fine fisssure phenomenon, cause the reliability test crash of OLED encapsulation; Second aspect, adopts the complex process of frit when OLED is encapsulated as packaging adhesive material, and general technology flow process comprises silk-screen, dry, sintering, pre-packaged, laser sintered and sliver, causes production cost to increase; The third aspect, adopts high temperature process easily to cause glass embrittlement with tired, reduces the mechanical performance of organic LED display panel, thereby affects product yield.
Summary of the invention
In view of this, the embodiment of the present invention provides a kind of organic LED display panel and preparation method thereof and display unit, easily produces bubble or fine fisssure, production cost is high and organic light emitting diodde desplay device yield is low problem to solve organic light emitting diodde desplay device.
First aspect, the embodiment of the present invention provides organic LED display panel, comprising: first substrate; Second substrate, is oppositely arranged with described first substrate; Organic illuminating element, is arranged between described first substrate and described second substrate; Sealant, the neighboring area between described first substrate and described second substrate, thereby by hermetically sealed described organic illuminating element between described first substrate and described second substrate; Wherein, described sealant comprises: supporting layer, is arranged on described first substrate and around described organic illuminating element; The first adhesive layer, covers described supporting layer.
Second aspect, the embodiment of the present invention provides a kind of display unit, and described display unit comprises the organic LED display panel of first aspect.
The third aspect, the embodiment of the present invention provides a kind of manufacture method of organic LED display panel, and described method comprises:
On first substrate, form organic illuminating element;
On first substrate and around described organic illuminating element, form supporting layer;
On described supporting layer, form the first adhesive layer, described the first adhesive layer covers described supporting layer, wherein, described supporting layer and described the first adhesive layer form sealant, the neighboring area of described sealant between described first substrate and second substrate forms, thus by hermetically sealed described organic illuminating element between described first substrate and described second substrate;
By described sealant, described first substrate and second substrate are pressed together, thus by hermetically sealed described organic illuminating element between described first substrate and described second substrate.
Organic LED display panel that the embodiment of the present invention provides and preparation method thereof and display unit, by supporting layer being set on first substrate and around organic illuminating element, on described supporting layer, form adhesive layer, thereby the neighboring area between described first substrate and described second substrate forms sealant, by hermetically sealed described organic illuminating element between described first substrate and described second substrate, thus, make organic LED display panel in encapsulation process, be not easy to produce bubble or fine fisssure phenomenon, simplify manufacture craft, reduce production cost, improve the yield of organic LED display panel.
Brief description of the drawings
To, by describe exemplary embodiment of the present invention in detail with reference to accompanying drawing, the person of ordinary skill in the art is more clear that above-mentioned and other feature and advantage of the present invention below, in accompanying drawing:
Fig. 1 is the encapsulating structure as the organic light emitting diode display of packaging adhesive material according to available technology adopting frit;
Fig. 2 is a kind of organic LED display panel floor map according to first embodiment of the invention;
Fig. 3 is the generalized section along A-A1 direction in Fig. 2 according to a kind of organic LED display panel of first embodiment of the invention;
Fig. 4 is according to the schematic diagram of a kind of organic LED display panel of second embodiment of the invention;
Fig. 5 is the schematic diagram that infiltrates organic LED display panel inside by sealant according to the steam of second embodiment of the invention and oxygen;
Fig. 6 is according to the flow chart of the manufacture method of a kind of organic LED display panel of third embodiment of the invention;
Fig. 7 a-Fig. 7 d is according to structural representation corresponding to the each step of the manufacture method of a kind of organic LED display panel of third embodiment of the invention;
Fig. 8 is according to the flow chart of the manufacture method of a kind of organic LED display panel of fourth embodiment of the invention;
Fig. 9 a-Fig. 9 g is structural representation corresponding to the each step of manufacture method according to the kind organic LED display panel of fourth embodiment of the invention.
Embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, in accompanying drawing, only show part related to the present invention but not full content, and size and the size of shown structure in accompanying drawing, not actual or to the size of the proportional structure of reality.
In Fig. 3, the first embodiment of the present invention is shown at Fig. 2.
Fig. 2 is a kind of organic LED display panel floor map according to first embodiment of the invention, Fig. 3 is the generalized section along A-A1 direction in Fig. 2 according to a kind of organic LED display panel of first embodiment of the invention, now describes the first embodiment of the present invention in conjunction with Fig. 2 and Fig. 3.
As shown in Figure 2 and Figure 3, described organic LED display panel comprises viewing area A and surrounds the external zones P of described viewing area, is also that the part between outward flange and the A border, viewing area of organic LED display panel is external zones P.Wherein, in the A of viewing area, be provided with organic illuminating element 23, in the P of external zones, be provided with sealant 24, sealing layer is arranged on the neighboring area of organic LED display panel, be arranged in the organic illuminating element of viewing area A in order to sealing, sealant 24 comprises supporting layer 241 and the first adhesive layer 242, the first adhesive layer 242 covers supporting layer 241, in the present embodiment, cabling or other can be set in white space between sealant 24 and viewing area A, for example can be provided with flexible printed circuit board (FPC), integrated circuit (IC) and various holding wires etc.
Particularly, with reference to figure 3, described organic LED display panel comprises first substrate 21, second substrate 22, organic illuminating element 23 and sealant 24, and described sealant 24 comprises supporting layer 241 and the first adhesive layer 242.
Second substrate 22 is oppositely arranged with first substrate 21, organic illuminating element 23 is arranged between first substrate 21 and second substrate 22, the neighboring area of sealant 24 between first substrate 21 and second substrate 22, thereby by hermetically sealed organic illuminating element 23 between first substrate 21 and second substrate 22, wherein, organic illuminating element 23 is arranged on first substrate 21, supporting layer 241 is arranged on first substrate 21, and around organic illuminating element 23, the first adhesive layer 242 covers supporting layer 241.
In the present embodiment, first substrate 21 can be transparency carrier, also can be translucent substrate or nontransparent substrate, it can be preferably preferably further tft array substrate, second substrate 22 can be transparent cover plate, further preferably can adopt glass, resin or have the transparent cover plate that functional (as flexibility) material is made.
In the present embodiment, the sealant 24 being made up of supporting layer 241 and the first adhesive layer 242 has stopped the approach that steam and oxygen infiltrate organic LED display panel inside, thereby prevent the infringement to organic illuminating element 23 of steam and oxygen, extended the life-span of organic LED display panel.
The height of supporting layer 241 is greater than the height of organic illuminating element 23, prevent that second substrate 22 is pressed onto organic illuminating element 23, in addition, also be provided with and support in organic LED display panel inside, this supports on the first substrate or second substrate that can be positioned at organic LED display panel, in the present embodiment, the object of supporting layer 241 is in order to match with supporting of organic LED display panel inside, thereby make the first substrate 21 of organic LED display panel and second substrate 22 distance each other keep homogeneous, avoid second substrate 22 directly to contact with organic illuminating element 23.
The material of described supporting layer 241 can be rigid material, be preferably flexible material, further, the flexible material of described supporting layer 241 preferably can comprise PETG (Polyethylene terephthalate, PET), PEN (Polyethylene naphthalate, PEN), polyimides (Polyimide, PI), Merlon (Polycarbonate, or polyethylene glycol succinate (PES) PC), these flexible high molecular materials have good mechanical performance, barrier properties for gases, the premium properties such as water proofing property and stability, steam solubility and steam diffusion coefficient are lower, thereby stop that steam and oxygen infiltrate organic LED display panel inside.
The material of described the first adhesive layer 242 preferably can comprise any one material in silicon (Si) or metallic atom or the combination of multiple material; described the first adhesive layer 242 adopts normal temperature process for pressing; at normal temperatures by first substrate 21 together with second substrate 22 vacuum pressing-combinings; and without high temperature process; manufacturing process is being not easy to produce bubble or fine fisssure phenomenon, thereby is conducive to protect the performance of organic LED display panel.Wherein, described normal temperature refers to general temperature or room temperature, and described normal temperature can include, but are not limited to: 5 DEG C-30 DEG C, the vacuum range of described vacuum pressing-combining can be preferably 10
-1pa-10
-8pa, the pressure limit of described vacuum pressing-combining can be preferably 1-1000N.
It will be understood by those skilled in the art that supporting layer 241 described in the present embodiment is only for explaining the present invention, but not limitation of the invention.Described supporting layer 241 can be positioned at but not only be positioned at or not must be positioned on first substrate 21, the present embodiment is a preferred embodiment, described supporting layer 241 also can be positioned on second substrate 22, as long as supporting layer 241 is between first substrate 21 and second substrate 22 and around organic illuminating element 23, therefore, should be using the schematic structure in Fig. 2 or Fig. 3 as the restriction to the embodiment of the present invention.
In the present embodiment, also provide a kind of display unit, comprised the organic LED display panel described in above any one embodiment.Wherein, described display unit is computer, mobile phone, Electronic Paper or other display unit.
The organic LED display panel that first embodiment of the invention provides and display unit, by supporting layer being set on first substrate and around organic illuminating element, on described supporting layer, adhesive layer is set, thereby the neighboring area between described first substrate and described second substrate forms sealant, by hermetically sealed described organic illuminating element between described first substrate and described second substrate, and without high temperature process, stop that steam and oxygen infiltrate organic LED display panel inside, extend the life-span of organic LED display panel, improve the product yield of organic LED display panel.
Figure 4 illustrates the second embodiment of the present invention.
Fig. 4 is according to the schematic diagram of a kind of organic LED display panel of second embodiment of the invention; the present embodiment is taking above-described embodiment as basis; as shown in Figure 4; this organic LED display panel comprises first substrate 31, second substrate 32, organic illuminating element 33 and sealant 34, and described sealant 34 comprises supporting layer 341, protective layer 342 and the first adhesive layer 343.
Wherein, protective layer 342 is arranged between supporting layer 341 and the first adhesive layer 343, and covers supporting layer 341 and organic illuminating element 33, the first adhesive layers 343 cover supporting layer 341.
In the present embodiment, the material of described protective layer 342 preferably can comprise silicon dioxide (SiO
2), silicon nitride (SiN), silicon oxynitride (SiON), silicon oxide carbide (SiOC), carborundum (SiC), aluminium oxide (Al
2o
3), any one material in zinc oxide (ZnO) or magnesium sulfide (MgS) or the combination of multiple material; the benefit that increases protective layer 342 is; can further stop that steam and oxygen infiltrate Organic Light Emitting Diode inside, thus protection organic LED display panel.
The organic LED display panel that the present embodiment provides; by increase protective layer in sealant; described protective layer covers supporting layer and organic illuminating element; further stop that steam and oxygen infiltrate organic LED display panel inside; extend the life-span of organic LED display panel, improved the product yield of organic LED display panel.
In a preferred embodiment of the present embodiment, described sealant 34 also comprises that the second adhesive layer 344, the second adhesive layers 344 are corresponding with the first adhesive layer 343, and the second adhesive layer 344 is arranged at the inner surface of second substrate 32 and around organic illuminating element 33.
Described the first adhesive layer 343 and the second adhesive layer 344 at normal temperatures by first substrate 31 together with second substrate 32 vacuum pressing-combinings, thereby by hermetically sealed organic illuminating element 33 between first substrate 31 and second substrate 32, increase by the second adhesive layer 344, can be on the basis of said structure, better at normal temperatures by first substrate 31 together with second substrate 32 vacuum pressing-combinings.
Described the first adhesive layer 343 and the second adhesive layer 344 can be made up of identical material, also can be made from a variety of materials, in the time of first substrate 31 and second substrate 32 vacuum pressing-combining, need one of them substrate in first substrate 31 or second substrate 32 to tip upside down on another substrate, when the concentration of substrate jointing material after surface activation process of back-off higher than another substrate on the concentration of adhesion-layer materials, make jointing material on the substrate of back-off be difficult for occurring to flow.
Fig. 5 is the schematic diagram that infiltrates organic LED display panel inside by sealant according to the steam of second embodiment of the invention and oxygen; as shown in Figure 5, sealant 34 comprises supporting layer 341, protective layer 342, the first adhesive layer 343 and the second adhesive layer 344.The approach that steam and oxygen infiltrate organic LED display panel inside comprises: contacting permeation and parent infiltration, wherein, contacting permeation comprises that steam and oxygen infiltrate and infiltrate from sealant 34 and the contact-making surface of second substrate 32 from sealant 34 and the contact-making surface of first substrate 31, parent infiltrates and refers to that steam and oxygen infiltrate from sealant, in the present embodiment, because the supporting layer 341 in sealant 34 and protective layer 342 adopts the material with low steam solubility and low steam diffusion coefficient, make sealant 34 there is low water vapor permeable rate, therefore the parent permeability of steam and oxygen is low, in addition, due to the first adhesive layer 343 and the second adhesive layer 344 at normal temperatures by first substrate 31 together with second substrate 32 vacuum pressing-combinings, by hermetically sealed organic illuminating element 33 between first substrate 31 and second substrate 32, therefore the situation that there will not be substrate breakage or come unglued, therefore the contacting permeation rate of steam and oxygen is low.
In the present embodiment, also provide a kind of display unit, comprised the organic LED display panel described in above any one embodiment.Wherein, described display unit is computer, mobile phone, Electronic Paper or other display unit.
The organic LED display panel that the embodiment of the present invention two provides and display unit; by increase protective layer, the first adhesive layer and the second adhesive layer in sealant; further stop that steam and oxygen infiltrate organic LED display panel inside; extend the life-span of organic LED display panel; in addition; can make first substrate and second substrate better press together; simplify manufacture craft; reduce production cost, thereby improved the product yield of organic LED display panel.
In Fig. 6 and Fig. 7 a-Fig. 7 d, the third embodiment of the present invention is shown.
Fig. 6 is according to the flow chart of the manufacture method of a kind of organic LED display panel of third embodiment of the invention, Fig. 7 a-Fig. 7 d is according to structural representation corresponding to the each step of the manufacture method of a kind of organic LED display panel of third embodiment of the invention, the method that the third embodiment of the present invention provides comprises that step S31 is to step S34, it should be noted that, it is for the each step of convenient differentiation that the 3rd embodiment names each step with step S31 to step S34, and be not the sequencing that limits each step, in different embodiments of the invention, each step can be adjusted sequencing according to the adjusting of technique.Below in conjunction with Fig. 7 a to Fig. 7 d, the each step of S31 to S34 is done to corresponding explanation, in fact, the present embodiment finally forms organic LED display panel as shown in Figure 3 with step S31 to S34 (corresponding to the each structure of Fig. 7 a to Fig. 7 d).
Step S31, on described first substrate, form organic illuminating element.
Refer to Fig. 7 a, the first substrate 61 that the present embodiment provides can be tft array substrate, on first substrate 61, form organic illuminating element 63, this organic illuminating element 63 includes OLED and other corresponding members, the process that organic illuminating element 63 is formed on first substrate 61 is prior art, does not repeat them here.
Step S32, on first substrate and around described organic illuminating element, form supporting layer.
Refer to Fig. 7 b, on first substrate 61 and around organic illuminating element 63, form supporting layer 64, particularly, can, by first substrate 61 and around organic illuminating element 63 coating flexible backing material around, irradiate or mode of heating formation supporting layer 64 by ultraviolet ray.
Step S33, on described supporting layer, form the first adhesive layer, wherein, described supporting layer and described the first adhesive layer form sealant, the formation around between described first substrate and second substrate of described sealant.
On supporting layer 64, form the first adhesive layer 65, the first adhesive layers 65 and cover supporting layer 64.
Particularly, refer to Fig. 7 c, can on supporting layer 64, form the first adhesive layer 65, can be by activation processing be carried out in the surface of supporting layer 64, utilize ion beam sputter depositing method on supporting layer 64, to form the first adhesive layer 65.
Described the first adhesive layer 65 and supporting layer 64 form sealant 66, and sealing layer 66 is formed between first substrate 61 and second substrate 62 around, so that by hermetically sealed organic illuminating element 63 sealant 66 between first substrate 61 and second substrate 62.
Step S34, by described sealant, described first substrate and second substrate are pressed together, thus by hermetically sealed described organic illuminating element between described first substrate and described second substrate.
Refer to Fig. 7 d, sealant 66 comprises the first adhesive layer 65 and supporting layer 64, by sealant 66, first substrate 61 and second substrate 62 are pressed together, first substrate 61 and second substrate 62 be at normal temperatures together with vacuum pressing-combining, thereby by hermetically sealed organic illuminating element 63 sealant 66 between first substrate 61 and second substrate 62.
The manufacture method of the organic LED display panel that third embodiment of the invention provides, stop that steam and oxygen infiltrate organic LED display panel inside, extend the life-span of organic LED display panel, simplify manufacture craft, reduce production cost, improved the product yield of organic LED display panel.
In Fig. 8 and Fig. 9 a-Fig. 9 g, the fourth embodiment of the present invention is shown.
Fig. 8 is according to the flow chart of the manufacture method of a kind of organic LED display panel of fourth embodiment of the invention, Fig. 9 a-Fig. 9 g is according to structural representation corresponding to the each step of the manufacture method of a kind of organic LED display panel of fourth embodiment of the invention, the method that the fourth embodiment of the present invention provides comprises that step S41 is to step S46, it should be noted that, it is for the each step of convenient differentiation that the 4th embodiment names each step with step S41 to step S46, and be not the sequencing that limits each step, in different embodiments of the invention, each step can be adjusted sequencing according to the adjusting of technique.Below in conjunction with Fig. 9 a-Fig. 9 g, the each step of S41 to S46 is done to corresponding explanation.
Step S41, on described first substrate, form organic illuminating element.
Refer to Fig. 9 a.The first substrate 81 that the present embodiment provides can be tft array substrate, on first substrate 81, form organic illuminating element 83, this organic illuminating element 83 includes OLED and other build accordingly, the process that organic illuminating element 83 is formed on first substrate 81 is prior art, does not repeat them here.
Step S42, on described first substrate and around organic illuminating element, form supporting layer.
Refer to Fig. 9 b.On first substrate 81 and around organic illuminating element 83, form supporting layer 84, particularly, can, by first substrate 81 and around organic illuminating element 83 coating flexible backing material around, irradiate or mode of heating formation supporting layer 84 by ultraviolet ray.
Step S43, on described supporting layer and described organic illuminating element, form protective layer.
Refer to Fig. 9 c; utilize ald, physical vapour deposition (PVD), chemical vapour deposition (CVD) or sputtering method to form protective layer 85 on described supporting layer 84 and described organic illuminating element 83; this protective layer 85 covers supporting layer 84 and organic illuminating element 83, and the benefit that increases protective layer 85 is further to have stopped that steam and oxygen infiltrate organic LED display panel inside.
Step S44, on described supporting layer, form the first adhesive layer, wherein, described supporting layer, protective layer and the first adhesive layer form sealant, the formation around between described first substrate and second substrate of described sealant.
Refer to Fig. 9 d, on supporting layer 84, form the first adhesive layer 86, particularly, can be by activation processing be carried out in the surface of supporting layer 84, utilize ion beam sputter depositing method on supporting layer 84, to form the first adhesive layer 86.
Supporting layer 84, protective layer 85 and the first adhesive layer 86 form sealant 88; sealing layer 88 is formed between first substrate 81 and second substrate 82 around, so that by hermetically sealed organic illuminating element 83 sealant 88 between first substrate 81 and second substrate 82.
In a preferred implementation of the present embodiment, described method also comprises step:
Step S45, form the second adhesive layer at the inner surface of second substrate and around described organic illuminating element; wherein; described the second adhesive layer is corresponding with described the first adhesive layer; wherein; described supporting layer, protective layer, the first adhesive layer and the second adhesive layer form sealant, the formation around between described first substrate and second substrate of described sealant.
Refer to Fig. 9 e, form the second adhesive layer 87 at the inner surface of second substrate 82 and around organic illuminating element 83, wherein, the second adhesive layer 87 is corresponding with the first adhesive layer 86, in the time that first substrate 81 and second substrate 82 are pressed together, the first adhesive layer 86 and the second adhesive layer 87 fit.Particularly, can be by the inner surface of second substrate 82 be carried out to activation processing, utilize ion beam sputter depositing method to form the second adhesive layer 87 at the inner surface of second substrate 82 and around organic illuminating element 83.
Supporting layer 84, protective layer 85, the first adhesive layer 86 and the second adhesive layer 87 form sealant 88; by sealant 88 by first substrate 81 and second substrate 82 at normal temperatures together with vacuum pressing-combining so that by hermetically sealed organic illuminating element 83 between first substrate 81 and second substrate 82.The benefit that increases by the second adhesive layer 87 is, first substrate 81 and second substrate 82 can better be pressed together, thereby improves the product yield of organic LED display panel.
Step S46, by described sealant, described first substrate and second substrate are pressed together, thus by hermetically sealed described organic illuminating element between described first substrate and described second substrate.
Refer to Fig. 9 f; in the time that sealant 88 comprises supporting layer 84, protective layer 85 and the first adhesive layer 86; by sealant 88, first substrate 81 and second substrate 82 are pressed together; first substrate 81 and second substrate 82 be at normal temperatures together with vacuum pressing-combining, thus by hermetically sealed organic illuminating element 83 between first substrate 81 and second substrate 82.
Refer to Fig. 9 g; in the time that sealant 88 comprises supporting layer 84, protective layer 85, the first adhesive layer 86 and the second adhesive layer 87; by sealant 88, first substrate 81 and second substrate 82 are pressed together; first substrate 81 and second substrate 82 be at normal temperatures together with vacuum pressing-combining, thus by hermetically sealed organic illuminating element 83 between first substrate 81 and second substrate 82.
The manufacture method of the organic LED display panel that fourth embodiment of the invention provides, further stop that steam and oxygen infiltrate organic LED display panel inside, extend the life-span of organic LED display panel, in addition, can make first substrate and second substrate better press together, simplify manufacture craft, reduced production cost, thereby improved the product yield of organic LED display panel.
Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious variations, readjust and substitute and can not depart from protection scope of the present invention.Therefore, although the present invention is described in further detail by above embodiment, the present invention is not limited only to above embodiment, in the situation that not departing from the present invention's design, can also comprise more other equivalent embodiment, and scope of the present invention is determined by appended claim scope.
Claims (19)
1. an organic LED display panel, is characterized in that, comprising:
First substrate;
Second substrate, is oppositely arranged with described first substrate;
Organic illuminating element, is arranged between described first substrate and described second substrate;
Sealant, the neighboring area between described first substrate and described second substrate, thereby by hermetically sealed described organic illuminating element between described first substrate and described second substrate;
Wherein, described sealant comprises:
Supporting layer, is arranged on described first substrate and around described organic illuminating element;
The first adhesive layer, covers described supporting layer.
2. organic LED display panel according to claim 1, is characterized in that, described first substrate and described second substrate vacuum pressing-combining at normal temperatures.
3. organic LED display panel according to claim 1, is characterized in that, described sealant also comprises:
Protective layer, is arranged between described supporting layer and described the first adhesive layer, and covers described supporting layer and described organic illuminating element.
4. organic LED display panel according to claim 1, is characterized in that, described sealant also comprises:
The second adhesive layer, corresponding with described the first adhesive layer, be arranged at the inner surface of described second substrate and around described organic illuminating element.
5. organic LED display panel according to claim 1, is characterized in that, the material of described supporting layer comprises PETG, PEN, polyimides, Merlon or polyethylene glycol succinate.
6. organic LED display panel according to claim 3; it is characterized in that, the material of described protective layer comprises any one material in silicon dioxide, silicon nitride, silicon oxynitride, silicon oxide carbide, carborundum, aluminium oxide, zinc oxide or magnesium sulfide or the combination of multiple material.
7. according to the organic LED display panel described in claim 1 or 4, it is characterized in that, the material of described the first adhesive layer and described the second adhesive layer comprises any one material of silicon or metallic atom or the combination of multiple material.
8. organic LED display panel according to claim 1, is characterized in that, described first substrate is tft array substrate, and described second substrate is glass cover-plate.
9. organic LED display panel according to claim 1, is characterized in that, the vacuum range of described vacuum pressing-combining is 10
-1pa-10
-8pa.
10. organic LED display panel according to claim 1, is characterized in that, the pressure limit of described vacuum pressing-combining is 1-1000N.
11. 1 kinds of display unit, is characterized in that, comprise the organic LED display panel as described in any one in claim 1-10.
The manufacture method of 12. 1 kinds of organic LED display panels, is characterized in that, described method comprises:
On described first substrate, form organic illuminating element;
On described first substrate and around described organic illuminating element, form supporting layer;
On described supporting layer, form the first adhesive layer, wherein, described supporting layer and described the first adhesive layer form sealant, and the neighboring area of described sealant between described first substrate and second substrate forms;
By described sealant, described first substrate and second substrate are pressed together, thus by hermetically sealed described organic illuminating element between described first substrate and described second substrate.
The manufacture method of 13. organic LED display panels according to claim 12, is characterized in that, described first substrate and described second substrate vacuum pressing-combining at normal temperatures.
The manufacture method of 14. organic LED display panels according to claim 12, it is characterized in that, on described first substrate and after forming supporting layer around described organic illuminating element, form the first adhesive layer on described supporting layer before, described method also comprises:
On described supporting layer and described organic illuminating element, form protective layer.
The manufacture method of 15. organic LED display panels according to claim 12, is characterized in that, form the first adhesive layer on described supporting layer after, described method also comprises:
Form the second adhesive layer at the inner surface of described second substrate and around described organic illuminating element, wherein, described the second adhesive layer is corresponding with described the first adhesive layer.
The manufacture method of 16. organic LED display panels according to claim 12, is characterized in that, on described first substrate and around described organic illuminating element, is coated with backing material, irradiates or mode of heating formation supporting layer by ultraviolet ray.
The manufacture method of 17. organic LED display panels according to claim 14; it is characterized in that, utilize ald, physical vapour deposition (PVD), chemical vapour deposition (CVD) or sputtering method to form protective layer on described supporting layer and described organic illuminating element.
The manufacture method of 18. organic LED display panels according to claim 12, is characterized in that, utilizes ion beam sputter depositing method on described supporting layer, to form the first adhesive layer.
The manufacture method of 19. organic LED display panels according to claim 15, is characterized in that, utilizes ion beam sputter depositing method to form the second adhesive layer at the inner surface of described second substrate and around described organic illuminating element.
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