CN109786574A - Encapsulating structure of organic electroluminescence device and preparation method thereof, display device - Google Patents
Encapsulating structure of organic electroluminescence device and preparation method thereof, display device Download PDFInfo
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- CN109786574A CN109786574A CN201910037023.2A CN201910037023A CN109786574A CN 109786574 A CN109786574 A CN 109786574A CN 201910037023 A CN201910037023 A CN 201910037023A CN 109786574 A CN109786574 A CN 109786574A
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- electroluminescence device
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Abstract
The disclosure provides encapsulating structure of a kind of organic electroluminescence device and preparation method thereof and display device, the encapsulating structure of the organic electroluminescence device, comprising: first substrate；The second substrate is oppositely arranged with the first substrate；First packaging plastic is arranged between the first substrate and the second substrate；Second packaging plastic is arranged between the second substrate and first packaging plastic, and the viscosity of first packaging plastic is greater than the viscosity of second packaging plastic.The encapsulating structure for the organic electroluminescence device that the embodiment of the present disclosure provides, can be improved water oxygen barrier effectiveness, improves the service life of OLED device.
Description
Technical field
This disclosure relates to the encapsulating structure and its system of field of display technology more particularly to a kind of organic electroluminescence device
Preparation Method and display device.
Background technique
Organic electroluminescence device (Organic Light Emitting Diode, OLED) to oxygen and steam very
Sensitivity, the water oxygen for penetrating into device inside can the serious luminescent lifetime for influencing device.For OLED emitting layer material, oxygen
And the carbonyls that OLED luminescent layer is generated by oxidation is effective quencher, can effectively reduce OLED device
Luminous efficiency；Water energy enough makes organic layer compound hydrolysis and influences electric conductivity, and stability of material is caused to reduce.For work
Metal electrode is sprinkled, the water oxygen being easily penetrated into device corrodes, or even electrochemical corrosion occurs, and influences the longevity of OLED device
Life.
The encapsulation of OLED device encapsulates (Dam&fill) method, packaging plastic (DAM) and glass using traditional filling glue at present
Glass bonding place and DAM and filling glue (Filler) overlap the important path that place is water oxygen invasion, are easy to pass through water oxygen micro-
Hole penetrates into device inside, influences the service life of OLED device.
It is, therefore, desirable to provide a kind of novel OLED encapsulating structure, penetrates into device content to avoid water oxygen, mentions
The service life of high OLED device.
It should be noted that information is only used for reinforcing to the background of the disclosure disclosed in above-mentioned background technology part
Understand, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
Encapsulating structure for being designed to provide a kind of organic electroluminescence device of the disclosure and preparation method thereof and
Assembling device is shown, to improve the service life of OLED device for improving water oxygen barrier effectiveness.
Other characteristics and advantages of the disclosure will be apparent from by the following detailed description, or partially by this public affairs
The practice opened and acquistion.
According to one aspect of the disclosure, a kind of encapsulating structure of organic electroluminescence device is provided, comprising: the first base
Plate；The second substrate is oppositely arranged with the first substrate；The first substrate and the second substrate is arranged in first packaging plastic
Between；Second packaging plastic is arranged between the second substrate and first packaging plastic, the viscosity of first packaging plastic
Greater than the viscosity of second packaging plastic.
In a kind of exemplary embodiment of the disclosure, second packaging plastic is completely covered or part covers described first
Packaging plastic.
In a kind of exemplary embodiment of the disclosure, first packaging plastic and the second packaging plastic include thermosetting property or light
Sensitive polymer resin.
In a kind of exemplary embodiment of the disclosure, first packaging plastic further includes water suction compound.
In a kind of exemplary embodiment of the disclosure, the water suction compound includes calcium oxide, sodium oxide molybdena, barium monoxide, oxygen
Change magnesium, lithium chloride, in lithium bromide any one or combinations thereof.
In a kind of exemplary embodiment of the disclosure, second packaging plastic further includes supporter.
According to one aspect of the disclosure, a kind of preparation method of organic electroluminescence device encapsulating structure is provided, is wrapped
It includes: first substrate being provided, the first packaging plastic is formed on the first substrate, forms the second packaging plastic on first packaging plastic,
The glue that the glue of second packaging plastic is wider than first packaging plastic is wide, and the viscosity of first packaging plastic is greater than institute
State the viscosity of the second packaging plastic.
In a kind of exemplary embodiment of the disclosure, first packaging plastic and the second packaging plastic include thermosetting property or light
Sensitive polymer resin.
In a kind of exemplary embodiment of the disclosure, first packaging plastic further includes water suction compound.
According to one aspect of the disclosure, a kind of display device, including organic electroluminescence device as described above are provided
Encapsulating structure.
The encapsulating structure for the organic electroluminescence device that the embodiment of the present disclosure provides uses the double-deck packaging plastic, can hinder
Keep off the invasion of the interface water oxygen between the first packaging plastic and cover board, and blocking of lesser second packaging plastic of viscosity to water oxygen
Effect is more preferable, and the encapsulation of biggish first packaging plastic of viscosity and support effect are more preferable, the knot of the first packaging plastic and the second packaging plastic
Excellent packaging effect can be obtained by closing use.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the reality for meeting the disclosure
Example is applied, and together with specification for explaining the principles of this disclosure.It should be evident that the accompanying drawings in the following description is only this
Disclosed some embodiments without creative efforts, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 schematically shows the encapsulating structure of OLED device in the prior art；
Fig. 2 schematically shows the encapsulating structure according to OLED device in one exemplary embodiment of the disclosure；
Fig. 3 schematically shows the encapsulating structure according to OLED device in disclosure another exemplary embodiment；
Fig. 4 schematically shows the encapsulating structure according to OLED device in disclosure another exemplary embodiment.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein；On the contrary, thesing embodiments are provided so that the disclosure will more
Add fully and completely, and the design of example embodiment is comprehensively communicated to those skilled in the art.Described spy
Sign, structure or characteristic can be incorporated in any suitable manner in one or more embodiments.
In addition, attached drawing is only the schematic illustrations of the disclosure, it is not necessarily drawn to scale.Identical attached drawing in figure
Label indicates same or similar part, thus will omit repetition thereof.
Fig. 1 schematically shows the encapsulating structure of OLED device in the prior art.As shown in Figure 1, OLED device in the prior art
The encapsulating structure of part includes: substrate 101, and red picture on the substrate 101 is arranged in the cover board 105 being oppositely arranged with substrate 101
Plain 102a, green pixel 102b and blue pixel 102c, and the passivation layer 103 of covering dot structure, are filled in substrate 101
Filling glue 106 between cover board 105, and the packaging plastic 104 being arranged between substrate 101 and cover board 105.
Packaging plastic 104 in the prior art is only formed by layer of material, and water oxygen can not be effectively stopped.
For this purpose, the exemplary embodiment of the disclosure proposes a kind of encapsulating structure of novel OLED device, below with reference to attached
Fig. 2-4 is described in detail.
Fig. 2 schematically shows the encapsulating structure according to OLED device in one exemplary embodiment of the disclosure.As shown in Fig. 2,
The encapsulating structure of the OLED device of the embodiment of the present disclosure includes: substrate 201, the cover board 205 being oppositely arranged with substrate 201, setting
Red pixel 202a, green pixel 202b and blue pixel 202c on substrate 201, and the passivation of covering dot structure
Layer 203, the filling glue 206 being filled between substrate 201 and cover board 205 are arranged in the between substrate 201 and cover board 105
One packaging plastic 204, and the second packaging plastic 207 being arranged between cover board 205 and the first packaging plastic 204, wherein the first envelope
The viscosity for filling glue 204 is greater than the viscosity of the second packaging plastic 207.
First packaging plastic 204 and the second packaging plastic 207 all include thermosetting property or photosensitive polymers resin, such as asphalt mixtures modified by epoxy resin
Rouge, olefin polymer, polyimide-based polymer etc., in addition to this, the first packaging plastic 204 further include water suction compound and branch
Object etc. is supportted, the water suction compound includes calcium oxide, sodium oxide molybdena, barium monoxide, magnesia, lithium chloride, lithium bromide etc..Second envelope
It fills and does not contain above-mentioned water suction compound and supporter in glue 207 then.
In the present embodiment, the second packaging plastic 207 cover the first packaging plastic 204 upper surface, double-deck packaging plastic it is good
Place is that the glue that is wider than the first packaging plastic 204 due to the glue of the second packaging plastic 207 is wide, can stop the first packaging plastic 204 and lid
The invasion of interface water oxygen between plate 205, smaller second packaging plastic 207 of viscosity is more preferable to the blocking effect of water oxygen, and
The encapsulation of first packaging plastic 204 and support effect are more preferable, and bigger the first packaging plastic 204 of viscosity can control viscosity compared with
The second small packaging plastic 207 overflows to the inside of display area, and the combination of the first packaging plastic 204 and the second packaging plastic 207 makes
With excellent packaging effect can be obtained.
Fig. 3 schematically shows the encapsulating structure according to OLED device in disclosure another exemplary embodiment.Such as Fig. 3 institute
Showing, the encapsulating structure of the OLED device of the embodiment of the present disclosure includes: substrate 301, the cover board 305 being oppositely arranged with substrate 301,
Red pixel 302a, green pixel 302b and blue pixel 302c on substrate 301 are set, and cover dot structure
Passivation layer 303, the filling glue 306 being filled between substrate 301 and cover board 305, is arranged between substrate 301 and cover board 305
First packaging plastic 304, and the second packaging plastic 307 being arranged between cover board 305 and the first packaging plastic 304, wherein first
The viscosity of packaging plastic 304 is greater than the viscosity of the second packaging plastic 307.
In this embodiment, the second packaging plastic 307 cover the first packaging plastic 304 upper surface and the first packaging plastic not
It is glued the outer surface of touching with filling.
First packaging plastic 304 and the second packaging plastic 307 all include thermosetting property or photosensitive polymers resin, such as asphalt mixtures modified by epoxy resin
Rouge, olefin polymer, polyimide-based polymer etc., in addition to this, the first packaging plastic 304 further include water suction compound and branch
Object etc. is supportted, the water suction compound includes calcium oxide, sodium oxide molybdena, barium monoxide, magnesia, lithium chloride, lithium bromide etc..Second envelope
It fills and does not contain above-mentioned water suction compound and supporter in glue 307 then.
In the encapsulating structure of the OLED device of the embodiment, the second packaging plastic 307 covers two of the first packaging plastic 304
Surface can better play the effect for stopping water oxygen, the envelope of first packaging plastic 304 more preferable with the bonding of the first packaging plastic 304
Dress and support effect are more preferable, and bigger the first packaging plastic 304 of viscosity can control lesser second packaging plastic 307 of viscosity
The inside of display area is overflowed to, the combined use of the first packaging plastic 304 and the second packaging plastic 307 can obtain excellent encapsulation
Effect.
Fig. 4 schematically shows the encapsulating structure according to OLED device in disclosure another exemplary embodiment.Such as Fig. 4 institute
Showing, the encapsulating structure of the OLED device of the embodiment of the present disclosure includes: substrate 401, the cover board 405 being oppositely arranged with substrate 401,
Red pixel 402a, green pixel 402b and blue pixel 402c on substrate 401 are set, and cover dot structure
Passivation layer 403, the filling glue 406 being filled between substrate 401 and cover board 405, is arranged between substrate 401 and cover board 405
First packaging plastic 404, and the second packaging plastic 407 being arranged between cover board 405 and the first packaging plastic 404, wherein first
The viscosity of packaging plastic 404 is greater than the viscosity of the second packaging plastic 407.
In this embodiment, except the face of the first packaging plastic 404 of the second packaging plastic 407 covering contacted with substrate 401
All surface.
First packaging plastic 404 and the second packaging plastic 407 all include thermosetting property or photosensitive polymers resin, such as asphalt mixtures modified by epoxy resin
Rouge, olefin polymer, polyimide-based polymer etc., in addition to this, the first packaging plastic 204 further include water suction compound and branch
Object etc. is supportted, the water suction compound includes calcium oxide, sodium oxide molybdena, barium monoxide, magnesia, lithium chloride, lithium bromide etc..Second envelope
It fills and does not contain above-mentioned water suction compound and supporter in glue 407 then.
In the encapsulating structure of the OLED device of the embodiment, the second packaging plastic 407 cover the first packaging plastic 404 and base
All surface except the face that plate 401 contacts can better play the effect for stopping water oxygen, the bonding with the first packaging plastic 404
More preferably, the encapsulation of the first packaging plastic 404 and support effect are more preferable, and bigger the first packaging plastic 404 of viscosity can control it is viscous
Spend the inside that lesser second packaging plastic 407 overflows to display area, the combination of the first packaging plastic 404 and the second packaging plastic 407
Using excellent packaging effect can be obtained.
The exemplary embodiment of the disclosure also provides a kind of preparation method of organic electroluminescence device encapsulating structure, packet
Include following steps:
With reference to Fig. 2, first offer substrate 201, red pixel 202a, the green pixel then formed on substrate 201
202b and blue pixel 202c, and the passivation layer 203 of covering dot structure, then form the first packaging plastic 204, then shape
Passivation layer 203 is covered at filling glue 206, then forms the second packaging plastic 207, second encapsulation on the first packaging plastic 204
The glue that the glue of glue 207 is wider than the first packaging plastic 204 is wide, and cover board then is arranged on filling glue 206 and the second packaging plastic 207
205.Obtain encapsulating structure shown in Fig. 2.
The viscosity of first packaging plastic 204 is greater than the viscosity of the second packaging plastic 207.First packaging plastic 204 and the second packaging plastic
207 all include thermosetting property or photosensitive polymers resin, such as epoxy resin, olefin polymer, polyimide-based polymer,
In addition to this, the first packaging plastic 204 further includes water suction compound and supporter etc., and the water suction compound includes calcium oxide, oxygen
Change sodium, barium monoxide, magnesia, lithium chloride, lithium bromide etc..Above-mentioned water suction compound and branch are not contained in second packaging plastic 207 then
Support object.
With organic electroluminescence device encapsulating structure prepared by the method for the exemplary embodiment of the disclosure, as previously mentioned,
Excellent packaging effect can be obtained.
Fig. 3 and encapsulating structure shown in Fig. 4 can also be used to be prepared in the method for the exemplary embodiment of the disclosure,
Detailed process is similar with the above method, and details are not described herein.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to the disclosure
Other embodiments.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are wanted by right
It asks and points out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the attached claims.
Claims (10)
1. a kind of encapsulating structure of organic electroluminescence device, comprising:
First substrate；
The second substrate is oppositely arranged with the first substrate；
First packaging plastic is arranged between the first substrate and the second substrate；
Second packaging plastic is arranged between the second substrate and first packaging plastic, and the viscosity of first packaging plastic is big
In the viscosity of second packaging plastic.
2. the encapsulating structure of organic electroluminescence device according to claim 1, wherein second packaging plastic covers completely
Lid or part cover first packaging plastic.
3. the encapsulating structure of organic electroluminescence device according to claim 2, wherein first packaging plastic and second
Packaging plastic includes thermosetting property or photosensitive polymers resin.
4. the encapsulating structure of organic electroluminescence device according to claim 3, wherein first packaging plastic further includes
Absorb water compound.
5. the encapsulating structure of organic electroluminescence device according to claim 4, wherein the water suction compound includes oxygen
Change calcium, sodium oxide molybdena, barium monoxide, magnesia, lithium chloride, in lithium bromide any one or combinations thereof.
6. the encapsulating structure of organic electroluminescence device according to claim 4 or 5, wherein second packaging plastic also wraps
Include supporter.
7. a kind of preparation method of organic electroluminescence device encapsulating structure, comprising:
First substrate is provided,
The first packaging plastic is formed on the first substrate,
The second packaging plastic is formed on first packaging plastic, the glue of second packaging plastic is wider than first packaging plastic
Glue is wide, and the viscosity of first packaging plastic is greater than the viscosity of second packaging plastic.
8. the preparation method of organic electroluminescence device encapsulating structure according to claim 7, wherein first encapsulation
Glue and the second packaging plastic include thermosetting property or photosensitive polymers resin.
9. the preparation method of the encapsulating structure of organic electroluminescence device according to claim 8, wherein first envelope
Dress glue further includes water suction compound.
10. a kind of display device, the encapsulating structure including organic electroluminescence device such as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910037023.2A CN109786574A (en) | 2019-01-15 | 2019-01-15 | Encapsulating structure of organic electroluminescence device and preparation method thereof, display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910037023.2A CN109786574A (en) | 2019-01-15 | 2019-01-15 | Encapsulating structure of organic electroluminescence device and preparation method thereof, display device |
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Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20100301742A1 (en) * | 2009-05-26 | 2010-12-02 | Sony Corporation | Display, method for producing display, and electronic apparatus |
| CN104167426A (en) * | 2014-06-03 | 2014-11-26 | 上海天马有机发光显示技术有限公司 | Organic light-emitting diode display panel and manufacturing method thereof and display device |
| CN104183785A (en) * | 2014-06-27 | 2014-12-03 | 京东方科技集团股份有限公司 | OLED device packaging method, OLED display panel and OLED display device |
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Application publication date: 20190521 |