CN109585677A - A kind of encapsulating structure and display device - Google Patents
A kind of encapsulating structure and display device Download PDFInfo
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- CN109585677A CN109585677A CN201811447412.4A CN201811447412A CN109585677A CN 109585677 A CN109585677 A CN 109585677A CN 201811447412 A CN201811447412 A CN 201811447412A CN 109585677 A CN109585677 A CN 109585677A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Abstract
The present invention provides a kind of encapsulating structure and display devices, solve the poor reliability of current thin film encapsulation, are easy the problem of intrusion water oxygen causes organic luminous layer to fail.It include: inorganic layer；The side of the inorganic layer is arranged in organic layer；First barrier layer, side of the organic layer far from the inorganic layer is set, wherein the organic layer is equipped with the first groove close to the side of first barrier layer, first barrier layer is equipped with the first protrusion close to the side of the organic layer, and first protrusion is filled in first groove；And/or second barrier layer, it is arranged between the organic layer and the inorganic layer, wherein, the inorganic layer is equipped with the second groove close to the side of second barrier layer, second barrier layer is equipped with the second protrusion close to the side of the inorganic layer, wherein second protrusion is filled in second groove.
Description
Technical field
The present invention relates to field of display technology, and in particular to a kind of encapsulating structure and display device.
Background technique
With the continuous development of display technology, flexible OLED (Organic Light-Emitting Diode, organic light emission
Diode) display device is due to having the advantages that self-luminous, response time are short, contrast is high, wide viewing angle and low-power consumption etc.
And it is widely applied.But flexible OLED devices are generally carried out using traditional thin-film encapsulation layer during being packaged
Encapsulation, thin-film encapsulation layer includes the organic film and inorganic thin film being stacked, but in real process in large-sized TFE
The unfailing performance of (Thin-Film Encapsulation, thin-film package) or very poor, water oxygen is easily accessible and causes organic
The failure of luminescent layer.
Summary of the invention
In view of this, solving the reliable of current thin film encapsulation the present invention provides a kind of encapsulating structure and display device
Property it is poor, be easy intrusion water oxygen the problem of causing organic luminous layer to fail.
A kind of encapsulating structure and display device that one embodiment of the invention provides include: inorganic layer；Organic layer is arranged in institute
State the side of inorganic layer；Side of the organic layer far from the inorganic layer is arranged in, wherein described organic in first barrier layer
Layer is equipped with the first groove close to the side of first barrier layer, and first barrier layer is equipped with close to the side of the organic layer
First protrusion, first protrusion are filled in first groove；And/or second barrier layer, setting in the organic layer and
Between the inorganic layer, wherein the inorganic layer is equipped with the second groove, second resistance close to the side of second barrier layer
Interlayer is equipped with the second protrusion close to the side of the inorganic layer, wherein second protrusion is filled in second groove.
In one embodiment, the encapsulating structure includes second barrier layer, wherein the encapsulating structure is into one
Step includes third barrier layer, side of the organic layer far from second barrier layer is arranged in, wherein the organic layer is close
The side of the third barrier layer is equipped with third groove, and the third barrier layer is convex equipped with third close to the side of the organic layer
It rises, wherein the third protrusion is filled in the third groove.
In one embodiment, the encapsulating structure includes multiple third barrier layers and multiple organic layers,
The plurality of organic layer and multiple third barrier layers are distributed in distance；Multiple organic layers are hindered close to the third
The side of interlayer is equipped with the third groove, and multiple third barrier layers are equipped with described close to the side of the organic layer
Third protrusion, wherein the third protrusion is filled in the third groove.
It in one embodiment, further comprise the first encapsulated layer that the encapsulating structure surface is set.
In one embodiment, the material of first encapsulated layer can be one of following material: ultra-thin glass
And organic sheet.
In one embodiment, the encapsulating structure includes first barrier layer, wherein the organic layer is described
Projection on first encapsulated layer is located in first encapsulated layer；The surrounding of the organic layer passes through cement and described first
Encapsulated layer engagement.
In one embodiment, the encapsulating structure includes first barrier layer, wherein the organic layer is far from institute
The side for stating barrier layer is engaged by cement and first encapsulated layer.
In one embodiment, the material of first barrier layer, second barrier layer and the third barrier layer
For one of following material or a variety of: nano-silicon dispersing agent, graphene and organic barrier water oxygen material.
In one embodiment, the encapsulating structure includes first barrier layer, wherein the organic layer is far from institute
The side for stating barrier layer is engaged by cement and first encapsulated layer.
In one embodiment, comprising: encapsulated layer, wherein the encapsulated layer has encapsulating structure described above；It is aobvious
Show luminescent layer, the side of the encapsulated layer is set, wherein the encapsulated layer is covered on the display luminescent layer；And driving
Layer, is arranged in the display side of the luminescent layer far from the encapsulated layer, is configured to that the display luminescent layer is driven to issue display
Light.
A kind of encapsulating structure provided in an embodiment of the present invention and display device, the encapsulating structure include inorganic layer, organic layer
With the first barrier layer and/or the second barrier layer.The side of inorganic layer is arranged in organic layer, and the setting of the first barrier layer is remote in organic layer
Side from inorganic layer, the side surface that organic layer is in contact with the first barrier layer be equipped with the first groove, the first barrier layer with have
The side that machine layer is in contact is equipped with the first protrusion, wherein the first protrusion is completely filled in the first groove；The setting of second barrier layer
Between organic layer and inorganic layer, inorganic layer is equipped with the second groove close to the side of the second barrier layer, and the second barrier layer is close to nothing
The side of machine layer is equipped with the second protrusion, and the second protrusion is completely filled in the second groove.It is equipped with the first groove in organic surface,
And/or the second groove is equipped in inorganic layer surface and has delayed steam since the presence of groove increases the intrusion path of water oxygen
Invasion, and stress can be preferably discharged during high temperature or bending, reduce the risk of film layer fracture.By the first resistance
First protrusion of interlayer is completely filled in the first groove, and the second protrusion of the second barrier layer is completely filled in the second groove
It is interior, since the first barrier layer and the second barrier layer have the ability for obstructing water oxygen, can reduce in organic layer and inorganic layer
Water oxygen permeability, to enhance TFE packaging effect.
Detailed description of the invention
Fig. 1 show a kind of structural schematic diagram of encapsulating structure of one embodiment of the invention offer.
Fig. 2 show a kind of structural schematic diagram of encapsulating structure of one embodiment of the invention offer.
Fig. 3 show a kind of structural schematic diagram of encapsulating structure of one embodiment of the invention offer.
Fig. 4 show a kind of encapsulation with multiple organic layers and multiple third barrier layers of one embodiment of the invention offer
The structural schematic diagram of structure.
Fig. 5 show a kind of organic layer of one embodiment of the invention offer and the first barrier layer is integrated the encapsulation knot of preparation
The structural schematic diagram of structure.
Fig. 6 show a kind of structural schematic diagram of display panel of one embodiment of the invention offer.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Fig. 1 show a kind of structural schematic diagram of encapsulating structure of one embodiment of the invention offer.Fig. 2 show the present invention
A kind of structural schematic diagram for encapsulating structure that one embodiment provides.
As depicted in figs. 1 and 2, which includes inorganic layer 1, organic layer 2 and the first barrier layer 3 and/or the second resistance
Interlayer 4.First barrier layer 3 has the function of barrier water oxygen, and the side of inorganic layer 1 is arranged in organic layer 2, and the first barrier layer 3 is set
It sets in side of the organic layer 2 far from inorganic layer 1, it is recessed that the side surface that organic layer 2 is in contact with the first barrier layer 3 is equipped with first
Slot, the side that the first barrier layer 3 is in contact with organic layer 2 is equipped with the first protrusion, wherein to be completely filled in first recessed for the first protrusion
In slot.Second barrier layer 4, the second barrier layer 4 has the function of obstructing water oxygen, wherein the second barrier layer 4 is arranged in 2 He of organic layer
Between inorganic layer 1, inorganic layer 1 is equipped with the second groove close to the side of the second barrier layer 4, and the second barrier layer 4 is close to inorganic layer 1
Side is equipped with the second protrusion, and the second protrusion is completely filled in the second groove.2 surface of organic layer be equipped with the first groove and/or
The second groove, which is equipped with, on 1 surface of inorganic layer has delayed entering for steam since the presence of groove increases the intrusion path of water oxygen
It invades, and can preferably discharge stress during high temperature or bending, reduce the risk of film layer fracture.By the first barrier
First protrusion of layer 3 is completely filled in the first groove, and the second protrusion of the second barrier layer 4 is completely filled in the second groove
It is interior, since the first barrier layer 3 and the second barrier layer 4 have the ability for obstructing water oxygen, organic layer 2 and inorganic layer can be reduced
Water oxygen permeability in 1, and and due to the presence of the first groove and/or the second groove, the intrusion path of water oxygen is increased, it is whole
Body improves the ability of encapsulating structure barrier water oxygen, to enhance TFE packaging effect.
It is appreciated that the first groove perhaps the second groove quantity can for one or more applications the first protrusion or
The quantity of second protrusion can also be one or more, and each first protrusion can be completely filled in the first groove, each
Second protrusion can be completely filled in the second groove.First groove, the second groove, the first protrusion and the second raised quantity can
Encapsulated layer demand is adjusted according to reality, the present invention is to the first groove, the second groove, the first protrusion and the second protrusion
Quantity is not construed as limiting.
It is further appreciated that the first groove and the second groove can be made by ink-jet printing process, the first groove and second recessed
Slot can also be made by other techniques, as long as third groove is made not by which kind of technique under conditions of meet demand
It limits.
It is also understood that the shape of the first groove and the second groove can be square, cuboid, taper or hemispherical etc.,
The present invention is not construed as limiting the concrete shape of the first groove and the second groove.
Fig. 3 show a kind of structural schematic diagram of encapsulating structure of one embodiment of the invention offer.
As shown in figure 3, the encapsulating structure may also include third barrier layer when the encapsulating structure includes the second barrier layer 4
5, third barrier layer tool 5 has the characteristic of barrier water oxygen, and one of organic layer 2 far from the second barrier layer 4 is arranged in third barrier layer 5
Side.The surface that third barrier layer 5 is in contact with organic layer 2 is equipped with third protrusion, and organic layer 2 is in contact with third barrier layer 5
Side is equipped with third groove, and wherein third protrusion is filled in third groove.Since third barrier layer 5 has the work of barrier water oxygen
With, so third protrusion similarly has the function of obstructing water oxygen, third protrusion is completely filled in third groove, it can be effective
The ability for improving organic layer 2 and obstructing water oxygen increase the intrusion path of water oxygen and due to the presence of third groove, it is whole
Improve the ability of encapsulating structure barrier water oxygen.
It is appreciated that the quantity of third groove and third protrusion can be one or more, guaranteeing each third protrusion
In the case where capable of being completely filled in third groove, the quantity of third groove and third protrusion can carry out according to actual needs
Adjustment, the present invention are not construed as limiting the particular number of third groove and third protrusion.
It is further appreciated that third groove can be made by ink-jet printing process, third groove can also pass through other techniques
Which kind of it is made, as long as being made and being not construed as limiting by technique to third groove under conditions of meet demand.
It is also understood that the shape of third groove can be square, cuboid, taper or hemispherical etc., the present invention is to
The concrete shape of three grooves is not construed as limiting.
Fig. 4 show a kind of encapsulation with multiple organic layers and multiple third barrier layers of one embodiment of the invention offer
The structural schematic diagram of structure.
As shown in figure 4, the quantity of third barrier layer 5 and organic layer 2 can be multiple, multiple organic layers 2 and multiple thirds
Barrier layer 5 is distributed in distance.Multiple organic layers 2 are equipped with third groove, Duo Ge close to the side of adjacent third barrier layer 5
Three barrier layers 5 are equipped with third protrusion close to the side of adjacent organic layer 2, and multiple third protrusions are filled in corresponding
In three grooves.When organic layer 2 is multiple, third barrier layer 5 is respectively provided on the surface of each organic layer 2, and by each third
The third protrusion of barrier layer 5 is completely filled in the third groove of organic layer 2, improves the barrier water oxygen of each organic layer 2
Ability, to improve packaging effect.
It is further appreciated that third groove can be arranged in the side close to inorganic layer 1 in organic layer 2, one far from inorganic layer 1
Side is not provided with third groove；Alternatively, organic layer 2 can be not provided with third groove in the side close to inorganic layer 1, far from inorganic
Third groove is arranged in the side of layer 1；Alternatively, organic layer 2 can be in the side close to inorganic layer 1 and far from the side of inorganic layer 1
It is respectively provided with third groove, under the premise of can guarantee to be filled with third protrusion in each third groove, the present invention is to third
Groove is arranged in organic layer 2 close to the side of inorganic layer 1 or organic layer 2 is arranged in is not construed as limiting far from the side of inorganic layer 1.
In one embodiment of the invention, which further includes the first encapsulated layer 6, and the first encapsulated layer 6 is arranged in the encapsulation
The surface of structure.When the encapsulating structure does not include the second barrier layer 4, the first encapsulated layer 6 is arranged in barrier layer far from organic layer 2
Side；When the encapsulating structure includes the first barrier layer 3, the second barrier layer 4, when not including third barrier layer 5, the first encapsulation knot
Side of the organic layer 2 far from second barrier layer 4 is arranged in structure；When the encapsulating structure is obstructed including the first barrier layer 3, second
When layer 4 and third barrier layer 5, side of the third barrier layer 5 far from the organic layer 2 is arranged in the first encapsulating structure；When the envelope
When assembling structure includes that the first barrier layer 3, the second barrier layer 4 and third obstruct 5 layers, and when third barrier layer 5 is multiple situation,
Outermost side of the third barrier layer 5 far from organic layer 2 is arranged in first encapsulated layer 6.First encapsulated layer 6 is the encapsulating structure
Outermost encapsulated layer on direction far from inorganic layer 1, the material of the first encapsulated layer 6 can be identical with the material of inorganic layer 1,
The material of first encapsulated layer 6 can also be ultra-thin glass or organic sheet.When the first encapsulated layer 6 material be ultra-thin glass or
When organic sheet, the intensity of the encapsulating structure is improved, prevents from being broken in the process of bending.
It it is appreciated that the material of the first encapsulated layer 6 can be identical with the material of inorganic layer 1, or can also be ultra-thin glass
Glass or organic sheet etc., the present invention are not construed as limiting the specific material of the first encapsulated layer 6.
It is further appreciated that the material of organic sheet can be polyimides or poly terephthalic acid etc., the present invention is to organic
The specific material of sheet material is not construed as limiting.
In one embodiment of the invention, when encapsulating structure includes the first barrier layer 3, organic layer 2 is on the first encapsulated layer 6
Projection be located at the first encapsulated layer 6 in, projected area of the organic layer 2 on the first encapsulated layer 6 less than the first encapsulated layer 6 area,
And the edge of projection of the organic layer 2 on the first encapsulated layer 6, without departing from the edge of the first encapsulated layer 6, organic layer 2 is in the first encapsulation
The edge of projection on the layer 6 also not coincident with the first encapsulated layer 6, thus the first encapsulated layer 6 in organic layer 2 far from first
The side of barrier layer 3, there are gaps between the first encapsulated layer 6 and the surrounding of organic layer 2, fill cement 7 in the gap, connect
Mixture 7 is for engaging the first encapsulated layer 6 and organic layer 2.The surrounding of organic layer 2 is carried out by bonding agent and the first encapsulated layer 6
In conjunction with the matter of display picture when can not increase the thickness of encapsulating structure, and not influence the encapsulating structure for display panel
Amount.
It is further appreciated that the type of the cement 7 can be adjusted according to practical application, the present invention is to cement 7
Specific material is not construed as limiting.
In one embodiment of the invention, when encapsulating structure includes the first barrier layer 3, in organic layer 2 far from the first barrier layer 3
Side smear cement 7, and then organic layer 2 is bonded on the first encapsulated layer 6.It is connect due to integrally being smeared on organic layer 2
Mixture 7 improves splicing results so that organic layer 2 is engaging stronger with the first encapsulated layer 6.
It is appreciated that when encapsulating structure includes the first barrier layer 37 He of cement can be used in the surrounding of organic layer 2
First encapsulated layer 6 is combined, and can also pass through cement 7 and the first encapsulation in one side of the organic layer 2 far from the first barrier layer 3
Layer 6 is combined, and the present invention is engaged in what position and is not construed as limiting to organic layer 2 and the first encapsulated layer 6.
In one embodiment of the invention, the material of the first barrier layer 3, the second barrier layer 4 and third barrier layer 5 can be nanometer
One or more of silicon dispersing agent, graphene and organic barrier water oxygen material.When the first barrier layer 3,4 and of the second barrier layer
When the material of third barrier layer 5 is nano-silicon dispersing agent, since nano-silicon dispersing agent can improve the adhesive force between film layer, so that
Adhesion enhancement between first barrier layer 3, the second barrier layer 4, third barrier layer 5 and organic layer 2, inorganic layer 1, reduces de-
The generation of problem is fallen, and nano-silicon dispersing agent can reduce water oxygen permeability, increases packaging effect.When the first barrier layer 3,
When the material of two barrier layers 4 and third barrier layer 5 is graphene, due to graphene intensity with higher itself and flexibility,
The intensity of encapsulating structure can be improved while effectively barrier water oxygen, and when the encapsulating structure is used for flexible display panels,
It can be improved the bend resistance characteristic of the encapsulating structure；When the material of the first barrier layer 3, the second barrier layer 4 and third barrier layer 5 is
When organic barrier water oxygen material, it can play the role of preventing steam from invading and slowing down stress.
It is appreciated that the material of the first barrier layer 3, the second barrier layer 4 and third barrier layer 5 can disperse for nano-silicon
One or more of agent, graphene and organic barrier water oxygen material etc., the present invention is to the first barrier layer 3, the second barrier layer 4
Without limitation with the specific material of third barrier layer 5.
It is further appreciated that the material of the first barrier layer 3, the second barrier layer 4 and third barrier layer 5 can identical not yet
Together, the present invention is to the first barrier layer 3, the second barrier layer 4 and whether third barrier layer 5 is identical is not construed as limiting.
Fig. 5 show a kind of organic layer of one embodiment of the invention offer and the first barrier layer is integrated the encapsulation knot of preparation
The structural schematic diagram of structure.
As shown in figure 5, the material of organic layer 2 can also be when 3 material of the first barrier layer is the material of organic barrier water oxygen
Obstruct water oxygen material.When the first barrier layer 3 is identical with the material of barrier water oxygen used in organic layer 2,3 He of the first barrier layer
Organic layer 2 can be prepared simultaneously, and reduce the process of the first groove of preparation, therefore under the premise of not influencing packaging effect,
Simplify preparation process.
It is appreciated that the material of the first barrier layer 3 and the material of organic layer 2 can be the same or different, the present invention couple
Identical without limitation whether the material of the material of the first barrier layer 3 and organic layer 2.
Fig. 6 show a kind of structural schematic diagram of display panel of one embodiment of the invention offer.
As shown in fig. 6, the display panel includes encapsulated layer, display luminescent layer 8 and driving layer 9, encapsulated layer includes inorganic layer
1, organic layer 2 and the first barrier layer 3 and/or the second barrier layer 4.First barrier layer 3 has the function of obstructing water oxygen, organic layer 2
The side of inorganic layer 1 is set, and side of the organic layer 2 far from inorganic layer 1, organic layer 2 and the first resistance is arranged in the first barrier layer 3
The side surface that interlayer 3 is in contact is equipped with the first groove, and it is convex that the side that the first barrier layer 3 is in contact with organic layer 2 is equipped with first
It rises, wherein the first protrusion is completely filled in the first groove.The encapsulated layer may also include the second barrier layer 4, the second barrier layer 4 tool
Play the role of obstructing water oxygen, wherein the second barrier layer 4 is arranged between organic layer 2 and inorganic layer 1, inorganic layer 1 is close to the second resistance
The side of interlayer 4 is equipped with the second groove, and the second barrier layer 4 is equipped with the second protrusion close to the side of inorganic layer 1, and the second protrusion is completely
It is filled in the second groove.The side of encapsulated layer is arranged in display luminescent layer 8, which is completely covered on display luminescent layer 8
On, display side of the luminescent layer 8 far from encapsulated layer is arranged in driving layer 9, acts on and issues display light for driving display luminescent layer 8.
It is equipped with the first groove on 2 surface of organic layer, the second groove is equipped on 1 surface of inorganic layer, since the presence of groove increases water oxygen
Intrusion path, delayed the invasion of steam, and stress can be preferably discharged during high temperature or bending, reduce
The risk of film layer fracture.First protrusion of the first barrier layer 3 is completely filled in the first groove, by the of the second barrier layer 4
Two protrusions are completely filled in the second groove, since the first barrier layer 3 and the second barrier layer 4 have the ability for obstructing water oxygen, because
This can reduce the water oxygen permeability in organic layer 2 and inorganic layer 1, to enhance TFE packaging effect, effectively protect display
Luminescent layer 8.
It is appreciated that the display panel can be applied in some display devices such as mobile phone, computer etc., the present invention is aobvious to this
Show that the concrete application of panel is not construed as limiting.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, made any modification, equivalent replacement etc. be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of encapsulating structure, which is characterized in that including
Inorganic layer；
The side of the inorganic layer is arranged in organic layer；
Side of the organic layer far from the inorganic layer is arranged in first barrier layer, wherein the organic layer is close to described
The side of one barrier layer is equipped with the first groove, and first barrier layer is equipped with the first protrusion, institute close to the side of the organic layer
The first protrusion is stated to be filled in first groove；And/or
Second barrier layer is arranged between the organic layer and the inorganic layer, wherein the inorganic layer is close to second resistance
The side of interlayer is equipped with the second groove, and second barrier layer is equipped with the second protrusion close to the side of the inorganic layer, wherein institute
The second protrusion is stated to be filled in second groove.
2. encapsulating structure according to claim 1, which is characterized in that when the encapsulating structure includes second barrier layer
When, wherein the encapsulating structure further comprises third barrier layer, the organic layer is set far from second barrier layer
Side, wherein the organic layer is equipped with third groove close to the side of the third barrier layer, the third barrier layer is close to institute
The side for stating organic layer is equipped with third protrusion, wherein the third protrusion is filled in the third groove.
3. encapsulating structure according to claim 2, which is characterized in that the encapsulating structure includes multiple third barriers
Layer and multiple organic layers, the plurality of organic layer and multiple third barrier layers are distributed in distance；
Multiple organic layers are equipped with the third groove, multiple third barriers close to the side of the third barrier layer
Layer is equipped with the third protrusion close to the side of the organic layer, wherein the third protrusion is filled in the third groove
It is interior.
4. encapsulating structure according to claim 3, which is characterized in that it further comprise the first encapsulated layer, the organic layer,
First barrier layer and/or second barrier layer and/or third barrier layer are arranged in first encapsulated layer and the nothing
Between machine layer.
5. encapsulating structure according to claim 4, which is characterized in that the material of first encapsulated layer can be following material
One of matter: ultra-thin glass and organic sheet.
6. encapsulating structure according to claim 4, which is characterized in that when the encapsulating structure includes first barrier layer
When, wherein the organic layer being located in first encapsulated layer in the projection on first encapsulated layer；
The surrounding of the organic layer is engaged by cement and first encapsulated layer.
7. encapsulating structure according to claim 4, which is characterized in that when the encapsulating structure includes first barrier layer
When, wherein side of the organic layer far from the barrier layer is engaged by cement and first encapsulated layer.
8. encapsulating structure according to claim 3, which is characterized in that first barrier layer, second barrier layer and
The material of the third barrier layer is one of following material or a variety of: nano-silicon dispersing agent, graphene and organic barrier water
Oxygen material.
9. encapsulating structure according to claim 1, which is characterized in that first barrier layer and the organic layer are integrated
Organic barrier water oxygen material of preparation.
10. a kind of display panel characterized by comprising
Encapsulated layer, wherein the encapsulated layer has any encapsulating structure in the claims 1-9；
It shows luminescent layer, the side of the encapsulated layer is set, wherein the encapsulated layer is covered on the display luminescent layer；With
And
Layer is driven, the display side of the luminescent layer far from the encapsulated layer is set, is configured to drive the display luminescent layer
Issue display light.
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| CN110335966A (en) * | 2019-06-24 | 2019-10-15 | 武汉华星光电半导体显示技术有限公司 | Encapsulating structure, the preparation method of encapsulating structure and display panel |
| WO2020248420A1 (en) * | 2019-06-12 | 2020-12-17 | 武汉华星光电半导体显示技术有限公司 | Package, display panel, and packaging method for display panel |
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