WO2020258536A1

WO2020258536A1 - Encapsulation structure and preparation method for encapsulation structure

Info

Publication number: WO2020258536A1
Application number: PCT/CN2019/106385
Authority: WO
Inventors: 李朝
Original assignee: 武汉华星光电半导体显示技术有限公司
Priority date: 2019-06-24
Filing date: 2019-09-18
Publication date: 2020-12-30
Also published as: CN110335966A

Abstract

Provided are an encapsulation structure and a preparation method for an encapsulation structure. The encapsulation structure comprises a first inorganic layer (101, 201), a first organic layer (102, 200) and a second inorganic layer (103), wherein an upper surface of the first organic layer (102, 200) is provided with a plurality of grooves, and an area, opposite the grooves, of a lower surface of the second inorganic layer (103) is provided with a plurality of protrusions. When a display panel is sealed, the protrusions extend into the grooves in a manner of corresponding one-to-one, the contact area between the organic layer and the inorganic layer is increased, an adhesive force between film layers is improved, and a display device is protected.

Description

Packaging structure and manufacturing method of packaging structure

Technical field

The present disclosure relates to the field of display technology, and in particular to a packaging structure and a manufacturing method of the packaging structure.

Background technique

Compared with liquid crystal display devices, Organic Light-Emitting Device (OLED) has the advantages of self-luminescence, fast response, lightness and thinness, and has become an emerging technology in the display field, which has been widely used and paid attention to.

The OLED display panel includes multiple film layers, and the film layers mainly include a base layer, a thin film transistor (TFT) driving layer, an OLED light-emitting layer, and an encapsulation layer from bottom to top. Among them, the encapsulation layer plays an important role in the subsequent use of the panel. In order to better block the transmission of water and oxygen and prevent the display panel from failing and aging due to water and oxygen attack, the encapsulation layer is mainly designed with an alternating structure of inorganic-organic-inorganic. At the same time, with the development of flexible display panels, there is a greater need for display panels to have better bending resistance and strong adhesion between packaging layers. However, in the current display panels designed with an inorganic-organic-inorganic alternate packaging structure, it was found in the durability test that there is a problem of easy peeling between the inorganic layer and the organic layer, and the packaging is not tight, which leads to the failure of the packaging. Affect the service life of the display panel.

Therefore, it is necessary to propose solutions to the problems in the prior art.

technical problem

To sum up, in the packaging structure design of the existing OLED display panel, the encapsulation inorganic film layer and the organic film layer are easy to peel off, the package is not tight, and water and oxygen easily enter the inside of the display panel, causing the package to fail. Problems such as low life. Need to propose further solutions and improvement methods.

Technical solutions

In order to solve the above problems, the present disclosure provides a packaging structure and a manufacturing method of the packaging structure, so as to solve the problems of easy peeling between packaging film layers, not tight packaging, and low service life of the display panel in the existing packaging structure.

To solve the above technical problems, the technical solutions provided by the embodiments of the present disclosure are as follows:

According to the first aspect of the embodiments of the present disclosure, there is provided a package structure including:

First inorganic layer

A first organic layer, the first organic layer being disposed on the first inorganic layer;

A second inorganic layer, the second inorganic layer is disposed on the first organic layer;

Wherein, the upper surface of the first organic layer is provided with a plurality of grooves, and the lower surface of the second inorganic layer is provided with a plurality of protrusions in the area opposite to the grooves, and the protrusions correspond one-to-one Extend into the groove;

The groove is located on the edges of at least two sides of the first organic layer, and the shape of the groove includes a circle, a triangle or a polygon.

According to an embodiment of the present disclosure, the grooves include one-dimensional or two-dimensional array grooves.

According to an embodiment of the present disclosure, the height of the protrusion is not less than the depth of the groove.

According to an embodiment of the present disclosure, the shape of the groove includes a triangle or a polygon.

According to an embodiment of the present disclosure, the material of the first organic layer includes polymethyl methacrylate.

According to an embodiment of the present disclosure, the material of the first inorganic layer includes silicon nitride, silicon dioxide or aluminum oxide.

According to an embodiment of the present disclosure, a packaging glue is further included, and the packaging glue is disposed in the groove.

According to the second aspect of the embodiments of the present disclosure, there is also provided an encapsulation structure, including: a first inorganic layer;

Wherein, the upper surface of the first organic layer is provided with a plurality of grooves, and the lower surface of the second inorganic layer is provided with a plurality of protrusions in the area opposite to the grooves, and the protrusions correspond one-to-one Into the groove.

According to an embodiment of the present disclosure, the groove is located on the edges of at least two sides of the first organic layer.

According to an embodiment of the present disclosure, the shape of the groove includes a circle, a triangle, or a polygon.

According to an embodiment of the present disclosure, the material of the first organic layer includes polymethylmethacrylate, and the material of the first inorganic layer includes silicon nitride, silicon dioxide, or aluminum oxide.

According to an embodiment of the present disclosure, the packaging structure further includes a packaging glue, and the packaging glue is disposed in the groove.

According to the third aspect of the embodiments of the present disclosure, there is also provided a method for manufacturing a package structure, including the following steps:

S100: depositing a first inorganic layer, and preparing a first organic layer on the first inorganic layer;

S101: preparing a plurality of grooves on the first organic layer;

S102: preparing a second inorganic layer on the first organic layer obtained in step S101.

According to an embodiment of the present disclosure, the step S101 further includes: passing nitrogen gas to prepare the groove under the mask of the rectangular array structure mask, and the depth of the groove is 0.2um-1um.

According to an embodiment of the present disclosure, the shape of the groove includes a circle or a polygon.

Beneficial effect

To sum up, the present disclosure provides a new packaging structure, by providing grooves on the organic layer of the packaging structure, and at the same time providing corresponding protrusions on the inorganic layer opposite to the grooves. The protrusion penetrates into the groove, and at the same time, a sealant is added in the groove to further enhance the sealing effect. Furthermore, water and oxygen are effectively prevented from entering the display panel, easy to peel off between the organic packaging film layer and the inorganic film layer, the sealing is not tight, and the service life of the display panel is improved.

Description of the drawings

FIG. 1 is a schematic diagram of each layer structure of a display panel according to an embodiment of the disclosure;

FIG. 2 is a package structure provided by an embodiment of the disclosure;

3 is a schematic diagram of the structure of a first organic layer provided by an embodiment of the disclosure;

4 is a schematic diagram of the structure of a first inorganic layer provided by an embodiment of the disclosure;

5 is a schematic diagram of a package structure provided by another embodiment of the disclosure;

FIG. 6 is a schematic flowchart of a method for manufacturing a package structure provided by an embodiment of the disclosure.

The best mode of the invention

The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that the present disclosure can be implemented.

In an embodiment of the present disclosure, a display panel is provided. As shown in FIG. 1, FIG. 1 is a schematic diagram of the structure of each layer of the display panel according to the embodiment of the disclosure. The display panel includes an OLED layer 100, a first inorganic layer 101 disposed on the OLED layer 100, a first organic layer 102 disposed on the first inorganic layer 101, and a second organic layer 102 disposed on the first organic layer 102. Inorganic layer 103. For the entire display panel, the second inorganic layer 101, the first organic layer 102, and the second inorganic layer 103 on the OLED layer 100 are equivalent to the sealing film layer. In the conventionally designed sealing film layer, due to the weak bonding between the organic layer and the inorganic layer, it is easy to peel off between the organic layer and the inorganic layer when the screen is used for a long time and when the screen is bent. Waiting to enter the display panel, causing the display panel to fail. In the embodiment of the present disclosure, the conventional design structure of the first organic layer 102 and the second inorganic layer 103 is improved, as shown in the first region 104 in FIG. 1. The first region 104 is disposed between the first organic layer 102 and the second inorganic layer 103, and the first region 104 is designed as a convex and concave structure.

Specifically, as shown in FIG. 2, FIG. 2 is a package structure provided by an embodiment of the disclosure. The packaging structure includes a first organic layer 200 and a first inorganic layer 201. In order to make the package more compact, a structure of a plurality of grooves is provided on the upper surface of the first organic layer 200, and at the same time, a plurality of protrusions are provided on the lower surface of the first inorganic layer 201 in an area opposite to the first organic layer 200 , The grooves and the protrusions are matched one by one. When sealing, the protrusions on the first inorganic layer 201 extend into the grooves on the first organic layer 200, so that the organic layer and the inorganic layer adhere to each other. Closer together.

The groove can be a circular groove, a square groove or a polygonal groove. At the same time, the groove can also be a long strip groove. Although the shape of the groove is different, the purpose is to increase the first The contact area between the organic layer 200 and the first inorganic layer 201 improves the sealing effect.

In order to ensure the effectiveness of the sealing, the height of the protrusion is not less than the depth of the groove. In this way, by pressing the protrusion into the groove, water and oxygen are further prevented from entering the inside of the display panel. At the same time, encapsulating glue can also be arranged in the groove. The purpose of the encapsulating glue is to tightly bond the protrusion and the groove, so as to ensure that the protrusion and the groove can be completely tightly attached when the protrusion and the groove are matched.

The material of the first organic layer 200 may be polymethyl methacrylate, and the material of the first inorganic layer 201 may be inorganic materials such as silicon nitride, silicon dioxide, or aluminum oxide.

When the structure of the organic layer is set, as shown in FIG. 3, FIG. 3 is a schematic diagram of the structure of the first organic layer provided by the embodiment of the disclosure. Wherein, a plurality of grooves 301 are provided on the upper surface 302 of the first organic layer 300, and the grooves 301 are arranged in an array, and can be arranged as a one-dimensional array or a two-dimensional array of grooves. As shown in FIG. 3, the cross section of the grooves 301 is a triangle, and they are arranged in an array on the edges of the first side 303 and the second side 304 of the upper surface 302. The above-mentioned array grooves 301 can also be arranged along the upper surface. The edges of the other two sides of 302 are arranged so as to further improve the sealing effect.

As shown in FIG. 4, FIG. 4 is a schematic diagram of the structure of the first inorganic layer provided by an embodiment of the disclosure. The first inorganic layer in FIG. 4 matches the first organic layer in FIG. 3, and the first inorganic layer is disposed above the first organic layer. Specifically, a plurality of protrusions 401 are provided on the lower surface of the first inorganic layer 400. 3, when the protrusions 401 are arranged, they are also arranged in an array, and the positions are arranged corresponding to the grooves 301 to ensure that the protrusions 401 can normally extend into when the first organic layer 300 is bonded to the first inorganic layer 400 Into the corresponding groove 301. The protrusions 401 may also be provided at the edges of at least two sides of the first inorganic layer 400 to increase the sealing effect.

When the above-mentioned grooves are set to other shapes, the corresponding protrusions are also designed to correspond to the grooves. At the same time, in order to increase the tightness of the seal, multiple layers can be arranged on the sealing layer of the display panel. The packaging film layers corresponding to the first organic layer and the first inorganic layer of the structure are shown in FIG. 5, which is a schematic diagram of the packaging structure provided by another embodiment of the disclosure. The encapsulation layer includes an inorganic layer 500, a first organic layer 501 disposed on the inorganic layer 500, a first inorganic layer 502 disposed on the first organic layer 501, and a second organic layer disposed on the first inorganic layer 502 503 and the outermost second inorganic layer 504. In this way, the sealing performance is further increased. The packaging layers are all arranged above the OLED layer.

At the same time, the embodiments of the present disclosure also provide a method for manufacturing the package structure. When the package structure provided by the embodiment of the present disclosure is set, as shown in FIG. 6, FIG. 6 is a schematic flow chart of the manufacturing method of the package structure provided by the embodiment of the present disclosure. Specifically include the following steps:

S100: Deposit a first inorganic layer, and prepare a first organic layer on the first inorganic layer.

Specifically, on the provided OLED device layer, the first inorganic layer can be prepared by a chemical vapor deposition method, and the first organic layer can be prepared by an inkjet printing technique. Wherein, the thickness of the first inorganic layer is between 0.5um and 2um.

S101: preparing a plurality of grooves on the first organic layer.

The groove structure can improve the bonding performance between the film layers. During the preparation, a rectangular array structure mask is used. The length of the rectangular mask is 5um~10um and the spacing is 10um~20um. The mask is placed On the first organic layer, nitrogen gas is used to bombard the first organic layer to remove part of the organic packaging material. A groove array structure with a depth of 0.2um-1um is formed on the bombarded first organic layer area. The nitrogen introduced is pure nitrogen and does not contain oxygen. This way, oxygen or other gases can prevent damage to the OLED device. At the same time, when nitrogen is introduced, the amount of input and the power of the air inlet device can be adjusted according to actual needs. .

After the introduction of nitrogen is completed, a second inorganic layer is prepared on the basis of the above-mentioned first organic layer, and the first organic layer is further encapsulated. Wherein, the second inorganic layer can be prepared by chemical vapor deposition.

Finally, the package structure provided in the embodiment of the present disclosure is obtained.

The packaging structure and the manufacturing method of the packaging structure provided by the embodiments of the present disclosure are described in detail above. The descriptions of the above embodiments are only used to help understand the technical solutions and core ideas of the present disclosure; those of ordinary skill in the art should It is understood that it is still possible to modify the technical solutions described in the foregoing embodiments, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

A packaging structure, including:

First inorganic layer

A first organic layer, the first organic layer being disposed on the first inorganic layer;

A second inorganic layer, the second inorganic layer is disposed on the first organic layer;

Wherein, the upper surface of the first organic layer is provided with a plurality of grooves, and the lower surface of the second inorganic layer is provided with a plurality of protrusions in the area opposite to the grooves, and the protrusions correspond one-to-one Extend into the groove;

The groove is located on the edges of at least two sides of the first organic layer, and the shape of the groove includes a circle, a triangle or a polygon.
The package structure according to claim 1, wherein the grooves comprise one-dimensional or two-dimensional array grooves.
The package structure according to claim 1, wherein the height of the protrusion is not less than the depth of the groove.
The package structure according to claim 1, wherein the material of the first organic layer includes polymethyl methacrylate.
The package structure according to claim 1, wherein the material of the first inorganic layer includes silicon nitride, silicon dioxide, or aluminum oxide.
The packaging structure according to claim 1, further comprising a packaging glue, the packaging glue being arranged in the groove.
A packaging structure, including:

First inorganic layer

A first organic layer, the first organic layer being disposed on the first inorganic layer;

A second inorganic layer, the second inorganic layer is disposed on the first organic layer;

Wherein, the upper surface of the first organic layer is provided with a plurality of grooves, and the lower surface of the second inorganic layer is provided with a plurality of protrusions in the area opposite to the grooves, and the protrusions correspond one-to-one Into the groove.
8. The package structure according to claim 7, wherein the groove is located on the edges of at least two sides of the first organic layer.
8. The package structure of claim 8, wherein the grooves comprise one-dimensional or two-dimensional array grooves.
8. The package structure of claim 7, wherein the height of the protrusion is not less than the depth of the groove.
8. The package structure according to claim 7, wherein the shape of the groove includes a circle, a triangle, or a polygon.
8. The package structure of claim 7, wherein the material of the first organic layer includes polymethyl methacrylate, and the material of the first inorganic layer includes silicon nitride, silicon dioxide, or aluminum oxide.
The packaging structure according to claim 7, further comprising a packaging glue, and the packaging glue is arranged in the groove.
A method for preparing a packaging structure includes the following steps:

S100: depositing a first inorganic layer, and preparing a first organic layer on the first inorganic layer;

S101: preparing a plurality of grooves on the first organic layer;

S102: preparing a second inorganic layer on the first organic layer obtained in step S101.
The method for manufacturing the package structure according to claim 14, wherein the step S101 further comprises: passing nitrogen gas to prepare the groove under the mask of the rectangular array structure mask, the depth of the groove is 0.2 um~1um.
The method for manufacturing the package structure according to claim 14, wherein the shape of the groove includes a circle or a polygon.
The method of manufacturing a package structure according to claim 14, wherein the grooves comprise one-dimensional or two-dimensional array grooves.
14. The method of manufacturing the package structure according to claim 14, wherein the material of the first organic layer comprises polymethyl methacrylate.
14. The method for manufacturing the package structure according to claim 14, wherein the material of the first inorganic layer comprises silicon nitride, silicon dioxide or aluminum oxide.