WO2020199272A1

WO2020199272A1 - Quantum dot flexible oled display device and manufacturing method

Info

Publication number: WO2020199272A1
Application number: PCT/CN2019/083771
Authority: WO
Inventors: 杨中国
Original assignee: 深圳市华星光电半导体显示技术有限公司
Priority date: 2019-04-03
Filing date: 2019-04-23
Publication date: 2020-10-08
Also published as: CN110021652A

Abstract

A quantum dot flexible OLED display device and a manufacturing method, comprising: a first barrier layer, a first flexible substrate, a TFT layer, a blue light OLED light-emitting layer, a first packaging film layer, an adhesive layer, a second packaging film layer, and a quantum dot color film substrate. The quantum dot color film substrate comprises a second barrier layer, a second flexible substrate, a color filter film, a black matrix, and a quantum dot film layer. The adhesive layer is attached at the upper edge to the second flexible substrate and completely covers the second packing film layer.

Description

Quantum dot flexible OLED display device and preparation method

Technical field

This application relates to the field of display technology, in particular to a quantum dot flexible OLED display device and a preparation method.

Background technique

At present, due to the excellent properties of quantum dot material (Quantum Dot, QD), such as high color purity and continuous adjustable spectrum, it becomes the most excellent luminescent material in the 21st century, which can greatly improve the existing liquid crystal display color gamut. The color performance of the display, so its display application has been widely studied in recent years. OLED (organic electroluminescent device) has the characteristics of self-luminescence, ultra-light and thin, fast response speed, and wide viewing angle. Blue OLED device (BOLED) is an ideal light source for excitation of quantum dots. Therefore, the combination of quantum dot blue OLED devices (QD-BOLED) will have the advantages of both quantum dots and OLED, thereby improving product performance.

However, both quantum dots and OLEDs are easily affected by water vapor and must be packaged. At present, the mainstream packaging of quantum dot liquid crystal displays is to paste the sheet material with quantum dots between the films between the backlight and the liquid crystal panel, but in QD-BOLED panels, the quantum dot material is inside the panel, so this packaging method It is not suitable for QD-BOLED packaging. Since both quantum dots and OLEDs are easily affected by water vapor, the packaging technology of large-size flexible OLED panels faces great technical difficulties. Therefore, it is necessary to develop new packaging methods and structures to package QD-BOLED TV panels.

In summary, the existing quantum dot flexible OLED display device, because the quantum dot film layer and the OLED device are easily affected by water vapor, the quantum dot film layer and the OLED device are oxidized, which further reduces the lifetime of the quantum dot flexible OLED display device .

technical problem

In the existing quantum dot flexible OLED display device, since the quantum dot film layer and the OLED device are easily affected by water vapor, the quantum dot film layer and the OLED device are oxidized, and the life of the quantum dot flexible OLED display device is further reduced.

Technical solutions

The present application provides a quantum dot flexible OLED display device and a preparation method, which can protect the quantum dot film layer and the OLED device from water vapor corrosion and reduce the life span, so as to solve the problem of the existing quantum dot flexible OLED display device, quantum dot film layer and OLED devices are easily affected by water vapor, resulting in oxidation of the quantum dot film layer and the OLED device, which further leads to the technical problem of reduced lifetime of the quantum dot flexible OLED display device.

To solve the above problems, the technical solutions provided by this application are as follows:

The present application provides a quantum dot flexible OLED display device, including: a first barrier layer, a first flexible substrate, a TFT layer, a blue OLED light emitting layer, a first packaging film layer, and an adhesive layer;

Wherein, a quantum dot color film substrate is arranged above the adhesive layer, and the quantum dot color film substrate includes a second barrier layer, a second flexible substrate, a color filter film, a black matrix, and a quantum dot film layer, The quantum dot color film substrate is provided with a second encapsulation film layer, the second encapsulation film layer completely covers the black matrix and the quantum dot film layer, the upper edge of the adhesive layer and the first The two flexible substrates are adhered to and completely cover the second packaging film layer.

In the quantum dot flexible OLED display device provided by the embodiment of the present application, the first encapsulation film layer includes a first inorganic water blocking layer, a buffer layer, and a second inorganic water blocking layer stacked from bottom to top. The second inorganic water blocking layer is located on the surface of the first inorganic water blocking layer and completely covers the buffer layer; the adhesive layer is a double-sided sealant, and the second encapsulating film layer is a third inorganic water blocking layer Floor.

In the quantum dot flexible OLED display device provided by the embodiment of the present application, the lower surface of the adhesive layer completely covers the first inorganic water blocking layer, and the upper surface of the adhesive layer completely covers the first inorganic water blocking layer. Three inorganic water blocking layer.

In the quantum dot flexible OLED display device provided by the embodiment of the present application, the materials of the first inorganic water blocking layer, the second inorganic water blocking layer and the third inorganic water blocking layer are SiN _x , SiON, At least one of SiO _x , Al ₂ O ₃ and SiO ₂ .

In the quantum dot flexible OLED display device provided by the embodiment of the present application, the material of the quantum dot film layer includes a polymer matrix and quantum dots dispersed in the polymer matrix.

In the quantum dot flexible OLED display device provided by the embodiments of the present application, the polymer matrix is a resin transparent material, and the resin transparent material includes acrylic resin, epoxy resin, cycloolefin polymer, organosilane resin, and One or more of cellulose esters.

In the quantum dot flexible OLED display device provided by the embodiment of the present application, the black matrix includes a plurality of sub-black matrices, and the color filter film is arranged between two adjacent sub-black matrices.

In the quantum dot flexible OLED display device provided by the embodiment of the present application, the color filter film is any one of a red sub-color film, a green sub-color film, and a blue sub-color film.

The present application also provides a method for manufacturing a quantum dot flexible OLED display device, the method including:

S10, a glass substrate is provided, a first flexible substrate and a TFT layer are sequentially prepared on the glass substrate to form a flexible TFT substrate, and a monochromatic blue light device is produced on the flexible TFT substrate by evaporation or inkjet printing to form Blue OLED light emitting layer;

S20, preparing a first packaging film layer on the surface of the TFT layer, the first packaging film layer completely covering the blue OLED light emitting layer;

S30, providing a glass cover plate, and sequentially preparing a second flexible substrate, a color filter film, a black matrix, and a quantum dot film layer on the surface of the glass cover plate;

S40, preparing a second packaging film layer on the second flexible substrate, the second packaging film layer completely covering the color filter film, the black matrix and the quantum dot film layer;

S50, using a double-sided sealant to bond the first packaging film layer and the second packaging film layer, the double-sided sealant is heated and cured by a heating machine to form an adhesive layer, and the adhesive layer The lower surface of the adhesive layer completely covers the first packaging film layer, and the upper surface of the adhesive layer completely covers the second packaging film layer;

S60. Separate the first flexible substrate from the glass substrate, attach a barrier film to the surface of the first flexible substrate to form a first barrier layer, and connect the second flexible substrate to the glass substrate. The cover plate is separated, and another barrier film is attached to the surface of the second flexible substrate to form a second barrier layer, and finally the quantum dot flexible OLED display device is obtained.

In the method for manufacturing the quantum dot flexible OLED display device provided by the embodiment of the present application, in the S20, the first packaging film layer includes a first inorganic water blocking layer, a buffer layer, and a first inorganic water blocking layer, a buffer layer, and a first layer stacked from bottom to top. Two inorganic water blocking layers, the second inorganic water blocking layer is located on the surface of the first inorganic water blocking layer and completely covers the buffer layer.

Beneficial effect

The beneficial effects of this application are: in the quantum dot flexible OLED display device and preparation method provided by this application, the packaging film layer of the OLED device and the packaging film layer of the quantum dot are bonded with a double-sided sealant, so that the OLED device and the quantum dot The barrier ability of the dots to water and oxygen is enhanced, the risk of oxidation of the internal devices of the quantum dot flexible OLED display device is reduced, and the life of the quantum dot flexible OLED display device is improved.

Description of the drawings

In order to explain the embodiments or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only for application. For some embodiments, those of ordinary skill in the art can obtain other drawings based on these drawings without creative work.

FIG. 1 is a schematic diagram of the structure of a quantum dot flexible OLED display device of this application.

FIG. 2 is a flow chart of the method for manufacturing the quantum dot flexible OLED display device of the present application.

2A-2F are schematic diagrams of manufacturing methods of the quantum dot flexible OLED display device described in FIG. 2.

Embodiments of the invention

The description of the following embodiments refers to the attached drawings to illustrate specific embodiments that can be implemented in this application. The directional terms mentioned in this application, such as [Up], [Down], [Front], [Back], [Left], [Right], [Inner], [Outer], [Side], etc., are for reference only The direction of the additional schema. Therefore, the directional terms used are used to illustrate and understand the application, rather than to limit the application. In the figure, units with similar structures are indicated by the same reference numerals.

This application is aimed at the existing quantum dot flexible OLED display device. Since the quantum dot film layer and the OLED device are easily affected by water vapor, the quantum dot film layer and the OLED device are oxidized, which further leads to the technology of reducing the life of the quantum dot flexible OLED display device Problem, this embodiment can solve the defect.

As shown in FIG. 1, it is a schematic diagram of the structure of the quantum dot flexible OLED display device of this application. Among them, the present application provides a quantum dot flexible OLED display device, including: a first barrier layer 11, a first flexible substrate 12, a TFT layer 13, a blue OLED light emitting layer 14, a first packaging film layer 15 and an adhesive layer 16;

Wherein, a quantum dot color film substrate 18 is provided above the adhesive layer 16, and the quantum dot color film substrate 18 includes a second barrier layer 181, a second flexible substrate 182, a color filter film 183, and a black matrix. 184 and a quantum dot film layer 185, the quantum dot color film substrate 18 is provided with a second encapsulation film layer 17, the second encapsulation film layer 17 completely covers the black matrix 184 and the quantum dot film layer 185, The upper edge of the adhesive layer 16 is bonded to the second flexible substrate 182 and completely covers the second packaging film layer 17.

Specifically, the first encapsulation film layer 15 includes a first inorganic water blocking layer 151, a buffer layer 152, and a second inorganic water blocking layer 153 stacked from bottom to top, and the second inorganic water blocking layer 153 is located at the The surface of the first inorganic water blocking layer 151 completely covers the buffer layer 152; the adhesive layer 16 is a double-sided sealant, and the second encapsulating film layer 17 is a third inorganic water blocking layer.

Specifically, the lower surface of the adhesive layer 16 completely covers the first inorganic water blocking layer 151, and the upper surface of the adhesive layer 16 completely covers the third inorganic water blocking layer.

Specifically, the materials of the first inorganic water blocking layer 151, the second inorganic water blocking layer 153, and the third inorganic water blocking layer are SiN _x , SiON, SiO _x , Al ₂ O ₃ and SiO ₂ At least one of.

Specifically, the material of the quantum dot film layer 185 includes a polymer matrix and quantum dots dispersed in the polymer matrix; the polymer matrix is a resin transparent material, and the resin transparent material includes acrylic resin and epoxy resin. , Cycloolefin polymer, organosilane resin and fiber ester one or more.

Specifically, the black matrix 184 includes a plurality of sub-black matrices 1841, and the color filter film 183 is arranged between two adjacent sub-black matrices 1841; the color filter film 183 is a red sub-color film and a green sub-color film. Any one of sub-color film and blue sub-color film.

As shown in FIG. 2, the present application also provides a manufacturing method flow of a quantum dot flexible OLED display device. The method includes:

S10, a glass substrate 201 is provided, a first flexible substrate 202 and a TFT layer 203 are sequentially prepared on the glass substrate 201 to form a flexible TFT substrate, and a single color is produced on the flexible TFT substrate by evaporation or inkjet printing The blue device forms the blue OLED light-emitting layer 204.

Specifically, the S10 further includes:

First, a glass substrate 201 is provided, and the glass substrate 201 is cleaned with a cleaning solution such as pure water or hot sulfuric acid, and then a polyimide solution is coated on the glass substrate 201, and a nitrogen silicon compound or nitrogen oxide is deposited. After compounding, the first flexible substrate 202 is prepared;

Then, a TFT layer 203 is fabricated on the first flexible substrate 202 to form a flexible TFT substrate, and a monochromatic blue light device is fabricated on the flexible TFT substrate by evaporation or inkjet printing to form a blue OLED light-emitting layer 204, as shown Shown in 2A.

S20, preparing a first packaging film layer 205 on the surface of the TFT layer 203, the first packaging film layer 205 completely covering the blue OLED light emitting layer 204.

Specifically, the S20 further includes:

The first encapsulation film layer 205 includes a first inorganic water blocking layer 2051, a buffer layer 2052, and a second inorganic water blocking layer 2053 stacked from bottom to top, and the second inorganic water blocking layer 2053 is located on the first The surface of the inorganic water blocking layer 2051 completely covers the buffer layer 2052; firstly, the first inorganic water blocking layer 2051 is made by using low temperature plasma chemical vapor deposition or atomic layer deposition on the TFT layer 203, so The material of the first inorganic water blocking layer is at least one of SiN _x , SiON, SiO _x , Al ₂ O ₃ and SiO ₂ ; afterwards, it is made by inkjet printing on the top of the first inorganic water blocking layer 2051 The buffer layer 2052, and the buffer layer 2052 is cured by ultraviolet light; then the second inorganic water blocking layer 2053 is made on the buffer layer 2052 by low temperature plasma chemical vapor deposition or atomic layer deposition The material of the second inorganic water blocking layer is at least one of SiN _x , SiON, SiO _x , Al ₂ O ₃ and SiO ₂ , as shown in FIG. 2B.

S30, a glass cover 2061 is provided, and a second flexible substrate 2062, a color filter film 2063, a black matrix 2064, and a quantum dot film layer 2065 are sequentially prepared on the surface of the glass cover 2061.

Specifically, the S30 further includes:

First, a glass cover 2061 is provided, and the glass cover 2061 is cleaned with a cleaning solution such as pure water or hot sulfuric acid, and then a polyimide solution is coated on the glass cover 2061, and a nitrogen silicon compound is deposited Or oxynitride and then prepare the second flexible substrate 2062; then, the color filter film 2063 and the black matrix 2064 are fabricated on the second flexible substrate 202, and the black matrix 2064 includes a plurality of sub-black matrices 20641. The color filter film 2063 is arranged between two adjacent sub-black matrices 20641, and the color filter film 2063 is any one of a red sub-color film, a green sub-color film, and a blue sub-color film Afterwards, the color filter film 2063 and the black matrix 2064 are first coated with a resin containing quantum dot materials through a yellow light process, and then the resin containing the quantum dot materials is cured by pre-baking, baking, etc. , Forming a quantum dot layer 2065, the material of the quantum dot film layer 2065 includes a polymer matrix and quantum dots dispersed in the polymer matrix, the polymer matrix is a resin transparent material, the resin transparent material includes acrylic resin One or more of, epoxy resin, cycloolefin polymer, organosilane resin and cellulose ester, as shown in Figure 2C.

S40, preparing a second packaging film layer 207 on the second flexible substrate 2062, the second packaging film layer 207 completely covering the color filter film 2063, the black matrix 2064, and the quantum dot film layer 2065.

Specifically, the S40 further includes:

On the second flexible substrate 2062, the second encapsulation film layer 207, that is, the third inorganic water-blocking layer, is fabricated by low-temperature plasma chemical vapor deposition or atomic layer deposition. The material of the water layer is at least one of SiN _x , SiON, SiO _x , Al ₂ O ₃ and SiO ₂ ; the second encapsulation film layer 207 completely covers the color filter film 2063, the black matrix 2064 and The quantum dot film layer 2065 is as shown in FIG. 2D.

S50. Use a double-sided sealant to bond the first packaging film layer 205 and the second packaging film layer 207. The double-sided sealant is heated and cured by a heating machine to form an adhesive layer 208. The lower surface of the mixture layer 208 completely covers the first packaging film layer 205, and the upper surface of the adhesive layer 208 completely covers the second packaging film layer 207.

Specifically, the S50 further includes:

First, provide a double-sided sealant, tear off the protective film on the lower surface side of the double-sided sealant, and stick the lower surface of the double-sided sealant on the first flexible substrate 202 by vacuum bonding After tearing off the protective film on the side of the upper surface of the double-sided sealant, the upper surface of the double-sided sealant is pasted on the second flexible substrate 2062 by means of vacuum bonding; and then heated by a heating machine Pressure or oven heating cures the double-sided sealant to form the adhesive layer 208. The lower surface of the adhesive layer 208 completely covers the first packaging film layer 205. The adhesive layer The upper surface of 208 completely covers the second packaging film layer 207, as shown in FIG. 2E.

S60, the first flexible substrate 202 is separated from the glass substrate 201, a barrier film is attached to the surface of the first flexible substrate 202 to form a first barrier layer 209, and the second flexible substrate 2062 is separated from the glass cover 2061, another barrier film is attached to the surface of the second flexible substrate 2062 to form a second barrier layer 2010, and finally the quantum dot flexible OLED display device is obtained.

Specifically, the S60 further includes:

First cut the glass substrate 201, and then separate the first flexible substrate 202 from the glass substrate 201, attach a barrier film on the surface of the first flexible substrate 202, and make the glue material by heating or pressing After curing, the first barrier layer 209 is formed; then the second flexible substrate 2062 is separated from the glass cover 2061, and another barrier film is attached to the surface of the second flexible substrate 2062, and heated or added. The adhesive material is cured by pressing to form the second barrier layer 2010, thereby completing the packaging and finally obtaining the quantum dot flexible OLED display device, as shown in FIG. 2F.

This application first fabricates the first flexible substrate 202 and the TFT layer 203 on the side of the glass substrate 201, then fabricates the blue OLED light-emitting layer 204, and finally uses the first encapsulation film layer 205 to The blue OLED light-emitting layer 204 is encapsulated; on the side of the glass cover 2061, the second flexible substrate 2062 and the color film substrate 206 are first fabricated, and then quantum dots are fabricated on the color film substrate 206 through a yellow light process The film layer 2065, and finally the quantum dot film layer 2065 is encapsulated with the second encapsulation film layer 207; then the double-sided sealant is vacuum-laminated to the first encapsulation film layer 205 The second packaging film layers 207 are bonded together, and the packaging structure of this packaging structure has a good packaging effect and can simultaneously meet the packaging requirements of large-size flexible TVs for quantum dot materials and OLED devices.

In summary, although the application has been disclosed as above in preferred embodiments, the above-mentioned preferred embodiments are not intended to limit the application, and those of ordinary skill in the art can make various decisions without departing from the spirit and scope of the application. Such changes and modifications, so the protection scope of this application is subject to the scope defined by the claims.

Claims

A quantum dot flexible OLED display device, which includes:

First barrier

A first flexible substrate located on the first barrier layer;

The TFT layer is located on the first flexible substrate;

The blue OLED light-emitting layer is located on the TFT layer;

The first packaging film layer is located on the TFT layer and covers the blue OLED light emitting layer;

An adhesive layer located on the TFT layer and covering the first packaging film layer;

Wherein, a quantum dot color film substrate is arranged above the adhesive layer, and the quantum dot color film substrate includes a second barrier layer, a second flexible substrate, a color filter film, a black matrix, and a quantum dot film layer, The quantum dot color film substrate is provided with a second encapsulation film layer, the second encapsulation film layer completely covers the black matrix and the quantum dot film layer, the upper edge of the adhesive layer and the first The two flexible substrates are adhered to and completely cover the second packaging film layer.
The quantum dot flexible OLED display device of claim 1, wherein the first packaging film layer comprises a first inorganic water blocking layer, a buffer layer, and a second inorganic water blocking layer stacked from bottom to top, and The second inorganic water blocking layer is located on the surface of the first inorganic water blocking layer and completely covers the buffer layer; the adhesive layer is a double-sided sealant, and the second encapsulating film layer is a third inorganic water blocking layer Floor.
The quantum dot flexible OLED display device according to claim 2, wherein the lower surface of the adhesive layer completely covers the first inorganic water blocking layer, and the upper surface of the adhesive layer completely covers the first inorganic water blocking layer. Three inorganic water blocking layer.
The quantum dot of claim 2 flexible OLED device of claim, wherein the first inorganic water-resisting layer, the second inorganic layer and the water blocking material of the third inorganic water-blocking layer is SiN x, SiON display, At least one of SiO x , Al 2 O 3 and SiO 2 .
The quantum dot flexible OLED display device according to claim 1, wherein the material of the quantum dot film layer comprises a polymer matrix and quantum dots dispersed in the polymer matrix.
The quantum dot flexible OLED display device of claim 5, wherein the polymer matrix is a resin transparent material, and the resin transparent material includes acrylic resin, epoxy resin, cycloolefin polymer, organosilane resin, and One or more of cellulose esters.
The quantum dot flexible OLED display device according to claim 1, wherein the black matrix includes a plurality of sub-black matrices, and the color filter film is arranged between two adjacent sub-black matrices.
7. The quantum dot flexible OLED display device of claim 7, wherein the color filter film is any one of a red sub-color film, a green sub-color film, and a blue sub-color film.
A method for preparing a quantum dot flexible OLED display device, wherein the method includes:

S10, a glass substrate is provided, a first flexible substrate and a TFT layer are sequentially prepared on the glass substrate to form a flexible TFT substrate, and a monochromatic blue light device is produced on the flexible TFT substrate by evaporation or inkjet printing to form Blue OLED light emitting layer;

S20, preparing a first packaging film layer on the surface of the TFT layer, the first packaging film layer completely covering the blue OLED light emitting layer;

S30, providing a glass cover plate, and sequentially preparing a second flexible substrate, a color filter film, a black matrix, and a quantum dot film layer on the surface of the glass cover plate;

S40, preparing a second packaging film layer on the second flexible substrate, the second packaging film layer completely covering the color filter film, the black matrix and the quantum dot film layer;

S50, using a double-sided sealant to bond the first packaging film layer and the second packaging film layer, the double-sided sealant is heated and cured by a heating machine to form an adhesive layer, and the adhesive layer The lower surface of the adhesive layer completely covers the first packaging film layer, and the upper surface of the adhesive layer completely covers the second packaging film layer;

S60. Separate the first flexible substrate from the glass substrate, attach a barrier film to the surface of the first flexible substrate to form a first barrier layer, and connect the second flexible substrate to the glass substrate. The cover plate is separated, and another barrier film is attached to the surface of the second flexible substrate to form a second barrier layer, and finally the quantum dot flexible OLED display device is obtained.
The method for manufacturing a quantum dot flexible OLED display device according to claim 9, wherein in S20, the first encapsulation film layer includes a first inorganic water blocking layer, a buffer layer, and a second layer that are stacked from bottom to top Two inorganic water blocking layers, the second inorganic water blocking layer is located on the surface of the first inorganic water blocking layer and completely covers the buffer layer.