WO2020181587A1 - Display panel manufacturing method, display panel, and electronic device - Google Patents

Display panel manufacturing method, display panel, and electronic device Download PDF

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Publication number
WO2020181587A1
WO2020181587A1 PCT/CN2019/079971 CN2019079971W WO2020181587A1 WO 2020181587 A1 WO2020181587 A1 WO 2020181587A1 CN 2019079971 W CN2019079971 W CN 2019079971W WO 2020181587 A1 WO2020181587 A1 WO 2020181587A1
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WO
WIPO (PCT)
Prior art keywords
layer
water blocking
blocking layer
display panel
thin film
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PCT/CN2019/079971
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French (fr)
Chinese (zh)
Inventor
杨中国
吴元均
李金川
Original Assignee
深圳市华星光电半导体显示技术有限公司
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Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Publication of WO2020181587A1 publication Critical patent/WO2020181587A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • This application relates to the field of display technology, in particular to a manufacturing method of a display panel, a display panel and an electronic device.
  • Quantum Dot is an inorganic nanoscale semiconductor material. By applying a certain light pressure and electric field to it, it will emit light of a specific frequency, and the frequency of the emitted light will vary with the size of the quantum dot Therefore, by precisely controlling the size of the quantum dots, it is possible to emit very pure RGB three primary colors, thereby significantly improving the color gamut. It has been widely used in QD-LCD TVs.
  • Organic light-emitting diode Light-Emitting Diode, OLED has self-luminous, ultra-thin, fast response speed, wide viewing angle and other characteristics. Blue organic light-emitting diode devices (Blue Organic Light-Emitting Diode (BOLED) is an ideal light source for excitation of quantum dots. Therefore, the combination of quantum dots and BOLED (QD-BOLED) panels will have the advantages of both quantum dots and OLEDs, thereby improving product performance.
  • QD and OLED are both susceptible to moisture and must be packaged.
  • the mainstream packaging of QD-LCD quantum dots is the On-Surface method, that is, the sheet material with quantum dots sandwiched between the films is pasted between the backlight and the LCD panel.
  • the quantum dot material is on the panel.
  • the On-Surface method is more mature in QD-LCD, it is not suitable for QD-BOLED. Therefore, it is necessary to develop new packaging methods and structures to improve QD-BOLED The TV panel is packaged.
  • the embodiments of the present application provide a method for manufacturing a display panel, a display panel, and an electronic device, which can effectively improve the packaging effect of the display panel, and can simultaneously meet the packaging requirements for quantum dots and organic light-emitting diodes of a large-size display panel, and can form Smaller border.
  • An embodiment of the present application provides a manufacturing method of a display panel, including:
  • a color film, a quantum layer, and a second water blocking layer are formed on the cover plate to obtain a cover plate packaging structure, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process.
  • the resin is made after curing the resin;
  • the thin film transistor substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, wherein the first water blocking layer and the second water blocking layer are correspondingly bonded through the sealant layer.
  • the manufacturing the blue organic light emitting diode device and the first water blocking layer on the thin film transistor substrate to obtain the thin film transistor substrate packaging structure includes:
  • a first water blocking layer is formed on the blue organic light emitting diode device to obtain a thin film transistor substrate packaging structure.
  • the manufacturing a blue organic light emitting diode device on the thin film transistor substrate includes:
  • the blue organic light emitting diode device is fabricated on the thin film transistor substrate by evaporation or inkjet printing.
  • the forming a first water blocking layer on the blue organic light emitting diode device includes:
  • the first water blocking layer is formed on the blue organic light emitting diode device by means of plasma enhanced chemical vapor deposition.
  • the forming a color film, a quantum layer and a second water blocking layer on the cover plate to obtain a cover plate packaging structure includes:
  • a second water blocking layer is formed on the quantum layer to obtain a cover plate package structure.
  • the forming a color film on the cover plate includes:
  • a color film with red pixel units, green pixel units, blue pixel units and black matrix is formed on the cover plate, wherein the black matrix is distributed on the periphery of the color film and each adjacent red pixel unit, green Between the pixel unit and the blue pixel unit.
  • the first water blocking layer covers the blue organic light emitting diode device
  • the second water blocking layer covers the quantum layer
  • the forming a second water blocking layer on the quantum layer includes:
  • the second water blocking layer is formed on the quantum layer by means of plasma enhanced chemical vapor deposition or atomic layer deposition.
  • the sealant layer when the sealant layer is in an idle state, one side of the sealant layer is provided with a first protective film, and the other side of the sealant layer is provided with a first protective film.
  • Two protective films, the vacuum bonding of the thin film transistor substrate packaging structure and the cover plate packaging structure through the sealant layer includes:
  • the sealant layer is cured by ultraviolet curing or heating.
  • the embodiment of the present application also provides a display panel, including: a thin film transistor substrate packaging structure, a cover plate packaging structure, and a sealant layer;
  • the thin film transistor substrate packaging structure includes a thin film transistor substrate, a blue organic light emitting diode device and a first water blocking layer which are arranged in sequence;
  • the cover plate packaging structure includes a cover plate, a color film, a quantum layer, and a second water blocking layer arranged in sequence;
  • the thin film transistor substrate packaging structure is attached to the cover package structure through the sealant layer, wherein the first water blocking layer and the second water barrier layer are correspondingly attached through the sealant layer.
  • the first water blocking layer covers the blue organic light emitting diode device
  • the second water blocking layer covers the quantum layer
  • the sealant layer covers the first water blocking layer and the second water blocking layer.
  • the blue organic light emitting diode device is covered by the first water blocking layer and the thin film transistor substrate between them, and the quantum layer is covered by the second blocking layer.
  • the water layer and the color film are wrapped between them.
  • the color filter includes a red pixel unit, a green pixel unit, a blue pixel unit and a black matrix, wherein the black matrix is distributed on the periphery of the color filter and each adjacent Between the red pixel unit, green pixel unit, and blue pixel unit.
  • the first water blocking layer is made of any one or more materials among silicon nitride, silicon oxynitride and silicon oxide.
  • the second water blocking layer is made of any one or more materials of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and silicon dioxide. to make.
  • the first water blocking layer and the second water blocking layer have a single-layer structure or a multi-layer structure.
  • An embodiment of the present application also provides an electronic device, including a housing and a display panel, the display panel is mounted on the housing, and the display panel includes: a thin film transistor substrate packaging structure, a cover packaging structure, and a sealant Floor;
  • the thin film transistor substrate packaging structure includes a thin film transistor substrate, a blue organic light emitting diode device and a first water blocking layer which are arranged in sequence;
  • the cover plate packaging structure includes a cover plate, a color film, a quantum layer, and a second water blocking layer arranged in sequence, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process.
  • the resin is made after curing the resin;
  • the thin film transistor substrate packaging structure is attached to the cover package structure through the sealant layer, wherein the first water blocking layer and the second water barrier layer are correspondingly attached through the sealant layer.
  • the first water blocking layer covers the blue organic light emitting diode device, and the second water blocking layer covers the quantum layer.
  • the sealant layer covers the first water blocking layer and the second water blocking layer.
  • An embodiment of the present application provides a method for manufacturing a display panel by providing a thin film transistor substrate; fabricating a blue organic light-emitting diode device and a first water blocking layer on the thin film transistor substrate to obtain a thin film transistor substrate packaging structure; and providing a cover A color film, a quantum layer, and a second water blocking layer are formed on the cover plate to obtain a cover plate packaging structure, wherein the quantum layer is coated on the color film by a yellow light manufacturing process containing quantum dot material
  • the resin is made after curing the resin; a sealant layer is provided; the thin film transistor substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, wherein the first water blocking layer and the second water blocking layer pass The sealant layer is attached correspondingly.
  • the BOLED is fabricated and packaged on the TFT substrate, and then the QD is fabricated and packaged on the cover plate, and finally the TFT substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, which can effectively enhance the display panel
  • the packaging effect can meet the packaging requirements of quantum dots and organic light-emitting diodes for large-size display panels at the same time, and can form a smaller frame.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of a first process of a method for manufacturing a display panel provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of a second process of a method for manufacturing a display panel provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram of a third process of a method for manufacturing a display panel provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of a fourth process of a method for manufacturing a display panel provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of the fifth process of the manufacturing method of the display panel provided by the embodiment of the application.
  • FIG 8 and 9 are schematic diagrams of the manufacturing process flow of the display panel provided by the embodiments of the application.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of this application, “multiple” means two or more than two, unless otherwise specifically defined.
  • connection should be interpreted broadly unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relationship.
  • connection should be interpreted broadly unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection.
  • Connected or integrally connected it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relationship.
  • the "on” or “under” of the first feature of the second feature may include the first and second features in direct contact, or may include the first and second features Not in direct contact but through other features between them.
  • “above”, “above” and “above” the second feature of the first feature include the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” the first feature of the second feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the embodiments of the present application provide a method for manufacturing a display panel, a display panel, and an electronic device.
  • the display panel can be integrated in an electronic device.
  • the display panel can be made using the method for manufacturing a display panel.
  • the electronic device can be a smart wearable device. , Smart phones, tablets, smart TVs and other devices.
  • An embodiment of the present application provides an electronic device, including a housing and a display panel, the display panel is mounted on the housing, and the display panel includes: a thin film transistor substrate packaging structure, a cover packaging structure, and a sealant layer ;
  • the thin film transistor substrate packaging structure includes a thin film transistor substrate, a blue organic light emitting diode device and a first water blocking layer which are arranged in sequence;
  • the cover plate packaging structure includes a cover plate, a color film, a quantum layer, and a second water blocking layer arranged in sequence, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process.
  • the resin is made after curing the resin;
  • the thin film transistor substrate packaging structure is attached to the cover package structure through the sealant layer, wherein the first water blocking layer and the second water barrier layer are correspondingly attached through the sealant layer.
  • the first water blocking layer covers the blue organic light emitting diode device, and the second water blocking layer covers the quantum layer.
  • the sealant layer covers the first water blocking layer and the second water blocking layer.
  • FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the application.
  • the electronic device 100 may include a display panel 10, a control circuit 20, and a housing 30. It should be noted that the electronic device 100 shown in FIG. 1 is not limited to the above content, and may also include other devices, such as a camera, an antenna structure, a pattern unlocking module, and the like.
  • the display panel 10 is disposed on the housing 30.
  • the display panel 10 may be fixed to the housing 30, and the display panel 10 and the housing 30 form a closed space to accommodate the control circuit 20 and other devices.
  • the housing 30 may be made of a flexible material, such as a plastic housing or a silicone housing.
  • control circuit 20 is installed in the housing 30.
  • the control circuit 20 can be the main board of the electronic device 100.
  • the control circuit 20 can be integrated with a battery, an antenna structure, a microphone, a speaker, a headphone interface, a universal serial bus interface, One, two or more of functional components such as camera, distance sensor, ambient light sensor, receiver, and processor.
  • the display panel 10 is installed in the housing 30, and at the same time, the display panel 10 is electrically connected to the control circuit 20 to form the display surface of the electronic device 100.
  • the display panel 10 may include a display area and a non-display area.
  • the display area can be used to display the screen of the electronic device 100 or for the user to perform touch manipulation.
  • This non-display area can be used to set various functional components.
  • FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • the display panel 10 may include a thin film transistor substrate packaging structure 11, a cover plate packaging structure 12 and a sealant layer 13.
  • the thin film transistor substrate packaging structure 11 includes thin film transistor substrates (Thin Film Transistor, TFT) 111, a blue organic light emitting diode device 112, and a first water blocking layer 113.
  • thin film transistor substrates Thin Film Transistor, TFT
  • TFT Thin Film Transistor
  • the cover package structure 12 includes a cover 121, a color film 122, a quantum layer 123, and a second water blocking layer 124 arranged in sequence.
  • the quantum layer 123 is made by coating a resin containing quantum dot materials on the color film 122 through a yellow light manufacturing process and curing the resin.
  • the thin film transistor substrate packaging structure 11 is bonded to the cover package structure 12 through the sealant layer 13, wherein the first water blocking layer 113 and the second water blocking layer 124 are correspondingly bonded through the sealant layer 13.
  • one side 131 of the sealant layer 13 is attached to the first water blocking layer 113, and the other side 132 of the sealant layer 13 is attached to the second water blocking layer 124, so that the first water blocking layer 113 and the second water blocking layer 124 is correspondingly bonded through the sealant layer 13.
  • one side 131 and the other side 132 of the sealant layer 13 are arranged opposite to each other.
  • the color film 122 may be a color filter (Color filter, CF).
  • the color film 122 includes a red pixel unit 1221, a green pixel unit 1222, a blue pixel unit 1223, and a black matrix 1224, wherein the black matrix 1224 is distributed on the periphery of the color film 122 and each adjacent red pixel unit 1221 , The green pixel unit 1222, the blue pixel unit 1223.
  • the first water blocking layer 113 may be made of any one or more materials such as silicon nitride (SiNx), silicon oxynitride (SiON), and silicon oxide (SiOx).
  • the second water blocking layer 124 may be made of silicon nitride (SiNx), silicon oxynitride (SiON), silicon oxide (SiOx), aluminum oxide (Al2O3), silicon dioxide (SiO2), etc. Made of one material or multiple materials.
  • the first water blocking layer 113 and the second water blocking layer 124 may have a single-layer structure or a multilayer structure.
  • it can be made of multiple layers of inorganic material films; or can be made of multiple layers of metal material films; or it can be made of alternating inorganic material films and metal material films.
  • the first water blocking layer 113 covers the blue organic light emitting diode device 112 and the second water blocking layer 124 covers the quantum layer 123.
  • the blue organic light emitting diode device 112 is covered by the first water blocking layer 113 and the thin film transistor substrate 111 therebetween.
  • the quantum layer 123 is covered between the second water blocking layer 124 and the color film 122.
  • the sealant layer 13 covers the first water blocking layer 113 and the second water blocking layer 124.
  • the display panel 10 provided by the embodiment of the present application includes a thin film transistor substrate packaging structure 11, a cover plate packaging structure 12, and a sealant layer 13.
  • the thin film transistor substrate packaging structure 11 includes thin film transistor substrates (Thin Film Transistor, TFT) 111, blue organic light-emitting diode device 112, and first water blocking layer 113;
  • cover plate package structure 12 includes cover plate 121, color film 122, quantum layer 123 and second water blocking layer 124 arranged in sequence, wherein,
  • the quantum layer 123 is made by coating a resin containing quantum dot material on the color film 122 through a yellow light manufacturing process and curing the resin;
  • the thin film transistor substrate packaging structure 11 is attached to the cover packaging structure 12 through the sealant layer 13, Wherein, the first water blocking layer 113 and the second water blocking layer 124 are correspondingly attached through the sealant layer 13.
  • the BOLED is packaged in the TFT substrate packaging structure, and the QD is packaged in the cover plate packaging structure, and finally the TFT substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, which can effectively improve the display panel
  • the packaging effect can simultaneously meet the packaging requirements for quantum dots and organic light emitting diodes of large-size display panels, and can form a smaller frame.
  • FIGS. 3 to 6 are schematic diagrams of the first to fourth processes of the manufacturing method of the display panel provided by the embodiments of the present application.
  • the manufacturing method of the display panel includes:
  • Step 101 Provide a thin film transistor substrate 111.
  • Step 102 fabricating a blue organic light emitting diode device 112 and a first water blocking layer 113 on the thin film transistor substrate 111 to obtain the thin film transistor substrate packaging structure 11.
  • step 102 may be implemented through steps 1021 to 1022, specifically:
  • Step 1021 fabricate a blue organic light emitting diode device 112 on the thin film transistor substrate 111.
  • fabricating the blue organic light emitting diode device 112 on the thin film transistor substrate 111 includes:
  • the blue organic light emitting diode device 112 is fabricated on the thin film transistor substrate 111 by evaporation or inkjet printing.
  • Step 1022 forming a first water blocking layer 113 on the blue organic light emitting diode device 112 to obtain a thin film transistor substrate packaging structure.
  • forming the first water blocking layer 113 on the blue organic light emitting diode device 112 includes:
  • the first water blocking layer 113 is formed on the blue organic light emitting diode device 112 by means of Plasma Enhanced Chemical Vapor Deposition (PECVD).
  • PECVD Plasma Enhanced Chemical Vapor Deposition
  • the first water blocking layer 113 may also be formed on the blue organic light emitting diode device 112 by means of atomic layer deposition (ALD).
  • ALD atomic layer deposition
  • the first water blocking layer 113 covers the blue organic light emitting diode device 112. Specifically, the blue organic light emitting diode device 112 is covered by the first water blocking layer 113 and the thin film transistor substrate 111 therebetween.
  • Step 103 Provide a cover 121.
  • Step 104 forming a color film 122, a quantum layer 123, and a second water blocking layer 124 on the cover plate 121 to obtain the cover plate package structure 12, wherein the quantum layer 123 is coated on the color film 122 through a yellow light manufacturing process. It is made of resin containing quantum dot material and cured by resin.
  • step 104 may be implemented through steps 1041 to 1043, specifically:
  • Step 1041 forming a color film 122 on the cover 121.
  • forming the color film 122 on the cover 121 includes:
  • a color film 122 having red pixel units 1221, green pixel units 1222, blue pixel units 1223, and black matrix 1224 is formed on the cover 121, wherein the black matrix 1224 is distributed on the periphery of the color film 122 and each adjacent red pixel unit 1221 between the green pixel unit 1222 and the blue pixel unit 1223.
  • step 1042 the color film 122 is coated with a resin containing quantum dot material through a yellow light manufacturing process, and the resin containing the quantum dot material is cured by pre-baking and baking to form the quantum layer 123.
  • step 1043 a second water blocking layer 124 is formed on the quantum layer 123 to obtain the cover package structure 12.
  • the second water blocking layer 124 covers the quantum layer 123. Specifically, the quantum layer 123 is covered between the second water blocking layer 124 and the color film 122.
  • forming the second water blocking layer 124 on the quantum layer 123 includes:
  • the second water blocking layer 124 is formed on the quantum layer 123 by means of plasma enhanced chemical vapor deposition or atomic layer deposition.
  • Step 105 provide a sealant layer 13;
  • Step 106 vacuum bonding the thin film transistor substrate packaging structure 11 and the cover packaging structure 12 through the sealant layer 13, wherein the first water blocking layer 113 and the second water blocking layer 124 are correspondingly bonded through the sealant layer 13.
  • step 106 can be implemented through steps 1061 to 1063, specifically:
  • step 1061 the first protective film 14 is torn off, and one side 131 of the sealant layer 13 is vacuum bonded to the first water blocking layer 113 on the thin film transistor substrate packaging structure 11.
  • step 1062 the second protective film 15 is torn off, and the other surface 132 of the sealant layer 13 is vacuum bonded to the second water blocking layer 124 on the cover package structure 12.
  • Step 1063 curing the sealant layer 13 by ultraviolet curing or heating.
  • FIG. 7 is a schematic diagram of the fifth process of the manufacturing method of the display panel provided by the embodiment of the application
  • FIG. 8 and FIG. 9 are the preparation of the display panel provided by the embodiment of the application. Schematic diagram of the process flow.
  • the manufacturing method of the display panel includes:
  • Step 201 providing a thin film transistor substrate 111.
  • a blue organic light emitting diode device 112 is fabricated on the thin film transistor substrate 111 by evaporation or inkjet printing.
  • Step 203 forming a first water blocking layer 113 on the blue organic light emitting diode device 112 by means of plasma enhanced chemical vapor deposition.
  • Step 204 provide a cover 121.
  • Step 205 forming a color film 122 having a red pixel unit 1221, a green pixel unit 1222, a blue pixel unit 1223, and a black matrix 1224 on the cover 121.
  • the black matrix 1224 is distributed between the periphery of the color filter 122 and the adjacent red pixel units 1221, green pixel units 1222, and blue pixel units 1223.
  • step 206 the color film 122 is coated with a resin containing quantum dot material through a yellow light manufacturing process, and the resin containing the quantum dot material is cured by pre-baking and baking to form the quantum layer 123.
  • Step 207 forming a second water blocking layer 124 on the quantum layer 123.
  • the second water blocking layer 124 may be formed on the quantum layer 123 by plasma-enhanced chemical vapor deposition or atomic layer deposition to obtain the cover package structure 12.
  • a sealant layer 13 is provided, one side 131 of the sealant layer 13 is provided with a first protective film 14, and the other side 132 of the sealant layer 13 is provided with a second protective film 15.
  • step 209 the first protective film 14 is peeled off, and one side 131 of the sealant layer 13 is vacuum bonded to the first water blocking layer 113 on the thin film transistor substrate packaging structure 11.
  • step 210 the second protective film 15 is torn off, and the other side 132 of the sealant layer 13 is vacuum bonded to the second water blocking layer 124 on the cover package structure 12.
  • step 211 the sealant layer 13 is cured by ultraviolet curing or heating.
  • An embodiment of the application provides a method for manufacturing a display panel, providing a thin film transistor substrate; fabricating a blue organic light-emitting diode device and a first water blocking layer on the thin film transistor substrate to obtain a thin film transistor substrate packaging structure; providing a cover plate A color film, a quantum layer and a second water blocking layer are formed on the cover plate to obtain a cover plate packaging structure, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process
  • the resin is made by curing the resin; a sealant layer is provided; the thin film transistor substrate package structure and the cover package structure are vacuum bonded through the sealant layer, wherein the first water blocking layer and the second water blocking layer are sealed
  • the glue layer is correspondingly attached.
  • the BOLED is fabricated and packaged on the TFT substrate, and then the QD is fabricated and packaged on the cover plate, and finally the TFT substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, which can effectively enhance the display panel
  • the packaging effect can meet the packaging requirements of quantum dots and organic light-emitting diodes for large-size display panels at the same time, and can form a smaller frame.

Abstract

Disclosed are a display panel manufacturing method, a display panel, and an electronic device. The method comprises: manufacturing a BOLED and a first waterproof layer on a thin film transistor (TFT) substrate to obtain a TFT substrate package structure; forming a color film, a quantum layer, and a second waterproof layer on a cover plate to obtain a cover plate package structure, wherein the quantum layer is manufactured by coating, by means of yellow light process technology, the color film with a resin containing a quantum dot material and curing the resin; and vacuum-adhering the first waterproof layer to the second waterproof layer by means of a sealant layer.

Description

显示面板的制作方法、显示面板及电子设备Manufacturing method of display panel, display panel and electronic equipment 技术领域Technical field
本申请涉及显示技术领域，具体涉及一种显示面板的制作方法、显示面板及电子设备。This application relates to the field of display technology, in particular to a manufacturing method of a display panel, a display panel and an electronic device.
背景技术Background technique
量子点(Quantum Dot，QD)是一种无机纳米级半导体材料，通过对其施加一定的光压和电场，它便会发出特定频率的光，而发出的光的频率会随着量子点的尺寸的改变而变化，因而通过精准控制量子点的尺寸就可以发出非常纯的RGB三原色，从而显著提高色域，目前已在QD-LCD TV中广泛应用。有机发光二极管（Organic Light-Emitting Diode, OLED）拥有自发光、超轻薄、响应速度快、宽视角等特性，蓝光有机发光二极管器件(Blue Organic Light-Emitting Diode, BOLED)是理想的量子点激发光源。因此量子点与BOLED的结合(QD-BOLED)制作的面板将同时拥有量子点与OLED的优点，从而提升产品性能。Quantum Dot (QD) is an inorganic nanoscale semiconductor material. By applying a certain light pressure and electric field to it, it will emit light of a specific frequency, and the frequency of the emitted light will vary with the size of the quantum dot Therefore, by precisely controlling the size of the quantum dots, it is possible to emit very pure RGB three primary colors, thereby significantly improving the color gamut. It has been widely used in QD-LCD TVs. Organic light-emitting diode Light-Emitting Diode, OLED) has self-luminous, ultra-thin, fast response speed, wide viewing angle and other characteristics. Blue organic light-emitting diode devices (Blue Organic Light-Emitting Diode (BOLED) is an ideal light source for excitation of quantum dots. Therefore, the combination of quantum dots and BOLED (QD-BOLED) panels will have the advantages of both quantum dots and OLEDs, thereby improving product performance.
但QD和OLED都容易受水汽影响，必须进行封装。目前QD-LCD量子点的主流封装为On-Surface方式，即将薄膜之间夹有量子点的片状材料贴在背光源和液晶面板之间，但在QD-BOLED面板中，量子点材料在面板内部，因此On-Surface方法虽然在QD-LCD较成熟，但并不适用于QD-BOLED。因此需要开发新的封装方法和结构来对QD-BOLED TV面板进行封装。However, QD and OLED are both susceptible to moisture and must be packaged. At present, the mainstream packaging of QD-LCD quantum dots is the On-Surface method, that is, the sheet material with quantum dots sandwiched between the films is pasted between the backlight and the LCD panel. However, in QD-BOLED panels, the quantum dot material is on the panel. Internally, although the On-Surface method is more mature in QD-LCD, it is not suitable for QD-BOLED. Therefore, it is necessary to develop new packaging methods and structures to improve QD-BOLED The TV panel is packaged.
技术问题technical problem
本申请实施例提供一种显示面板的制作方法、显示面板及电子设备，可以有效提升显示面板的封装效果，且能同时满足大尺寸显示面板对量子点和有机发光二极管的封装要求，并能形成较小的边框。The embodiments of the present application provide a method for manufacturing a display panel, a display panel, and an electronic device, which can effectively improve the packaging effect of the display panel, and can simultaneously meet the packaging requirements for quantum dots and organic light-emitting diodes of a large-size display panel, and can form Smaller border.
技术解决方案Technical solutions
本申请实施例提供一种显示面板的制作方法，包括：An embodiment of the present application provides a manufacturing method of a display panel, including:
提供一薄膜晶体管基板；Provide a thin film transistor substrate;
在所述薄膜晶体管基板上制作蓝光有机发光二极管器件以及第一阻水层，以得到薄膜晶体管基板封装结构；Fabricating a blue organic light emitting diode device and a first water blocking layer on the thin film transistor substrate to obtain a thin film transistor substrate packaging structure;
提供一盖板；Provide a cover;
在所述盖板上形成彩膜、量子层以及第二阻水层，以得到盖板封装结构，其中，所述量子层为通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂并进行树脂固化后制成；A color film, a quantum layer, and a second water blocking layer are formed on the cover plate to obtain a cover plate packaging structure, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process. The resin is made after curing the resin;
提供一密封胶层；Provide a sealant layer;
通过所述密封胶层将所述薄膜晶体管基板封装结构与盖板封装结构进行真空贴合，其中，所述第一阻水层与第二阻水层通过所述密封胶层对应贴合。The thin film transistor substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, wherein the first water blocking layer and the second water blocking layer are correspondingly bonded through the sealant layer.
在本申请实施例所述的显示面板的制作方法中，所述在所述薄膜晶体管基板上制作蓝光有机发光二极管器件以及第一阻水层，以得到薄膜晶体管基板封装结构，包括：In the manufacturing method of the display panel according to the embodiment of the present application, the manufacturing the blue organic light emitting diode device and the first water blocking layer on the thin film transistor substrate to obtain the thin film transistor substrate packaging structure includes:
在所述薄膜晶体管基板上制作蓝光有机发光二极管器件；Fabricating a blue organic light emitting diode device on the thin film transistor substrate;
在所述蓝光有机发光二极管器件上形成第一阻水层，以得到薄膜晶体管基板封装结构。A first water blocking layer is formed on the blue organic light emitting diode device to obtain a thin film transistor substrate packaging structure.
在本申请实施例所述的显示面板的制作方法中，所述在所述薄膜晶体管基板上制作蓝光有机发光二极管器件，包括：In the manufacturing method of the display panel according to the embodiment of the present application, the manufacturing a blue organic light emitting diode device on the thin film transistor substrate includes:
通过蒸镀或喷墨打印的方式在所述薄膜晶体管基板上制作所述蓝光有机发光二极管器件。The blue organic light emitting diode device is fabricated on the thin film transistor substrate by evaporation or inkjet printing.
在本申请实施例所述的显示面板的制作方法中，所述在所述蓝光有机发光二极管器件上形成第一阻水层，包括：In the manufacturing method of the display panel according to the embodiment of the present application, the forming a first water blocking layer on the blue organic light emitting diode device includes:
通过等离子体增强化学气相沉积的方式在所述蓝光有机发光二极管器件上形成所述第一阻水层。The first water blocking layer is formed on the blue organic light emitting diode device by means of plasma enhanced chemical vapor deposition.
在本申请实施例所述的显示面板的制作方法中，所述在所述盖板上形成彩膜、量子层以及第二阻水层，以得到盖板封装结构，包括：In the manufacturing method of the display panel according to the embodiment of the present application, the forming a color film, a quantum layer and a second water blocking layer on the cover plate to obtain a cover plate packaging structure includes:
在所述盖板上形成彩膜；Forming a color film on the cover plate;
通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂，并进行预烘烤及烘烤的方式对所述含有量子点材料的树脂进行固化，以形成量子层；Coating a resin containing quantum dot material on the color film by a yellow light manufacturing process, and curing the resin containing quantum dot material by pre-baking and baking to form a quantum layer;
在所述量子层上形成第二阻水层，以得到盖板封装结构。A second water blocking layer is formed on the quantum layer to obtain a cover plate package structure.
在本申请实施例所述的显示面板的制作方法中，所述在所述盖板上形成彩膜，包括：In the manufacturing method of the display panel according to the embodiment of the present application, the forming a color film on the cover plate includes:
在所述盖板上形成具有红色像素单元、绿色像素单元、蓝色像素单元以及黑色矩阵的彩膜，其中所述黑色矩阵分布于所述彩膜的周缘以及各相邻的红色像素单元、绿色像素单元、蓝色像素单元之间。A color film with red pixel units, green pixel units, blue pixel units and black matrix is formed on the cover plate, wherein the black matrix is distributed on the periphery of the color film and each adjacent red pixel unit, green Between the pixel unit and the blue pixel unit.
在本申请实施例所述的显示面板的制作方法中，所述第一阻水层包覆所述蓝光有机发光二极管器件，以及所述第二阻水层包覆所述量子层。In the manufacturing method of the display panel according to the embodiment of the present application, the first water blocking layer covers the blue organic light emitting diode device, and the second water blocking layer covers the quantum layer.
在本申请实施例所述的显示面板的制作方法中，所述在所述量子层上形成第二阻水层，包括：In the manufacturing method of the display panel according to the embodiment of the present application, the forming a second water blocking layer on the quantum layer includes:
通过等离子体增强化学气相沉积或者原子层沉积的方式在所述量子层上形成所述第二阻水层。The second water blocking layer is formed on the quantum layer by means of plasma enhanced chemical vapor deposition or atomic layer deposition.
在本申请实施例所述的显示面板的制作方法中，当所述密封胶层处于闲置状态时，所述密封胶层的一面设置有第一保护膜，所述密封胶层另一面设置有第二保护膜，所述通过所述密封胶层将所述薄膜晶体管基板封装结构与盖板封装结构进行真空贴合，包括：In the manufacturing method of the display panel according to the embodiment of the application, when the sealant layer is in an idle state, one side of the sealant layer is provided with a first protective film, and the other side of the sealant layer is provided with a first protective film. Two protective films, the vacuum bonding of the thin film transistor substrate packaging structure and the cover plate packaging structure through the sealant layer includes:
撕除所述第一保护膜，将所述密封胶层的一面与所述薄膜晶体管基板封装结构上的所述第一阻水层进行真空贴合；Tearing off the first protective film, and vacuum bonding one side of the sealant layer to the first water blocking layer on the thin film transistor substrate packaging structure;
撕除所述第二保护膜，将所述密封胶层的另一面与所述盖板封装结构上的所述第二阻水层进行真空贴合；Tearing off the second protective film, vacuum bonding the other side of the sealant layer with the second water blocking layer on the cover plate packaging structure;
通过紫外固化或者加热的方式对所述密封胶层进行固化。The sealant layer is cured by ultraviolet curing or heating.
本申请实施例还提供一种显示面板，包括：薄膜晶体管基板封装结构、盖板封装结构以及密封胶层；The embodiment of the present application also provides a display panel, including: a thin film transistor substrate packaging structure, a cover plate packaging structure, and a sealant layer;
其中，所述薄膜晶体管基板封装结构包括依次设置的薄膜晶体管基板、蓝光有机发光二极管器件以及第一阻水层；Wherein, the thin film transistor substrate packaging structure includes a thin film transistor substrate, a blue organic light emitting diode device and a first water blocking layer which are arranged in sequence;
所述盖板封装结构包括依次设置的盖板、彩膜、量子层以及第二阻水层；The cover plate packaging structure includes a cover plate, a color film, a quantum layer, and a second water blocking layer arranged in sequence;
所述薄膜晶体管基板封装结构通过所述密封胶层贴合于所述盖板封装结构，其中，所述第一阻水层与第二阻水层通过所述密封胶层对应贴合。The thin film transistor substrate packaging structure is attached to the cover package structure through the sealant layer, wherein the first water blocking layer and the second water barrier layer are correspondingly attached through the sealant layer.
在本申请实施例所述的显示面板中，所述第一阻水层包覆所述蓝光有机发光二极管器件，以及所述第二阻水层包覆所述量子层。In the display panel according to the embodiment of the present application, the first water blocking layer covers the blue organic light emitting diode device, and the second water blocking layer covers the quantum layer.
在本申请实施例所述的显示面板中，所述密封胶层包覆所述第一阻水层与第二阻水层。In the display panel according to the embodiment of the present application, the sealant layer covers the first water blocking layer and the second water blocking layer.
在本申请实施例所述的显示面板中，所述蓝光有机发光二极管器件被所述第一阻水层与薄膜晶体管基板包覆在其二者之间，所述量子层被所述第二阻水层与彩膜包覆在其二者之间。In the display panel according to the embodiment of the present application, the blue organic light emitting diode device is covered by the first water blocking layer and the thin film transistor substrate between them, and the quantum layer is covered by the second blocking layer. The water layer and the color film are wrapped between them.
在本申请实施例所述的显示面板中，所述彩膜包括红色像素单元、绿色像素单元、蓝色像素单元以及黑色矩阵，其中所述黑色矩阵分布于所述彩膜的周缘以及各相邻的红色像素单元、绿色像素单元、蓝色像素单元之间。In the display panel according to the embodiment of the present application, the color filter includes a red pixel unit, a green pixel unit, a blue pixel unit and a black matrix, wherein the black matrix is distributed on the periphery of the color filter and each adjacent Between the red pixel unit, green pixel unit, and blue pixel unit.
在本申请实施例所述的显示面板中，所述第一阻水层由氮化硅、氮氧化硅和氧化硅中的任一种材料或者多个材料制成。In the display panel according to the embodiment of the present application, the first water blocking layer is made of any one or more materials among silicon nitride, silicon oxynitride and silicon oxide.
在本申请实施例所述的显示面板中，所述第二阻水层由氮化硅、氮氧化硅、氧化硅、三氧化二铝和二氧化硅中的任一种材料或者多个材料制成。In the display panel according to the embodiment of the present application, the second water blocking layer is made of any one or more materials of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and silicon dioxide. to make.
在本申请实施例所述的显示面板中，所述第一阻水层与第二阻水层为单层结构或者多层结构。In the display panel according to the embodiment of the present application, the first water blocking layer and the second water blocking layer have a single-layer structure or a multi-layer structure.
本申请实施例还提供一种电子设备，包括壳体和显示面板，所述显示面板安装在所述壳体上，所述显示面板为包括：薄膜晶体管基板封装结构、盖板封装结构以及密封胶层；An embodiment of the present application also provides an electronic device, including a housing and a display panel, the display panel is mounted on the housing, and the display panel includes: a thin film transistor substrate packaging structure, a cover packaging structure, and a sealant Floor;
其中，所述薄膜晶体管基板封装结构包括依次设置的薄膜晶体管基板、蓝光有机发光二极管器件以及第一阻水层；Wherein, the thin film transistor substrate packaging structure includes a thin film transistor substrate, a blue organic light emitting diode device and a first water blocking layer which are arranged in sequence;
所述盖板封装结构包括依次设置的盖板、彩膜、量子层以及第二阻水层，其中，所述量子层为通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂并进行树脂固化后制成；The cover plate packaging structure includes a cover plate, a color film, a quantum layer, and a second water blocking layer arranged in sequence, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process. The resin is made after curing the resin;
所述薄膜晶体管基板封装结构通过所述密封胶层贴合于所述盖板封装结构，其中，所述第一阻水层与第二阻水层通过所述密封胶层对应贴合。The thin film transistor substrate packaging structure is attached to the cover package structure through the sealant layer, wherein the first water blocking layer and the second water barrier layer are correspondingly attached through the sealant layer.
在本申请实施例所述的电子设备中，所述第一阻水层包覆所述蓝光有机发光二极管器件，以及所述第二阻水层包覆所述量子层。In the electronic device according to the embodiment of the present application, the first water blocking layer covers the blue organic light emitting diode device, and the second water blocking layer covers the quantum layer.
在本申请实施例所述的电子设备中，所述密封胶层包覆所述第一阻水层与第二阻水层。In the electronic device described in the embodiment of the present application, the sealant layer covers the first water blocking layer and the second water blocking layer.
有益效果Beneficial effect
本申请实施例提供的一种显示面板的制作方法，通过提供一薄膜晶体管基板；在薄膜晶体管基板上制作蓝光有机发光二极管器件以及第一阻水层，以得到薄膜晶体管基板封装结构；提供一盖板；在盖板上形成彩膜、量子层以及第二阻水层，以得到盖板封装结构，其中，所述量子层为通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂并进行树脂固化后制成；提供一密封胶层；通过密封胶层将薄膜晶体管基板封装结构与盖板封装结构进行真空贴合，其中，第一阻水层与第二阻水层通过密封胶层对应贴合。本申请实施例通过在TFT基板上制作BOLED并进行封装，然后在盖板上制作QD并进行封装，最后通过密封胶层将TFT基板封装结构与盖板封装结构真空贴合，可以有效提升显示面板的封装效果，且能同时满足大尺寸显示面板对量子点和有机发光二极管的封装要求，并能形成较小的边框。An embodiment of the present application provides a method for manufacturing a display panel by providing a thin film transistor substrate; fabricating a blue organic light-emitting diode device and a first water blocking layer on the thin film transistor substrate to obtain a thin film transistor substrate packaging structure; and providing a cover A color film, a quantum layer, and a second water blocking layer are formed on the cover plate to obtain a cover plate packaging structure, wherein the quantum layer is coated on the color film by a yellow light manufacturing process containing quantum dot material The resin is made after curing the resin; a sealant layer is provided; the thin film transistor substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, wherein the first water blocking layer and the second water blocking layer pass The sealant layer is attached correspondingly. In the embodiment of the application, the BOLED is fabricated and packaged on the TFT substrate, and then the QD is fabricated and packaged on the cover plate, and finally the TFT substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, which can effectively enhance the display panel The packaging effect can meet the packaging requirements of quantum dots and organic light-emitting diodes for large-size display panels at the same time, and can form a smaller frame.
附图说明Description of the drawings
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly describe the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.
图1为本申请实施例提供的电子设备的结构示意图。FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the application.
图2为本申请实施例提供的显示面板的结构示意图。FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the application.
图3为本申请实施例提供的显示面板的制备方法的第一流程示意图。FIG. 3 is a schematic diagram of a first process of a method for manufacturing a display panel provided by an embodiment of the application.
图4为本申请实施例提供的显示面板的制备方法的第二流程示意图。4 is a schematic diagram of a second process of a method for manufacturing a display panel provided by an embodiment of the application.
图5为本申请实施例提供的显示面板的制备方法的第三流程示意图。FIG. 5 is a schematic diagram of a third process of a method for manufacturing a display panel provided by an embodiment of the application.
图6为本申请实施例提供的显示面板的制备方法的第四流程示意图。FIG. 6 is a schematic diagram of a fourth process of a method for manufacturing a display panel provided by an embodiment of the application.
图7为本申请实施例提供的显示面板的制备方法的第五流程示意图。FIG. 7 is a schematic diagram of the fifth process of the manufacturing method of the display panel provided by the embodiment of the application.
图8和图9为本申请实施例提供的显示面板的制备工艺流程示意图。8 and 9 are schematic diagrams of the manufacturing process flow of the display panel provided by the embodiments of the application.
本发明的实施方式Embodiments of the invention
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative work are within the protection scope of this application.
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise" and other directions or The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it cannot be understood as a restriction on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more than two, unless otherwise specifically defined.
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that the terms "installation", "connection", and "connection" should be interpreted broadly unless otherwise clearly specified and limited. For example, it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relationship. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。In this application, unless expressly stipulated and defined otherwise, the "on" or "under" of the first feature of the second feature may include the first and second features in direct contact, or may include the first and second features Not in direct contact but through other features between them. Moreover, "above", "above" and "above" the second feature of the first feature include the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is higher in level than the second feature. The "below", "below" and "below" the first feature of the second feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for realizing different structures of the present application. To simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the application. In addition, the present application may repeat reference numerals and/or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not indicate the relationship between the various embodiments and/or settings discussed. In addition, this application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and/or the use of other materials.
本申请实施例提供一种显示面板的制作方法、显示面板及电子设备，该显示面板可以集成在电子设备中，该显示面板可以采用显示面板的制作方法制成，该电子设备可以是智能穿戴设备、智能手机、平板电脑、智能电视等设备。The embodiments of the present application provide a method for manufacturing a display panel, a display panel, and an electronic device. The display panel can be integrated in an electronic device. The display panel can be made using the method for manufacturing a display panel. The electronic device can be a smart wearable device. , Smart phones, tablets, smart TVs and other devices.
本申请实施例提供一种电子设备，包括壳体和显示面板，所述显示面板安装在所述壳体上，所述显示面板为包括：薄膜晶体管基板封装结构、盖板封装结构以及密封胶层；An embodiment of the present application provides an electronic device, including a housing and a display panel, the display panel is mounted on the housing, and the display panel includes: a thin film transistor substrate packaging structure, a cover packaging structure, and a sealant layer ；
其中，所述薄膜晶体管基板封装结构包括依次设置的薄膜晶体管基板、蓝光有机发光二极管器件以及第一阻水层；Wherein, the thin film transistor substrate packaging structure includes a thin film transistor substrate, a blue organic light emitting diode device and a first water blocking layer which are arranged in sequence;
所述盖板封装结构包括依次设置的盖板、彩膜、量子层以及第二阻水层，其中，所述量子层为通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂并进行树脂固化后制成；The cover plate packaging structure includes a cover plate, a color film, a quantum layer, and a second water blocking layer arranged in sequence, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process. The resin is made after curing the resin;
所述薄膜晶体管基板封装结构通过所述密封胶层贴合于所述盖板封装结构，其中，所述第一阻水层与第二阻水层通过所述密封胶层对应贴合。The thin film transistor substrate packaging structure is attached to the cover package structure through the sealant layer, wherein the first water blocking layer and the second water barrier layer are correspondingly attached through the sealant layer.
在本申请实施例所述的电子设备中，所述第一阻水层包覆所述蓝光有机发光二极管器件，以及所述第二阻水层包覆所述量子层。In the electronic device according to the embodiment of the present application, the first water blocking layer covers the blue organic light emitting diode device, and the second water blocking layer covers the quantum layer.
在本申请实施例所述的电子设备中，所述密封胶层包覆所述第一阻水层与第二阻水层。In the electronic device described in the embodiment of the present application, the sealant layer covers the first water blocking layer and the second water blocking layer.
请参阅图1，图1为本申请实施例提供的电子设备的结构示意图。该电子设备100可以包括显示面板10、控制电路20、以及壳体30。需要说明的是，图1所示的电子设备100并不限于以上内容，其还可以包括其他器件，比如还可以包括摄像头、天线结构、纹解锁模块等。Please refer to FIG. 1. FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the application. The electronic device 100 may include a display panel 10, a control circuit 20, and a housing 30. It should be noted that the electronic device 100 shown in FIG. 1 is not limited to the above content, and may also include other devices, such as a camera, an antenna structure, a pattern unlocking module, and the like.
其中，显示面板10设置于壳体30上。Among them, the display panel 10 is disposed on the housing 30.
在一些实施例中，显示面板10可以固定到壳体30上，显示面板10和壳体30形成密闭空间，以容纳控制电路20等器件。In some embodiments, the display panel 10 may be fixed to the housing 30, and the display panel 10 and the housing 30 form a closed space to accommodate the control circuit 20 and other devices.
在一些实施例中，壳体30可以为由柔性材料制成，比如为塑胶壳体或者硅胶壳体等。In some embodiments, the housing 30 may be made of a flexible material, such as a plastic housing or a silicone housing.
其中，该控制电路20安装在壳体30中，该控制电路20可以为电子设备100的主板，控制电路20上可以集成有电池、天线结构、麦克风、扬声器、耳机接口、通用串行总线接口、摄像头、距离传感器、环境光传感器、受话器以及处理器等功能组件中的一个、两个或多个。Wherein, the control circuit 20 is installed in the housing 30. The control circuit 20 can be the main board of the electronic device 100. The control circuit 20 can be integrated with a battery, an antenna structure, a microphone, a speaker, a headphone interface, a universal serial bus interface, One, two or more of functional components such as camera, distance sensor, ambient light sensor, receiver, and processor.
其中，该显示面板10安装在壳体30中，同时，该显示面板10电连接至控制电路20上，以形成电子设备100的显示面。该显示面板10可以包括显示区域和非显示区域。该显示区域可以用来显示电子设备100的画面或者供用户进行触摸操控等。该非显示区域可用于设置各种功能组件。Wherein, the display panel 10 is installed in the housing 30, and at the same time, the display panel 10 is electrically connected to the control circuit 20 to form the display surface of the electronic device 100. The display panel 10 may include a display area and a non-display area. The display area can be used to display the screen of the electronic device 100 or for the user to perform touch manipulation. This non-display area can be used to set various functional components.
请参阅图2，图2为本申请实施例提供的显示面板的结构示意图。该显示面板10可以包括薄膜晶体管基板封装结构11、盖板封装结构12以及密封胶层13。Please refer to FIG. 2, which is a schematic structural diagram of a display panel provided by an embodiment of the application. The display panel 10 may include a thin film transistor substrate packaging structure 11, a cover plate packaging structure 12 and a sealant layer 13.
其中，薄膜晶体管基板封装结构11包括依次设置的薄膜晶体管基板（Thin Film Transistor，TFT）111、蓝光有机发光二极管器件112以及第一阻水层113。Among them, the thin film transistor substrate packaging structure 11 includes thin film transistor substrates (Thin Film Transistor, TFT) 111, a blue organic light emitting diode device 112, and a first water blocking layer 113.
盖板封装结构12包括依次设置的盖板121、彩膜122、量子层123以及第二阻水层124。其中，量子层123为通过黄光制程工艺在彩膜122上涂布含有量子点材料的树脂并进行树脂固化后制成。The cover package structure 12 includes a cover 121, a color film 122, a quantum layer 123, and a second water blocking layer 124 arranged in sequence. Wherein, the quantum layer 123 is made by coating a resin containing quantum dot materials on the color film 122 through a yellow light manufacturing process and curing the resin.
薄膜晶体管基板封装结构11通过密封胶层13贴合于盖板封装结构12，其中，第一阻水层113与第二阻水层124通过密封胶层13对应贴合。The thin film transistor substrate packaging structure 11 is bonded to the cover package structure 12 through the sealant layer 13, wherein the first water blocking layer 113 and the second water blocking layer 124 are correspondingly bonded through the sealant layer 13.
例如，密封胶层13的一面131贴合于第一阻水层113，密封胶层13的另一面132贴合于第二阻水层124，使得第一阻水层113与第二阻水层124通过密封胶层13对应贴合。其中，密封胶层13的一面131与另一面132背向设置。For example, one side 131 of the sealant layer 13 is attached to the first water blocking layer 113, and the other side 132 of the sealant layer 13 is attached to the second water blocking layer 124, so that the first water blocking layer 113 and the second water blocking layer 124 is correspondingly bonded through the sealant layer 13. Wherein, one side 131 and the other side 132 of the sealant layer 13 are arranged opposite to each other.
其中，彩膜122可以为彩色滤光片（Color filter，CF）。The color film 122 may be a color filter (Color filter, CF).
在一些实施例中，彩膜122包括红色像素单元1221、绿色像素单元1222、蓝色像素单元1223以及黑色矩阵1224，其中黑色矩阵1224分布于彩膜122的周缘以及各相邻的红色像素单元1221、绿色像素单元1222、蓝色像素单元1223之间。In some embodiments, the color film 122 includes a red pixel unit 1221, a green pixel unit 1222, a blue pixel unit 1223, and a black matrix 1224, wherein the black matrix 1224 is distributed on the periphery of the color film 122 and each adjacent red pixel unit 1221 , The green pixel unit 1222, the blue pixel unit 1223.
在一些实施例中，第一阻水层113可以由氮化硅（SiNx）、氮氧化硅（SiON）、氧化硅（SiOx）等任一种材料或者多个材料制成。In some embodiments, the first water blocking layer 113 may be made of any one or more materials such as silicon nitride (SiNx), silicon oxynitride (SiON), and silicon oxide (SiOx).
在一些实施例中，第二阻水层124可以由氮化硅（SiNx）、氮氧化硅（SiON）、氧化硅（SiOx）、三氧化二铝（Al2O3）、二氧化硅（SiO2）等任一种材料或者多个材料制成。In some embodiments, the second water blocking layer 124 may be made of silicon nitride (SiNx), silicon oxynitride (SiON), silicon oxide (SiOx), aluminum oxide (Al2O3), silicon dioxide (SiO2), etc. Made of one material or multiple materials.
其中，第一阻水层113与第二阻水层124可以为单层结构或是多层结构。当为多层结构时，可以由多层无机材料薄膜制成；或者可以由多层金属材料薄膜制成；或者由无机材料薄膜与金属材料薄膜交替设置而制成。Wherein, the first water blocking layer 113 and the second water blocking layer 124 may have a single-layer structure or a multilayer structure. When it has a multi-layer structure, it can be made of multiple layers of inorganic material films; or can be made of multiple layers of metal material films; or it can be made of alternating inorganic material films and metal material films.
在一些实施例中，第一阻水层113包覆蓝光有机发光二极管器件112，第二阻水层124包覆量子层123。其中，蓝光有机发光二极管器件112被第一阻水层113与薄膜晶体管基板111包覆在二者之间。量子层123被第二阻水层124与彩膜122包覆在二者之间。In some embodiments, the first water blocking layer 113 covers the blue organic light emitting diode device 112 and the second water blocking layer 124 covers the quantum layer 123. Wherein, the blue organic light emitting diode device 112 is covered by the first water blocking layer 113 and the thin film transistor substrate 111 therebetween. The quantum layer 123 is covered between the second water blocking layer 124 and the color film 122.
在一些实施例中，密封胶层13包覆第一阻水层113与第二阻水层124。In some embodiments, the sealant layer 13 covers the first water blocking layer 113 and the second water blocking layer 124.
本申请实施例提供的显示面板10，包括薄膜晶体管基板封装结构11、盖板封装结构12以及密封胶层13；薄膜晶体管基板封装结构11包括依次设置的薄膜晶体管基板（Thin Film Transistor，TFT）111、蓝光有机发光二极管器件112以及第一阻水层113；盖板封装结构12包括依次设置的盖板121、彩膜122、量子层123以及第二阻水层124，其中，量子层123为通过黄光制程工艺在彩膜122上涂布含有量子点材料的树脂并进行树脂固化后制成；薄膜晶体管基板封装结构11通过密封胶层13贴合于盖板封装结构12，其中，第一阻水层113与第二阻水层124通过密封胶层13对应贴合。本申请实施例通过将BOLED封装于TFT基板封装结构内，且QD封装于盖板封装结构内，最后通过密封胶层将TFT基板封装结构与盖板封装结构真空贴合，可以有效提升显示面板的封装效果，且能同时满足大尺寸显示面板对量子点和有机发光二极管的封装要求，并能形成较小的边框。The display panel 10 provided by the embodiment of the present application includes a thin film transistor substrate packaging structure 11, a cover plate packaging structure 12, and a sealant layer 13. The thin film transistor substrate packaging structure 11 includes thin film transistor substrates (Thin Film Transistor, TFT) 111, blue organic light-emitting diode device 112, and first water blocking layer 113; cover plate package structure 12 includes cover plate 121, color film 122, quantum layer 123 and second water blocking layer 124 arranged in sequence, wherein, The quantum layer 123 is made by coating a resin containing quantum dot material on the color film 122 through a yellow light manufacturing process and curing the resin; the thin film transistor substrate packaging structure 11 is attached to the cover packaging structure 12 through the sealant layer 13, Wherein, the first water blocking layer 113 and the second water blocking layer 124 are correspondingly attached through the sealant layer 13. In the embodiment of this application, the BOLED is packaged in the TFT substrate packaging structure, and the QD is packaged in the cover plate packaging structure, and finally the TFT substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, which can effectively improve the display panel The packaging effect can simultaneously meet the packaging requirements for quantum dots and organic light emitting diodes of large-size display panels, and can form a smaller frame.
为了进一步描述本申请，下面从显示面板的制作方法的方向进行描述。In order to further describe the present application, the following description is from the direction of the manufacturing method of the display panel.
请参阅图3至图6，图3至图6为本申请实施例提供的显示面板的制作方法的第一至第四流程示意图。该显示面板的制作方法包括：Please refer to FIGS. 3 to 6. FIGS. 3 to 6 are schematic diagrams of the first to fourth processes of the manufacturing method of the display panel provided by the embodiments of the present application. The manufacturing method of the display panel includes:
步骤101，提供一薄膜晶体管基板111。Step 101: Provide a thin film transistor substrate 111.
步骤102，在薄膜晶体管基板111上制作蓝光有机发光二极管器件112以及第一阻水层113，以得到薄膜晶体管基板封装结构11。Step 102, fabricating a blue organic light emitting diode device 112 and a first water blocking layer 113 on the thin film transistor substrate 111 to obtain the thin film transistor substrate packaging structure 11.
在一些实施例中，如图4所示，步骤102可通过步骤1021至1022来实现，具体为：In some embodiments, as shown in FIG. 4, step 102 may be implemented through steps 1021 to 1022, specifically:
步骤1021，在薄膜晶体管基板111上制作蓝光有机发光二极管器件112。Step 1021, fabricate a blue organic light emitting diode device 112 on the thin film transistor substrate 111.
在一些实施例中，在薄膜晶体管基板111上制作蓝光有机发光二极管器件112，包括：In some embodiments, fabricating the blue organic light emitting diode device 112 on the thin film transistor substrate 111 includes:
通过蒸镀或喷墨打印的方式在薄膜晶体管基板111上制作蓝光有机发光二极管器件112。The blue organic light emitting diode device 112 is fabricated on the thin film transistor substrate 111 by evaporation or inkjet printing.
步骤1022，在蓝光有机发光二极管器件112上形成第一阻水层113，以得到薄膜晶体管基板封装结构。Step 1022, forming a first water blocking layer 113 on the blue organic light emitting diode device 112 to obtain a thin film transistor substrate packaging structure.
在一些实施例中，在蓝光有机发光二极管器件112上形成第一阻水层113，包括：In some embodiments, forming the first water blocking layer 113 on the blue organic light emitting diode device 112 includes:
通过等离子体增强化学气相沉积（Plasma Enhanced Chemical Vapor Deposition，PECVD）的方式在蓝光有机发光二极管器件112上形成第一阻水层113。The first water blocking layer 113 is formed on the blue organic light emitting diode device 112 by means of Plasma Enhanced Chemical Vapor Deposition (PECVD).
在一些实施例中，还可以通过原子层沉积（Atomic Layer Deposition，ALD）的方式在蓝光有机发光二极管器件112上形成第一阻水层113。In some embodiments, the first water blocking layer 113 may also be formed on the blue organic light emitting diode device 112 by means of atomic layer deposition (ALD).
其中，第一阻水层113包覆蓝光有机发光二极管器件112。具体的，蓝光有机发光二极管器件112被第一阻水层113与薄膜晶体管基板111包覆在二者之间。Wherein, the first water blocking layer 113 covers the blue organic light emitting diode device 112. Specifically, the blue organic light emitting diode device 112 is covered by the first water blocking layer 113 and the thin film transistor substrate 111 therebetween.
步骤103，提供一盖板121。Step 103: Provide a cover 121.
步骤104，在盖板121上形成彩膜122、量子层123以及第二阻水层124，以得到盖板封装结构12，其中，量子层123为通过黄光制程工艺在彩膜122上涂布含有量子点材料的树脂并进行树脂固化后制成。Step 104, forming a color film 122, a quantum layer 123, and a second water blocking layer 124 on the cover plate 121 to obtain the cover plate package structure 12, wherein the quantum layer 123 is coated on the color film 122 through a yellow light manufacturing process. It is made of resin containing quantum dot material and cured by resin.
在一些实施例中，如图5所示，步骤104可通过步骤1041至1043来实现，具体为：In some embodiments, as shown in FIG. 5, step 104 may be implemented through steps 1041 to 1043, specifically:
步骤1041，在盖板121上形成彩膜122。Step 1041, forming a color film 122 on the cover 121.
在一些实施例中，在盖板121上形成彩膜122，包括：In some embodiments, forming the color film 122 on the cover 121 includes:
在盖板121上形成具有红色像素单元1221、绿色像素单元1222、蓝色像素单元1223以及黑色矩阵1224的彩膜122，其中黑色矩阵1224分布于彩膜122的周缘以及各相邻的红色像素单元1221、绿色像素单元1222、蓝色像素单元1223之间。A color film 122 having red pixel units 1221, green pixel units 1222, blue pixel units 1223, and black matrix 1224 is formed on the cover 121, wherein the black matrix 1224 is distributed on the periphery of the color film 122 and each adjacent red pixel unit 1221 between the green pixel unit 1222 and the blue pixel unit 1223.
步骤1042，通过黄光制程工艺在彩膜122上涂布含有量子点材料的树脂，并进行预烘烤及烘烤的方式对含有量子点材料的树脂进行固化，以形成量子层123。In step 1042, the color film 122 is coated with a resin containing quantum dot material through a yellow light manufacturing process, and the resin containing the quantum dot material is cured by pre-baking and baking to form the quantum layer 123.
步骤1043，在量子层123上形成第二阻水层124，以得到盖板封装结构12。In step 1043, a second water blocking layer 124 is formed on the quantum layer 123 to obtain the cover package structure 12.
其中，第二阻水层124包覆量子层123。具体的，量子层123被第二阻水层124与彩膜122包覆在二者之间。Wherein, the second water blocking layer 124 covers the quantum layer 123. Specifically, the quantum layer 123 is covered between the second water blocking layer 124 and the color film 122.
在一些实施例中，在量子层123上形成第二阻水层124，包括：In some embodiments, forming the second water blocking layer 124 on the quantum layer 123 includes:
通过等离子体增强化学气相沉积或者原子层沉积的方式在量子层123上形成第二阻水层124。The second water blocking layer 124 is formed on the quantum layer 123 by means of plasma enhanced chemical vapor deposition or atomic layer deposition.
步骤105，提供一密封胶层13；Step 105, provide a sealant layer 13;
步骤106，通过密封胶层13将薄膜晶体管基板封装结构11与盖板封装结构12进行真空贴合，其中，第一阻水层113与第二阻水层124通过密封胶层13对应贴合。Step 106, vacuum bonding the thin film transistor substrate packaging structure 11 and the cover packaging structure 12 through the sealant layer 13, wherein the first water blocking layer 113 and the second water blocking layer 124 are correspondingly bonded through the sealant layer 13.
在一些实施例中，当密封胶层13处于闲置状态时，密封胶层13的一面131设置有第一保护膜14，密封胶层13的另一面132设置有第二保护膜15。如图6所示，步骤106可通过步骤1061至1063来实现，具体为：In some embodiments, when the sealant layer 13 is in an idle state, one side 131 of the sealant layer 13 is provided with a first protective film 14, and the other side 132 of the sealant layer 13 is provided with a second protective film 15. As shown in FIG. 6, step 106 can be implemented through steps 1061 to 1063, specifically:
步骤1061，撕除第一保护膜14，将密封胶层13的一面131与薄膜晶体管基板封装结构11上的第一阻水层113进行真空贴合。In step 1061, the first protective film 14 is torn off, and one side 131 of the sealant layer 13 is vacuum bonded to the first water blocking layer 113 on the thin film transistor substrate packaging structure 11.
步骤1062，撕除第二保护膜15，将密封胶层13的另一面132与盖板封装结构12上的第二阻水层124进行真空贴合。In step 1062, the second protective film 15 is torn off, and the other surface 132 of the sealant layer 13 is vacuum bonded to the second water blocking layer 124 on the cover package structure 12.
步骤1063，通过紫外固化或者加热的方式对密封胶层13进行固化。Step 1063, curing the sealant layer 13 by ultraviolet curing or heating.
为了进一步描述本申请，请参阅图7至图9，图7为本申请实施例提供的显示面板的制作方法的第五流程示意图，图8和图9为本申请实施例提供的显示面板的制备工艺流程示意图。该显示面板的制作方法包括：In order to further describe the present application, please refer to FIGS. 7 to 9. FIG. 7 is a schematic diagram of the fifth process of the manufacturing method of the display panel provided by the embodiment of the application, and FIG. 8 and FIG. 9 are the preparation of the display panel provided by the embodiment of the application. Schematic diagram of the process flow. The manufacturing method of the display panel includes:
步骤201，提供一薄膜晶体管基板111。Step 201, providing a thin film transistor substrate 111.
步骤202，通过蒸镀或喷墨打印的方式在薄膜晶体管基板111上制作蓝光有机发光二极管器件112。In step 202, a blue organic light emitting diode device 112 is fabricated on the thin film transistor substrate 111 by evaporation or inkjet printing.
步骤203，通过等离子体增强化学气相沉积的方式在蓝光有机发光二极管器件112上形成第一阻水层113。Step 203, forming a first water blocking layer 113 on the blue organic light emitting diode device 112 by means of plasma enhanced chemical vapor deposition.
步骤204，提供一盖板121。Step 204, provide a cover 121.
步骤205，在盖板121上形成具有红色像素单元1221、绿色像素单元1222、蓝色像素单元1223以及黑色矩阵1224的彩膜122。Step 205, forming a color film 122 having a red pixel unit 1221, a green pixel unit 1222, a blue pixel unit 1223, and a black matrix 1224 on the cover 121.
其中，黑色矩阵1224分布于彩膜122的周缘以及各相邻的红色像素单元1221、绿色像素单元1222、蓝色像素单元1223之间。The black matrix 1224 is distributed between the periphery of the color filter 122 and the adjacent red pixel units 1221, green pixel units 1222, and blue pixel units 1223.
步骤206，通过黄光制程工艺在彩膜122上涂布含有量子点材料的树脂，并进行预烘烤及烘烤的方式对含有量子点材料的树脂进行固化，以形成量子层123。In step 206, the color film 122 is coated with a resin containing quantum dot material through a yellow light manufacturing process, and the resin containing the quantum dot material is cured by pre-baking and baking to form the quantum layer 123.
步骤207，在量子层123上形成第二阻水层124。Step 207, forming a second water blocking layer 124 on the quantum layer 123.
在一些实施例中，可以通过等离子体增强化学气相沉积或者原子层沉积的方式在量子层123上形成第二阻水层124，以得到盖板封装结构12。In some embodiments, the second water blocking layer 124 may be formed on the quantum layer 123 by plasma-enhanced chemical vapor deposition or atomic layer deposition to obtain the cover package structure 12.
步骤208，提供一密封胶层13，密封胶层13的一面131设置有第一保护膜14，密封胶层13的另一面132设置有第二保护膜15。In step 208, a sealant layer 13 is provided, one side 131 of the sealant layer 13 is provided with a first protective film 14, and the other side 132 of the sealant layer 13 is provided with a second protective film 15.
步骤209，撕除第一保护膜14，将密封胶层13的一面131与薄膜晶体管基板封装结构11上的第一阻水层113进行真空贴合。In step 209, the first protective film 14 is peeled off, and one side 131 of the sealant layer 13 is vacuum bonded to the first water blocking layer 113 on the thin film transistor substrate packaging structure 11.
步骤210，撕除第二保护膜15，将密封胶层13的另一面132与盖板封装结构12上的第二阻水层124进行真空贴合。In step 210, the second protective film 15 is torn off, and the other side 132 of the sealant layer 13 is vacuum bonded to the second water blocking layer 124 on the cover package structure 12.
步骤211，通过紫外固化或者加热的方式对密封胶层13进行固化。In step 211, the sealant layer 13 is cured by ultraviolet curing or heating.
本申请实施例提供的一种显示面板的制作方法，提供一薄膜晶体管基板；在薄膜晶体管基板上制作蓝光有机发光二极管器件以及第一阻水层，以得到薄膜晶体管基板封装结构；提供一盖板；在盖板上形成彩膜、量子层以及第二阻水层，以得到盖板封装结构，其中，所述量子层为通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂并进行树脂固化后制成；提供一密封胶层；通过密封胶层将薄膜晶体管基板封装结构与盖板封装结构进行真空贴合，其中，第一阻水层与第二阻水层通过密封胶层对应贴合。本申请实施例通过在TFT基板上制作BOLED并进行封装，然后在盖板上制作QD并进行封装，最后通过密封胶层将TFT基板封装结构与盖板封装结构真空贴合，可以有效提升显示面板的封装效果，且能同时满足大尺寸显示面板对量子点和有机发光二极管的封装要求，并能形成较小的边框。An embodiment of the application provides a method for manufacturing a display panel, providing a thin film transistor substrate; fabricating a blue organic light-emitting diode device and a first water blocking layer on the thin film transistor substrate to obtain a thin film transistor substrate packaging structure; providing a cover plate A color film, a quantum layer and a second water blocking layer are formed on the cover plate to obtain a cover plate packaging structure, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process The resin is made by curing the resin; a sealant layer is provided; the thin film transistor substrate package structure and the cover package structure are vacuum bonded through the sealant layer, wherein the first water blocking layer and the second water blocking layer are sealed The glue layer is correspondingly attached. In the embodiment of the application, the BOLED is fabricated and packaged on the TFT substrate, and then the QD is fabricated and packaged on the cover plate, and finally the TFT substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, which can effectively enhance the display panel The packaging effect can meet the packaging requirements of quantum dots and organic light-emitting diodes for large-size display panels at the same time, and can form a smaller frame.
以上对本申请实施例提供的显示面板的制作方法、显示面板及电子设备进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。The manufacturing method, display panel, and electronic equipment of the display panel provided by the embodiments of the application are described in detail above. Specific examples are used in this article to illustrate the principles and implementation of the application. The description of the above embodiments is only for help Understand this application. At the same time, for those skilled in the art, according to the idea of the application, there will be changes in the specific implementation and the scope of application. In summary, the content of this specification should not be construed as a limitation of the application.

Claims (20)

  1. 一种显示面板的制作方法，其包括：A manufacturing method of a display panel, which includes:
    提供一薄膜晶体管基板；Provide a thin film transistor substrate;
    在所述薄膜晶体管基板上制作蓝光有机发光二极管器件以及第一阻水层，以得到薄膜晶体管基板封装结构；Fabricating a blue organic light emitting diode device and a first water blocking layer on the thin film transistor substrate to obtain a thin film transistor substrate packaging structure;
    提供一盖板；Provide a cover;
    在所述盖板上形成彩膜、量子层以及第二阻水层，以得到盖板封装结构，其中，所述量子层为通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂并进行树脂固化后制成；A color film, a quantum layer, and a second water blocking layer are formed on the cover plate to obtain a cover plate packaging structure, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process. The resin is made after curing the resin;
    提供一密封胶层；Provide a sealant layer;
    通过所述密封胶层将所述薄膜晶体管基板封装结构与盖板封装结构进行真空贴合，其中，所述第一阻水层与第二阻水层通过所述密封胶层对应贴合。The thin film transistor substrate packaging structure and the cover plate packaging structure are vacuum bonded through the sealant layer, wherein the first water blocking layer and the second water blocking layer are correspondingly bonded through the sealant layer.
  2. 如权利要求1所述的显示面板的制作方法，其中所述在所述薄膜晶体管基板上制作蓝光有机发光二极管器件以及第一阻水层，以得到薄膜晶体管基板封装结构，包括：3. The method of manufacturing a display panel according to claim 1, wherein the manufacturing a blue organic light emitting diode device and a first water blocking layer on the thin film transistor substrate to obtain a thin film transistor substrate packaging structure comprises:
    在所述薄膜晶体管基板上制作蓝光有机发光二极管器件；Fabricating a blue organic light emitting diode device on the thin film transistor substrate;
    在所述蓝光有机发光二极管器件上形成第一阻水层，以得到薄膜晶体管基板封装结构。A first water blocking layer is formed on the blue organic light emitting diode device to obtain a thin film transistor substrate packaging structure.
  3. 如权利要求2所述的显示面板的制作方法，其中所述在所述薄膜晶体管基板上制作蓝光有机发光二极管器件，包括：3. The method for manufacturing a display panel according to claim 2, wherein the manufacturing a blue organic light emitting diode device on the thin film transistor substrate comprises:
    通过蒸镀或喷墨打印的方式在所述薄膜晶体管基板上制作所述蓝光有机发光二极管器件。The blue organic light emitting diode device is fabricated on the thin film transistor substrate by evaporation or inkjet printing.
  4. 如权利要求2所述的显示面板的制作方法，其中所述在所述蓝光有机发光二极管器件上形成第一阻水层，包括：3. The manufacturing method of the display panel according to claim 2, wherein the forming a first water blocking layer on the blue organic light emitting diode device comprises:
    通过等离子体增强化学气相沉积的方式在所述蓝光有机发光二极管器件上形成所述第一阻水层。The first water blocking layer is formed on the blue organic light emitting diode device by means of plasma enhanced chemical vapor deposition.
  5. 如权利要求1所述的显示面板的制作方法，其中所述在所述盖板上形成彩膜、量子层以及第二阻水层，以得到盖板封装结构，包括7. The method of manufacturing a display panel according to claim 1, wherein said forming a color film, a quantum layer and a second water blocking layer on the cover plate to obtain a cover plate packaging structure comprises
    在所述盖板上形成彩膜；Forming a color film on the cover plate;
    通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂，并进行预烘烤及烘烤的方式对所述含有量子点材料的树脂进行固化，以形成量子层；Coating a resin containing quantum dot material on the color film by a yellow light manufacturing process, and curing the resin containing quantum dot material by pre-baking and baking to form a quantum layer;
    在所述量子层上形成第二阻水层，以得到盖板封装结构。A second water blocking layer is formed on the quantum layer to obtain a cover plate package structure.
  6. 如权利要求5所述的显示面板的制作方法，其中所述在所述盖板上形成彩膜，包括：8. The manufacturing method of the display panel of claim 5, wherein the forming a color film on the cover plate comprises:
    在所述盖板上形成具有红色像素单元、绿色像素单元、蓝色像素单元以及黑色矩阵的彩膜，其中所述黑色矩阵分布于所述彩膜的周缘以及各相邻的红色像素单元、绿色像素单元、蓝色像素单元之间。A color film with red pixel units, green pixel units, blue pixel units and black matrix is formed on the cover plate, wherein the black matrix is distributed on the periphery of the color film and each adjacent red pixel unit, green Between the pixel unit and the blue pixel unit.
  7. 如权利要求5所述的显示面板的制作方法，其中所述第一阻水层包覆所述蓝光有机发光二极管器件，以及所述第二阻水层包覆所述量子层。5. The method for manufacturing a display panel according to claim 5, wherein the first water blocking layer covers the blue organic light emitting diode device, and the second water blocking layer covers the quantum layer.
  8. 如权利要求5所述的显示面板的制作方法，其中所述在所述量子层上形成第二阻水层，包括：7. The method of manufacturing a display panel according to claim 5, wherein said forming a second water blocking layer on said quantum layer comprises:
    通过等离子体增强化学气相沉积或者原子层沉积的方式在所述量子层上形成所述第二阻水层。The second water blocking layer is formed on the quantum layer by means of plasma enhanced chemical vapor deposition or atomic layer deposition.
  9. 如权利要求5所述的显示面板的制作方法，其中当所述密封胶层处于闲置状态时，所述密封胶层的一面设置有第一保护膜，所述密封胶层另一面设置有第二保护膜，所述通过所述密封胶层将所述薄膜晶体管基板封装结构与盖板封装结构进行真空贴合，包括：The manufacturing method of the display panel according to claim 5, wherein when the sealant layer is in an idle state, one side of the sealant layer is provided with a first protective film, and the other side of the sealant layer is provided with a second protective film. The protective film, wherein the vacuum bonding of the thin film transistor substrate packaging structure and the cover packaging structure through the sealant layer includes:
    撕除所述第一保护膜，将所述密封胶层的一面与所述薄膜晶体管基板封装结构上的所述第一阻水层进行真空贴合；Tearing off the first protective film, and vacuum bonding one side of the sealant layer to the first water blocking layer on the thin film transistor substrate packaging structure;
    撕除所述第二保护膜，将所述密封胶层的另一面与所述盖板封装结构上的所述第二阻水层进行真空贴合；Tearing off the second protective film, vacuum bonding the other side of the sealant layer with the second water blocking layer on the cover plate packaging structure;
    通过紫外固化或者加热的方式对所述密封胶层进行固化。The sealant layer is cured by ultraviolet curing or heating.
  10. 一种显示面板，其包括：薄膜晶体管基板封装结构、盖板封装结构以及密封胶层；A display panel, comprising: a thin film transistor substrate packaging structure, a cover plate packaging structure and a sealant layer;
    其中，所述薄膜晶体管基板封装结构包括依次设置的薄膜晶体管基板、蓝光有机发光二极管器件以及第一阻水层；Wherein, the thin film transistor substrate packaging structure includes a thin film transistor substrate, a blue organic light emitting diode device and a first water blocking layer which are arranged in sequence;
    所述盖板封装结构包括依次设置的盖板、彩膜、量子层以及第二阻水层，其中，所述量子层为通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂并进行树脂固化后制成；The cover plate packaging structure includes a cover plate, a color film, a quantum layer, and a second water blocking layer arranged in sequence, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process. The resin is made after curing the resin;
    所述薄膜晶体管基板封装结构通过所述密封胶层贴合于所述盖板封装结构，其中，所述第一阻水层与第二阻水层通过所述密封胶层对应贴合。The thin film transistor substrate packaging structure is attached to the cover package structure through the sealant layer, wherein the first water blocking layer and the second water barrier layer are correspondingly attached through the sealant layer.
  11. 如权利要求10所述的显示面板，其中所述第一阻水层包覆所述蓝光有机发光二极管器件，以及所述第二阻水层包覆所述量子层。10. The display panel of claim 10, wherein the first water blocking layer covers the blue organic light emitting diode device, and the second water blocking layer covers the quantum layer.
  12. 如权利要求11所述的显示面板，其中所述密封胶层包覆所述第一阻水层与第二阻水层。11. The display panel of claim 11, wherein the sealant layer covers the first water blocking layer and the second water blocking layer.
  13. 如权利要求11所述的显示面板，其中所述蓝光有机发光二极管器件被所述第一阻水层与薄膜晶体管基板包覆在其二者之间，所述量子层被所述第二阻水层与彩膜包覆在其二者之间。11. The display panel of claim 11, wherein the blue organic light emitting diode device is covered by the first water blocking layer and the thin film transistor substrate between them, and the quantum layer is blocked by the second water blocking layer. The layer and the color film are wrapped between them.
  14. 如权利要求10所述的显示面板，其中所述彩膜包括红色像素单元、绿色像素单元、蓝色像素单元以及黑色矩阵，其中所述黑色矩阵分布于所述彩膜的周缘以及各相邻的红色像素单元、绿色像素单元、蓝色像素单元之间。The display panel of claim 10, wherein the color filter includes a red pixel unit, a green pixel unit, a blue pixel unit, and a black matrix, wherein the black matrix is distributed on the periphery of the color filter and each adjacent Between the red pixel unit, the green pixel unit, and the blue pixel unit.
  15. 如权利要求10所述的显示面板，其中所述第一阻水层由氮化硅、氮氧化硅和氧化硅中的任一种材料或者多个材料制成。10. The display panel of claim 10, wherein the first water blocking layer is made of any one or more of silicon nitride, silicon oxynitride, and silicon oxide.
  16. 如权利要求10所述的显示面板，其中所述第二阻水层由氮化硅、氮氧化硅、氧化硅、三氧化二铝和二氧化硅中的任一种材料或者多个材料制成。The display panel of claim 10, wherein the second water blocking layer is made of any one or more materials of silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, and silicon dioxide .
  17. 如权利要求10所述的显示面板，其中所述第一阻水层与第二阻水层为单层结构或者多层结构。10. The display panel of claim 10, wherein the first water blocking layer and the second water blocking layer have a single-layer structure or a multi-layer structure.
  18. 一种电子设备，其包括壳体和显示面板，所述显示面板安装在所述壳体上，所述显示面板包括：薄膜晶体管基板封装结构、盖板封装结构以及密封胶层；An electronic device comprising a casing and a display panel, the display panel being mounted on the casing, the display panel comprising: a thin film transistor substrate packaging structure, a cover packaging structure and a sealant layer;
    其中，所述薄膜晶体管基板封装结构包括依次设置的薄膜晶体管基板、蓝光有机发光二极管器件以及第一阻水层；Wherein, the thin film transistor substrate packaging structure includes a thin film transistor substrate, a blue organic light emitting diode device and a first water blocking layer which are arranged in sequence;
    所述盖板封装结构包括依次设置的盖板、彩膜、量子层以及第二阻水层，其中，所述量子层为通过黄光制程工艺在所述彩膜上涂布含有量子点材料的树脂并进行树脂固化后制成；The cover plate packaging structure includes a cover plate, a color film, a quantum layer, and a second water blocking layer arranged in sequence, wherein the quantum layer is coated with a quantum dot material on the color film through a yellow light manufacturing process. The resin is made after curing the resin;
    所述薄膜晶体管基板封装结构通过所述密封胶层贴合于所述盖板封装结构，其中，所述第一阻水层与第二阻水层通过所述密封胶层对应贴合。The thin film transistor substrate packaging structure is attached to the cover package structure through the sealant layer, wherein the first water blocking layer and the second water barrier layer are correspondingly attached through the sealant layer.
  19. 如权利要求18所述的电子设备，其中所述第一阻水层包覆所述蓝光有机发光二极管器件，以及所述第二阻水层包覆所述量子层。19. The electronic device of claim 18, wherein the first water blocking layer covers the blue organic light emitting diode device, and the second water blocking layer covers the quantum layer.
  20. 如权利要求19所述的电子设备，其中所述密封胶层包覆所述第一阻水层与第二阻水层。The electronic device of claim 19, wherein the sealant layer covers the first water blocking layer and the second water blocking layer.
PCT/CN2019/079971 2019-03-08 2019-03-28 Display panel manufacturing method, display panel, and electronic device WO2020181587A1 (en)

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CN110413150B (en) * 2019-07-09 2020-12-25 深圳市华星光电半导体显示技术有限公司 Infrared touch display device and preparation method thereof
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105304684A (en) * 2015-11-18 2016-02-03 深圳市华星光电技术有限公司 Color display device and manufacturing method thereof
CN107591431A (en) * 2017-09-15 2018-01-16 深圳市华星光电半导体显示技术有限公司 A kind of color membrane substrates and display device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10692417B2 (en) * 2017-06-23 2020-06-23 Samsung Electronic Co., Ltd. Display apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105304684A (en) * 2015-11-18 2016-02-03 深圳市华星光电技术有限公司 Color display device and manufacturing method thereof
CN107591431A (en) * 2017-09-15 2018-01-16 深圳市华星光电半导体显示技术有限公司 A kind of color membrane substrates and display device

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