CN107331790A - A kind of OLED display panel and its method for packing, OLED display - Google Patents
A kind of OLED display panel and its method for packing, OLED display Download PDFInfo
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- CN107331790A CN107331790A CN201710592150.XA CN201710592150A CN107331790A CN 107331790 A CN107331790 A CN 107331790A CN 201710592150 A CN201710592150 A CN 201710592150A CN 107331790 A CN107331790 A CN 107331790A
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- oled display
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a kind of OLED display panel and its method for packing, OLED display, it is related to display technology field, it can effectively prevent steam and oxygen in air from being permeated from the side of oled display substrate, steam and oxygen is avoided to impact luminescent device, so as to improve the service life of OLED display.Wherein, OLED display panel includes oled display substrate, and the side of oled display substrate is the scarf of the inclined bottom surface relative to oled display substrate；Encapsulated layer, encapsulated layer covers the top surface and scarf of oled display substrate；Wherein, bottom surface is the surface of the backward luminous device of underlay substrate in oled display substrate, and top surface is the surface relative with bottom surface, and scarf is the surface intersected with bottom surface.Above-mentioned OLED display panel is used to realize that picture is shown.
Description
Technical field
Shown the present invention relates to display technology field, more particularly to a kind of OLED display panel and its method for packing, OLED
Device.
Background technology
At present, Organic Light Emitting Diode (Organic Light-Emitting Diode, hereinafter referred to as OLED) display dress
Put because have the advantages that high brightness, full visual angle, fast response time and can Flexible Displays, display field obtained extensively should
With.
Include oled display substrate in OLED display.As shown in figure 1, traditional oled display substrate includes substrate
Substrate 11, the cushion 22 on underlay substrate 11 and located at the luminous of the dorsad surface of underlay substrate 11 of cushion 22
Device 33.Wherein, the negative electrode of luminescent device 33 is typically formed using metal materials such as aluminium, magnesium, calcium, the chemistry of these metal materials
Nature comparison work ripple, is easily reacted with steam and oxygen, also, each functional film layer in luminescent device 33, such as hole are passed
Defeated layer and electron transfer layer are also easier to chemically react with steam and oxygen.Once there are steam and oxygen to penetrate,
It will be reacted with the negative electrode and each functional film layer of luminescent device 33, the failure of luminescent device 33 can be caused when serious, and then
Influence the service life of OLED display.
To overcome above mentioned problem, generally by luminescent device 33 and steam by the way of being packaged to oled display substrate
With oxygen isolation.Existing method for packing is specially：The edge of oled display substrate first to being formed with luminescent device 33 enters
Row perpendicular cuts, make side and the plane perpendicular of oled display substrate, are then formed on oled display substrate again after dicing
For isolating the encapsulated layer 44 of water oxygen, the oled display substrate after encapsulation is as shown in Figure 1.But, due to oled display substrate
Side is perpendicular with bottom surface, is limited to the limitation of the formation process of encapsulated layer 44, in subsequent deposition formation encapsulated layer 44, encapsulation
Layer 44 can only cover the top surface of oled display substrate, it is impossible to cover the side of oled display substrate, this results in steam and oxygen
From the non-encapsulated side infiltration of underlay substrate 11 and cushion 22, and then cause the steam and oxygen of infiltration to luminescent device
33 produce harmful effect, shorten the service life of OLED display.
The content of the invention
The invention provides a kind of OLED display panel and its method for packing, OLED display, for preventing in air
Steam and oxygen permeated from the side of oled display substrate, it is to avoid steam and oxygen are impacted to luminescent device, so as to carry
The service life of high oled display substrate.
To reach above-mentioned purpose, the present invention is adopted the following technical scheme that：
The first aspect of the present invention provides a kind of OLED display panel, including：
Oled display substrate, the side of the oled display substrate is the oblique of the inclined bottom surface relative to oled display substrate
Tangent plane；
Encapsulated layer, the encapsulated layer covers the top surface and scarf of the oled display substrate；
Wherein, the bottom surface of the oled display substrate is the backward luminous device of underlay substrate in the oled display substrate
Surface, the top surface of the oled display substrate is the surface relative with the bottom surface of the oled display substrate, and the OLED is shown
The scarf of substrate is the surface intersected with the bottom surface of the oled display substrate.
In OLED display panel provided by the present invention, include oled display substrate, also, oled display substrate
Side is the scarf relative to inclined bottom surface.Because the scarf of oled display substrate has certain gradient, therefore,
When being subsequently formed encapsulated layer, the encapsulated layer formed can not only cover the top surface of oled display substrate, can also cover simultaneously
The scarf of oled display substrate.Compared with existing OLED display panel, using OLED display panel provided by the present invention,
On the one hand steam and oxygen in air can be avoided to be permeated from the top surface of oled display substrate, on the other hand can also further be kept away
Exempt from steam and oxygen to permeate from the side of oled display substrate, so that the water resistant oxygen attack ability of OLED display panel is improved,
And then improve the service life of OLED display.
The second aspect of the present invention provides a kind of method for packing of OLED display panel, the envelope of the OLED display panel
Dress method is applied in the OLED display panel as described in the first aspect of the present invention, the method for packing of the OLED display panel
Including：
One oled display substrate is provided；
The edge of the oled display substrate is cut, makes the oled display substrate formation relative to inclined bottom surface
Scarf；Wherein, the bottom surface of the oled display substrate is the backward luminous device of underlay substrate in the oled display substrate
Surface, the scarf of the oled display substrate is the surface intersected with the bottom surface of the oled display substrate；
Form the top surface of the covering oled display substrate and the encapsulated layer of scarf；Wherein, the oled display substrate
Top surface be the surface relative with the bottom surface of the oled display substrate.
The beneficial effect of the method for packing of OLED display panel provided by the present invention is carried with the first aspect of the present invention
The beneficial effect of the OLED display panel of confession is identical, and here is omitted.
The third aspect of the present invention provides a kind of OLED display, and the OLED display is included such as the present invention
OLED display panel described in first aspect.
The beneficial effect of OLED display provided by the present invention shows with the OLED that the first aspect of the present invention is provided
Show that the beneficial effect of panel is identical, here is omitted.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the display base plate after encapsulation of the prior art；
The structural representation one for the OLED display panel that Fig. 2 is provided by the embodiment of the present invention one；
The structural representation two for the OLED display panel that Fig. 3 is provided by the embodiment of the present invention one；
The structural representation three for the OLED display panel that Fig. 4 is provided by the embodiment of the present invention one；
The structural representation four for the OLED display panel that Fig. 5 is provided by the embodiment of the present invention one；
The structural representation five for the OLED display panel that Fig. 6 is provided by the embodiment of the present invention one；
The flow chart one of the method for packing for the OLED display panel that Fig. 7 is provided by the embodiment of the present invention two；
The flowchart 2 of the method for packing for the OLED display panel that Fig. 8 is provided by the embodiment of the present invention two；
The flow chart 3 of the method for packing for the OLED display panel that Fig. 9 is provided by the embodiment of the present invention two.
Description of reference numerals：
The existing underlay substrates of 11-；The existing cushions of 22-；
The existing luminescent devices of 33-；The existing encapsulated layers of 44-；
1-OLED display base plates；2- encapsulated layers；
3- underlay substrates；4- luminescent devices；
5- protective layers；6- flexible substrates；
7- thin film transistor (TFT)s；8- second buffer layers；
9- planarization layers；21- inorganic thin films；
22- organic films；23- glue-lines；
The flexible membrane layers of 61- first；62- first buffer layers；
The flexible membrane layers of 63- second.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with present invention implementation
Accompanying drawing in example, the technical scheme in the embodiment of the present invention is clearly and completely described.Obviously, described embodiment
Only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, the common skill in this area
All other embodiment that art personnel are obtained on the premise of creative work is not made, belongs to the model that the present invention is protected
Enclose.
Embodiment one
As shown in Fig. 2 present embodiments providing a kind of OLED display panel, the OLED display panel specifically includes OLED and shown
Show substrate 1 and the encapsulated layer 2 for encapsulating oled display substrate 1.Wherein, the side of oled display substrate 1 be relative to
The scarf of the inclined bottom surface of oled display substrate 1, encapsulated layer 2 covers the top surface and scarf of oled display substrate 1.
Specifically, the bottom surface of oled display substrate 1 is the table of the backward luminous device 4 of underlay substrate 3 in oled display substrate 1
Face, the top surface of oled display substrate 1 is the surface relative with the bottom surface of oled display substrate 1, the scarf of oled display substrate 1
The surface intersected for the bottom surface with oled display substrate 1.
In the OLED display panel that the present embodiment is provided, including oled display substrate 1, wherein, oled display substrate 1
Side be relative to inclined bottom surface scarf.Because the scarf of oled display substrate 1 has certain gradient, because
This, when being subsequently formed encapsulated layer 2, the encapsulated layer 2 formed can not only cover the top surface of oled display substrate 1, can also be same
When cover oled display substrate 1 scarf.Compared with existing OLED display panel, the OLED provided using the present embodiment
Display panel, on the one hand can avoid steam and oxygen in air from being permeated from the top surface of oled display substrate 1, on the other hand also
Steam and oxygen can be further avoided to be permeated from the side of oled display substrate 1, so as to improve the water resistant of OLED display panel
Oxygen attack ability, and then improve the service life of OLED display.
When the scarf of oled display substrate 1 is excessive relative to the angle of inclination of bottom surface, when such as close to 90 °, OLED shows
Show the scarf of substrate 1 with bottom surface already close to plumbness, so, when forming encapsulated layer 2, encapsulated layer 2 is only capable of forming sediment
Top surface of the product in oled display substrate 1, it is impossible to be deposited on the scarf of oled display substrate 1.Therefore, in order to ensure in encapsulated layer
2 can be deposited on the scarf of oled display substrate 1 completely, and the scarf of oled display substrate 1 is relative to inclined bottom surface
Angle is just unsuitable excessive.On the other hand, it is contemplated that caused cost is wasted when being cut to oled display substrate 1, OLED
The scarf of display base plate 1 is also unsuitable too small relative to the angle of inclined bottom surface.It is preferred that, the oblique of oled display substrate 1 can be made
Tangent plane is 25 °~60 ° relative to the angle of inclined bottom surface.
Optionally, as shown in figure 3, encapsulated layer 2 can be specifically made up of multiple alternate inorganic thin films 21 and organic film 22.
Inorganic thin film 21 has higher compactness, can preferably isolate steam and oxygen, but be due to the elasticity of inorganic thin film 21
Relatively low, internal stress is larger, thus is easier to be produced crack by external force effect.Therefore, between two neighboring inorganic thin film 21
One layer of organic film 22 as cushion is formed, can effectively suppress inorganic thin film 21 and ftracture.
Certainly, as shown in figure 4, the relatively thick film layers of encapsulated layer 2 or individual layer.When the relatively thick film layers that encapsulated layer 2 is individual layer
When, in order to prevent encapsulated layer 2 from being peeled off with oled display substrate 1, encapsulated layer 2 can be coated with towards the surface of oled display substrate 1
One layer of glue-line 23, thus can be by encapsulated layer 2 together with the tight adhesion of oled display substrate 1, so as to ensure that encapsulated layer 2 has
Effect ground isolation steam and oxygen.
In addition, in order to further avoid steam and oxygen in air from being permeated from top surface, as shown in figure 5, can also be in OLED
The protective layer 5 of one layer of covering top surface is formed between the top surface and encapsulated layer 2 of display base plate 1.So, in protective layer 5 and encapsulated layer 2
The top surface of oled display substrate 1 is carried out under double shielding, can more effectively completely cut off steam and oxygen.
It should be noted that the OLED display panel that the present embodiment is provided can be rigid OLED display panel, or it is soft
Property OLED display panel.When the OLED display panel that the present embodiment is provided is flexible OLED display panel, as shown in fig. 6,
Oled display substrate 1 specifically include underlay substrate 3, cover underlay substrate 3 flexible substrates 6 and located at flexible substrates 6 dorsad
The thin film transistor (TFT) 7 and luminescent device 4 of the side of underlay substrate 3.Wherein, thin film transistor (TFT) 7 and the different layer of luminescent device 4 are set,
The concrete structure of thin film transistor (TFT) 7 and luminescent device 4 is the conventional structure of existing thin film transistor (TFT) and luminescent device, and thin
The set-up mode of each structure is also conventional arrangement mode in film transistor 7 and luminescent device 4, and the present embodiment is not gone to live in the household of one's in-laws on getting married to this
State.
In order to preferably prevent steam and oxygen from being permeated from the bottom surface of oled display substrate 1, it is preferred that in flexible substrates 6
It may include multiple flexible membrane layers.
Below so that flexible substrates 6 include two flexible membrane layers as an example, the structure to flexible substrates 6 is specifically described：
Referring again to Fig. 6, flexible substrates 6 specifically include the first flexible membrane layer 61 being formed on underlay substrate 3, formed
Dorsad the first buffer layer 62 on the surface of underlay substrate 3 and first buffer layer 62 is formed in the first flexible membrane layer 61 dorsad
Second flexible membrane layer 63 on the surface of the first flexible membrane layer 61.
Wherein, the first flexible membrane layer 61 and the second flexible membrane layer 63 can be respectively the polyimides that thickness is 5 μm~15 μm
Film layer.First buffer layer 62 can be bySilicon oxide layer andAmorphous silicon layer constitute.When
So, the first flexible membrane layer 61 and the second flexible membrane layer 63 be by polyimide material in addition to being formed, can also be by makrolon, poly-
Other are organic for acrylate, PEI, polyether sulfone, polyethylene terephthalate or PEN etc.
Material is formed, and the present embodiment is not restricted to this.
In addition, oled display substrate 1 may also include be formed at flexible substrates 6 dorsad the surface of underlay substrate 3 second delay
Rush layer 8 and be formed at the planarization layer 9 on the dorsad surface of flexible substrates 6 of second buffer layer 8.Wherein, second buffer layer 8 can
ForSilicon dioxide layer, planarization layer 9 can be bySilicon nitride layer andSilicon dioxide layer constitute.
Embodiment two
Present embodiments provide a kind of method for packing of OLED display panel, the method for packing application of the OLED display panel
In the OLED display panel as described in embodiment one.
As shown in fig. 7, the method for packing that the present embodiment provides OLED display panel is specifically included：
Step S1：One oled display substrate is provided.
Step S2：The edge of oled display substrate is cut, makes oled display substrate formation relative to inclined bottom surface
Scarf.Wherein, the bottom surface of oled display substrate be oled display substrate in the backward luminous device of underlay substrate surface,
The scarf of oled display substrate is the surface intersected with the bottom surface of oled display substrate.
Step S3：Form the top surface of covering oled display substrate and the encapsulated layer of scarf；Wherein, oled display substrate
Top surface is the surface relative with bottom surface.
Compared with the method for packing of existing OLED display panel, the envelope of the OLED display panel provided in the present embodiment
In dress method, the edge of oled display substrate is cut, so that oled display substrate formation is relative to inclined bottom surface
Scarf, so, when being subsequently formed encapsulated layer, the encapsulated layer formed can be while cover the top of oled display substrate
Face and scarf.Therefore, the method for packing of the OLED display panel provided using the present embodiment, can not only be avoided in air
Steam and oxygen permeated from the top surface of oled display substrate, can also further avoid steam and oxygen from oled display substrate
Side is permeated, so as to improve the corrosion resistance of OLED display panel, and then improves the service life of OLED display.
It is preferred that, the scarf of oled display substrate relative to oled display substrate inclined bottom surface angle for 25 °~
60°。
In addition, in order to further avoid steam and oxygen in air from being permeated from the top surface of OLED display panel, in step
Between S1 and step S2, the method for packing of OLED display panel may also include：In one layer of guarantor of top surface formation of oled display substrate
Sheath, makes formed protective layer cover the top surface of oled display substrate.
As shown in figure 8, step S1 specifically may include：
Step S11：One underlay substrate is provided.
Step S12：In underlay substrate formation flexible substrates.
Step S13：Thin film transistor (TFT) and luminescent device are formed in the side of flexible substrates dorsad underlay substrate.
In order to preferably stop that steam and oxygen permeate from the bottom surface of OLED display panel, specifically it may include in flexible substrates
Multiple flexible membrane layers.Exemplary, when flexible substrates include two flexible membrane layers, as shown in figure 9, step S12 specifically may be used
Including：
Step S121：In underlay substrate the first flexible membrane layer of formation.
Step S122：The first flexible membrane layer dorsad underlay substrate surface formed first buffer layer.
Step S123：First buffer layer dorsad the first flexible membrane layer surface formed the second flexible membrane layer.
It should be noted that the first flexible membrane layer and the second flexible membrane layer specifically can be by polyimides, makrolon, poly- third
The organic material shape such as olefin(e) acid ester, PEI, polyether sulfone, polyethylene terephthalate or PEN
Into.
When the first flexible membrane layer and the second flexible membrane layer are formed by polyimide material, corresponding, step
S121 specifically may include：On underlay substrate, the strata acid imide glue of coating one, using low pressure drying process, 300 DEG C~
At a temperature of 400 DEG C, polyimides glue is solidify to form to 5 μm~15 μm of polyimide film, that is, forms the first flexible membrane
Layer.
Step S122 specifically may include：First flexible membrane layer is cleaned, in the first flexible membrane layer dorsad underlay substrate
Surface, be sequentially depositingSilicon oxide layer andAmorphous silicon layer, that is, formed first buffer
Layer.
Step S123 specifically may include：On the surface of first buffer layer dorsad the first flexible membrane layer, the strata acyl of coating one is sub-
Amine glue, using low pressure drying process, at a temperature of 300 DEG C~400 DEG C, 5 μm~15 μ are solidify to form by polyimides glue
M polyimide film, that is, form the second flexible membrane layer.
In addition, between step S12 and step S13, the method for packing of OLED display panel also includes：In the flexible substrates back of the body
Formed to the surface of underlay substrateSilicon dioxide layer, as second buffer layer, and second buffering
The surface of layer dorsad flexible substrates is sequentially depositingSilicon nitride layer andSilica
Layer, is used as planarization layer.
Embodiment three
A kind of OLED display is present embodiments provided, the OLED display includes the OLED as described in embodiment one
Display panel.
Compared with existing OLED display, by the OLED display that the present embodiment is provided includes such as embodiment
OLED display panel described in one, therefore, the OLED display that the present embodiment is provided have more preferable water oxygen obstructing capacity,
Luminescent device is had undesirable effect into OLED display so as to be prevented effectively from steam and oxygen, and then with more
Good display performance and more long service life.
The embodiment of the present invention is the foregoing is only, but protection scope of the present invention is not limited thereto, it is any
Those familiar with the art the invention discloses technical scope in, the change or replacement that can be readily occurred in, all should
It is included within the scope of the present invention.Therefore, protection scope of the present invention should using the scope of the claims as
It is accurate.
Claims (10)
1. a kind of OLED display panel, it is characterised in that including：
Oled display substrate, the side of the oled display substrate is the beveling of the inclined bottom surface relative to oled display substrate
Face；
Encapsulated layer, the encapsulated layer covers the top surface and scarf of the oled display substrate；
Wherein, the bottom surface of the oled display substrate is the table of the backward luminous device of underlay substrate in the oled display substrate
Face, the top surface of the oled display substrate is the surface relative with the bottom surface of the oled display substrate, and the OLED shows base
The scarf of plate is the surface intersected with the bottom surface of the oled display substrate.
2. OLED display panel according to claim 1, it is characterised in that the scarf of the oled display substrate is relative
In the oled display substrate inclined bottom surface angle be 25 °~60 °.
3. OLED display panel according to claim 1, it is characterised in that the top surface of the oled display substrate with it is described
Protective layer is also formed between encapsulated layer, the protective layer covers the top surface of the oled display substrate.
4. OLED display panel according to claim 1, it is characterised in that the oled display substrate includes substrate base
Plate, the flexible substrates of the covering underlay substrate and located at the thin of the flexible substrates dorsad side of the underlay substrate
Film transistor and luminescent device.
5. OLED display panel according to claim 4, it is characterised in that the flexible substrates include：
It is formed at the first flexible membrane layer of the underlay substrate, is formed at the first flexible membrane layer dorsad underlay substrate
The first buffer layer on surface and it is formed at the second flexible of the first buffer layer dorsad surface of first flexible membrane layer
Film layer.
6. OLED display panel according to claim 4, it is characterised in that the oled display substrate also includes being formed at
The second buffer layer on the flexible substrates dorsad surface of the underlay substrate, and it is formed at the second buffer layer dorsad institute
State the planarization layer on the surface of flexible substrates.
7. a kind of method for packing of OLED display panel, it is characterised in that the method for packing of the OLED display panel is applied to
In OLED display panel as described in any one of claim 1~6, the method for packing of the OLED display panel includes：
One oled display substrate is provided；
The edge of the oled display substrate is cut, makes the oled display substrate formation oblique relative to inclined bottom surface
Tangent plane；Wherein, the bottom surface of the oled display substrate is the table of the backward luminous device of underlay substrate in the oled display substrate
Face, the scarf of the oled display substrate is the surface intersected with the bottom surface of the oled display substrate；
Form the top surface of the covering oled display substrate and the encapsulated layer of scarf；Wherein, the top of the oled display substrate
Face is the surface relative with the bottom surface of the oled display substrate.
8. the method for packing of OLED display panel according to claim 7, it is characterised in that the oled display substrate
Scarf is 25 °~60 ° relative to the angle of the inclined bottom surface of the oled display substrate.
9. the method for packing of OLED display panel according to claim 7, it is characterised in that base is being shown to the OLED
Before the side of plate is cut, the method for packing of the OLED display panel also includes：
In the top surface formation layer protective layer of the oled display substrate, the protective layer covers the top of the oled display substrate
Face.
10. a kind of OLED display, it is characterised in that the OLED display is included such as any one of claim 1~6 institute
The OLED display panel stated.
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| CN201710592150.XA CN107331790A (en) | 2017-07-19 | 2017-07-19 | A kind of OLED display panel and its method for packing, OLED display |
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| CN110828519A (en) * | 2019-07-31 | 2020-02-21 | 云谷（固安）科技有限公司 | Display panel, preparation method thereof and display device |
| CN110828519B (en) * | 2019-07-31 | 2023-02-07 | 云谷（固安）科技有限公司 | Display panel, preparation method thereof and display device |
| WO2023226033A1 (en) * | 2022-05-27 | 2023-11-30 | 京东方科技集团股份有限公司 | Display substrate, mold assembly, tiled display module and display device |
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Application publication date: 20171107 |